ZTE MG2636 Module Hardware Design User Manual
Contents
1. Er n aT ti a oo ci CR yo Le a ka gel ng ne iii uu i S sit im ir DAICLE AGND 42 10 pAITXD 11 DAIRST 12 BATT TEMP SYTSHEST HN DCDO 39 CTS1 36 CTSO of RISI 36 16 TXD1 DTRO 39 17 TXDO RISO 34 18 BAT BACKUP DSRO 33 RINGO 32 EEE 13 SIG LED LKE SEILER App de d ae KEE mk d We CNR 5 15 RADO Ti 20 21 GATEDRU GND E NEE k Gi CO 7 ml po Mal Bol t w RIS 8 Bi sie CO T 14 ZIE GSM Modules 2 2 50 Pin B2B Connector Interface Definitions Table 2 1 50 Pin B2B Connector Interface Definitions 1 sex o smene 2 aer o auser Max output current 20mA__ a smoam vo SiM card data ee a Madi Current inductor detect EE SIM GND SIM card GND SIM card s GND PIN and SIM GND PIN must connect with the modules power GND 7 DAR 1 DA receive data intemal pulk domn 61 1K0 e DAISING o DartameSe M a paar Dak clock iniemalpulkdomn S1 1K0 _ 10 am o partansmidta n tt past o parese inemal pulldown St 1KO _ 12 BATT TEMP Al Battery ID or battery Analog input voltage range I PMT ae dem nn SIG LED Network signal LED High level LED ON need externally connect dynatron Pa Dan mwn AE corresponding to internal pull down 75KQ EE men nr corresponding to internal pull down 75KQ DTE s RXD TXD1 UART1 corresponding to internal pull down 75KQ DTE s TXD2. TXDO UARTO corresponding to internal pull down 75KQ DTE s TXD BAT BACKUP Real time clock RTC Connect button battery or backup power large capacitor Input 2 2 5V max output 2 6 2 85V under POWER DOWN mode min input 1 3V CHRIN External charge power 4 2V 8V recommended detection input 5 5V external connect the charge power with the current no less than 800mA This pin IS just used as diction And It will be hung out when not used 15 EE ZIE GSM Modules 20 GATEDRV Battery charge control Valid at low level switch Ca en ss eno P Work current anode input 3 4V 4 7V recommended 3 8V as the module transmits with the max power the current will instantly reach 1 6A The min value of BATT voltage is no lower than 3 3V and the current no lower than 2A Module output digital Typical value 2 85V MIN interface voltage 2 75V MAX 2 95V MAX current 150mA There is voltage output only as the module is powered on And It will be hung out when not used 32 RINGO UARTO corresponding to internal pull down 75KQ DTE s RING 33 DSRO UARTO corresponding to internal pull down 75KQ RE CE 34 RTSO UARTO corresponding to internal pull down 75KQ CROP i 35 DTRO UARTO corresponding to internal pull down 75KQ TT eroe ee fee 36 RTS1 UART1 corresponding to internal pull down 75KQ DTE s RTS 37 CTSO UARTO corresponding to internal pull down 75KQ DTE s CTS 38 CTS1 UART1 corr
3. 2 SPK 1 is differential interface with 320 resistance SPK_2 is the single end interface with 320 resistance Due to the differences between SPK_1 and SPK 2 SPK 1 is usually used as hand hold device s Receiver and SPK 2 is used for headset s left right ears Note Differential design of audio signals could suppress the noise and the PCB wiring must be as short as possible The differential signals must be kept far away from the power RF and antenna circuit 3 6 DAI Digital Audio Interface DAI digital audio interface adopts PCM encoding from analog signal to digital signal which could connect with devices for digital audio communications such as Bluetooth device and it is convenient for users to develop peripheral audio communicating system Table 3 5 MG2636 module DAI PIN No Signal Name I O Descriptions of Remarks e te e DAIRXD DAI Rx data Internal a down CO ES 8 DAISYNC DA frame SYNC DAICLK DAI clock Te pull down 1KO Co onmo o ona 11 DAIRST DAI reset Internal EEE down 51 1KQ 23 LTE py GSM Modules 3 7 Network Status LED Interface MG2636 GSM module provides a network status LED interface SIG_LED which outputs pulse signal to control the blinking frequency of LED and indicate different network status through the definitions of LED s blinking modes For details please refer to table 3 6 Table 3 6 MG2636 module s network status definitions Period 1s high level output 0 1s No
4. SIM Card Audio Interface 2CH analog audio interface DAI interface 1CH digital audio interface Network signal indication interface Antenna interface Other 3 2 Power and Reset 3 2 1 Power MG2636 GSM module requires VBAT and real time clock BAT_BACKUP to work normally For details please see the following table 3 1 Power PIN Interface Definitions Table 3 1 Power PIN Interface Definitions PIN No Signal Name Descriptions of Remarks Functions is eo P ono n 26 30 BATT M o M Work Power Anode Input Real time Clock RTC Backup 3 4V 4 7V EE 3 8V a the module transmits with the max power the current will instantly reach 1 6A The min value of BATT voltage is no lower than 3 3V and the current no lower than 2A Connect button battery or large capacitor Input 2 2 5V max output 2 6 2 85V under POWER DOWN mode min input 1 3V MG2636 module requires external power supply and the power supply voltage ranges from 3 4V 4 7V typical value 3 8V The external power supplies the power to the module through B2B connector s VBAT PIN As the module transmits with the max power the current will instantly reach 18 ZIE GSM Modules about 1 6A and VBAT voltage will fall down however the min value of BATT voltage must be no lower than 3 4V The external power can provide the current required at MAX Tx Power and it s recommended to use LDO or switch power with the output current larger than
5. document is formally released on Apr 22 2010 ZIE GSM Modules Contents i GeneraliDese ripiani piena r 7 pi FUNCIONS l 7 l2 Principle IAG FARIS et ian abi anana na ed tbe ane Date rt kel at mab ia cd tions 9 t3 Applicaton DO AS ee ee ae en eee eee eee 10 1 4 Relevant EIERE 11 EV A AAA 11 2 RRE le ei E 14 Zil MOES PIN D IA JI AN See al e lea Ai at ts 14 2 2 50 Pin B2B Connector Interface Definitions 15 3 Decription of Hardware Interfaces issues 18 D UIN bee de a id b 18 oz e E nta ee aa kes n te aki ai 18 il Perin 18 322 Power LE EE 19 D la 20 CON en 20 34 SIM Gard ENA OO et ii a 21 3 5 AUOIO ALEN ACS me kt e bi k ta ed st 22 ol lee ee Lee EE 23 EE 23 3 6 DAI Digital Audio Interface ins 23 3 7 Network Status LED Interface iii 24 230 Antenne WANS AC ie i dalia 24 4 Mechamcal DOSO ori e n abo ty e ia fan fk SE pain 26 4 1 Appearance Diagram iii 26 42 Assembly DIE ON ANS soti avi tl tan a ot n ta aa iaia iaia 26 4 2 1 MG2636 Module s Assembly Diagram Dimensions 27 4 22 BZB Connector SO K k i ene dekatonn kb da kt kt ai lb aj ek lt l kn e n l e at a b ie a 27 ZIE GSM Modules Figure Contents Figure 1 1 Module s principle dagrams sn 9 Figure 1 2 Module s application diagramS aaa at aa ata ata taaetasetaeosteooteooserososoeoosorosooooooonon 10 Figure 2 1 Module s A CHE Le Eu ME 14 ZIE GSM Modules Tabl
6. figure 4 4 is ESD protection device MG2636 module baseband processor integrates SIM card interface conforming to ISO 7816 3 standard and it s compatible with SIM card with two voltages 1 8V 3 0V and reserves SIM card interface signal on B2B connector Users should note that SIM card s electrical interface definitions are the same as SIM card socket s definitions See table 3 3 for MG2636 module s B2B connector s interface definitions Table 3 3 MG2636 module s SIM card signal PIN No Signal Name Descriptions of Remarks Functions iu SIM CLK O SIM card clock SIM VCC SIM card power ui output current x 3 SIM DATA WO SiMcarddata ee a O SIM GND SIM card GND SIM card s GND PIN and SIM GND PIN must connect with the LTE GSM Modules ill module spower GND Figure 3 3 Standard SIM card PIN Definitions As shown in figure 3 4 the module connects the external SIM card and SIM VPP could directly connect SIM VCC 33 ohm resistor on 3 wires has been parallel connected with the capacitor to guarantee the compatibility of SIM card with different electrical performances meantime it can also meet the requirements of EMC test standards TOND _ SIM VPP mp mp MG2636 27pF 15k gilt H 27pF Figure 3 4 Connection Diagram of MG2636 module and external SIM card Besides since SIM card design should meet the requirements of ESD electrical performances to avoid the damage of SIM card it s recommended to add TVS comp
7. 0 50DS 0 5V 81 is Shenzhen JieRong Technology Co Ltd 21 LTES GSM Modules DF 12 kak DS D SV d DF 12 ke KDP O 5V_ Figure 4 3 MG2636 module connector s assembly status Vacuum area Fi x Figure 4 4 MG2636 module connector s relevant appearance diagram 28
8. 2A and a 100uF energy storage capacitor is parallel connected at the power end of the module In order to guarantee the supply of current use 5PIN on the power loop as the power supply and GND return current respectively BAT BACKUP is real time backup input interface of MG2636 GSM module As VBAT is ON real time clock could supply power through VBAT as VBAT is not ON BAT_BACKUP will supply the backup power for real time clock BAT_ BACKUP can use the battery to supply the power and the battery voltage ranges from 2 8 5V If the backup battery is not used it could externally connect the capacitor The value of capacitor decides the clock s duration as VBAT is not ON The calculation formula is as below t C 15 t represents the real time clock s duration unit s and C represents the value of capacitor unit uF The required current is about 15uA as MG2636 modules maintains the real time clock function upon the power cut off The following figure is the charge reference circuit of RTC backup battery or capacitor SWITCH K di se RTC UJ N W MG2636 itt RTCHA Figure 3 1 MG2636 Module s RTC Backup Battery Capacitor Reference Circuit AS VBAT gt backup battery it can charge the backup battery and the charging cut off voltage is 3 3V as the battery does not work RTC work current is 15uA 3 2 2 Power On Off The module is under power off status a
9. CE ZIE GSM Modules 1 2 Principle Diagrams RF_ANT Antenna connector RF Transceiver Communication control ST Memory 3 Baseband n n Interface 50 Pin B2B e SS Figure 1 1 Module e principle diagrams ZTE GSM Modules 1 3 Application Diagrams MC2636 a th Ai o 50 PIN B2Bikd 8 En 3 34 BVN pee A een DSPS Figure 1 2 Module s application diagrams ZIE GSM Modules AT Command Manual for ZTE Corporation s MG2636 Modules e ZTE Corporation GPRS modules FAQ Wireless modules Test References 1 5 Acronyms Table 1 2 Table of Acronyms MALE PR Automatic Frequency Control ASit hi Automatic Gain Control I Qi Pr til Absolute Radio Frequency Channel CETTE Number Antenna Reference Point KABA NI Application Specific Integrated Circuit T HR k HE ADC Analog Digital Converter FC GC ARFCN ASIC BER Bit Error Rate ERRI ZK Base Transceiver Station EARE R EE RSR RRE Digital Audio interface Ar EE A Digital to Analog Converter ARR EE HE Data Communication Equipment BOOM A DAC DCE E Il DTR Hl SS RR RS EDGE Enhanced Data Rate for GSM Evolution tee fay AE ZEN GSM HE EFR Enhanced Full Rate P AY AE A EGSM Enhanced GSM Pe an A GSM ZIE GSM Modules FEAR EN TI RA HE JBC KON ETE den HE O Electromagnetic Compatibility Electro Magnetic Interference Electronic Static Dis
10. LTE pit GSM Modules 1010 IAA 100010101101010010111011 This user manual is for MG2636 module ZIE GSM Modules Copyright Statement Copyright 2010 by ZTE Corporation All rights reserved No part of this publication may be excerpted reproduced translated or utilized in any form or by any means electronic or mechanical including photocopying and microfilm without the prior written permission of ZTE Corporation LTE is the registered trademark of ZTE Corporation All other trademarks appeared in this manual are owned by the relevant companies ZTE Corporation reserves the right to make modifications on print errors or update specifications in this manual without prior notice ZTE Corporation keeps the right to make the final explanation to this manual 1 0 TY edition in Apr 2010 ZIE GSM Modules With strong technical force ZTE Corporation can provide COMA GPRS module customers with the following all around technical support 1 Provide complete technical documentation 2 Provide the development board used for R amp D test production after sales etc 3 Provide evaluations and technical diagnosis for principle diagram PCB test scenarios 4 Provide test environment ZTE Corporation provides customers with onsite supports and also you could get supports through telephone website instant communication E mail etc The module website module ztemt com cn provides the relevant industry information and
11. SIM card not enter PIN or searching network Period 3s high level output 0 1s Registered to network IDLE Period 0 125s high level output 0 1s GPRS data transmitting SIG_LED PIN output status is defined according to the software protocol and users could judge the module s work status according to SIG_LED status SIG LED PIN is common UO port which can t directly drive LED and it needs to work with dynatron For detailed circuit please see figure 3 5 Figure 3 5 SIG LED driver LED reference circuit 3 8 Antenna Interface The module provides two kinds of antenna interface e PCB welding pad e Antenna test socket PCB welding pad adopts 500 RF shield cable to connect the module and the antenna in order to reduce the cost However this method can not completely shield the electromagnets which might have slight influence on RF signal quality Please note that there should not be strong radiation near the welding pad Meantime during the welding make sure the core of RF shield cable must connect with RF welding pad and RF shield cable s shield metal mask must be welded to the module s GND During the welding the GND must be welding securely otherwise the core is easily broken due to the shaking of shield cable See figure 3 6 for RF welding pad antenna 24 ZIE px GSM Modules T696615002AA01 RH 45000326110025 PRK1003 011 SUO SOSSEST W O APBG SIS rye Ni E Figure 3 6 MG2636 module RF welding pad ante
12. charge m TS European Telecommunication Standard Frequency Division Multiple Access Way amp HE Full Rate bat X General Packet Radio Service WHT ZH AE ANL 5 Global Standard for Mobile TERE Jup LS e Communications Half Rate PRK IMEI Intematonal Mobile Equipment Identity He N ISO Intemational Standards Organization e be CD I gt L LCD ENE ED BE MCU EE NEEN MS Mobile Station Be VAR Po FERA Pou ProtocolDataumt Watt GE mr Pointtopoint protoco es O RAM Random Access Memory bt HL UT Ie AA fiti d 12 ZIE GSM Modules SE SS DE TUE MT Surface Mount Technology HEE ZAZA SRAM Static Random Access Memory MAPON a a a T TE Terminal Equipment also referred it as Aim thts DTE DTE UART Universal asynchronous H BA RIA receiver transmitter UM User Identifier Management HPA USB Universal Serial Bus wH RITA E USM o Universal Subscriber Identity Module HI CO UR Hu VSWR Voltage Standing Wave Ratio RER EL ZTE Corporation ONE UE RAN A 13 LTE py GSM Modules 2 PIN Definitions Adopting 50 Pin B2B connector interface MG2636 module has 50 pins with the distance 0 5mm between the pins 2 1 Modules PIN Diagram Figure 2 1 Module s PIN Diagram 1 SIM CLK 2 SIM UCC 3 SIM DATA SIH RST SPRI NO 4 ISENSE MIC2N MISE 50 LO A BRE RF RGAE Pin_1 Pin 50 5 6 SIM GND 45 T DAIRXD MICA P 8 DAISYHC 9 J j si
13. e Contents Table 1 1 Table of functions wennen denk kt n essaie ol a pa a T Table 1 2 Table of Acronyms ii 11 Table 2 1 50 Pin B2B Connector Interface Definitions LR 15 ZIE GSM Modules 1 General Description This user manual is for MG2636 modules Refer to this manual to make your hardware and mechanical design fully compatible with GSM GPRS applications except for antenna design With the function of voice SMS and data service ZTE MG2636 module can be used for data transmission wireless POS security and surveillance lottery terminal intelligent metering system wireless fax small switch tobacco communication system campus communications wireless AD wireless media medical surveillance direct discharge station surveillance railway terminals intelligent home appliances and vehicle mounted monitoring etc This manual describes MG2636 module s logic structure hardware interface 8 major functions and provides references to the hardware and mechanical design 1 1 Functions Table 1 1 Table of functions Work frequency EGSM900 Transmit uplink MS BTS 880 915 MHz Dual band _ Receive downlink BIS MS 925 960 MHz EGSM9000 DCS1800 Transmit uplink MS BTS 1710 1785 MHz DCS1800 Receive downlink BIS MS 1805 1880 MHz Max Tx power 31 35dBm typical value 33 dBm Work current GPRS Class10 MAX 300mA UARTO interface 8 wire hardware flow control max data rate 921600bps support do
14. esponding to internal pull down 75KQ DTE s CTS 39 DCDO UARTO corresponding to internal pull down 75KQ nage Je 40 SYSRST_N Module s reset Valid at low level need externally connect dynatron driver Its recommended to parallel connect 0 1uF capacitor to GDN for ESD protection near 50 pin B2B connector 16 ZIE GSM Modules 41 PWRKEY_N Module s power on off Valid at low level need externally connect dynatron driver AGND Pp foo MIC1 N 1CH audio input cathode Default audio I O is the first MIC1_P 1CH audio input anode channel Usually the first 45 MIC2_P AI 2CH audio input anode channel is used for the receiver and the second channel used for headset or hands free 46 MIC2_N AI SPK1_N 1CH audio output cathode SPK1_P 1CH audio output anode 49 SPK2_P AO 2CH audio output LES anode right ear 50 SPK2_N AO 2CH audio output RCE cathode left ear Note 1 I representing digital signal input PIN O representing digital signal output PIN Al representing analog signal input PIN AO representing analog signal input DIN P representing power PIN 2 UARTO and UART1 are named by DCE PIN signals 17 CIE GSM Modules 3 Decription of Hardware Interfaces 3 1 Summary This chapter introduces MG2636 module s each function amp its operation descriptions and provides the designing sample Power interface Charge interface Power on off interface Reset interface UART interface 2CH
15. fter it s normally powered on To turn on the module provide a 2000 3000mS low level pulse to PWRKEY_N pin when the module is OFF In Data mode if you connect VCHG to VPH PWR the module will be automatically powered on It s specially noted that PWRKEY_N is valid at low level which is required externally to connect dynatron driver It s recommended to parallel connect 0 1uF capacitor to GDN for ESD protection near 50 pin B2B connector 19 ZIE GSM Modules 3 2 3 Reset SYSRST_N PIN is used to reset the module s main chip and SYSRST_N signal needs to be pulled down 200ms to reset the module Likewise this pin is required externally to connect dynatron driver and parallel connect 0 1uF capacitor to GDN to prevent SYSRST_N signal from external interference And it s noted that the wiring of 50pin connector must be as short as possible 3 3 COM Port The module provides 1CH serial interface supports 8 wire serial BUS interface or 4 wire serial BUS interface or 2 wire serial interface The module communicates with the external devices and inputs AT commands through UART interface UART supports programmable data width programmable data stop bit programmable parity check or no check and UART port supports from 300bit s to 921 6kbit s baud rate The default baud rate is 115200bit s and it supports baud rate storage upon power drop MG2636 module can directly connect the same signal name of DTE devices Please see table 3 2 module UART signal
16. module technical documentation The authorized module customers could download the latest technical documentation for our website If you have more requirements you could send an E mail to module zte com cn You can also call us at 0755 86140899 for more supports ZIE GSM Modules Preface Summary This user manual is for MG2636 modules It takes MG2636 modules for example to give the reference to the relevant hardware and mechanical design This manual could instruct the users how to quickly and conveniently design different kinds of wireless terminals based on this type of module Target Readers e System designing engineers e Mechanical engineers e Hardware engineers e Software engineers e Test engineers Brief Introduction This manual contains 4 chapters See the table below Chapter 1 General Description Introduces MG2636 module s basic functions principle diagrams application diagrams the relevant documents for reference 2 PIN Definitions Introduces MG2636 module s PIN name and functions 3 Description of Hardware Introduces the design of the hardware interface on each part of MG2636 Interface modules 4 Mechanical Design Introduces MG2636 module s appearance diagram and assembly diagram Update History The update history records the documents update descriptions every time The updates of all previous versions will be contained in the latest version Document Version V1 0 2010 04 22 The
17. names and figure 3 2 for the connection diagram between the module and DTE device Table 3 2 MG2636 module UART external device s signal names and functions UARTO port corresponding Internal pull up 75KOQ i PRT UARTO port corresponding Internal pull up 75KQ ees a UARTO port corresponding Internal pull up 75KQ ER UARTO port corresponding Internal pull up 75KQ i A UART1 port corresponding Internal pull up 75KQ ERP UARTO port corresponding Internal pull up 75KQ ER UART1 port corresponding Internal pull up 75KQ i A UARTO port corresponding Internal pull up 75KQ 20 LTE py GSM Modules VDO Figure 3 2 MG2636 module external DTE device s circuit connection diagram MG2636 module can communicate with RXD and TXD of single chip microcomputer to compose the simplest 2 line mode Its noted that MG2636 module s PIN level typical value is 2 8V and interface level range 2 4V 3 1V Likewise the module can also communicate with the standard RS232 device Due to the different interface level 232 chip must be added for level conversion e g use MAX3232 for 2 wire serial port and use MAX3238 for 8 wire serial port The connection is the same as DTE device above 3 4 SIM Card Interface The module supports 1 8V 3V UIM card and there are 4 pins at the terminal of the card VREG_RUIM is used to supply the UIM card It s strongly recommended to add ESD to protect the UIM card in hostile environments FV2 in
18. nna The antenna test socket is used for the module s calibration and test The contact resistance is small and the shielding is good An exclusive 500 socket to SMA connection cable is used to connect the module and the antenna The antenna test socket s resistance is 500 The antenna test socket s part number is MM9329 2700B Please refer the socket manufacturer s manual to select the relevant 25 LTE GSM Modules 4 Mechanical Design 4 1 Appearance Diagram MG2636 module s appearance rs de stent plico er be erat a ee ae S Figure 3 8 MG2636 modules appearance Dimensions LxWxH 350 10 x 32 5 0 10 x 3 85 0 20 mm e Weight 7g 4 2 Assembly Diagrams 26 ZIE px GSM Modules 4 2 1 MG2636 Module s Assembly Diagram Dimensions RFA EE P N 042120700004 2 00 HE DIR BE 59 30 P N 42220046MT P LES A 1 00 ER FT IL Amp 3 A ANN 2 Z m D Si o AM MG n CU m D da 42 05 m Fe MG26 30 Bit Figure 4 2 MG2636 Module s Assembly Diagram Technical requirements 1 Dimensions Representing check the dimensions 2 tolerances 0 1mm 42 2 B2B Connector Socket In order to meet the requirements of electrical performances of B2B connector users should select the proper connector The part number of the connector for MG2636 module is DF12C 3 0 50DS 0 5V 81 Users can refer to DF12C 3 0 50DS 0 5V 81 specifications to search for the matched connector Remarks DF12C 3
19. onent on 4 CH SIM card signal meantime the signal wire need first pass TVS component and enter the module s baseband processor to avoid the damage of module 3 5 Audio Interface MG2636 GSM module supports 2CH audio signal input output When it s used for hand held devices the hand held MIC hand held receiver or hands free speaker headset MIC headset receiver could be divided See table 3 4 for the audio interface signals Table 3 4 MG2326 module s audio input signals MIC2_N 2CH audio input cathode 1 channel used for SPK1_N 1CH audio output cathode receiver ane SPK1_P 1CH audio output anode channel used for 22 ZIE GSM Modules 49 SPK2_P AO 2CH audio output anode headset right ear hands free SPK2_N 2CH audio output anode Cleft ear 3 5 1 Microphone The two microphone interfaces MIC1 and MIC2 are both differential interfaces which could also be used for single end input It s recommended to use differential mode and meet the requirements of differential signals during the wiring layout and the wiring must be as short as possible to reduce the noises These two inputs are coupled in AC domain and added a 1 8V offset voltage inside and they should directly connect with the microphone ON the circuit design add 33pF filter capacitor to the audio signal wire to reduce the interferences caused by the external antenna meantime add TVS components accordingly 3 5 2 Recelver The receiver interfaces are SPK 1 and SPK
20. wnload and data communication Application UART1 interface 4 wire hardware flow control max data rate 921600bps interface SOPin Standard SIM card interface 1 8V 3 0V support R UIM B2B connector 2CH analog audio I O interface using differential signals 1CH serial digital audio interface using PCM encoding analog audio signal to digital signal Network status indication interface different network status indicated by LED s different flashing modes Power on off interface externally power on off the module through the interface indirect switch power Reset interface externally reset the module through the interface ZIE GSM Modules Antenna MURATA MM9329 2700RA1 50 ohm antenna connector Antenna s welding pad Voice Support FR EFR HR and AMR audio encoding ME Support hands free talk echo suppression function Support MO and MT SMS Support Point to Point and cell broadcast Support TEXT and PDU support PBCCH and virtual online TTT PBCCH and virtual online Embedded TCP IP protocol support multi link provides ACK and large capacity cache Circuit domain Support CSD data service max data rate 14 4Kbit s data service Support USSD Supplementary Incoming caller ID presentation call forwarding call held call waiting etc ento A Physical Dimensions 35 0 10 x 32 5 0 10 x 3 85 0 20 mm Weight 7 0 g ROHS Meet the requirements of ROHS environment protection CE certification Meet the requirements of
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