NUCLEUS PLUS - Phillip Technologies, LLC
Contents
1. Section 11 Specifications 11 0 Device Parameters Table 3 Device Parameters 0 10 to 99 99 g cm3 0 00 to 15 00 11 1 Deposition Settings Table 4 Coating 0 10 to 99 99 g cm3 0 00 to 15 00 0 00 to 9999 99 A s 0 00 to 9999 99 KA 0 00 to 999 99 0 00 to 999 99 s 0 00 to 999 99 s 0 00 to 999 99 s 0 00 to 999 99 s 0 00 to 99 99 96 0 00 to 999 99 s 0 00 to 999 99 s 0 00 to 99 99 96 20 21 11 2 11 4 Specifications 11 2 Measurement Table 5 Measurement 0 002 Hz 10x to 1x per second 5 or 6 MHz 0 1 0 1 11 3 Display Table 6 Process Display Selected Material 0 00 to 99 9 A s 0 00 to 999 9 K 3 00 to 6 500 000 Hz Hh mm ss 0 to 999 9 C 0 00 to 100 96 11 4 Communications Table 7 Communications 11 5 Deposition Settings Table 8 Inputs and Outputs 11 5 Specifications 24 VDC One Half Duplex Two BNC Connector 2 Type K Connectors One DB9 Connector 22 End Manual 2003 Perimeter Rd Suite E Greenville SC 29605 864 277 1560 sales Phillip Tech com support Phillip Tech com TECHNOLOGIES2. Menu Process Tab eene Section 6 Device Parameters 6 0 Setup Menu Device Parameters Tab Section 7 Manual Power 7 0 Setup Menu Manual Power Tab Section 8 First Start 8 0 Communication Port Selection 8 1 PLFOCCCUIE cccccccceccccececccceccaceccceccceneneccentaceneanentanes Section 9 Using the Software 9 0 PAGE INNER 9 1 Adding a POE de 9 2 Starting a DepoSltlODs sin cuia oct S Exe ndn ee Ex oan ER a ces p p U p 0 6 6 7 8 10 11 12 13 14 15 16 16 17 17 18 18 Contents Section 11 Specifications 11 0 11 1 11 2 11 3 Section 10 HOUDIESHOONNG NETT p 19 Device Parameters arrrarnanrnnrnnnrnnrnnnnnannnnrnnnnannnernanenernnnnnnenunenernasnnnene p 20 Deposition SN p 20 Measurement EEE p 21 Process WSF m ESENS p 21 COMI GAM ONS EEE iaoe p 21 11 4 11 5 Deposition SENGS kane dendritic Ga eda aia p 22 Tables amp Figures Tables 1 Coating 9SbDEIHOOllOEISisarenneemutiuntepuuu t dunqpdretiode EN NE p 12 2 TOUS SIO OMIM eee E UT A p 19 3 Device SCC INC 0 gi MR RN RR ET p 20 4 Sociale SCH CANO ING EE p 20 5 Measurement Specifications eeessessseesseesssessese nennen nennen nnns p 21 6 Process Display SPecifiCations cccccecccseeceeeceeeceeeceeeteeeeeeeteeeteeet
3. deposition This is useful when a shutter is used Section 5 Process Controls Selections Layer Process Device Parameters Manual Power Set Process Name Process List Process Settings Rate A s Thickness KA Clear Settings 5 0 1 Set Process Name Enter a process name 5 0 2 Process List This list contains the current saved processes 5 0 3 Save Process When a new process name is entered this button will be enabled to save a new process Load Process 0 0 4 Load Process When a process is selected from the process list this button will be enabled to load the process Processes are automatically loaded If the process is changed press the Load Process button to reload the previous settings 5 0 5 Update Process When the process has been changed press the update process button to save the changes 5 0 6 Clear Process List This button deletes all of the saved processes Select Layer gm Process Type r Codeposition Delete Layer Clear Settings Rate Als Thicknes KA 5 0 Process Controls Selections 5 0 7 Finish This exits the setup window Save any changing before pressing Finish 5 0 8 Select Layer Select the layer for the process 5 0 9 Process Type Selected if user intends to add multiple layers 5 0 10 Add layer Adds the currently selected layer 5 0 11 Delete layer Deletes the current remove layer number 5 0 12 Remove layer Sel
4. material and enter the desired density ZFactor cm 3 n g ap eo Ld Soak Time gt Q Derivative AI o Soak Time s Rise to Predeposit y Mi 1 Soak Power 96 T 1 1 Predesposit Time s Tooling Factor jJ 100 4 0 Layer Controls Selections 4 0 8 Z Factor Z Factor of Material 1 The field automatically populates with the value selected under Material 1 The Z Factor can be manually adjusted using the dropdown arrows 4 0 9 Proportional Indicates the Proportional of the source 4 0 10 Integral Indicates the Integral of the source 4 0 11 Derivative Indicates the Derivative of the source 4 0 12 Rise to Soak Time Defines the rise to soak power in seconds 4 0 13 Soak Time Defines the amount of soak time in the soak power 4 0 14 Soak Power Defines Soak power 4 0 15 Rise to Predeposit Defines the Rise to Predeposit power in seconds 4 0 16 Predeposit Time Defines the amount of Predeposit Time in predeposit power 4 0 17 Predeposit Power Determines the Predeposit Power 4 0 18 Tooling Factor Selects the Tooling Factor for the material 4 0 Layer Controls Selections weno 4 0 19 Source Select p Select the source which will control the material deposition a 4 0 20 Sensor Select Select the sensor that will monitor the deposition Dwell Time 4 0 21 Dwell Time y Select the time delay between the predeposit and automatic
5. TM MUGLEVS PLUS PC based film thickness controller i ger an LE ene ee Va dE 1 a ge FUA y a j la DUI 3 E ini Neth pt j AE Th Meere Fr Vey bs H ENG n i EN ol an E 1 Vi ERI s Een ER ai Em 5 A ia EU vu Min M EMT e i a dus E zm c as poe n user manual Je TECHNOLOGIES A WARNING All electrical components are to be considered extremely dangerous if tampered with in any way Phillip Technologies is not liable for any injury resulting from product misuse modification or disassembly D WARRANTY LABEL f the warranty label has been tampered with VOID will appear where the warranty label was originally placed If this is visible at the time of arrival it is important that you contact Phillip Technologies immediately after receiving the product Copyright 2014 Phillip Technologies All information contained within this technical manual and accompanying pages are copyright of Phillip Technologies All rights reserved It is a breach of copyright if this technical manual is copied distributed or reproduced in whole or part using any means whatsoever without the prior written approval of Phillip Technologies Phillip Technologies gives no condition or warranty expressed or implied about the fitness of this technical manual or accompanying hardware product Phillip Technologies reserves the right to make changes to this technical manual or accompanying hardware o
6. These items represent the same values as the indicators but in graphical form Click on the tabs graph titles to switch between graphs During the run you have the ability to change the scale of the x axis and y axis 3 2 1 Rate Graph Displays a graphical representation of the rate as a function of time 3 2 2 Temperature Displays a graphical representation of TC temperature as a function of time 3 2 3 Thickness Graph Displays a graphical representation of thickness as a function of time 3 2 4 Frequency Displays a graphical representation of frequency as a function of time Unit time is dependent on sample period Section 4 Layer Controls Selections Layer Process Device Parameters Manual Power Layer Name Layer Select Deposition Settings Tooling Factor Predesposit Time s Predeposit Power an Ag y y 4 0 1 Save Layer Saves the deposition settings under a new layer named as stated mm 4 0 2 Load Layer Loads the layer name selected under the Layer Select dropdown menu 4 0 3 Update Layer Updates any changes to the selected layer dean 4 0 4 Clear All Layers Clears all of the saved layers 4 0 5 Finish Closes the Setup Menu 4 0 6 Material Dropdown option enables selection of the material being deposited Densi igen 4 0 7 Density Density of the material to be deposited is automatically populated when a material is selected For custom densities select Custom under
7. d select the correct COMPORT 3 Click the Setup button and open the Setup Menu 4 Select the material and make sure the Density and Z Factor is correct and save layer 5 Switch to the Device Parameters tab 6 Select the correct Crystal Frequency Tooling Factor and name the log file alpha values and filter 7 Press the update parameters button 8 Press FINISH when all changes are saved Section 9 Using the Software 9 0 Adding a Layer This guide will instruct on how to add a new layer to be used in the deposition process This is done from the Layer tab in the Setup window 9 0 1 9 0 2 9 0 5 9 0 4 9 0 5 Enter the desired layer name in the Layer Name Field Press the Save Layer button to save the new layer Enter the desired information for the process Press Update Layer to save the changed settings Press Finish if there are no more changes to save 9 1 Adding a Process This guide will instruct on how to add a deposition process This is done from the Process tab in the Setup window 9 1 1 9 1 2 Enter the desired process name in the Set Process Name field Press the Save Process button to save the new process Select the layer to be added under Select Layer Select the process type under Process Type If using codeposition only 1 more layer will be available to be added If using sequential up to 10 layers will be available to be added Pr
8. e sure that the tamper evident labels are intact In order to ensure safe correct operation of your Nucleus Plus please follow the step by step instructions presented in the Nucleus Plus Quick Start guide Warranty Nucleus Plus is warranted to the original purchaser to be free of any manufacturing related defects for one year from the date of purchase Phillip Technologies reserves the right to repair or replace the unit after inspection Contact support Phillip Tech com for more information Contents WES AAA Oi Rc Safety ALLA KG 0 EE OE ENNER COVO EE EE About Nucleus Plus msrrruvrrsnvennvrernvrnrvrrnnvvernrernverrnrersrorsnvenvrersrennnn TENNE Inspection and Initial Setup rrrrnnrrnnrrnnrrnnrranevanennernnnrnnnrvnnennnennnen VIN NP RR RE oection 1 System Components and Connections 1 0 Nucleus Plus Package Eeg RETE 1 1 Proton System Components Section 2 Hardware and Design 2 0 Connecting Inputs seeeeeeeeeeeeeereeen 2 1 Connecting OUIPUIS vrasiciceceisceositacutcadwenataneesbebiede bseeds Section 3 Front Panel Controls and Displays 3 0 0115 MLPH HQ 3 2 Status Displays rrrrrrrorrrrnrorarernnrrrnrrnnarnnnernvanennnennnne 3 3 E 1 0 EEE Section 4 Layer Controls Selections 4 0 Setup Menu Layer Tab rrnnnrnnnnonannnnanennnnnnnnennnnnnnrr Section 5 Process Controls Selections 5 0 Setup
9. ects the layer to be removed after pressing the Delete Layer button 5 0 13 Clear settings Clears all of the currently active processes settings 5 0 14 Layer Displays the name of the layer to receive deposition 5 0 15 Rate A s The target deposition rate for the active layer 5 0 16 Thickness KA The target thickness for the active layer This field displays information only and cannot be changed Section 6 Device Parameters Layer Process Device Parameters Manual Power Crystal Frequency Append Log Name pr Size 6 Mhz x Thickness 01 02 03 04 05 06 07 08 09 1 Zero Before Run Zero S1 Before PID Zero S2 Before PID gt C C Relay 1 Relay 2 6 0 1 Append Log Name Log files can be named in the Append Log Name box Filter Size 6 0 2 Filter Size gi The buffer size for averaging time Alpha 6 0 3 Alpha goo Alpha is a data smoothing parameter Increase Alpha for quicker response Decrease Alpha for smoother response aa 6 0 4 Crystal Frequency Crystal frequency range can be selected on the dropdown 6MHz or 5 MHz option ie ErsrEm 6 0 5 Zero Before Run Zeros the thickness before a process starts 6 0 6 Zero S1 before PID Zeros Sensor 1 before entering into automatic deposition 6 0 Device Parameters m teers 6 0 7 Zero S2 before PID s Zeros Sensor 2 before entering into automatic deposition 6 0 8 Relay 1 Operation mode for relay Actuates Relay 1 see Table 1 fo
10. eeeteenaes p 21 T Communication S EAN Baran p 21 8 Input and Output SPECIES ONS een p 22 Figures A Nucleus Plus System p 1 COMMON GIS NNI cneselwaeaastewnseiwagenniaanesleamedaens p 2 B Phoenix System Package Content ccccccccseccssecceseeseeeceeeeeeeessneeaaees p 2 C Connections Between Phoenix System Components p 3 D Nucleus Plus Front Hardware p 3 Goa 1 1 0 Lo gt pie tivo m LrU d sarees ncivvieiacide D 5 E Nucleus Plus Rear Hardware p 8 CONNECCION EEE p 11 F Front Panel Controls and DiSplayS c cccccecccceecceeeceeeseeeeceeeeseeeaneeseeeeaes p 13 G TES IM NAD RENE es p 15 H PROCS SS NAD EEE p 16 Device Parameters TaDicesscneeeicssestdcent ee E J Kanaal F Owar TaD EE E er K Comport Selection Prompt cccccecceeccseeceeeceeeceeeseeeseeeseeseeeteeetseetseeeeeenaes Section 1 System Components and Connections Power Supply Nucleus Plus Thin Film Input 100 200VAC 50 60Hz 2 0A Monitor Output 24V 3 75A 90W MAX Nucleus Plus Monitor BNC Sensor Inputs Type K Thermocouple Inputs Power Power Supply Cable North America standard plug Europlug available on request RS 232 Extension Cable Standard male to female serial cable BNC to Microdot Cable Quartz Crystals Nucleus Plus Quick Start Nucleus Plus Software Guide Disc Eon LT software Labview runtime USB drivers and manual Software requires administrat
11. ess Add Layer Button 9 1 10 9 1 11 9 1 9 2 Software In the Rate A s Field for the newly added layer enter the target rate for the deposition In the Thickness K A field for the newly added layer enter the target thickness for the deposition Repeat steps 9 1 2 to 9 1 7 to add more layers When all changes are saved press Finish to exit the setup window 9 2 Starting a Deposition This guide will instruct on how to begin a deposition process This action is performed in the front panel The setup window should not be open when starting a deposition 9 2 7 9 2 2 9 2 3 9 2 4 9 2 5 9 2 6 Select the process to be deposited from the Process Selection Ensure that the correct sensor tab is selected Press Start to start the deposition If the processes needs to be aborted press the Abort button Wait for the process to complete and the Process Complete window to appear Repeat stops 9 2 1 to 9 2 6 to start other processes Section 10 Troubleshooting Table 2 Troubleshooting Frequency reads 2 0 Hz Sensor not detected Check sensor connection No information displayed Wrong comport selected Restart and select the correct comport Rate reads 1 Improper settings Restart software and Nucleus Plus If you cannot resolve an issue please contact Phillip Technologies support at support PhillipTech com or call 480
12. ive Figure A Nucleus Plus Package Components Phoenix System Phoenix Sensor Head Phoenix temperature measuring sensor head Figure B Proton Package Components Proton Sensor Head substrate source shutter UNES TM Nucleus Plus TM Nucleus Plus software Figure C Connections Between Proton System Components Section 2 Hardware and Design BNC Sensor Inputs For connecting to sensor head Outputs For relay and source outputs Type K Thermocouple Inputs For temperature measurement OG Figure D Nucleus Plus Front Hardware Connections Power Input 24 VDC Power Input RS 232 For connecting Nucleus Plus LED Indicator Variable Stat Indicator Figure E Nucleus Plus Rear Hardware Connections 2 0 2 1 Connecting Inputs amp Outputs Nucleus Plus has been designed so that ONLY the correct hardware can be plugged into the appropriate input or output The following is a guideline on how hardware should be connected in order to prevent damage to Nucle 2 0 Connecting Inputs There are four 4 inputs attached to Nucleus Plus It is important that the correct hardware is used with these inputs see Figure E 2 0 1 Power Only the provided power supply should be used with Nucleus Plus Not doing so will cause hardware damage to Nucleus Plus that will not be covered by warranty Ensure that the power supply has a 24 VDC 2 0 2 Compor
13. n Log files 3 0 4 Zero Thickness ZT The interface contains three ZT buttons one on each sensor tab 2 and one on the control tab The control tab ZT button zeroes both sensors simultaneously 3 0 5 Relay 1 1 e Actuates Relay 1 3 0 3 1 Front Panel Controls and Displays 3 0 6 Relay 2 Actuates Relay 2 3 0 7 Setup Change settings to materials processes etc 3 0 8 Process Select the active process 3 1 Status Displays Custom Rate s 0 00 Temperature C 0 Thickness KA 0 0000 Frequency Hz 0 000 Health v 3 1 1 Film Displays the current film being deposited 3 1 2 Rate Displays the current rate of deposition in angstroms per second 3 1 3 Temperature Displays the TC temperature reading numerically and graphically the fill bar covers a range of 0 C to 500 C 3 1 4 Thickness Displays the current thickness of the material in kilo angstroms or angstroms 3 1 5 Frequency Displays the current frequency of the crystal in hertz 3 1 6 Health Displays the crystal health in graphical and numeric form the fill bar covers a range of 0 to 100 3 1 3 2 Front Panel Displays and Graphs crystal 3 1 7 Crystal Displays if the crystal health is below 50 Source 1 3 1 8 Source 1 HN Displays if Source 1 is active above 0 power for the current sensor 3 1 9 Source 2 Displays if Source 2 is active above 0 power for the current sensor 3 2 Graphs
14. r design without notice to any person or company Phillip Technologies shall not be liable for any indirect special consequential or incidental February 2014 damages resulting from the use Version 3 0 of this technical manual or the EXAMINE YOUR NEW NUCLEUS PLUS FOR ANY SIGNS OF PHYSICAL DAMAGE ALSO ENSURE THAT THE TAMPER EVIDENT LABELS ARE INTACT Before shipping your Nucleus Plus was calibrated and tested by Phillip Technologies to meet the highest quality standards It is important that you take a few minutes to inspect the product to ensure that your equipment was not damaged or otherwise What Is the Nucleus Plus Thin Film About Nucleus Plus With the ability to sense deposition and temperature with high precision the Nucleus Plus thin film monitor is one of the newest advancements in Thin Film deposition monitors The Nucleus Plus provides features that help improve measurement accuracy for better process monitoring LabVIEWO Interface The Nucleus Plus offers a simple LabVIEW interface that provides control and operation that is intuitive efficient and impressive The Nucleus Plus is easy to set up right out of the box Software Updates The Nucleus Plus interface software can be upgraded on site to provide software improvements There will be notifications when these updates become available Inspection amp Initial Setup Examine Nucleus Plus for any signs of physical damage Also mak
15. r functions 6 0 9 Relay 2 Operation mode for relay Actuates Relay 2 see Table 1 for functions UpdateParancterd 0 0 10 Update Parameters 3 Updates Nucleus Plus with any changes made in the Device Parameters tab In order to implement any changes to the device parameters Update Parameters must be selected Table 1 Coating Manual No automatic action The relay button must be pressed to actuate Start Triggers the relay when a process is started After Predeposit Triggers the relay after a predeposit is complete Predeposit Trigger Triggers the relay when the predeposit starts Section 7 Manual Power Layer Process Device Parameters Manual Power Manual Source Power 1 Manual Source Power 2 Source Power Source Power y 0 y 0 7 0 1 Manual Power 1 Enables manual power for Source 1 7 0 2 Manual Power 2 Enables manual power for Source 2 sume Por 7 0 3 Source 1 Power oets the percent power for Source 1 7 0 4 Source 296 Power oets the percent power for Source 2 7 0 5 Update Power oets manual power If left unselected power will remain unchanged As a safety feature if power is changed and the button is unselected power will return to 0 Power also returns to 0 when exiting the setup window Section 8 First Start 8 1 Procedure 1 Plug in the Nucleus Plus and all of its components 2 Open on the Nucleus Plus software an
16. t Connect an RS232 cable to this port Always use the provided USB to RS232 cable 2 0 3 BNC Nucleus Plus has a built in oscillator Phillip Technologies also offers an external oscillator for purchase The cable between Nucleus Plus and the crystal should remain as short as possible to avoid noise The advisable maximum acceptable length for this is one 1 foot or 30 cm 2 0 4 TC Connection Nucleus Plus uses a thermocouple probe to measure the temperature of the sensor head 2 1 Connecting Output There is one 1 output attached to Nucleus Plus 2 1 1 DB9 Connector Connects the two SPST relays Section 3 Front Panel Controls and Displays G L L N AT E G Eon PROCESS CONTROL Ex Haa I Ancar Film Rate amp Temperature C Custom 0 00 01D ULLAS KA Hau IT Health i i 0 0000 0 000 uw Run Time s Source Power 95 0 0 00 Urwata Source I Sourced Fate amp Teuas Lzmcmecv amp Lannea 3 oh T E uf ite y Se z 400 PEAT Y war 1 E E l TM 51 E nwa SUE B i r am p r I di Eram gt 3 0 1 Start Initiates the selected deposition process Each time a deposition process is initiated a new log file is created 3 0 2 Abort 1 Manually cancels the deposition process and closes the log file 3 0 3 Log Lee if Logs the current running process New log files can be found on the hard drive under Eo
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