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1. Semiconductor Group Errata Sheet C167CR LM ES CB CB 1 1 Mh 9 of 10 In addition to the description in the C167 Derivatives User s Manual V2 0 the following feature enhancements have been implemented in the C167CR LM CB step and all higher steps Incremental position sensor interface For each of the GPT1 timers T2 T3 T4 of the GPT1 unit an additional operating mode has been implemented which allows to interface to incremental position sensors A B Top0 This mode is selected for a timer Tx via TxM 110b in register TxCON x 2 3 4 Optionally the contents of T5 may be captured into register CAPREL upon an event on T3 This feature is selected via bit CT3 1 in register TS5CON 10 Compatibility with previous versions In previous versions e g C167CR LM BA step both of the settings TxM 110b T5CON 10 1 were reserved and should not be used Therefore systems designed for previous versions will also work without problems with the C167CR LM CB step and all higher steps Oscillator Watchdog The C167CR LM CB step and all higher steps provide an Oscillator Watchdog OWD which monitors the clock at XTAL1 in direct drive mode In case of clock failure the PLL Unlock OWD Interrupt Request Flag XP3IR is set and the internal CPU clock is supplied with the PLL basic frequency This feature can be disabled by a low level on pin Vpp OWE See also C167CR 4RM Data Sheet 7 97 Bidirectional Reset The C167CR LM CB step and
2. all higher steps allow to indicate an internal watchdog timer or software reset on the RSTIN pin which will be driven low for the duration of the internal reset sequence This option is selectable by software via bit BBRSTEN SYSCON 3 After reset the bidirectional reset option is disabled BDRSTEN SYSCON 3 0 See also C167CR 4RM Data Sheet 7 97 Beginning with the CB step of the C167CR LM RSTIN will also be driven low for the duration of the internal reset sequence when this reset was initiated by an external HW reset signal on pin RSTIN Please note also the following functional difference to the C167CR LM BA step XBUS Peripheral Enable Bit XPEN SYSCON 2 In the C167CR LM CB step and all higher steps bit SYSCON 2 is a general XBUS Peripheral Enable bit i e it controls both the XRAM and the CAN module Compatibility with previous versions When bit SYSCON 2 0 default after reset in the C167CR LM CB step and an access to an address in the range EFOOh EFFFh is made either an external bus access is performed if an external bus is enabled or the Illegal Bus Trap is entered In previous versions e g C167CR LM BA step the CAN module was accessed in this case Systems where bit SYSCON 2 was set to 1 before an access to the CAN module in the address range EFOOh EFFFh was made will also work without problems with the C167CR LM CB step and all higher steps Application Support Group Munich Semiconductor Group E
3. C167CR LM ES CB CB 1 1 Mh 10f 10 Functional Problems PWRDN 1 Execution of PWRDN Instruction while pin NMI high When instruction PWRDN is executed while pin NMI is at a high level power down mode should not be entered and the PWRDN instruction should be ignored However under the conditions described below the PWRDN instruction may not be ignored and no further instructions are fetched from external memory i e the CPU is in a quasi idle state This problem will only occur in the following situations a the instructions following the PWRDN instruction are located in external memory and a multiplexed bus configuration with memory tristate waitstate bit MTTCx 0 is used or b the instruction preceeding the PWRDN instruction writes to external memory or an XPeripheral XRAM CAN and the instructions following the PWRDN instruction are located in external memory In this case the problem will occur for any bus configuration Note the on chip peripherals are still working correctly in particular the Watchdog Timer will reset the device upon an overflow Interrupts and PEC transfers however can not be processed In case NMI is asserted low while the device is in this quasi idle state power down mode is entered Workaround Ensure that no instruction which writes to external memory or an XPeripheral preceeds the PWRDN instruction otherwise insert e g a NOP instruction in front of PWRDN When a muliplexed bus wi
4. SIEMENS Microcontroller Components Errata Sheet May 29 1998 Release 1 0 Device SAK C167CR LM SAK C167CR L25M Stepping Code Marking ES CB CB Package MQFP 144 This Errata Sheet describes the deviations from the current user documentation The classification and numbering system is module oriented in a continual ascending sequence over several derivatives as well already solved deviations are included So gaps inside this enumeration could occur The current documentation is Data Sheet C167CR 4RM Data Sheet 07 97 C167SR CR L25M Data Sheet Addendum 1998 03 Users Manual C167 Derivatives User s Manual V2 0 03 96 Instruction Set Manual 12 97 Version 1 2 Note Devices marked with EES or ES are engineering samples which may not be completely tested in all functional and electrical characteristics therefore they should be used for evaluation only The specific test conditions for EES and ES are documented in a separate Status Sheet Change summary to Errata Sheet Rel 1 0 for devices with stepping code marking ES CB Modifications of ADM field while bit ADST 0 ADC 11 POH spikes after XPER write access and external 8 bit Non multiplexed bus X12 Execution of PWRDN Instruction while pin NMI high PWRDN 1 Bidirectional Hardware Reset RST 3 Arithmetic Overflow by DIVLU instruction CPU 17 workaround extended ADC Overload Current ADCC 2 AC timing relaxations added Semiconductor Group Errata Sheet
5. as been changed before or with the same instruction which selected the auto scan mode this channel number has no effect on the unintended auto scan sequence i e it is not used in this auto scan sequence Note When a conversion is already in progress and then the configuration in register ADCON is changed the new conversion mode in ADM is evaluated after the current conversion the new channel number in ADCH and new status of bit ADST are evaluated after the current conversion when a conversion in fixed channel conversion mode is in progress and after the current conversion sequence i e after conversion of channel 0 when a conversion in an auto scan mode is in progress In this case it is a specified operational behaviour that channels n 1 0 are converted when ADM is changed to an auto scan mode while a fixed channel conversion of channel n is in progress see e g C167 User s Manual V2 0 p16 4 Workaround When an auto scan conversion is to be performed always start the A D converter with the same instruction which sets the configuration in register ADCON RST 3 Bidirectional Hardware Reset When the bidirectional reset feature is enabled bit BDRSTEN SYSCON 3 1 and a short hardware reset pulse gt 4 TCL is applied to pin RSTIN the following problem may occur Pin RSTIN may not be driven low by the internal circuitry for the duration of the internal reset sequence if the falling edge of the hardware reset p
6. ed after a DIVLU instruction with the TASKING C166 compiler for the following intrinsic functions code is generated which uses the overflow flag for minimizing or maximizing the function result after a division with a DIVLU _div_u32u16_u16 _div_s32u16_s16 _div_s32u16_s32 Consequently an incorrect overflow flag when clear instead of set might affect the result of one of the above intrinsic functions but only in a situation where no correct result could be calculated anyway These intrinsics first appeared in version 5 1r1 of the toolchain Libraries not affected Semiconductor Group Errata Sheet C167CR LM ES CB CB 1 1 Mh 30f 10 ADC 11 Modifications of ADM field while bit ADST 0 The A D converter may unintentionally start one auto scan single conversion sequence when the following sequence of conditions is true 1 the A D converter has finished a fixed channel single or continuous conversion of an analog channel n gt 0 i e contents of ADCON ADCH n during this conversion 2 the A D converter is idle i e ADBSY 0 3 then the conversion mode in the ADC Mode Selection field ADM is changed to Auto Scan Single ADM 10b or Continuous ADM 11b mode without setting bit ADST 1 with the same instruction Under these conditions the A D converter will unintentionally start one auto scan single conversion sequence beginning with channel n 1 down to channel number 0 In case the channel number ADCH h
7. ge of ALE for the external bus cycle POH x low _ gt output low voltage rises to approx 2 5V spike width approx 7ns 0 2 Vcc POH x high gt output high voltage drops to approx 2 0V spike width approx 7ns 0 8 Vcc Referring to a worst case simulation the maximum width of the spikes may be 15ns with full amplitude Vcc Vss But this might not be seen on application level Note that if any of the other bus modes is selected in addition to the 8 bit non multiplexed mode POH can not be used for I O per default Workaround use a different port instead of POH for I O when only an external 8 bit non multiplexed bus mode is selected or use a different bus type e g 8 bit multiplexed where P1H may be used for I O instead of POH or the spikes on POH may be filtered with an application specific RC element or do not perform an external bus access directly after an XBUS write access this may be achieved by an instruction sequence which is executed in internal ROM Flash OTP or internal RAM or internal XRAM e g ATOMIC 3 to prevent PEC transfers which may access external memory instruction which writes to XBUS peripheral NOP NOP Semiconductor Group Errata Sheet C167CR LM ES CB CB 1 1 Mh 50f 10 Deviation from Electrical and Timing Specification The following table lists the deviations of the DC AC characteristics from the specification in the C167CR 4RM Data Sheet 7 97 and C167SR CR L25M Data Sheet Addendu
8. m 1998 03 AC Characteristics Vec 5Vt5 fcpu 24 MHz L25M version only CL 50 pF Problem Parameter Symbol Limit Values Unit Test short name min max Condition DCVOL 1 Output low voltage Vor 0 45 V l 2 0 mA Port0 1 4 ALE RD instead of WR WRH BHE 2 4 mA CLKOUT RSTOUT DCAH 1 ALE active current evi 1000 MA Vy 2 4 V instead of 500 DCRL 1 RD WR active current law 600 MA Vous Vomax DCP6L 1 Port 6 active current l 600 i MA Vour Vorma instead of 500 DCHYS 1 Input Hysteresis HYS 300 mV l Special Threshold instead of LEERE L Semiconductor Group Errata Sheet C167CR LM ES CB CB 1 1 Mh 60f 10 JUnit Parameter Symbol CPU Clock Variable CPU Clock 20 MHz 1 2TCL 1 to 24 MHz min max min max ALE high time t5 10 ta TCL 15 ta ns instead of instead of 15 ta TCL 10 ta WR WRH low time t12 38 tc 2TCL 12 tc ns with RW delay instead of instead of 40 tc 2TCL 10 tc WR WRH low time t13 63 tc 3TCL 12 tc ns no RW delay instead of instead of 65 tc 3TCL 10 tc Address hold after t28 5 tf 5 tf instead ns WRH instead of of O tf O tf ALE falling edge to t38 7 ta 10 ta 7 ta 10 ta ns CS instead of instead of 4 ta 4 ta RDCS WRCS low t48 38 tc 2TCL 12 tc ns time instead of instead of with RW delay 40 tc 2TCL 10 tc RDCS WRCS low t49 63 tc 3TCL 12 tc n
9. rrata Sheet C167CR LM ES CB CB 1 1 Mh 10 of 10
10. s time instead of instead of with RW dela 65 tc 3TCL 10 tc Notes 1 Pin READY has an internal pullup all C167xx derivatives This will be documented in the next revision of the Data Sheet 2 Timing t28 Parameter description and test changed from Address hold after RD WR to Address hold after WR It is guaranteed by design that read data are internally latched by the controller before the address changes 3 During reset the internal pullups on P6 4 0 are active independent whether the respective pins are used for CS function after reset or not Semiconductor Group Errata Sheet C167CR LM ES CB CB 1 1 Mh 70f 10 ADCC 2 ADC Overload Current During exceptional conditions in the application system an overload current can occur on the analog inputs of the A D converter when Van gt Vaa OF Van lt Va For this case the following conditions are specified in the Data Sheet loma 5 MA The specified total unadjusted error TUE 2 LSB is only guaranteed if overload conditions occur on maximum 2 not selected analog input pins and the absolute sum of input overload currents on all analog input pins does not exceed 10 mA Due to an internal problem the specified TUE value is only met for a positive overload current l lt 5 mA all currents flowing into the microcontroller are defined as positive and all currents flowing out of it are defined as negative If the excep
11. th memory tristate waitstate is used the PWRDN instruction should be executed out of internal RAM or XRAM Semiconductor Group Errata Sheet C167CR LM ES CB CB 1 1 Mh 20f 10 CPU 17 Arithmetic Overflow by DIVLU instruction For specific combinations of the values of the dividend MDH MDL and divisor Rn the Overflow V flag in the PSW may not be set for unsigned divide operations although an overflow occured E g MDH MDL Rn MDH MDL FOFO OFOFh FOFOh FFFF FFFFh but no Overflow indicated result with 32 bit precision 1 0000h The same malfunction appears for the following combinations nOnO OnOn nOnd n00n Onno n0O0n n000 000n n000 nOnn Onnn nOnn where n means any Hex Digit between 8 F i e all operand combinations where at least the most significat bit of the dividend MDH and the divisor Rn is set In the cases where an overflow occurred after DIVLU but the V flag is not set the result in MDL is equal to FFFFh Workaround Skip execution of DIVLU in case an overflow would occur and explicitly set V 1 E g CMP Rn MDH JMPR cc_ugt NoOverflow no overflow if Rn gt MDH BSET V set V 1 if overflow would occur JMPR cc_uc NoDivide and skip DIVLU NoOverflow DIVLU Rn NoDivide ot next instruction may evaluate correct V flag Note the KEIL C compiler run time libraries and operating system RTX166 do not generate or use instruction sequences where the V flag in the PSW is test
12. tional conditions in the application system cause a negative overload current then the maximum TUE can be significantly exceeded depending on value of and R of converted channel when the negative overload current occurs on analog input channel ANn n 10 the accuracy of the neighbour channels ANn 1 and ANn 1 is affected when the negative overload current occurs on channel AN10 the accuracy of all other analog input channels is affected Semiconductor Group Errata Sheet C167CR LM ES CB CB 1 1 Mh 8of 10 History List since device step BA Functional Problems AC DC Deviations Functional Short Description aa Problem ste PWRDN 1_ Execution of PWRDN Instruction while pin NMI high CPU 8 Jump instruction in EXTEND sequence CB CPU 9 PEC Transfers during instruction execution from Internal RAM CB CPU 11 Stack Underflow during Restart of Interrupted Multiply CB CPU 17 Arithmetic Overflow by DIVLU instruction RST 1 System Configuration via POL O during Software Watchdog Timer Reset CB RST 3 Bidirectional Hardware Reset ADC 8 CC31 ADC Interference CB ADC 10 Start of Standard Conversion at End of Injected Conversion CB ADC 11 Modifications of ADM field while bit ADST 0 X9 Read Access to XPERs in Visible Mode X12 POH spikes after XPER write access and external 8 bit Non multiplexed bus AC DC Short Description Fixed in Deviation ste see pages 6 8
13. ulse occurred during the second cycle of a 2 cycle instruction e g CALL RETI TRAP As a consequence the level at pin RSTIN may be pulled up to a high level through the internal pullup in case the external reset source is no longer driving the pin low Note The internal reset sequence is always completed correctly Software and Watchdog Timer reset are not affected by this problem This problem will be fixed in the next step X9 Read Access to XPERs in Visible Mode The data of a read access to an XBUS Peripheral XRAM CAN in Visible Mode is not driven to the external bus PORTO is tristated during such read accesses Semiconductor Group Errata Sheet C167CR LM ES CB CB 1 1 Mh 40f 10 X12 POH spikes after XPER write access and external 8 bit Non multiplexed bus When an external 8 bit non multiplexed bus mode is selected and POH is used for general purpose I O and an internal byte or word write access to an XBUS peripheral e g XRAM CAN or I C module is performed and an external bus cycle is directly following the internal XBUS write cycle then POH is actively driven with the write data for approx 7ns spikes on POH The spikes also occur if POH is configured as input However read operations from POH are not affected and will always return the correct logical state The spikes have the following position and shape in a typical application spikes occur after the rising edge of CLKOUT which follows the rising ed

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