SN75DP130 EVM Users Manual (Rev. A)
Contents
1. 3P3V 3P3V o ii 1PO5V R36 0 1 R37 ODNI VCCO SS AND DS VCO SS VDD DS Tae VCC1 SS AND DS DNCO SS VDDD4 ps HE E DNC1 SS VDDD5 DS EE INSTALL DNI N SES ENEE s eg eu VCC2 SS VDDDO DS DNC2 SS VDDD6 DS KE VCC3 SS VDDD1 DS DNC3 SS VDDD7 DS GOD deded VCC4 SS VDDD2 DS Lip SEE INSTALL DNI NOTE VCC5 SS VDDD3 DS E A P l C22 C23 C24 C25 C26 C27 C28 C29 0 001uF 0 001uF 0 001uF 0 001uF 0 01uF 0 01uF 0 1uF 0 1uF C30 c31 C32 C33 C34 C35 C36 d 1 d 1 1 0 1uF 0 01uF 0 0iuF 0 001uF 0 001uF 0 001uF 0 001uF 4 4 A A A PLACE NEAR THE DP130 DEVICE SN PLACE NEAR THE DP130 DEVICE LT y NGI Ke R38 NG3 145 2k e VDDD REG VDDD DREG PIN A ul R39 0 E j g SEE INSTALL DNI NOTE Ge 8 a SR Rip KS VDDD DREG PIN VDDD_DREG_SS_VDDD8_DS GND3 Pi 2 U DI 49 YELLOW SEE INSTALL DNI NOTE THERMAL_PAD o S DP130 81 p1 S ad ger C37 C38 C39 C40 3 DREG LED 1uF 0 1uF 0 01uF 0 001uF c2 4 DREG LED BASE yy PLACE NEAR THE DP130 DEVICE paba Eo E INSTALL i SC ZXTD09N50DE6 ohm R35 R40 R37 R39 1P05V 3P3V 4 4 9 C41 C42 C43 C44 C45 C46 C47 C48 C49 C50 C51 C52 TuF TuF 0 1uF 0 1uF 0 01uF 0 01uF TuF TuF 0 1uF 0 1uF 0 01uF 0 01uF e ki d TEXAS INSTRUMENTS PAGE2. 1 E oclo TDO ot TDI I AE TMS pi 219 o8 j TCK 1 2160110 JTAG is for lab evaluation only DNI Conn 2x5 shroud R76 tomer can leave these 1k onnected see Page4 SCL_SMBCLK X SCL_SMBCLK see Page4 SDA SMBDAT X SDA SMBDAT s 45 TEXAS INSTRUMENTS PAGE TITLE USB I2C 8040 SIZE DOCUMENT NUMBER REV PAGE B 6516396 A 7 of 8 veus H lt USB_VBUS_UP see Page7 om H USB DM UP see Page7 SPOSE SE A DNI DP EI USB DP UP see Page7 FB1 GND SSTXN H CAR UP TXM 672 ALE USB SSTXM UP see Page7 gt C77 220 100MHZ ssTxp CAP UE TXP C75 pilak USB SSTXP UP see Page7 FOE 0 001UF GND Z 4 SSRXN pS lt USB_SSRXM_UP see Page 4 SSRXP H2 USB SSRXP UP see Page7 al ala 10 SHIELDO SHIELD1 Hi KZ USB3_TYPEB_CONNECTOR L ona GREEN EES Y tuF y D9 3P3V_B 3P3V u A DNI R77 FB2 C79 C78 R78 2 001uF AUF 330 x d Sy 10402 c81 c82 c83 5 10402 220 100MHZ E C80 0 001uF 0 01uF 0 1uF
3. 5 10uF T u7 u8 CAP_UP_TXM 1 USB SSRXM UP 4 D D GND L GND L CAP UP TXP 2 USB SSRXP UP 2 3P3V A 3P3V ba BE A DNI TPD2EUSB30_DNI TPD2EUSB30_DNI FB3 d d d d d S u9 C85 C86 C87 C88 C89 E aio USB DM UP 1 C84 0 001uF 0 01uF 0 1uF 0 001uF 0 01uF 0 1uF De Gel 10uF USB DP UP 2 5 L 4 TPD2EUSB30_DNI Optional ESD Protection 1P05V_B O 1P05V A DNI FB4 gt C92 C93 C94 C95 C96 C97 C98 C99 C100 C101 C102 C108 m cot 0 001uF 0 01uF 0 tuF 0 001uF 0 01uF 0 1uF 0 001uF 0 01uF 0 1uF 0 001uF 0 01uF 0 tuF 22uF gt e 1 1POSV_A 1P05V A DNI FBS d d d Ak C105 C106 C107 20a 0z C104 0 001uF 0 01uF 0 1uF 22uF e d TEXAS INSTRUMENTS PAGE TITLE EXT POWER INTERFACE SIZE DOCUMENT NUMBER REV PAGE B 6516396 A 8of 8 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries Tl reserve the right to make corrections modifications enhancements improvements and other changes to its products and services at any time and to discontinue any product or service without notice Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment TI warrants performance of its hardware products to the specifications app
4. exclusive Tl assumes no liability for applications assistance customer product design software performance or infringement of patents or services described herein Mailing Address Texas Instruments Post Office Box 655303 Dallas Texas 75265 Copyright 2012 Texas Instruments Incorporated REGULATORY COMPLIANCE INFORMATION As noted in the EVM User s Guide and or EVM itself this EVM and or accompanying hardware may or may not be subject to the Federal Communications Commission FCC and Industry Canada IC rules For EVMs not subject to the above rules this evaluation board kit module is intended for use for ENGINEERING DEVELOPMENT DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by Tl to be a finished end product fit for general consumer use It generates uses and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES 003 rules which are designed to provide reasonable protection against radio frequency interference Operation of the equipment may cause interference with radio communications in which case the user at his own expense will be required to take whatever measures may be required to correct this interference General Statement for EVMs including a radio User Power Frequency Use Obligations This radio is intended for development professional use only in legally allocated frequency and power limits Any use of radio freq
5. 0 D coso so 0 NS x e 8 o NG e 00 o R a S SCH O A bi 2 o 8 O 3 g 0000 g KS m 8 o ek eo 00 o O i 99 e o n o pes 20 o 8 5 5 edt g 8 oa o ge o ES O Et d o o 8 O 9 pi 8 o o 2 a O o 000 O 909 d j 8 B O s O Q i o 8 o O o o amp o o o a o o 2o oco 000 xs r Q9 N o J O oo A e O o 0 Figure 6 SN75DP130 EVM Power Layer 3 SN75DP130 EVM January 2011 o o 9 g 8 8 8 8 e 8 8 d eco o 8 o ag 28 u m M 2 3 3 3 a 0 0 60 Figure 7 SN75DP130 EVM Power Layer 4 o 9 o 8 8 8 8 8 o D g 9960 o A o 2 8 A 8 o o o o 9o P ag 8 8 8 8 8 8 000 o o 000 8 9 9 8 KL O 8 8 8 d ST Va S e o o Figure 8 SN75DP130 EVM Ground Layer 5 SN75DP130 EVM January 2011 SN75DP130 EVM Bottom Layer 6 Mirrored SN75DP130 EVM Board Construction The EVM board is a 6 layer board constructed of FR4 TurboClad 370 material The board stackup consists of a signal layer on top a ground layer a power layer power ground and a Signal layer on bottom Figure 10 EVM Layer Stack up SN75DP130 EVM Signal Ground VDD VCC Ground Signal January 2011 TS A SN75DP130 EVM Material Listing The complete Bill of Material for the EVM is l
6. ti com Medical www ti com medical Logic logic ti com Security www ti com security Power Mgmt power ti com Space Avionics and Defense www ti com space avionics defense Microcontrollers microcontroller ti com Video and Imaging www ti com video RFID www ti rfid com OMAP Mobile Processors www ti com omap Wireless Connectivity www ti com wirelessconnectivity TI E2E Community Home Page e2e ti com Mailing Address Texas Instruments Post Office Box 655303 Dallas Texas 75265 Copyright 2012 Texas Instruments Incorporated
7. 75DP130 EVM Switch and Jumper Location Top Figure 3 SN75DP130 EVM Switch and Jumper Location Botom 4 SN75DP130 EVM January 2011 TEXAS INSTRUMENTS Jumper Number Functionality Selection Switch CAD Sink Over Ride the CAD pin input from the sink is Normal CAD operation JMP1 2 3 independently pulled high by a 2k pullup to allow the DP130 Over ride CAD JMP1 2 1 EVM to be in TMDS mode independent of the sink HPD Sink Over Ride the HPD pin input from the sink is Normal HPD operation JMP2 2 3 JMP2 independently pulled high by a 2k pullup to allow the DP130 Over ride HPD JMP2 2 1 EVM to provide an indication of the sink presence JMP3 MP4 not installed JMP7 not installed JMP8 not installed Allows for easy connect to the 3 3V rail for monitoring Allows for selection of EVM power from the wall or 9V battery JMP9 Normal position would be Wall to VIN OOOO oo JMP10 HPD Override for port A Only used to override or create an HPD c Only used to override or create an HPD Only used to change CAD from 0 to 1 CAD Override for port B RES Only used to change CAD from 0 to 1 Priority Control DP Out A B Low Power mode control LP Normal Vdd Voltage selection Some EVM s will have this voltage fixed Table 1 Jumper and Switch Functionality The power supply provided with this EVM is a 5V DC power supply Any ac to dc converter can be used as long as it has a 2 5m
8. A ARO CEDIES AREF OTD UTOT TOf Exo TOR KANO ETO CIEE SG 1 TRATA O CSE lt 1843 28 HB 5141735 CED 5717 E ED ABR O E OTE TES 2 SERIO Haak DURE AO TEE 3 BREA EB 4 OPEV TEE ZB AIX ERO TERR o CORE AREA BECCA LAU BRO RE BETX ZOBOLLET bee eT eVGA HINEODTH ANH SIVA RENEDO L E RAN HATEFA ECKE SY VB RR abs ia RE rte 6 J H 2 44127 AHE http www tij co jp EVALUATION BOARD KIT MODULE EVM WARNINGS RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only in Laboratory Development Environments Unless otherwise indicated this EVM is not a finished electrical equipment and not intended for consumer use lt is intended solely for use for preliminary feasibility evaluation in laboratory development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components systems and subsystems It should not be used as all or part of a finished end product Your Sole Responsibility and Risk You acknowledge represent and agree that 1 You have unique knowledge concerning Federal State and local regulatory requirements including but not limited to Food and Drug Administration regulations if
9. For GPUs with combined DDC AUX the device can operate as a FET switch to short circuit the AUX channel AC coupling caps while connected to a TMDS sink device Other sideband circuits such as Hot Plug Detect HPD are optimized to reduce external components providing a seamless connection to Intel AMD and NVIDIA graphics processors The SN75DP130 is optimized for mobile applications and contains activity detection circuitry on the Main Link input that transitions to a low power Output Disable mode in the absence of a valid input signal Other low power modes are supported including a Standby mode with typical dissipation of 2mW when no video sink eg monitor is connected The device is characterized for an extended operational temperature range from 0 C to 85 C 1 SN75DP130 EVM January 2011 TS A Contents ias PAM AA o OO 3 SN75DP130 Evaluation Module Configuration 3 SN75DP130 EVM Kit OMS tad AA AARAL 3 Eeseripuon Ot EVM BOT e ut cito o 3 es AP e A 6 SN75DP130 EVM Board LayOLlb iios cus ibo ner haies its 6 SNZSDPISO EVM Board Construction cacas 9 SNZ5DP130 EVM Material Listing criar diia 10 SN75DP130 EVM Board E Ee VE 10 Appendix A Bill of MaterlalS ER NEESE 11 Figures Figure 1 SNZBDP130 EVM Block Diagram cese AANGAT ANAN 3 Figure 2 SN75DP130 EVM Switch and Jumper Location Top 4 Figure 3 SN75DP130 EVM Switch and Jumper Location Gotom ieii iieis 4 Figure 4 SN75DP130 EVM Top Layer bos 6 Figure 5
10. Kit Module EVM under the following conditions The user assumes all responsibility and liability for proper and safe handling of the goods Further the user indemnifies Tl from all claims arising from the handling or use of the goods Should this evaluation board kit not meet the specifications indicated in the User s Guide the board kit may be returned within 30 days from the date of delivery for a full refund THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES EXPRESSED IMPLIED OR STATUTORY INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT SPECIAL INCIDENTAL OR CONSEQUENTIAL DAMAGES Please read the User s Guide and specifically the Warnings and Restrictions notice in the User s Guide prior to handling the product This notice contains important safety information about temperatures and voltages For additional information on TI s environmental and or safety programs please visit www ti com esh or contact TI No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine process or combination in which such TI products or services might be or are used TI currently deals with a variety of customers for products and therefore our arrangement with the user is not
11. N3p IN2n IN2p IN1n INtp INOn INOp CAD_SRC Out HPD_SRC Out AUX_SRCp AUX_SRCn VCC DP130 45 TEXAS INSTRUMENTS PAGE TITLE DP130 SOURCE CONNECTION SIZE DOCUMENT NUMBER REV PAGE B 6516396 A 2of8 SGND2 C20 R11 1 0uF 1M 3P3V 1 OUTOp 23 EES E C12 _0 1uF DP OUTPUT 0 P rupe GND OUTO p22 DPO_N C13 0 1uF DP OUTPUT 0 N Qul OR ee 4 _ 20 DP1 P C14 up DP OUTPUT 1 P T 5 ML_ip GND10 Suma big BECH C15 Our DP OUTPUT i N a GND 7 OUT2p H DELE C16 O tuF DP OUTPUT 2 P T 3 M P QUIS bis DP2_N C17 0 1uF DP OUTPUT 2 N 9 ML on 10 E OUT3p 14 DP3 P C18 0 tuF DP OUTPUT 3 P T iL Mac See DP3 N C19 0 1uF DP OUTPUT 3 N 121 ML an 3P3V JMP1 BI 1 TMDS CAD OVERIDE 2K T 10 CAD 2 CAD SINK In 8 RA mem los SILKSCREEN 3P3V OVRD 3 Pin Berg Jumper R13 CAD OVRD 1M 8 NORM R14 100K 14 GND5 AUX SNKp 1 28 AUX SINK P R15 0 e AUX SINK OUTPUT P 15 AUX p AUX_SNKn p2 AUX SINK N R16 o AUX_SINK_OUTPUT_N 5 SR R17 100K SILKSCREEN N VERRIDE VED 3 FOR NORMAL HPD_OVRD SHORT 1 gt 2 FOR FORCED HPD HIGH NORM JMP2 3P3V 1 HPD_OVERIDE RIR A ABK 11 HPD 2 HPD_SINK IN 3 HPD_SINK lies DP130 3 Pin Berg Jumper pa 19 Se 100K DP PWR Display Port Connector Source
12. NT NUMBER REV SHEET B 6516396 A 1 of8 Jt GND7 ML_3n MAIN_LINK_IN_3N C1 0 1uF MAIN LINK 3N U1A GND8 GND1 MAIN LINK IN 3P C2 0 1uF MAIN LINK 3P pe GND9 ML_3p GND10 ML_2n MAIN_LINK_IN_2N C3 0 1uF MAIN LINK 2N S GND2 MAIN_LINK_IN_2P 0 tuF MAIN LINK 2P Po ML 2p MAIN LINK IN 1N C5 0 1uF MAIN LINK 1N ML 1n MAIN LINK IN 1P C6 0 1uF MAIN LINK 1P sla lala R1 1M GND3 ML 1p ML 0n GND4 ML 0p CAD GND DP CEC GND AUX p SCL GND6 AUX_n SDA HPD DP PWR RTN DP PWR ko ko i ka les ko e 2 d MAIN LINK IN ON C7 0 1uF MAIN LINK ON MAIN LINK IN 0P C9 0 1uF MAIN LINK 0P DP CAD SINK OUTPUT ko Be CEC AUX_P_SCL_IN porberre AUX_N_SDA_IN DP_HPD_SINK_OUTPUT i Display_Port_Connector_Sink_0 R5 3P3VO DP PWR SINK 0 DNI DP er does not normall ted in the D 3P3V R9 27K DNI see Page3 CEC gt R10 5M DNI A R2 100k DNI A R3 100k DNI C10 0 1uF AUXSCL SOURCE P C11 0 1uF AUXSDA SOURCE N R4 R6 3P3V 2K DNI DNI 2 R7 SCL SOURCE R8 BP SDA SOURCE high allowing IN3n I
13. SN75DP130 EVM Ground EE 7 Figure 6 SN75DP130 EVM Power Layer Bis 7 Figure 7 SN75DP130 EVM Power Layer innen eniin 8 Figure 8 SN75DP130 EVM Ground Layer EE 8 Figure 9 SN75DP130 EVM Bottom Layer 6 Mirrored ssssesenemmnmn 9 Figure 10 EVM Layer Stack up E 9 Tables Table 1 Jumper and Switch Functionality EE 5 Table 2 DP130 EVM Bill of Lc c 11 2 SN75DP130 EVM January 2011 TS A Introduction The SN75DP 130 is a high speed one to one redriver for Display Port signals This guide describes the construction and usage of the EVM for the SN75DP130 The EVM is meant to serve as an evaluation tool for the SN75DP 130 as well as a reference design for the device SN75DP130 Evaluation Module Configuration SN75DP130 EVM Kit Contents This EVM kit should contain the following items e SN75DP130 EVM board e DC Power Supply e This users manual Description of EVM Board The SN75DP 130 EVM is designed to provide easy evaluation of the SN75DP130 device It is also meant to serve as a reference design to show a practical example of how to use the device in a mass production system x x Power Conversion o 3 3V XD Regulated 1 05V SN75DP130 GPU i 9 DP DP DP Source e A DisplayPort Enabled Monitor or HDTV x XD LP Enable Figure 1 SN75DP130 EVM Block Diagram EVM 3 SN75DP130 EVM January 2011 Figure 2 SN
14. TEXAS INSTRUMENTS www ti com SLLU143A October 2010 Revised January 2011 SN75DP130 EVM User s Manual I TEXAS INSTRUMENTS High Performance Analog Interface Group ABSTRACT The SN75DP130 is a single port Dual Mode DisplayPort DP repeater that regenerates the DP high speed digital link The device complies with the VESA Embedded DisplayPort Standard Version 1 2 supporting up to four lanes of 5 4 Gbps HBR2 and DP dual mode TMDS signaling for full HDMI 1 4a data rate support The device compensates for PCB related frequency loss and switching related loss to provide the optimum DP electrical performance from source to sink The Main Link signal inputs feature configurable equalizers with selectable boost settings At the Main Link output four primary levels of differential output voltage swing Vop and four primary levels of pre emphasis are available as well as a secondary level of boost adjustment programmed through IZC for fine tuning the Main Link output The device can monitor the AUX channel and automatically adjust the output signaling levels and input equalizers in response to Link Training commands Additionally the SN75DP130 output signal conditioning and EQ parameters are fully programmable through the TC interface The SN75DP130 offers separate AUX and DDC source ports and an AUX sink port This minimizes component count when implemented with a graphics processor GPU comprising separate DDC and AUX interfaces
15. TITLE LOCAL DECOUPLING CAPACITORS PLACE NEAR THE DP130 DEVICE DP130 POWER SIZE B DOCUMENT NUMBER 6516396 PAGE 5of 8 1PO5V REG BI 1PO5V R42 U3 100 e t SIN our 3 1 MON 2 BIAS R43 5 5 5 HI1206N101R 00 JMP7 d R44 4 99K 7 2 1 91k 1 8 _ 2 2 1 c WA EN FB kt C57 cse RES 8 1uF 4 10uF tul Otul D2 En 1 ss GND 8 8 8 NI K GREEN TPS74401 x ilk R45 SE 5 62k 1 Dn 3 0 001uF 5 NOTE PLACE BULK DECOUPLING CAPACITORS 3 374 T Fd NEAR THE REGULATORS AND FERRITE BEADS gt SILKSCREEN _ lt 5 49k 1 191k 1 1 87k 1 R49 1 1P05V NOM 1 05V_HIGH 4 53k 1 4 2 1P05V HIGH 3 1P05V LOW 3 DNI i NOTE REMOVE R45 IF JMP8 IS INSTALLED a 3P3V e 9v L2 ug 3P3V_REG 3P3V R50 Vin H 34 s a Vout L LW 2 GND2 GND1 NR Adjust 4 J HI1206N101R 00 JMP9 d c NM TE TT 8 10uF Lul 01ul D3 DES ee NI Y GREEN tuF 1 a 4 R52 150K NOTE PLACE BULK DECOUPLING CAPACITORS 2 E ass NEAR THE REGULATORS AND FERRITE BEADS ES 150K g
16. aere io USB_SSRXP_DNO USB DM DNO USB SSTXP DN USB SSTXM DNl 10402 USB_SSRXM_DNO USB_SSRXP_DNO USB SSTXM DN 28 1 UsB_ssTxp_pyg 77 USB_SSRXM_DNO U6 USB_SSTXM_DNO USB_SSTXP_DNO USB_DP_DN3 3P3Y Sens USB_SSTXM_DNO USB_DP_DN3 48 wen om pws R60 2 R61 gt R62 USB_DM_DN3 7 USB_SSRXP_DN3 4 7K 4 7K 4 7K SILKSCREEN VDD RESETZ USB DP DN2 USB SSRXP DN3 USB SSRXM DN3 T0402 r0402 r0402 usa DW pnz Z USB_DP_DN2 USB SSRXM DN3 48 ven aen pus 596 5 5 J GND BEE USB_DM_DN2 USB SSTXP DN3 L Aen SSTXM_DN3 i TPS3809K33 USB SSRXM DN2 USB SSRXP DN2 USB SSTXM DN3 20 E FULLPWRMGMTZ SMBAT 1 ENABLE 3 SSRXM DN 13 2 PWR Maut USB SSTXP DN2 USB SSRXM DN2 3 Ga UER SETIM DNZ USB_SSTXP_DN2 314 DISABLE S ASI USB SSTXM DN2 FULLPWRMGMTZ SMBA1 1 SMBUSZ JP2 33d GRSTZ mA PWRONOZ BATENO EC 1 nc t 2 4 lt N OVERCUR0Z j 1 c72 HS 22 HS E a 5 ay A OVERCUROZ SMBUSZ 2 SMBUSZ SS 23 ss s aa o2par SMBUS 3 SMBUS Light Touch Switch 1uF HS_SUSPEND 24 ES za ES SS SUSPEND HS SUSPEND E Ss vllt oi 25 SS SUSPEND 28 as 22222 a JP3 33 DD 55555 al BATEN 1 ENABLE L USBEEDIG I d da F e PWRONOZ BATENO 23 4 BATEN 3 HY E BATDIS 3 3 DISABLE 3P3V Y D5 Y D6 Y D7 Y D8 R64 A xd 4 el 10K amp amp amp amp 10402 ul ul ul ul oi D 1 6 O 6 O R65 R66 R67 R68 R69 R70 R71 R72 330 330 330 330 DNI DNI DNI DNI HUS SA RE r0402 r0402 r0402 r0402 r0402 ro402 r0402 5 5 5 5 5 5 5 is TRSTZ a
17. applicable which relate to your products and which relate to your use and or that of your employees affiliates contractors or designees of the EVM for evaluation testing and other purposes 2 You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements and also to assure the safety of any activities to be conducted by you and or your employees affiliates contractors or designees using the EVM Further you are responsible to assure that any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard 3 You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage injury or death even if the EVM should fail to perform as described or expected 4 You will take care of proper disposal and recycling of the EVM s electronic components and packing materials Certain Instructions It is important to operate this EVM within Tl s recommended specifications and environmental considerations per the user guidelines Exceeding the specified EVM ratings including but not limited to input and output voltage current power and environmental ranges may cause property damage personal injury or death If there are questions concerning these ratings ple
18. ase contact a TI field representative prior to connecting interface electronics including input power and intended loads Any loads applied outside of the specified output range may result in unintended and or inaccurate operation and or possible permanent damage to the EVM and or interface electronics Please consult the EVM User s Guide prior to connecting any load to the EVM output If there is uncertainty as to the load specification please contact a Tl field representative During normal operation some circuit components may have case temperatures greater than 60 C as long as the input and output are maintained at a normal ambient operating temperature These components include but are not limited to linear regulators switching transistors pass transistors and current sense resistors which can be identified using the EVM schematic located in the EVM User s Guide When placing measurement probes near these devices during normal operation please be aware that these devices may be very warm to the touch As with all electronic evaluation tools only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs Agreement to Defend Indemnify and Hold Harmless You agree to defend indemnify and hold TI its licensors and their representatives harmless from and against any and all claims damages losses expenses costs and liabilities collectively Claims arising out
19. e pour chaque type d antenne Les types d antenne non inclus dans cette liste ou dont le gain est sup rieur au gain maximal indiqu sont strictement interdits pour l exploitation de l metteur Important Notice for Users of this Product in Japan This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan you are required by Radio Law of Japan to follow the instructions below with respect to this product 1 Use this product in a shielded room or any other test facility as defined in the notification 4173 issued by Ministry of Internal Affairs and Communications on March 28 2006 based on Sub section 1 1 of Article 6 of the Ministry s Rule for Enforcement of Radio Law of Japan 2 Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product or 3 Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product Also please do not transfer this product unless you give the same notice above to the transferee Please note that if you could not follow the instructions above you will be subject to penalties of Radio Law of Japan Texas Instruments Japan Limited address 24 1 Nishi Shinjuku 6 chome Shinjukku ku Tokyo Japan http www tij co jp THERE bi CORE ABR IE X Li E Y
20. eil num rique de la classe A ou B est conforme la norme NMB 003 du Canada Les changements ou les modifications pas express ment approuv s par la partie responsable de la conformit ont pu vider l autorit de l utilisateur pour actionner l quipement Concernant les EVMs avec appareils radio Le pr sent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est susceptible d en compromettre le fonctionnement Concernant les EVMs avec antennes d tachables Conform ment la r glementation d Industrie Canada le pr sent metteur radio peut fonctionner avec une antenne d un type et d un gain maximal ou inf rieur approuv pour l metteur par Industrie Canada Dans le but de r duire les risques de brouillage radio lectrique l intention des autres utilisateurs il faut choisir le type d antenne et son gain de sorte que la puissance isotrope rayonn e quivalente p i r e ne d passe pas l intensit n cessaire l tablissement d une communication satisfaisante Le pr sent metteur radio a t approuv par Industrie Canada pour fonctionner avec les types d antenne num r s dans le manuel d usage et ayant un gain admissible maximal et l imp dance requis
21. f sale supplied at the time of order acknowledgment including those pertaining to warranty patent infringement and limitation of liability Customers are responsible for their applications using TI components In order to minimize risks associated with applications using TI components adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards The information in this document is provided by TI as a courtesy and in no way constitutes a reference design Any direct duplication of this design in its entirety is strictly prohibited without expressed written approval by TI Furthermore TI assumes no liability for applications assistance or customer product design TI does not warrant or represent that any license either express or implied is granted under any patent right copyright mask work right or other intellectual property right of TI covering or relating to any combination machine or process in which such semiconductor products or services might be or are used TI s publication or information regarding any third party s products or services does not constitute TI s approval warranty or endorsement thereof e TEXAS INSTRUMENTS Copyright O 2009 Texas Instruments Incorporated A T ARE DP130 EVM ENGINEER DATE K SHAW 05 08 10 PAGE TITLE LAYOUT DATE DP130 DATA SHEET REVISION 0 98 Steve Gregory 05 09 10 DATA SHEET LAST UPDATED ON 03 30 10 RELEASED DATE SIZE DOCUME
22. isted in Appendix A SN75DP130 EVM Board Schematics The board schematic sheets for the EVM are shown at the end of this document 10 SN75DP130 EVM January 2011 TEXAS INSTRUMENTS Appendix A Bill of Materials The following table is the complete BOM for the EVM Item DJ Oo O 20 N QW W Od O O Od O D G O m m ND N N N N N N N hh 4 hh aa aa O O WAN O Om A O D DAN DOA BR ON THAN DA FP N Oo 11 Quantity 1 2 sk uk a NG a a a on P D 3 D NY ND 9 BB sk sk 2 sk 09 OT 3 ND ON OA ABA ND 3 N WD OD Reference Value C1 C2 C3 C4 C5 C6 C7 C8 C10 C11 C12 C13 C14 C15 C16 C17 0 1uF C9 C18 0 01uF C19 C31 C33 0 1uf C20 C22 220u C21 DNI C23 22u C24 C27 0 01u C25 10u C26 0 1u C28 C29 C34 C35 C36 C37 0 01uF C30 C32 1 0uf D1 D3 LED D2 40V 1A JMP1 JMP2 JMP5 JMP6 JMP7 Header 2x1 JMP3 JMP4 JMP8 Header 3x1 JMP9 Header 2x1 DNI JMP10 DNI Ji Display Port Connector Sink J2 Display Port Connector Source J3 Battery Holder 9V L1 HI1206N101R 00 P1 RAPC722 R1 R9 1M R2 R4 R6 R7 R15 R21 R22 100k DNI R3 R12 0 DNI R5 27k DNI R8 5M DNI R10 R11 1M DNI R13 R14 R19 R20 4 7k R16 1M R17 450 R18 100k R23 250 R24 23 2k R25 R26 150k R27 DNI R28 64 9k R29 13k U1 SN75DP130 U2 REG104 3 3 Table 2 DP130 EVM Bill of Materials SN75DP130 EVM January 2011 EVALUATION BOARD KIT MODULE EVM ADDITIONAL TERMS Texas Instruments TI provides the enclosed Evaluation Board
23. licable at the time of sale in accordance with TI s standard warranty Testing and other quality control techniques are used to the extent Tl deems necessary to support this warranty Except where mandated by government requirements testing of all parameters of each product is not necessarily performed Tl assumes no liability for applications assistance or customer product design Customers are responsible for their products and applications using TI components To minimize the risks associated with customer products and applications customers should provide adequate design and operating safeguards TI does not warrant or represent that any license either express or implied is granted under any TI patent right copyright mask work right or other Tl intellectual property right relating to any combination machine or process in which Tl products or services are used Information published by TI regarding third party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof Use of such information may require a license from a third party under the patents or other intellectual property of the third party or a license from TI under the patents or other intellectual property of TI Reproduction of Tl information in Tl data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties conditions limitations and notice
24. m plug with the positive terminal in the center The output voltage of the power supply should be within the range of 2 5V to 10V JMP9 VIN WALL For portability a battery holder is also provided for use with a 9V battery JMP9 BATT IN 5 SN75DP130 EVM January 2011 WG TEXAS rs PCB Construction This section discusses the construction of the EVM boards It includes the board schematics and Gerber files to show how the board was built SN75DP130 EVM Board Layout This EVM was designed to show the implementation of this device on a 6 layer board The pin assignments of the input ports of the SN75DP130 device are optimized for the PCB mount DP connector This allows easy routing of the input traces without the need for vias The output port of the SN75DP130 device is optimized for a direct connection to a TMDS receiver On this EVM the output port is routed to a DP connector In this case the pin assignment for the connector is exactly opposite of the device Every effort was made to keep the routing as clean as possible to the DP connectors The board was designed to maintain 100 Q differential impedance between each of the TMDS differential traces For the material used in this design FR4 TurboClad 370 and with the stackup shown below this required the differential traces to be 12mil wide with an 11mil air gap between differential pairs A minimum spacing of 3 times the trace width was maintained to all other components to pre
25. of or in connection with any use of the EVM that is not in accordance with the terms of the agreement This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory and even if the EVM fails to perform as described or expected Safety Critical or Life Critical Applications If you intend to evaluate the components for possible use in safety critical applications such as life support where a failure of the TI product would reasonably be expected to cause severe personal injury or death such as devices which are classified as FDA Class Ill or similar classification then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement REVISIONS ECR NUMBER DATE NOTES EE 1 SILKSCREEN ALL JUMPERS AND HEADERS 2 PLACE ALL PARTS ON A 0 OR 90 DEGREE ORIENTATION 3 HIGH SPEED SERIAL DATA SHOULD BE ROUTED AS SINGLE ENDED 50 OHM TRANSMISSION LINES ROUTING DISTANCE SHOULD BE 3 INCHES OR LESS 4 USE FR4 370 MATERIAL 5 PLACE TI LOGO IN TOP SIDE METAL Texas Instruments and its subsidiaries TI reserve the right to make changes to their products and publications or to discontinue any product or service without notice and advise customers to obtain the latest version of relevant information to verify before placing orders that information being relied on is current and complete All products are sold subject to the terms and conditions o
26. r help For EVMs annotated as IC INDUSTRY CANADA Compliant This Class A or B digital apparatus complies with Canadian ICES 003 Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment Concerning EVMs including radio transmitters This device complies with Industry Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Concerning EVMs including detachable antennas Under Industry Canada regulations this radio transmitter may only operate using an antenna of a type and maximum or lesser gain approved for the transmitter by Industry Canada To reduce potential radio interference to other users the antenna type and its gain should be so chosen that the equivalent isotropically radiated power e i r p is not more than that necessary for successful communication This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain greater than the maximum gain indicated for that type are strictly prohibited for use with this device Cet appar
27. s Reproduction of this information with alteration is an unfair and deceptive business practice Tl is not responsible or liable for such altered documentation Information of third parties may be subject to additional restrictions Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice TI is not responsible or liable for any such statements TI products are not authorized for use in safety critical applications such as life support where a failure of the TI product would reasonably be expected to cause severe personal injury or death unless officers of the parties have executed an agreement specifically governing such use Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications and acknowledge and agree that they are solely responsible for all legal regulatory and safety related requirements concerning their products and any use of TI products in such safety critical applications notwithstanding any applications related information or support that may be provided by Tl Further Buyers must fully indemnify Tl and its representatives against any damages arising out of the use of Tl products in such safety critical applications TI products are neither designed nor intended for u
28. s uses and can radiate radio frequency energy and if not installed and used in accordance with the instruction manual may cause harmful interference to radio communications Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one or more of the following measures e HReorient or relocate the receiving antenna e Increase the separation between the equipment and receiver e Connect the equipment into an outlet on a circuit different from that to which the receiver is connected e Consult the dealer or an experienced radio TV technician fo
29. se in military aerospace applications or environments unless the TI products are specifically designated by TI as military grade or enhanced plastic Only products designated by TI as military grade meet military specifications Buyers acknowledge and agree that any such use of TI products which TI has not designated as military grade is solely at the Buyer s risk and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO TS 16949 requirements Buyers acknowledge and agree that if they use any non designated products in automotive applications Tl will not be responsible for any failure to meet such requirements Following are URLs where you can obtain information on other Texas Instruments products and application solutions Products Applications Audio www ti com audio Automotive and Transportation www ti com automotive Amplifiers amplifier ti com Communications and Telecom www ti com communications Data Converters dataconverter ti com Computers and Peripherals www ti com computers DLP Products www dlp com Consumer Electronics www ti com consumer apps DSP dsp ti com Energy and Lighting www ti com energy Clocks and Timers www ti com clocks Industrial www ti com industrial Interface interface
30. see Page2 CEC gt gt 45 TEXAS INSTRUMENTS PAGE TITLE DP130 SOURCE CONNECTION SIZE B DOCUMENT NUMBER 6516396 PAGE 3of 8 see Page SDA_SMBDAT KS U1C Page7 SCL SMBCLK Jho R21 R22 SH ka gt 4 64K 4 64K SILKSCREEN JMP3 gt j ADDR EQ PU foo ADDR FQ MID 4 C2 ADDR EQ Bi iren ADDR EQ MID ADDR EQ PD 3 ADDR EQ PD 4 Pin T Berg Jumper R23 R24 4 64K 4 64K R25 R26 O DNI 0 DNI T SILKSCREEN R27 R28 4 64K 4 64K VCC 3P3V me 12C PULLUP Ge GND SILKSCREEN d i T I2C HEADER PWR EN PU EN MID EN 4 EN MID 4 EN_EQ 26 EN_PD 3P3V 4 Pin T Berg Jumper JMP5 R29 R30 LOCAL GC PULLUP 4 4 64K 4 64K DC PWR J3 4 Pin T Berg Jumper 2 u 4 3 R31 R32 6 5 2K 2K 8 10 9 1 LOCAL SCL amp scient 5x2 Keyed Connector 4 LOCAL_SDA 5 SDA CTL VDDD_DREG_PIN NOTE RSTN is a 1 05V circuit Keen SILKSCREEN R33 Do not drive this input more than the spec of 1 2V JMP6 4 99K DNI ENABLE 8 1 T E BOGA RSTN 2 Pin Berg Jumper R34 4 99K DP130 sil 0 2 uF A 45 TEXAS INSTRUMENTS PAGE TITLE DP130 CONTROL SIZE B DOCUMENT NUMBER REV 6516396 A PAGE 4of 8
31. t DNI 64 9K SILKSCREEN amp 1 3P3V NOM Sie 3P3V HIGH 3P3V HIGH op e 3P3V LOW E le DNI A NOTE REMOVE R52 IF JMP10 IS INSTALLED gt g J4 P 9V_BATT_IN 9v Battery Holder 9V SILKSCREEN BATT GND 9v WALL C69 4 Pin T Berg Jumper 22uF P1 1 SLEEVE d al ds 9V WALL IN 2 pea 9V DC IN Gi 24 SHUNT 45 TEXAS INSTRUMENTS RAPC722 10 3 SILK 9V PAGE TITLE EXT POWER INTERFACE SIZE DOCUMENT NUMBER REV PAGE B 6516396 A 6of 8 5 4 1P05V A 1PO5V B 3P3V_B 3P3V_A 3P3V_OSC R57 JN a R vi bo 3 PFP s pafp g80 e MO O0 9 aaa O O D oQoaooooaaoooaoaaoaooaoaao OO oc KEEN R58 0000200002000000 A AQ a 205000 Sa ebe ef ef ef ef ef e E ef e ee af Q gt gt D 000000 co 90 9K gt gt tum m m ZE 2 10402 j m 8 ECS 25MHZ D see Page8 USB VBUS UP gt 37 USB_VBUS 18pF 18pF see Page8 USB DP UP Ge USB_DP_UP XI tg see Page8 USB DM UP USB DM UP xo seePage8 USB SSRXP UP ae USB_SSRXP_UP vss osc LZ see Page8 USB SSRXM UP USB SSRXM UP see Page8 USB SSTXP UP 64 USB SSTXP UP T 3Psv see Page8 USB SSTXM UP 63 USB SSTXM UP USB DP DN1 Ss USF DH DN USB_DM_DN1 53 USB_SSRXP_DN1 A R59 USB DP DNO USB SSRXP DN USB SSRXM DN1 Aen p men 27 USB DP DNO USB SSRXM DN PEE oss sero pwi 10K DM 55 ven
32. uencies and or power availability of this EVM and its development application s must comply with local laws governing radio spectrum allocation and power limits for this evaluation module It is the user s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations Any exceptions to this is strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental development licenses from local regulatory authorities which is responsibility of user including its acceptable authorization For EVMs annotated as FCC FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules Operation is subject to the following two conditions 1 This device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment This equipment generate
33. vent coupling N E D i v Qu 8 P y p O Y B QU i Oo 3r Ug je En o LOX D H D oble Sela a FF 29 _HIGH 12C P a E oe EN d t pa 2 E aly ERRIDE E BN o A d 3 ba ppm so i a ERRIDE Li gt e gts f g o KA INI E pa nn y d SS ei DJADDR FQ en O 3h j 4 H T HI o i 3 EJRSTI E 1 a G got 5 lt Jab 2 D 363 T 5 H 4 QES RU MPS A TEI G N j N E gu B la o RESET DON j y ME E mad aa C E Leg a J JA Figure 4 SN75DP130 EVM Top Layer 1 SN75DP130 EVM January 2011 e O 0 0 SE e SK E A DN Be ON NY o 0 0 o NAG e D e e o eo A VO Pe a i 8 8 o 3 O o O d O A AE E 8 O o idi m o i o o o o a 3 8 8 lt d Soo o E i o o d 2 8 P e o O mE By 8 9 2 o A E ZC 0 e LJ eo Nas O NM 0 o 0 a Figure 5 SN75DP130 EVM Ground Layer 2 0 9 O 2 7 L o fos y 1 Lo E Lo MY
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