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VISOR® Solar User Manual - SensoPart Industriesensorik GmbH

1. Parameter Functions al Height Range to accept the height of a wafer Width Range to accept the width of a wafer Trigger Image update Area RAE to accept the area of a Single Angle range Range to accept the current Trigger z value of rotation _ Continuous Brightness Select the brightness of your object comparing to the Connection mode Aeaee a Shape Select the type of wafer Online Offline 100 shape E J ae ul Configure detectors and regions pereto Wafer Chipsize Chip shape Hole Calibration Detector name Result Detector type Height Brightness 1 Detector 2 Wafer pE 169 95 mi rer Width Shape 48 04 mm 226 51 mm Square Blanking region SSS 21346 mm 23592 mm Active None Angle range Position control 45 00 45 00 S E off New Copy Reset Delete Delete all Mode Config Name Visor V10 your Active job 1 Job1 Cycle time n a Flash 0 4 kB 40 3 MB X 0 Y 0 I 0 DOUT Q Q Q Q Q Figure 34 Applying the wafer detector for position detection and size verification First choose the contrast setting between wafer and background with the Brightness menu on the left If your wafer appears brighter than the background choose Brighf IF it appears darker than the background choose Dark The default sett
2. D Oni C i Bi Play Accepted area for each Online Offline LJ 200 la dira Sp br Configure detectors and regions Detector name Result Detector type j Wafer Chip size n Chip shape 9 Hole 1 Wafer 9 Wafer Y Hole Brightness Bright Brightness threshold j 50 Relative x Area mE 1 25 mm l Overlay Marked pixel New Copy Reset Delete Delete all Mode Config Name Visor V10 your Active job 1 Job1 Cycle time n a Flash 0 4 B 40 3 MB X 0 01 0 Figure 42 Configuring the Hole defecfor The wafer detector determines the average grey level of the wafer Referring to this level which can be shifted by a value entered in Brightness threshold deviations within the wafer cell area can be detected Select the Brightness of the spot of interest as Bright or Dark For test purposes the user may enter Absolute values not related to the gray level of the wafer To achieve sufficient stability of the tests it is strongly recommended to use Relative thresholds only The default setting Marked pixel of Overlay makes all pixels meeting above criteria to be shown in red Adherent pixels so called blobs which do not meet the Area criterion cause a FAIL and will surrounded with a red rectangle see 1 item above In case 10 holes have been detected the search for further holes is aborted Blanking regions affect the search for holes only in case they cover th
3. Configure job Jobs Name Description Author Created t Image acquisition Image transmission Archiving Pre processing Cycle time 1 Jobi Basisjob Autor 22 02 2012 2 Resolution Shutter speed Quadrant Auto shutter 9 Q 3 Trigger mode Gain EL M m p i j o s d T 9 Free run External illumination off New Load Save Delete Delete all Mode Config Name Line 5 OUT Active job 1 Jobi Cycle time n a Flash 0 4 kB 40 2 MB X 0 Y 0 1 0 DOUT Q Q J J Q Q Figure 26 Load a job file and upload it to the sensor VISOR Vision Sensor E 068 14505 01 Page 26 of 75 VISOR Solar User Manual G SCNSOPART 4 2 System design For best performance during operation the application of the sensor should aim the following targets e High precision o High accuracy o High repeatability and reproducibility e High robustness against ambient influences such as o Ambient illumination and sun light o Vibrations e Minimal maintenance o No re calibration o Sporadic cleaning In the following these targets are discussed with respect to the different options of setups The VISOR Solar sensor utilises powerful and intensively field proven algorithms To ensure that the sensor achieves this standard some basic aspects of the system design impacting the fundamental camera s image quality need to be discussed The following sections are useful to make sure the sen
4. gt Welcome to SensoConfig With this programme you can configure your VISOR vision sensor for one or several jobs in six logical operating steps Basic image setting Image brightness Adjust shutter or amplification see Job General u Image sharpness Focus setting screw on the back of VISOR Job Position tracking Detectors Output Result Start Sensor Other programme functions m Trigger settings a Mode of connection online offline Simulation of inspection jobs using series of images filmstrip Image recording for analysis or simulation purposes Use of SensoConfig may require password entry administrator user group See user administration To obtain a continuously updated live image even v VGA 640x480 m Trigger mode Trigger 9 Freerun C Image acquisition Image transmission Archiving Shutter speed e Gain Pre processing Cycle time Quadrar ts Internal illumination On External illumination off 1 00 B Mode Config Name Visor V10 your Active job 1 Jobl Cycle time n a Flash 0 2 kB 40 3 MB X 0 Y 0 1 0 DOUT e 9090000 Figure 23 Camera image with the right working distance and optimal mounting Then zoom in use the controls marked with an rectangle in Figure 25 to see an enlarged image of the upper left corner of the wafer VISORe Vision Sen
5. gt Mew detector Available detector types Detector type Description 1 Pattern matching Locate object by greyscale pattern z P Contrast Verify contrast in specified region 3 d Brightness Verify brightness in specified region 4 Grey Verify grey level in specified region 5 Wafer Locate and check wafers cells 6 lll Busbar Locate and check busbars NN Figure 31 Detectors available in the VISOR Solar Advanced product line The V SOR sensors are able to run several tests or measurements on your wafer All the tests results are provided in the section Result Typically the results are compared to user defined limits and ranges defining the PASS FAIL criterions To generate a PASS a wafer has to PASS ALL criteria activated by the user criterion AND criterion2 etc VISORe Vision Sensor E 068 14505 01 Page 36 of 75 VISOR Solar User Manual G SCNSOPART The following paragraph provides a basic guideline how to define limits and ranges A typical set up of the sensor criteria provides the following results All good sample devices PASSes the tests and all defect parts FAIL see Figure 32 To reach this aim some devices OK and Not OK ones should be tested under several operating modes with some start criteria and then the criteria should be re adjusted until they provide your production needs To provide a high reliability of your tests you may tighten the criteria this means the number of wafer damage
6. Hao 2 g o a SGNSOPARI Alignment Home Prev Next Print Detector Output Wafer Detector 3 Result This detector is useful to check cracks at a wafer contur and measure some geometric parameter like width height position rotation angle Cell or wafer are marked by the following drawings Failed contour points by chip size Failed contour points by chip size if area bigger than specified in area per chip Countour points o k Counter points not analysed Failed contour points by chip shape Trigger Image update Rectangels for blanking regions Sind Fit rectangle BoundingBox Single Trigger Wafer cut Continuous Position control Connection mode Tab for Wafer A RA lt Pla gt 1 1 Tab for Chip size Online e Offline Fit Y P Li Tab for Chip shape v Configure detectors and regions Detector name Result Detector type wafer Chip size Chip shape Hole Calibration 1 Detector1 9 Wafer Height Brightness 00mm vj 500mm v eS Width Shape e 45 00 mm T24 55 00 mm p Rectangle 2 Area Blanking region CREE 29354 mn j 32995 mm j A Active None Angle range i i Position control a 20 00 t 00 S EK off T New Copy Reset Delete Delete all i i i i Mode Config Mame Simulator Active job 1 Jobi Cycle time n a Flash O 4kB X 0 o I DOLIT Q Q Q Q
7. 6 Start sensor o By clicking on this button the configuration parameters are transferred to the sensor which then runs autonomously from the configuration PC Only in this mode the cycle time is displayed on the lower edge of the screen Please note that outputs will be set or reset according to your parameters No liability is taken for damage occurring from this action Unless stated otherwise all operations are done running SensoConfig without activating the Expert mode VISOR Vision Sensor E 068 14505 01 Page 32 of 75 VISOR Solar User Manual SCNSOPART 5 Image acquisition parameters with Job After mechanically mounting and electrically connecting the camera it will be necessary to set the shutter speed gain and focus to ensure a sharp clear high contrast image This basis setup provides best performance of the sensor and will led you to a optimal productivity The most relevant controls are explained in this section 5 7 mage acquisition parameters with Job a complete description can be found in the V SOR user manual Ensure before starting that your sensor provides a sharp image The focus is adjusted by the use of the small slotted screw in the rear of the camera please use the screw driver provided to avoid any damage See section 4 1 6 Focusing To implement these basic settings go to Job Image acquisition as shown in Figure 29 All settings are saved in a so called Job file This job fil
8. Lore jJ Load Save Delete Delete all Mode Config Name Visor 10 your Active job Cycle time n a Flash 0 0 kB 40 3 MB X 0 0 I DOLIT Q Q Q Q Q Figure 19 Screenshot of an SensoConfig window with a wafer image Press the New button marked with the red rectangle in Figure 79 this will create you a new default Job and allows you to make the necessary settings e g the shutter speed A detailed description of transferring the Job is given in section 4 1 7 Configure or upload a job file to the camera You are now able to configure the sensor and make the necessary settings VISOR Vision Sensor E 068 14505 01 Page 19 of 75 VISOR Solar User Manual 4 1 5 Adjust the sensor to ensure the perpendicular mounting G SCNSOPART First check if the sensor is mounted in the right working distance The working distance can be calculated with the program SensoCalc For further information refer to section 3 2 7 VISOR product line First adjustments target the perpendicular mounting of the sensors to the wafer or cell to be checked Use a reflective foil mirror or sheet of glass and put it on the position your wafer is typically placed Other positions e g an direction of view not perpendicular to the object can cause a maladjustment You get an image from your sensor like this SensoConfig Solar File view Options Help jl oaa i g IB 9 2 Un o e
9. Figure 4 Key parameters of VISOR V10 SO for machine integration An easy way to calculate the distance as a function of the field of view is to use the software tool SensoCalc which can been downloaded from our homepage www sensopart com see section 9 Useful links and contacts F 3 SensoPart SensoCalc See Help Calculate distance Calculate Field of view Settings Object Lens Facal length Ons Osm Orm sm CUM SCNSOPART 156 00 mm B 156 00 mm e C Maunt Bmm 16 mm BO mm O Tolerance width Tolerance height 456 57 fs 10 00 5 3 226 80 mm 171 60 mm Working distance in mm Resolution 363 50 mm O aves oves 9 VGA WGA Pixel per mm mm per pixel 2 797 px 0 358 mm Figure 5 SensoCalc supporting the selection of the best fitting camera for a given field of view and working distance VISOR Vision Sensor E 068 14505_01 Page 10 of 75 VISOR Solar User Manual the defect and to a minor extent on the lens used G SCNSOPART A second criterion to choose the right lens can be the ability to detect chips at the edge of the wafer Chips can be identified by the two tools Chip Size and Chip Shape The ability to detect a chip depends on the size and shape of SensoConfig Solar File View Options Help cga ga emoe Setup Job Alignment Detector Output Result Start sensor Trigger Image update Single Trigger Continuou
10. e Mechanical mounting the clamp and the camera e Electrical connection to power supply and Ethernet optionally to PLC and trigger input e Assign IP address to the camera e Adjust the focus screw for a sharp image e Configure a camera job or upload a job file to the camera e Verify image quality and output results After just about 15 minutes of mounting and installation the sensor runs autonomously within the machine performing the desired wafer tests 4 1 1 Mechanical mounting the clamp and the camera At first the mechanical mounting is done The camera should be mounted at a location with minimal vibration perpendicularly to the wafer respectively cell and with free line of sight to it Usually the mounting bracket MG 2A is used supporting easy adjustments Alternatively a precisely adjusted mounting clamp MK 45 may be used The camera should be mounted on a stable part of your machine with the correct working distance which is depending on the camera type see section 3 2 1 VISOR product line from your wafer respectively cell The mounting bracket MG ZA is fixed with three cylinder head M6 screws in the base plate To assemble the mounting clamp MK 43 on your machine use the two internal screw threads both M4 on the back side of the clamp The mounting bracket MG 2A is fixed with three M6 screws in the base plate The camera can be fixed on both mounting accessories with the dovetail on the front side Before mounting t
11. 09 RD no function undefined 05 PK Result 06 YE Result 07 BK B Result 08 GY C Result H W Trigger Encoder Ejector Result External illumination Encoder 4D 4 4 4 4 4 4 4 Mode Config Name Visor V10 your Active job 1 Job1 Cycle time n a Flash 0 4 kB 40 3 MB X 0 0 1 0 pour Q o 99 Q9 OQ Figure 51 Start window to configure the Outputs 5 4 I I O mapping With the O mapping you can chose which digital In or Outputs you use The pinning has been described in section 4 1 2 Electrical connection respectively in Figure 74 The digital Os pins 5 8 can be configured either as input or as output In Figure 57 a screenshot of the start window is shown In the advanced version pin 10 can be used as positive encoder input Optionally on pin 5 a negative encoder input is available To configure an I O as Input or Output use the check boxes The available functions are described in the in Online help of SensoConfig on the right VISOR Vision Sensor E 068 14505 01 Page 61 of 75 VISOR Solar User Manual Q SeN SO PART 5 4 2 Digital output With the Digital output tab you can define which results are attributed to which pins In Figure 52 an example is shown On pin 5 is the result of detector 1 a grey level detector on pin 6 the inverted result of detector 2 a wafer detector on pin 7 the res
12. 40 3 MB x 0 01 0 not Figure 20 Camera image of the reflective foil Decrease the shutter speed use the slider or the spin box marked with an rectangle in Figure 20 to get an image with a bright dot ring of bright dots near to the centre and a dark background VISORe Vision Sensor E 068 14505 0l Page 20 of 75 VISOR Solar User Manual C9 SeNSOPART e SensoConfig Solar File View Options Help J c g jll 9 G SCNSOPART Welcome to SensoConfig With this programme you can configure your VISOR vision sensor for one or several jobs in six logical operating steps Basic image setting a Image brightness Adjust shutter or amplification see Job General u Image sharpness Focus setting screw on the back of VISOR m Job u Position tracking m Detectors u Output m Result m Start Sensor Other programme functions Trigger settings Mode of connection online offline Simulation of inspection jobs using series of images filmstrip Image recording for analysis or simulation purposes Trigger Image update UD use of SensoConfig may require password entry administrator user group See user administration mm _ Play um TNI Ei To obtain a continuously updated live image even 02 05 2012 Resolution Shutter speed f ie E Mode Config Name Visor VIO your Active job 1 Jobl
13. Cycle time n a Flash 0 2 kB 40 3 MB x 320 240 1 253 o Q QOQ Q9 Figure 21 Camera image of a reflective foil with the cursor position marked The position of the bright spot should be in the centre of your camera image To ensure this the best method is the following Bring the cursor to the position of the half resolution of your camera e g for VGA X 320 Y 240 The current position of your cursor is indicated on the bottom of the window in pixels In Figure 27 above it is marked with the lower rectangle in the same part of your window the intensity at the cursor position is printed as well Then adjust the sensor mechanically to move the centre of the bright spot into the centre of the field of view which is marked with your cursor now Then your image should look like Figure 22 VISOR Vision Sensor E 068 14505_01 Page 21 of 75 VISOR Solar User Manual G SCNSOPART SensoConfig Solar G SENSOPART Welcome to SensoConfig With this programme you can configure your VISOR vision sensor for one or several jobs in six logical operating steps Basic image setting Image brightness Adjust shutter or amplification see Job General Image sharpness Focus setting screw on the back of VISOR Start Sensor Other programme functions Trigger settings Mode of connection online offline Simulation of inspection jobs using series of images filmstrip Image recordin
14. Solar User Manual G SCNSOPART 5 3 7 2 Checking the quality of the antireflective coating The quality of the antireflective coating ARC of wafers can be checked from the sensor with the Aole tool of a wafer detector Visible defects of the ARC may be caused by the following origins e Dust particles of sizes of typ 1mm e Insufficient cleaning before the ARC process on spots of 100 mm and more To check the antireflective coating first create a Wafer Detector as described in section 5 3 Configuration of the Detector characteristics Then use the hole tool to detect areas with bad antireflective coatings and therefore a higher reflection Choose in the tab Hole of the Defector sub menu the Brightness as Bright With Brightness threshold you choose the threshold between the good and the bad areas on your wafer surface In typical applications the default setting of 30 relative will lead you to good results As known from the threshold settings before and in according to section 5 3 Configuration of the Detector characteristics it is very useful to check your setting on some test wafers A screenshot of a typical setting is shown in Figure 45 SensoConfig Solar Inl xl File View Options Help jl oad g e IJ 8 9 Setup r a SENSOPART Alignment TT Hone Rev nee Output Wafer Detector Result This detector is useful to check cracks at a wafer
15. The edges of wafers may be damaged during handling forming chips Chips from 0 5 mm in size can be either identified due to their size or due to their shape The sensor is able to distinguish between comparatively harmless mouse bites and severe shark teeth defects e Holes Holes formed during the manufacturing of the ingot or block with sizes down to 0 02 mm can be detected e Busbars position pads The position of the busbars is correctly identified for tabber stringer tools and for electrical tests like cell sorting or electroluminescence e Cell type identification Different cell types can be identified due to the number and spacing of busbars the presence of pads and manufacturer logos Moreover the correct identification of the upper surface can be detected The availability of the functions for each camera model is described in section 3 1 Product lines VISOR Vision Sensor E 068 14505_01 Page 6 of 75 VISOR Solar User Manual a SeGNSOPART 2 2 User benefits The sensors are designed for industrial usage withstanding even harsh conditions Due to the integration of the illumination into the camera and a standardised set of mounting accessories the integration into machines becomes an easy task CAD files can be found on our website e Easy integration cost efficient solution The key objective of the product line is to provide robust and reliable wafer and cell analysis on a stand alone solution with m
16. VISOR Vision Sensor E 068 14505 01 Page 9 of 75 VISOR Solar User Manual Q SeNSO PART 3 2 Machine infegrafion 3 2 1 VISOR product line Within the Advanced product line V 0 SO A different models are available to provide the best fit to the requirements of the specific machine They offer different colours of the internal illumination and different focal length lenses to adapt to the required working distance White light cameras are most frequently used and can be combined with external red ring or area lights as well Infrared light is not seen by the operators and thus avoids potential disturbances by the flash and is also very robust against ambient light changes due to its special in built lens filter According to the requested working distance the lens type is selected The table below provides information on typical setups V10 SO S1 W6 Typical dimensions v10 SO A1 W6 V10 SO A1 I6 V10 SO A1 112 Product lines Advanced amp Standard Advanced Advanced Illumination White Infrared Infrared Internal Lens Focal length 6 mm 5 mm 12 mm Working Distance 364 mm 364 mm 712 mm Shutter speed with reflective foil 0 17 ms 0 16 ms 0 06 ms Shutter speed with back light 0 23 ms n a n a Field of view 6 Wafer min 10 space Typical values for wafer detection on LF 200 RD Measured from lower edge of camera to wafer Using LFR 115 RD 24 2L12 and LO C 8 Typical values for wafer detection on RF 775
17. the job may comprise of just one busbar detector e To optimize the illumination for the different requirements of the wafer and busbar detector the two detectors can be distributed to two different jobs This way even a switched backlight can be run in combination with the wafer detector without affecting the busbar detection However this approach requires a much higher cycle time and job switching by a PLC VISOR Vision Sensor E 068 14505 01 Page 56 of 75 VISOR Solar User Manual G SCNSOPART The easiest way to determine the calibration factor tor mm units is to implement a wafer detector and copy the value to the clipboard To make use of the Busbar detector a new Detector has to be created which is described in section 3 3 Configuration of the Detector characteristics Choose a Busbar detector 6 item in the list in Figure 3 1 For calibration activate mm units on the tab calibration and paste the calibration factor determined by the wafer detector or other means into the busbar detector s control calibration factor and press Apply see Figure 48 All settings of calibration including distortion removal should be identical for all wafer and busbar detectors gt SensoConfig Solar File View Options Help i r gil Zi gi T 8 9 2 Setup m Job Alignment Output Result Trigger Image update Single be Trigger Nu Continuous ER P Connection
18. 1 3 Assign IP address fo ihe Camera pissin iaie a yake ki ka y Aka Eee ae aUai errai EEE ai airiai 17 2 14 Starling up the Sofware SeHsoFIMeluiua succeed OR SEDI AE SIKDU PLIN ENE NVES EEEE ESNEA 18 4 1 5 Adjust the sensor to ensure the perpendicular mounting sss 20 AO OWS UN NRI 23 4 1 7 Configure or upload a job file to the COMET Css dioeceseos abt ee puteo baeo i sudes test oret eden 26 w d MM MM HHHHHHEEnKNE EE ENE RRTJ JJ MpP h 3N MB 27 4 2 1 Recommended setup Reflective foil or back light ii kk keke ke keke 27 4 2 2 Machine paris in the imdage EiEii krea kereke keke erek k k ere e r Kek KAK K KHK HKH AHA HAK AKA HK HAK KHK 27 Dede n brEDrDr ll reto METAM M UU UM EUM IET Ue UU DIE 29 cc o c c r eeeaeaeaeaebjjsv wwwecww_www wwwww ox 30 veya cc T T T T T TDTDTTgggoggggegg mE Ee 3 S ooir conia Lo To cnt ON IQ 32 3 1 Image acquisition parameters with Job u ereke edaecigeecstltaipadeosicndnsiaanineuantdvedede 33 5 2 Alignment Advanced version only reke keke erkeke reke keke keke keke k reke keke k rek k reke 36 5 3 Configuration of the Detector characteristics essent ntn tnnt 36 MES ee e PNE TT T oom 38 5 3 2 Teaching the sensor your machine configuration sss nnns 40 5 3 3 Setting of the dimension measurement 5s oet cte taque eec ve bit eec itd tar Pr c keke ereke kek tste bu
19. 2 Fiducials 6 ms 6 ms lmage acquisition amp busbar position 72 to 90 ms 72 ms Total 72 ms Total 150 ms Cameras manufactured before September 2012 and updated to this firmware show different cycle times Figure 58 Cycle time of the offered tools The Typical setup refers to a V10 SO with 6 mm lenses In case of severe disturbances of the image e g when there is no wafer but a machine background present or a hand of the operator is exposed to the camera the cycle time may deviate significantly from the above observations To cope with such situations in a line which constantly feeds wafers the Job cycle time max cycle time should be activated and set to a value which is required for an undisturbed line operation Thus the image analysis will be aborted after this duration and the result will be a FAIL VISOR Vision Sensor E 068 14505 01 Page 67 of 75 VISOR Solar User Manual SCNSOPART 7 VISOR related tools 7 1 Software A 1 1 SensoView With the VISOR software package comes a tool dedicated to be used by operators Unlike SensoConfig it can be used during running production to show the actual images results and statistics The operator cannot change parameters with this software Senso View is started by selecting a camera with SensoFind and pressing the View button The first pages shows the results as described previously for SensoConhg In case of several jobs and detectors being up
20. 8 SCNSOPART VISOR Solar User Manual VISOR Solar User Manual G SCNSOPART Content Purpose of ihis user non DO 4544245444454451 qesioen d na qon i haven bd wade da y eee ian et cubed nested eee jek e e eke kek 5 2 Applications covered bv VIS OR Solar sahs O moneri ti n cel It uIR IO One tuc Serb Cil d bat K eae ER eM He Dedi E y na 6 gt eoe zzil 7Tr e e e e J r _ll_ r gt gt oa_r_r_r_r_rrwvwr ra E A 6 ww gt gt _ gt w e u u__hhmh c aaa Beb Qnbcnn 7 23 piena SS RR T E N E TE E 8 3 Component selection BINNEN RN IRR RR V4 AU WA WA HAH V Ua H R W K Hb 0Ku WW u HG VA WA VA A 9 HAA GA VA VA HA UU uu W U k AW 8 Ce PAI eL MH M 9 SP tere TR dii is Ee 5FEeBIII JJ Jiy ZJ II IE IE II IE E IE IIIeE EISDE E E O 9IJI EEEE E8E MDEAEAEN EEEEEENNDPPEN gt E PDDADBEPI AE D E E E 10 gt H o _ h r rnzacr xrombebemmmmmmm 10 3 2 2 MUI em amp Backgro nd DRE ERE TOU 12 3 2 2 1 Illumination amp Background for wafer analysis sse 13 3 2 2 2 Illumination amp Background for cell analysis sse 129 982 SV UA HOCOSSOI aee Bl l aH xxx _ AA _ 14 4 Setting up the camera BIN RI RR 15 Ak aa MOO e a Tm 15 4 1 1 Mechanical mounting the clamp and the camera 15 pn eee 16 4
21. Box R2422 R2232 Ethernet EtherMetlP VISOR V10 Solar sensor Advanced unlimited number af jobs and detectors alignment for wafer inspection busbar detection B types of detectors C Mount 10 IG channels encoder input interface to lO Box R2422 RS232 Ethernet EtherMet lP gr2 51801 C L12FG S 2m PLI amp Power lC Cable 2 m M12 12 pole Straight Connector shielded 902 51796 C L12FG S 5m PLIR Power iO Cable 5 m M12 12 pole Straight Connector shielded 302 51737 C L12F 3 10m PUR Power lC Cable 10 m M12 1 12 pole Straight Connector shielded 902 51 795 L12FA 5 2 T PLIF Power lC Cable 2 m M12 12 pole Angled Connector shielded 902 51 799 L12FVy 3 Sim PUF Power MO Cable 5 m M12 12 pole Angled Connector shielded 902 51 800 C L12F 5 amp 1 Om PUR Power WO Cable 10m M12 712 pole Angled Connector shielded Ethernet cables 902 51 54 CI Lhe RJ450G 55 3rn PLIR Ethernet cable 3m M12 Straight Connector 4pole RJ45 shielded 902 51 752 CI L4l lG R J45G G5 5IT PLIR Ethernet cable Sm M12 Straight Connector 4pole RJ45 shielded 902 51 7584 CLAM SRI S6 65 10m PUR Ethernet cable 10m M12 Straight Connector 4pole RJ45 shielded 902 51 786 CI Laney RJ456 56 Sm PUR Ethernet cable 3m M12 Angled Connector 4pole R145 shielded 902 51 7868 Cl Lahey RJ456 56 5m PUR Ethernet cable Sm M12 Angled Connector 4pole RJ45 shielded 902 51 7930 Cl Lan RJ45G S6G 10 0m PLIR amp Ethern
22. Result With this programme you can configure your VISOR vision sensor for one or several jobs in six Start sensor logical operating steps Basic image setting a Image brightness Adjust shutter or amplification see Job General Image sharpness Focus setting screw on the back of VISOR Job Position tracking Detectors Output Result Start Sensor Other programme functions Trigger settings Mode of connection online offline Simulation of inspection jobs using series of Triager Image update images filmstrip _ pa a Image recording for analysis or simulation Single purposes Trigger Continuous Use of SensoConfig may require password 4 entry administrator user group See user Connection mode administration T Play gt B Online Offline 400 t To obtain a continuously updated live image even v E xana nad d na Configure job Jobs Name Description Author Created Image acquisition Image transmission Archiving Pre processing Cycletime 1 Jobi Job Author 02 05 2012 0 Resolution Shutter speed m Quadrants VGA 640x480 CI 7 lozsms 99 Auto shutter 3 O 3 Trigger mode Gain en Internal illumination Trigger a 1 00 l j on 2d gt Free run External illumination Off gt New Load Save Delete Delete all Mode Config Name Visor V10
23. VISOR Vision Sensor E 068 14505 01 Page 65 of 75 VISOR Solar User Manual Q SeN SO PART 7 1 2 Data log 5 5 Starting the sensor Now alll settings are done their results checked you are now able to start the sensor it will then run autonomously To start the sensor press the Start button as described at the beginning of section 5 Software configuration All needed settings will be stored now on the sensor until they are overwritten with new settings It may be useful to save the actual Jobfile on your PC as a back up or to use it in similar machine configuration as described in section VISOR Vision Sensor E 068 14505 01 Page 66 of 75 VISOR Solar User Manual C SeN SO PART 6 Cycle time This section summarizes the cycle times which are to be expected under typical conditions Obviously the cycle time depends on the content of the image which may deviate from the setups used here Typically the 6 mm cameras run with a cycle time of 72 ms whereas 12 mm and C Mount cameras require just 57ms for the same task Cycle time V10 SO Typical set up Typical set up Cell Handling Stringer Image acquisition amp wafer position 43 ms 43 ms 43 ms Further wafer detector 22 ms Wafer Blanking region 2ms Wafer Area 10 ms Calibration Distortion compensation 18 ms 18 ms 18 ms Chip size 11 to 24 ms 11 ms 11 ms Chip shape 32 to 48 ms Hole 6 ms Grey level detector Sunny side up down 1ms Position of
24. chips The complete feature set is provided as Advanced product line Product line overview V 10 SO Standard Features Position accuracy 50 um Repeatability 1 um Alignment to fiductals Chip detection limit 0 5 mm Double layer detection v Busbar position Hole detection v Sunny Side up down detection v Typical cycle time amp wafer VGA 75 ms Typical cycle time cell VGA Humber of jobs 2 Humber of detectors d Detectors Wafer v Busbar Pattern matching Grey level brightness contrast v Optics Max Resolution WGA 7368450 Hlumination White Focal length 5mm Min working distance for 6 Wafer 350 mm C Mount Interfaces Number of digital outputs Humber of inputs Humber of configurable VO ports Encoder input Ethernet EtherNetP RS 232 RS 422 IP class IP Bf Stability Subsequent tests 4Mia parts RN RO ROM Typical values under recommended conditions 1 wafer subsequent measurements 5 mm travel Typical values Wafer Wafer detector only Cell Wafer and busbar detector Cameras manufactured before September 2012 and updated to this firmware show different properties a C Mount version reaches IP 65 with overhousing Figure 3 Product line overview of VISOR Solar Note The VISOR Solar performs both wafer and in cell analysis For reasons of simplicity in the following only the term wafer will be used representing both kinds of devices Wafers and cells
25. comprises of MP45 MST45 40 MGA5 MST45 20 MB45 MA45 and MKA5 VISOR Vision Sensor E 068 14505_01 Page 7 of 75 VISOR Solar User Manual a SEN SO PART 2 3 Interfaces The sensors run on 24V DC industrial power supplies and provide short circuit proof digital I O For data such as position measurement the fully integrated ethernet or a serial bus connections may be used The protocol is easily configurable and can be adapted to almost any PLC A trigger signal may be sent as a digital input or via Ethernet Data can be pulled by a server or transmitted by the sensor via FTP or SMB An Engineering level SensoConfig software is provided for the configuration and setup whilst for easy overview and job selection the Operator level SensoView provides live images and statistics In addition to these there is also a 3 level password protection built in to stop unauthorised changes being made 3 Component selection The VISOR Solar product family comprises of different models sharing a wide range of illumination and lens options so all physical mounting possibilities are ensured M12 x 1 153 00912 Figure 2 VISOR drawings Top Integrated lens and illumination Bottom C Mount version VISORe Vision Sensor E 068 14505 01 Page 8 of 75 VISOR Solar User Manual CC SCNSOPART 3 1 Product lines The Standard product line of the VISOR V10 provides fundamental functions for the detection of wafer position and
26. contur and measure some geometric parameter like width height position rotation angle Tab for Wafer Tab for Chip size Tab for Chip shape Tab for Hole Tab for Calibration Tri E Tab for Binarization rigger Image upda Tab for Rectangle fit Tab for Cut Single Trigger Tab for Miscellaneous Continuous Settings at tab for Hole Connection mode MS Parameter Functions owe eoe Qe HE Lom J gt LJE Hole Activate hole Configure detectors and regions 2 Wafer Chipsize Chipshape 3 Hole Calibration Detector name Result Detector type Hole 1 Detectori 2 Wafer Brightness Brightness threshold 32 Relative Area CD 0 25 mm 5 Overlay Marked pixel new eo ree C oaee oeeo _ Mode Config Name Simulator Active job 1 Job1 Cyde time n a Flash 0 4kB X 0 0 1 0 bur Figure 45 Example of a polysilicon wafer with an incomplete ARC due to insufficient cleaning VISOR Vision Sensor E 068 14505 01 Page 54 of 75 VISOR Solar User Manual a SeN SO PART 5 3 8 Sunny side up down As a result of manual handling wafers may be put on conveyors with the sunny side down With the sensor such wafers can be sorted out The grey eve detector can be used to differentiate the wafers according to the different reflectivity To make use of the grey level detector a new Detector has to be created which is described in section 2 3 Configuration o
27. equipped with internal LEDs a ring light becomes mandatory Figure 8 V10 SO A1 C with C Mount lens and ring light LFR 115 RD 24 2L12 VISOR Vision Sensor E 068 14505_01 Page 12 of 75 VISOR Solar User Manual G SENSOPART 3 2 2 1 Illumination amp Background for wafer analysis For wafer analysis it is recommended to place the reflective foil RF 775 in the background Using integrated powerful illumination this results in a shutter speed of less than 0 2 ms for very little costs A similar approach can be followed using the C Mount camera with a ring light For detailed values of the shutter speed see Figure 4 In the special case of detecting holes in wafers or cells a back light is necessary to provide sufficient light through the tiny defects Such backlight lights can be controlled by the sensor when adding the connection adapter LA 45 V 24 2112 Figure 9 VISOR with Back light LF 200 RD and connection adapter LA 45 V 24 2112 3 2 2 2 Illumination amp Backaround for cell analvsis To analyse the printing on the front side of a cell Infrared illumination is strongly recommended The usage of white illumination may cause disturbing reflections in combination with polycrystalline material Figure 10 Images of a polycrystalline cell with poor antireflective coating using recommended infrared left and non recommended white illumination right As background the usage of a homogeneous white material is
28. for unusual conditions for your application can be applied in cooperation with the SensoPart technical support team VISOR Vision Sensor E 068 14505_01 Page 31 of 75 VISOR Solar User Manual SCNSOPART 5 Software configuration This section describes how the software tools are used and optimized to meet the requirements of the application For details on general VISOR tools see VISOR user manual as well To run offline analysis of stored images choose the requested model in the SensoFind section Sensors for simulation mode The configuration of the VISOR sensors is performed in the following simple six steps using SensoConfig Image acquisition parameters with Job o This includes the configuration of the Image acquisition parameters illumination trigger mode and timing 2 Alignment Advanced version only o This feature allows to refer all regions of interest ROI positions to one fiducial or edge 3 Configuration of the detection characteristics via Detector o Tool box for image processing here are the characteristics of the wafer defined which are tested wit the sensor available tools are listed in Figure 3 4 Adjustment of the needed Os via Output o Definition of digital I O and telegram for data transmission 5 Control of the adjustments via Result o The results of image processing are displayed on the screen for information and to check the influences of the set parameters
29. last calibration step should be repeated e Offset level of chip depth The internal lenses yield to a small blurring of the image which influences the detection of chips To compensate this effect a default offset of 0 4 mm is provided which compensates this effect This setting should not be changed for the internal 6 mm and 12 mm lenses of the V10 models VISOR Vision Sensor E 068 14505 01 Page 39 of 75 VISOR Solar User Manual a SCNSOPART 5 3 2 Teaching the sensor your machine configuration Since the sensor is made to work in a lot of different environmental conditions a few settings depending on the individual machine configuration are needed This includes the contrast setting between the wafer and background the shape and size of the wafer and machine parts in the image e g from conveyor belt which have to be blanked SensoConfig Solar 8 xl File view Options Help Oead ce Setup G SCNSOPART Home Prev Next Print Job u l gt Output Wafer Detector Result This detector is useful to check cracks at a wafer contur and measure some geometric parameter like width height position rotation angle Start sensor Tab for Wafe Tab for Chip size Tab for Chip shape Tab for Hole Tab for Calibration Tab for Binarization Tab for Rectangle fit Tab for Cut Tab for Miscellaneous Settings at tab for Wafer
30. mode Online Offline Configure detectors and regions Busbar Calibration Distortion removal Detector name Result Detector type BusBar Busbar 2 Cell Q Wafer Kappa x10E 6 Ba 0 300 Scale eu 0 980 Mew Copy Reset Delete Delete all Mode Config Name Simulator Active job 1 Jobi Cycle time n a Flash 0 5 kB a SECNSOPART Home Prev Next Print Busbar Detector Settings in tab Binarization Parameter Functions Activate automatic binarization Threshold For each image the intensity correction threshold will be automatically calculated by evaluating the current brightness of the mm units Calibration Factor object and the background These dynamic threshold can be manually corrected so that the final value will be move closer or further away to the intensity of the background 4 2 38817 pximm x Y 0 I 0 DOLIT T o0 900900 0 Figure 48 Calibration of the busbar detector VISORe Vision Sensor E 068 14505 0l Page 57 of 75 VISOR Solar User Manual G SECNSOPART Then switch to the tab Busbarto configure the busbar detection gt SensoConfig Solar File View Options Help cega a gerna Setup 3 Alignment Home Prev Next Prnt Detector P
31. of the wafer edge and to almost constant values of the wafer position shown in Results Wafer Center X Center Y and Angle With optimized setups shown in Figure 7 subsequently recorded positions do not vary by more than the displayed resolution 1 pm The resulting position can be transmitted via Ethernet or serial bus to a PLC or robot controlling unit Alternatively the sensor may compare these values against user settings to perform a PASS FAIL decision and to control one of digital outputs for this purpose Using a V10 model in VGA resolution the standard deviation of the repeatability is typ 0 5 pm respectively 0 001 in a setup like described in Figure 7 This outstanding repeatability underlines the high precision and reliability of the algorithm employed in this product line The average cycle time to perform this operation is just 43 ms without distortion removal VISOR Vision Sensor E 068 14505_01 Page 42 of 75 VISOR Solar User Manual G SCNSOPART 5 3 3 1 Measurement of wafer and cell distances With the Wafer Detector it is also possible to measure the distance between two wafers To do this create a new Wafer Detector choose the Brightness as Bright Shape as Rectangle and define the ROI in a proper way An example for a string inspection is shown in Figure 35 The distance is given as Height since it s the shorter side of the ROI SensoConfig Solar File View Options Help Bop e j Setup
32. positions are listed Depending on the different mounting position of your sensors and therefore different calibration factors of the two sensors all given positions and measurements have to be done in pixels VISOR Vision Sensor E 068 14505 01 Page 50 of 75 VISOR Solar User Manual G SCNSOPART 5 3 7 Hole Tool The Hole tool is very versatile to detect spots within the area of the wafer or cell which are of special interest such as e Holes formed during the manufacturing of the ingot or block Cracks Stains from a printing process Holes or inhomogeneities in the antireflective coating In the following the usage of the Ao e tool and the mentioned applications will be described SensoConfig Solar File View Options Help ioaad aego Setup C SENSOPART l Alignment M M Home Prev Next Print Output Parameter Functions Hole Activate hole Result Brightness Select a bright or dark object intensity in Start sersor relation to the i brightness of solar wafer Brightness Define the intensity threshold absolute threshold to detect an oe d faulty object as a fixed Trigger Image update grey value l Single Brightness Define the intensity Trigger a threshold relative threshold to detect an Continuous faulty object as an offset in addition to the Connection mode averaged brightness of each solar wafer
33. recommended This can be plastic or coated aluminium Do not use the reflective foil in these applications VISOR Vision Sensor E 068 14505_01 Page 13 of 75 VISOR Solar User Manual Ou SENSO PART 3 2 3 Mounting accessories Each VISOR camera comes with a mounting clamp MK 45 The camera may be fixed to it via the dovetail fitting on its base Figure 11 Mounting clamp MK 45 To support the easy and precise adjustment of the camera the use of the mounting bracket MG 2A no 543 11023 shown in Figure 12 Mounting bracket with two axes MG 2A is recommended The precise orientation of the camera towards the object is crucial for reliable measurements DIN 912 M6 3x Figure 12 Mounting bracket with two axes MG 2A Mounting kits are available for the accessories like external illumination as well and can be found using the product finder on the SensoPart homepage www sensopart com see section 9 Useful links and contacts Within the VISOR product family the different accessories may be combined e g an MG2A with external illumination VISOR Vision Sensor E 068 14505_01 Page 14 of 75 VISOR Solar User Manual G SCNSOPART A Setting up the camera 4 Installation The V SOR user manual provides detailed information on the setup The document can be found under Windows Start All Programs SensoPart VISOR vision sensor Documentation In this document the main steps are briefly listed
34. the example below a chip is detected and shown in eightfold magnification The red line indicates locations violating above distance check of the fit condition 1 FAILED These deviations are observed for 15 times condition 2a causes a FAIL Concluding the chip size tool rejects the wafer Since the two previous conditions FAILED the comparison to Area per chip becomes irrelevant in this case SensoConfig Solar File View Options Help gBecmmuceilanauos Setup a CC SGNSOPARI Alignment l Home Prev Next Print a Output Wafer Detector ma Result F This detector is useful to check cracks at a wafer contur and measure some geometric Start sensor parameter like width height position rotation angle Tab for Wafer Tab for Chip size Tab for Chip shape Trigger Image update Tab for Hole Tab for Calibration Single Tab for Binarization Trigger Tab for Rectangle fit Continuous _ Tab for Miscellaneous v 1220 NE Connection mode Settings at tab for Chip size Online Offline 400 mm cay s nd ol ka n km Parameter Functions b Configure detectors and regions Detector name Result Detector type Wafer Chip size Chip shape Hole Calibration 1 Wafer Wafer Chip size Level of chip depth Deviations per chip Area per chip a 50 00 mm H New Copy Reset Delete Delete all Mode Config Name Visor V10 your Active job 1 Jobl Cy
35. 2 job files simultaneously For sensors of the Advanced product line the number of jobs may reach up to 255 but may be lower in case of complex jobs SensoConfig Solar E i 2 laj a X File View Options Help jl oaa gi IB 9 ss Detector Output SENSOPART Home Prev Next Print Parameters for image acquisition Result Start sensor The basic parameters for image acquisition are determined in the General tab Set image sharpness with the focus setting screw on the back of the VISOR Image transmission parameters for image transmission Pre processing parameters for preprocessing of image Parameters Functions and setting possibilities Resolution Standard resolution is WVGA 736x480 but a lower resolution CGA can be selected with time critical applications or for compatibility reasons Available resolutions W VGA 736x480 VGA 640x480 QVGA 320x240 QQVGA 160x120 A When the resolution is altered all the detectors previously defined Trigger Image update AFAT deleted Single Trigger Select trigger mode triggered or Trigger mode free run In case of triggered mode trigger can be issued by hardware trigger Pin 03 WH or over one of the interfaces Connection mode Shutter Parameter for control of image speed brightness Exposure can be set Ours cek m ES eR mL LL automatically with the Auto
36. 75mm var length self adhesive price per 100mm length VISOR Vision Sensor E 068 14505_01 Page 73 of 75 VISOR Solar User Manual CC SCNSOPART 9 Useful links and contacts Free download of Vision Sensor VISOR PC http www sensopart com en download finish 7 1 software 1720 Software with sample images including visor pc software v 1 300 SensoFind SensoCalc SensoContg Registration required SensoView VISOR user manual After installation of above software Windows START All programs SensoPart VISOR Vision sensor documentation user manual SensoCalc After installation of above software Windows START All programs SensoPart SensoCalc Manual on Ethernet communication After installation of above software Windows START All programs SensoPart VISOR Vision sensor Tools Ethernet Product Finder www sensopart com en products CAD drawings www sensopart com downloads Technical support support sensopart de 49 7665 94769 750 VISOR Vision Sensor E 068 14505_01 Page 74 of 75 VISOR Solar User Manual CC SCNSOPART Appendix A Test sample shark Teeth triangles SU with indicated depth Testwafer for Mouse Bites Semicircles U Set M au With indicated 156 x 156 mm radius VISOR Vision Sensor E 068 14505_01 Page 75 of 75
37. Calibration Tab for Binarization Tab for Rectangle fit Tab for Miscellaneous Trigger Image update Single Trigger Continuous Connection mode Settings at tab for Calibration Online Offline Fit a 4 IParameterlFunc ons LLL Configure detectors and regions Detector name Result Detector type Wafer Chip size Chipshape Hole Calibration 1 Wafer 9 Wafer Distortion removal Y mm units Calibration Fackor Kappa x10E 6 2 68675 pximm Apply em 0 2 Wafer height 156 000 mm So Calibrate to wafer Scale n ae 0 980 S Offset level of chip depth 0 80 mm New Copy Reset Delete Delete all Mode Config Mame Visor V10 your Active job 1 Jobl Cycle time n a Flash 0 4 kB 40 3 MB X 0 Y 0 I 0 DOUT Q 9 9 9 9 9 Figure 33 Using Wafer Detector Calibration the camera is calibrated within three clicks VISOR Vision Sensor E 068 14505 01 Page 38 of 75 VISOR Solar User Manual C SeN SO PART The meaning of the controls on the calibration tab is as follows e Distortion removal The usage of cameras with internal 6 mm lenses allows small working distances However a slight optical distortion of the square object is observed in the image For best results with the V10 6 mm cameras ALWAYS activate the distortion removal this can be found under Detector Calibration tab distortion removal without changing the defa
38. NSOPART Alignment Home Prev Next Print Detector VO mapping Result Here are made the following settings 1 Definition if I O are used as input or output Pin Start sensor 05 08 can be used as input or output 2 Assignment of fuctionality to inputs and outputs In the list box there can be seen and selected all available functions for this input or output Some functions can be assigned only to one special input or output e g HW Trigger Functions of inputs Function Description H W Hardware Trigger only on pin 03 Trigger WH available Encoder Positive input for encoder only on pin 10 VT availabe Encoder Negative input for encoder only on pin 05 PK availabe Enable Enable or disable trigger signals Trigger input needs a minimum signal lenght of 2ms before raising trigger Trigger Image update signal reee Job 1 N Job change by pulses on one input ingle 1 Trigger 3 Teach Teaching of all detectors and a Continuous temp alignment Rising edge on this input perm and trigger start teaching Temporary storage in RAM Connection mode permenent storage in flash c lay gt f Job PinX Job change by binary bit pattern 9 Online Offline 10095 T 4 D Configure output I O mapping Digitaloutput Interfaces Timing Telegram Pin color Input Output Function Unique Function 03 WH HIW Trigger 10 VT Mi no function undefined 12 RDBU A Ejector Result
39. P X gt 7U 74J 4790795 0525 gt 050bE5E09995N5NDNDJJJJJ p J rrr r er r r nrll _ ur rr E yyy _aMM 63 a HL T Bb KE EUNT 66 Rare RTI REN T ue teen eae 67 7 VISOR related 100l NER RA en ne ae an en ew n bed n 68 VISOR Vision Sensor E 068 14505_01 Page 2 of 75 VISOR Solar User Manual a SEN SO PART Ty os OM ING DDN D DMM_ iIM MAME N NnRnREnEXE ENREE NENE RE HHnHHHEHNHn E N nNaE lt En InnE EanNnENnEnE En n EEE IDWImaIaR DM MM MMMMDIWTT Mz 68 NES Io EL 68 7M EPA Do fo reo RN RERO H E 70 n m ___ggxg xomgp2 _ _qog _onmpn_mmmmmpman 72 n3 eee oe x s jjjjwm irnrbPHHH H F PEDMnrNNEDEZRXENMDMDM 74 rav Te t REN EE 75 VISORe Vision Sensor E 068 14505_01 Page 3 of 75 VISOR Solar User Manual G SECNSOPART No part of this document may be reproduced published or stored in information retrieval systems or data bases in any manner whatsoever nor may illustrations drawings and the layout be copied without prior written permission from SensoPart Industriesensorik GmbH SensoPart accepts no responsibility for printing errors and mistakes which occurred in drafting this user manual Subject to delivery and technical alterations General remark All data shown is based on tests under laboratory conditions It is necessary to confirm the results of our tests under process
40. Q Q Figure 35 Typical setup of a distance measurement This easy setup provides further very valuable information The width is a quality measure for the presence of the two ribbons within the ROI If one of them is missing the width will increase significantly Adding a second wafer detector the presence of the lower ribbon can be performed as well VISORe Vision Sensor E 068 14505 01 Page 43 of 75 VISOR Solar User Manual G SCNSOPART 5 3 4 Checking the thresholds with Result After setting the initial thresholds of dimensions and position it is useful to check the result of further tests These results of the sensor are shown in Result With the knowledge of the results of your measurement your thresholds can be re adjusted as described before By clicking on the Result button you get an image like Figure 36 On the right the Statistics are shown of all images taken by the sensor since starting it or since resetting the Statistics On the left are the results of the actual image taken by the sensor in respect to the actual Detector used The following description is unless stated otherwise in respect to the Wafer Detector The name of the actual Defector is grey marked in the small window Detectors on the left 2 SensoConfig Solar File View Options Help ji lt gil gd g a 8 9 2 Setup C SGNSOPARI Alignment Home Prev Next Print Detector a i Output Welcome to Se
41. User Manual CC SCNSOPART Figure 28 Using Contour smoothing and Ignore protrusions the wafer analysis can be performed even on a metal grid These examples illustrate the ability of the camera to operate even with confusing and difficult background conditions Further options for unusual conditions have been established and can be applied in cooperation the SensoPart technical support team contactable at our headquarters in Germany 49 7665 94769 750 or via your local area sales channel 4 2 3 Front light applications In case neither a reflector nor a back light can be deployed in the machine the wafer will likely appear bright in front of a dark background of the machine This is a satisfactory solution although limitations will be found on the sensors ability to find small defects It should be noted that for hole detection a back light solution is always required to achieve good image contrast between the wafer and the background Care and attention has to be spent on shutter speed and contrast which are treated in the following sections VISOR Vision Sensor E 068 14505 01 Page 29 of 75 VISOR Solar User Manual G SCNSOPART 4 2 3 1 Shutter speed The shutter speed has to be adjusted to show the bright parts of the image either the background or the wafer cell with intensity values slightly below saturation Since the reflectivity of the reflective foil RF775 is very high in this case the shutter speed becomes v
42. ad cello m a SENSOPART Rest ata output via serial interfaces RS 422 and Ethernet as well as for archiving in cvs files legram lelegram Score t IP Response telegram Execution time t IP Request telegram Trigger Image update Busbar center X Single Busbar center Y Trigger Busbar width Continuous Busbar length Ethernet RS422 eon m E osition contro N oine ome J n AE ER azayan BR j canan pum A j fi Busbar brightness threshol max Result byte i I Busbar 1 I O mapping Digitaloutput Interfaces Timing Telegram aras i Center Y Start ox0A 0x0D 0x__ 0x__ 0x__ 0x__ Ox 0x__ Payload Men Trailer Ox Ox Ox Ox Ox Ox Ox Ox ERIE 1 Result area check PASS FAIL ese Active Detector Pads Separator 0x38 Ox__ Ox__Ox__Ox__ 1 vY Cell 1 _ox__ox_ox__ f keapen 5 2 V1 mee T Save to file Selected fields Data length _ Status Detector result Digital outputs Logical outputs uw _ Execution time Active job no _ Checksum Mode Config Name Simulator Active job 1 Job1 Cyde time n a Flash 0 5kB X 0 Y 0 1 0 pout 9 Q9 O9 Q 9 9 Figure 57 Telegram definition of a Busbar Detector Once the sensor has been started it autonomously sends a telegram for each image taken The example above is compliant to a tool logging the telegrams ino a tt file which is described in section
43. arameter Functions p Output Number of Setting for expected number Result busbars of busbars Range to accept the area of H a busbar If area of busbar is outside specified range of this parameter computing of all other values is aborted Area of busbars is calculated from the total number of Trigger Image update selected pixels Range to accept the current Single A value of rotation m Continuous Position To check the position of the control center of gravity you can j i define a rectangle or elliptical Connection mode area where it has to be ir Oris offline Fi 2m lt Play gt 13 15 Overlay Activate graphical overlays i ji j d for huchar nivele M C Kun Configure detectors and regions Detector name Result Detector type Busbar Calibration 1 BusBar 9 Busbar Number of busbars 2 Cel Wafer emp s G Area per busbar j a i Position control CD n j2 877mm E Off Angle range A Overlay EET 20 00 3 50 00 f None New Copy Reset Delete Delete all Mode Config Name Simulator Active job 1 Jobi Cycle time n a Flash O SkB x 0 0 1 0 DOUT 9 9 9 9 9 9 Figure 49 Settings of the busbar detector The settings of the Busbar Detector are done with a few clicks First the yellow region of interest ROI has to be adjusted in the well known manner described in section 5 3 Configuration of the Detector characteristics The number of busbar
44. cle time n a Flash 0 4 kB 40 3MB X 0 Y 0 1 0 DOLIT Q Q Q Q Q Q Figure 37 Applying the Chip Size tool Locations exceeding the Level of chip depth are shown in red If additionally the Area per chip is exceeded the line will be broad red Please note that the Level of chip depth is not identical to the physical dimension Due to the finite camera resolution and effects of the optics there is an offset between the two which is compensated by a calibration parameter see section 5 3 1 Calibration Figure Z reveals the detection limits with the Leve of chip depth used in above example The average cycle time to perform this operation on a good wafer is 13 ms Typical chips increase the cycle time by a few ms However analysing several massive defects in one wafer this tool may take 24 ms or more VISOR Vision Sensor E 068 14505_01 Page 46 of 75 VISOR Solar User Manual G SECNSOPART 5 3 5 2 Chip Shape tool The Chip Shape tool scans for sudden angle deviations along the edge of a wafer To generate a fail signal the chip violates 1 The set Level of chip depth AND 2 The set Angle deviation which defines the sensitivity of the algorithm The locations representing a chip according to this scanning method are shown in orange To illustrate the performance of this tool it has been applied to the same chip like used in the previous section keeping the default parameters gt SensoConfig Solar File Vi
45. compatible network and firewall settings on the local PC In this case please contact your local IT department to solve the issue 12 SensoFind VISOR Vision Sensor File Settings Help Oo 5 g Active sensors ium dE SCNSOPART 1690 30 9 V1U olar andara a pee run ine 5 OU 3 9 192 168 30 199 10 Code Reader Advanced 1 2 3 1 run Line 5 Wafer ID Home Previous Next Print Active sensors Lu Le All sensors available on the connected network are displayed in the selection list Active sensors Sensors For simulation mode Type Version Variant Configure the connected sensor call up 1 9 Object 1 2 4 0 v Advanced v SensoConfig 2 e Code reader 1 2 4 0 v Advanced v Display the connected sensor call up 3 9 Solar 1 3 3 0 v Standard v SensoView Significance of parameters displayed Add active sensor Parameters Significance LE BEME ee IP address Sensor s IP address jin the network IP address PC 192 168 30 100 Subnet mask 255 255 255 0 Figure 17 SensoFind is used for the camera selection here are 3 cameras found 2 solar 1 code reader Double click on the sensor to start the program SensoConfig Automatically a small window Figure 78 will open If you press OK the sensor will stop working therefore you should not do this while the sensor and the machine is working It may cause damage depending on your machine configuration After ensuring your machine a
46. conditions to achieve process stability Therefore SensoPart provides demo samples and recommends to use this opportunity for final application evaluation Please use the data shown as a recommendation only Your individual process environment such as ambient light heterogeneous reflection behaviour of your products colour variability of inspected goods repeatability of parts and feeding processes et cetera need to be considered within your final solution Please consider space requirements accuracy and stability of the positioning of optical systems communication protocols to your PLC Ethernet sequential digital and timing within your process as well Manual Version 1 3 describing Software Versions 1 6 x y First publication September 2012 SensoPart Industriesensorik GmbH NdgelseestraBe 16 D 79288 Gottenheim VISOR Vision Sensor E 068 14505_01 Page 4 of 75 VISOR Solar User Manual SCNSOPART 1 Purpose of this user manual The VISOR Solar sensors are dedicated products developed to meet the needs of the silicon wafer production cell handling and module fabrication They include the functionality of a camera a powerful illumination and fast data processing unit to provide an integrated stand alone solution The vision sensors provide precise positioning tasks with real world 50 pm accuracy and all established quality checks The products are extremely easy to use and can be configured using established terms of the phot
47. d bad reflections from machine parts or from the wafer which can cause bad image conditions Usually all LED are illuminated to ensure a high shutter speed Illumination With the menu internal and external illumination you can choose the used illumination condition per default the internal illumination is on and the external are off The external illumination can also operate in permanent mode this is preferred when you will avoid the flash from the illumination but can shorten the lifetime of your external illumination Once the basic settings are done then we can move on to the calibration and image distortion settings Usually no configurations in the tab mage transmission have to be done since the transmission to SensoView per default is On see Figure 30 This setting is used to transfer your sensor images to the program Senso View Configure job C Image acquisition Image transmission Archiving Pre processing Cycle time Sensuoview Image recorder OfF Ak EN Ram disk OFF all Ak Cycle time nfa Flash 0 4 kB f DOUT Q Q Q Q Figure 30 Image transmission The tabs Archiving Preprocessing and Cycle time are only needed in special applications see the V SOR user manual for further information After the illumination settings are done and a sharp image is available you are now able to teach the sensor in how to analyse the images e g which character
48. d regions Detector Basic Detector name Result Detector type Threshold Pattern Wafer Wafer Sy fcc _ oo oo i E 2 fida Pattern matching 3 Right Fiducial Pattern matching Accurate fast aJr Position off Edit pattern Delete Delete all Mode Config Name Visor 10 your Active job 1 Job1 Cycle time n a Flash 4 1 kB 40 3 MB x 0 Y 0 10 DOUT 9 9 9 9 9 Figure 40 One possible configuration to use the fiducial option The fiducials should be fixed on the reference frame with this following characteristics Their position should be at two sides of the wafer on a line through the centre of the The fiducials are detected with two Pattern matching Detectors by the sensor These Detectors are added with the New button described in section 5 3 Configuration of the Detector characteristics 1 item in Figure 31 To configure the Pattern matching detector the steps are similar to the steps of configuration of the Wafer detector First the yellow region of interest RO has to be defined the size and position of the RO depends on the size of your fiducials Only patterns inside of the amp O are registered and compared to the saved pattern To teach a pattern the red rectangle has to be positioned as close as possible to the actual positions of the fiducials it is very useful to make use of the possibility to zoom into th
49. e Description Solar Standard camera 35 35 31048 Solar Advanced cameras 5 35 81051 3 35 81053 335 81052 3 35 81054 335 8150 Power and lO cables WI0 50 5741 n5 W4O S0 41 6 v1 0 S0 4 1 16 v1 0 SO 1 AAH 2 v710 S0 A1 112 W10 50 41 0 VISOR 1 Solar sensor Standard max 2 jobs with 32 detectors for vafer inspection 4 types of detectors focal length 6mm white LEDs lC channels Ethernet EtherMet lP VISOR V10 Solar sensor Advanced unlimited number af jobs and detectors alignment for vaferinspection busbar detection 6 types of detectors focal length 6mm white LEDs 1010 channels encoder input interface to IG Box R2422 RS232 Ethernet EtherMet AF VISOR V10 Solar sensor Advanced unlimited number af jobs and detectors alignment for wafer inspection busbar detection 6 types of detectors focal length 6mm infrared LEDs 1010 channels encoder input interface to IG Box R2422 R2232 Ethernet EtherMet AF VISOR V10 Solar sensor Advanced unlimited number af jobs and detectors alignment for wafer inspection busbar detection 6 types of detectors focal length 12mm white LEDs 1010 channels encoder input interface to IG Box R2422 R2232 Ethernet EtherNetAP YISOR V10 Solar sensor Advanced unlimited number af jobs and detectors alignment for wafer inspection busbar detection B types of detectors focal length 12mm infrared LEDs 1010 channels encoder input interface to IG
50. e actual image The actual detected pattern is marked with a green rectangle this is usually at a likewise position as your red rectangle so you will see one red green rectangle instead of two rectangles VISOR Vision Sensor E 068 14505 01 Page 49 of 75 VISOR Solar User Manual G SECNSOPART Please note that the Pattern matching Detector will only provide the center of the fiducial as position once the center of the green box has been initially moved to the center of the fiducial SensoConfig Solar la a X File view Options Help 0o gl I gi IB 9 os i O3 SENSOPART Alignment Home Prev Next Print ee me sj ce sii mm Output Result Start sensor Pattern matching detector This detector is suitable for the detection of patterns of any shape even without distinctive edges or contours Settings in tab Pattern Switching Zone for the required concordance threshold ofthe pattern found with the pattern min max taught Accurate Number of search levels fast coarsening levels 0 automatic selection Higher value faster riskier overlook candidates Smaller value slower less risky all candidates Position Checks whether the pattern found is check in the right position If position check is activated the position frame is shown in blue Trigger Image update either rectangluar or ellipt
51. e can be saved with the button Save see Figure 29 e g to make a backup or to use the settings in a similar machine To load a job file use the Load button With the Delete button single jobs are deleted with the Delete all all jobs can be deleted With the New button a new Job file is created SensoConfig Solar la a X File View Options Help ioa i IB 8 9 2 gt CHB SENSOPART Home Prev Next Print Output Result J Parameters for image acquisition Start sensor The basic parameters for image acquisition are determined in the General tab Set image sharpness with the focus setting screw on the back of the VISOR Image transmission parameters for image transmission Pre processing parameters for preprocessing of image Parameters Functions and setting possibilities Resolution Standard resolution is WVGA 736x480 but a lower resolution CGA can be selected with time critical applications or for compatibility reasons Available resolutions W VGA 736x480 VGA 640x480 QVGA 320x240 QQVGA 160x120 A When the resolution is altered all the detectors previously defined are deleted Trigger Image update Single Trigger Select trigger mode triggered or Trigger mode free run In case of triggered mode Continuous trigger can be issued by hardware trigger Pin 03 WH or over one of the inter
52. e wafer AND the surrounding Blacking areas which are completely inside the green square area are ignored see 2 and 3 item above In case the Expert setting Filter wafer edge has been activated not shown here holes which are close to the wafer edge are ignored see 4 item above VISOR Vision Sensor E 068 14505_01 Page 51 of 75 VISOR Solar User Manual G SCNSOPART All found holes exceeding the area limit are shown in the sub menu Resu t press button Resu tas in Figure 36 in the tab Hole They listed with their position and size see Figure 43 The tab Summary provides the number of found holes Wafer Summary Chip overview Hole chip contour Area mm Center X mm Center Y mm width mm Height mm 40 32 159 88 19 1 B 19 5 7 255 37 179 05 24 06 2 31 10 05 Figure 43 Tab Hole of the Result sub menu VISOR Vision Sensor E 068 14505_01 Page 52 of 75 VISOR Solar User Manual G SECNSOPART 5 3 7 1 Holes Cracks and Stains Holes formed during the manufacturing of the ingot or block can be observed using the back light shown in Figure 9 in combination with the Ao e tool The same setup should be used to detect cracks Moreover this tool can be used for detecting the larger stains as residues from the printing process in a front light setup The brightness threshold has to be adjusted to observe the defect which is then mark
53. ed in red SensoConfig Solar File View Options Help Beocmsuw acelauose Setup a SENSOPART Detector Home Prev Next Print Output te Result Wafer Detector Start sensor This detector is useful to check cracks at a wafer contur and measure some geometric parameter like width height position rotation angle Tab for Wafer Tab for Chip size Tab for Chip shape Trigger Image update Tab for Hole ei S Tab for Calibration Single Tab for Binarization Trigger ae Tab for Rectangle fit Continuous Tab for Cut Tab for Miscellaneous Connection made Plav Settings at tab for Hole Online Offline Fit Configure detectors and regions Detector Wafer Chipsize Chipshape 9 Hole Calibration Detector name Result Detector type Hole 1 Detektor1 GB W afer Brightness Bright Brightness threshold Cmim is Relative Area EA 1 00 mm Overlay Marked pixel New Copy Reset Delete Delete all Mode Config Name Line 5 IN Active job 1 Wafer inspecti Cycle time n a Flash 0 4 kB 40 3 MB X 01 0 DOLIT Q Q Q Figure 44 Hole detection Using an active backlight holes and cracks can be detected down to 0 02 mm The average cycle time to perform this operation is 6 ms largely independent of the wafer properties VISORe Vision Sensor E 068 14505 01 Page 53 of 75 VISOR
54. eed E g if the product is moving at 20 m min and the shutter speed is 1 0 ms then the amount of motion blur is 0 333 mm VISOR Vision Sensor E 068 14505 01 Page 30 of 75 VISOR Solar User Manual G SCNSOPART 4 2 3 2 Contrast Waters on poorly reflecting background like metal sheets may reveal a poor contrast since the reflectivity of metal and the wafer may be similar The edge of the tested wafer may appear less straight than under recommended conditions To ensure the high quality of analysis nevertheless the user may consider the following options e Change the colour of the illumination to achieve different reflectivity of the materials SensoPart offers white red and infrared illumination for cameras and external light sources e Adjust Binarization threshold factorin Expert mode this is found in SensoConfig software on the top menu bar in View Expert mode tor a smoother contour in the green plotted overlay A manua setting of the water brightness threshold should be limited to lab tests only For stable mass production always use Automatic binarization e A smooth contour can be obtained by using Wafer Miscellaneous Contour smoothing in Expert mode Use Job Pre processing Dilation and Erosion filters with same areas subsequently Some other solutions are described in section 4 2 2 Machine parts in the image The usage of filters reduces the ability to resolve chips and should be avoided Further options
55. eived Sent data Connecting tg 1924 165 30 50 Connected to 192 168 30 50 90457 116403 195 904355 116403 194 904356 116403 195 30435 116404 193 30435 116403 193 30434 116403 191 30437 116404 193 90435 116403 192 30434 116402 193 9043577116402 7195 S045 5 7 116403 195 9043527116403 195 904535 116403 195 904355 116402 195 90436 116402 195 904356 116403 195 30435 116403 193 3043 6 116402 193 Connection closed G SCNSOPART To receive the date open the Hercules tool turn to the tab TCP Client and enter the IP address of the sensor which runs autonomously define the Port as 2005 and connect to it by pressing the highlighted button With the context TEP Module IP Fart 1 92 168 30 50 2005 Ping BR Connect EA authorization TEA key 1 a 020304 3 l30 B L 2 05060708 4 DDEDF1D p ej PorkStore test NVT disable Received test data Redirect to UDP SSS j group www Hll group com Hercules SETUP atility Yersion 3 1 0 Figure 62 Receiving date from the VISOR with the Hercules tool via Ethernet VISORe Vision Sensor E 068 14505_01 Page 71 of 75 VISOR Solar User Manual CC SCNSOPART 8 Related products The most important products for the applications shown above are listed here An actual and complete overview is offered by the product finder on our homepage VISOR V10 Solar sensor Ordering code Typ
56. ery short and results in fractions of a millisecond Even in case the reflective foil cannot be used the shutter speed of 1 2 ms should not be exceeded to avoid disturbances by ambient light and by vibrations Obviously the reflectivity of a wafer strongly depends on the process step of the wafer under test As cut wafers reflect better than textured ones The later reflect better than anti reflective coated cells To ensure sufficient shutter speed under all circumstances the user may choose among the following options e Increase the overall gain setting for the image up to a value of 4 This can be done in Job mage acquisition tab gain Then the shutter speed can be adjusted by the same factor see also Figure 20 Camera image of the reflective foil e In case the shutter speed exceeds 1 6 ms the LED power is reduced proportionally to avoid overheating Adjusting the minimum cycle time of the overall inspection will avoid this This setting can be found in Job Cycle time tab Cycle time min this effect can be avoided For details see the online help file in the VISOR software e Use an additional ring light in parallel to the internal illumination This typically reduces the exposure time by a reduction factor of x3 in case of a red ring light Adding an infrared ring light to an infrared camera provides a reduction factor of x4 in shutter speed e Use a C Mount version with lenses having high aperture The adjustment
57. et cable 10m M12 Angled Connector 4pole R45 shielded Data cables serial link 8902 51813 LSFG S 2m PUR Datacable 2m M12 5 pole Straight gu2 31814 Gl LSFG S Sm PUF Datacahble Sm M12 5 pole Straight gu2 31815 Cl LSFG 5 1 m PLIF Datacahle 10m M12 3 pole Straight 902 51 816 Cl LSPVI S 2m PLUFR Datacable 2m M12 5 pole Angled 902 5181 7 Cl LSPYW S Sm PUR Datacable 5m M12 5 pole Angled gu2 31818 Cl LSPVV s 10m PLIF Datacable 10m M12 5 pale Angled Converters 533 11017 Kz ADE TB Converter RS232 RS 485 422 901 05097 CLISB RE232 2m Interface cable incl CD Rom zm USB to RS 232 302 51735 AS S781 DOF DOF Anybus Communicator Profibus VISORe Vision Sensor E 068 14505_01 Page 72 of 75 VISOR Solar User Manual G SENSOPART Lens accessories 5326 51513 Locas Lens C mount 8 mm 525 51514 LO C12 Lens mounit 12 mm 325 515315 LO C18 Lens mount 16 mm 527 51129 ETS Lens Mount spacer ring set 5227 51132 LPT 45 CML 5 Lens Mount Housing Gwer Housing P65 flange 5 mm 3 33 01010 WF T M1 Infrared filter for C mount lens DR Ga NN Mounting O O O O 5 352RIE EI K IEEEMULBk i iirujU1 LiUjjkdiiiki kNk P FP E IE DT L__EE LJ U DDIDIJ I 5435 11025 MC 2A Mounting Dovetail mounting bracket 2 axis rotation 5435 11015 MA LR 10012 Fixing bracket rina light diameter 100 mm for LFR115 Reflective foil 9004 51643 RF OF FSX mm Reflective fail width 7
58. ew Options Help Bop d leo a O oQ Setup pP CC SENSOPART Alignment j Home Prev Next Print Detector F Output Wafer Detector E Result r This detector is useful to check cracks at a wafer contur and measure some geometric Start sensor parameter like width height position rotation angle Tab for Wafer Tab for Chip size Tab for Chip shape Triager Image update Tab for Hole E AV Tab for Calibration Single Tab for Binarization Trigger Tab for Rectangle fit Continuous Re Tab for Miscellaneous w 38 Connection mode Settings at tab for Chip shape Online Offline 400 ke a Fa rrr d 2 M Parameter Functions b Configure detectors and regions i PSS r F Detector name Result Detector type Wafer Chip size 9 Chip shape Hole Calibration Level of chip depth i UR o5mm i Angle deviation OD finn S New Copy Reset Delete Delete all Mode Config Name Visor V10 your Active job 1 Job1 Cycle time n a Flash 0 4 kB 40 3MB X 0 Y I 0 DOLIT Q Q Q Q Q Q Figure 38 Applying the Chip Shape tool to the same chip shown in Figure 37 Detected chips are shown in orange Above chip could be detected reliably with angle deviation set between 10 and 140 Since just the peak of the chip is observed this tool cannot differentiate between large and small chips of the same shape The average cycle ti
59. f max 50 mA each For detailed information of the electrical characteristics see V SOR user manua as well Now use the LAN socket to connect the camera via Ethernet to your PC or PLC the required cables are named CI LAMG RJA5G SG Xm PUR available in 3m 5m 1Om with angled or straight plug To configure the sensor you need to setup a connection to a PC After the configuration no PC is needed and the sensor will work as a stand alone system It is possible to connect the PC directly to the camera or via a switch or hub as shown here Ethernet cable sue VISOR fa 155 01304 CI L4MG RJ45G SG xm PUR Ethernet cable Cl LAMG RJ45G SG xm PUR Network e g switch hub etc Standard network cable os VISOR 7155 01302 Figure 15 Possible Ethernet interfacing of the camera In the Advanced version of the camera the Data socket may be used for serial data transfer to a PLC For connection use a data cable like Cl L5FS Xm G W PUR with the RJ45 connector available in 2m 5m 10m with angled or straight plug VISOR Vision Sensor E 068 14505 01 Page 16 of 75 VISOR Solar User Manual G SECNSOPART After connection of all needed cables switch on the power supply and check the LED display of your camera The correct connection of the power cable results in the lighting of the green Pwr LED After connection the camera will flash once to indicate it has finished the power up and is ready for operati
60. f the Detector characteristics You have to choose a Grey type 4 item in the window shown in Figure 3 1 According to the brightness of the wafer a Greyleve range is defined which should include only one wafer orientation The 7hresho d is then adjusted according to the stability requirements SensoConfig Solar File View Options Help Becamscelagoe Setup CC SENSOPART Detector Home Prev Next Print Output zan i i Result Trigger settings start sensor uy Select the required trigger mode in the job settings in the General tab Triggered Operation with external trigger or trigger button in the interface Trigger Image update Single Trigger SS Continuous maximum possible frequency Connection mode Online _ Offline up Select the form in which the images are Configure detectors and regions Detector Basic Detector name Result Detector type Greylevel 1 Sunny Side up Grey emm Els i 2 Sunny Side down 2 Grey Threshold 3s eR 350 S 10 0 2 E Search region Overlay Rectangle valid pixels Oh T I SE Edit search region Overlay search region New Copy Reset Delete Delete all Mode Config Name Line 5 IM Active job 1 Wafer inspecti Cycle time n a Flash 0 3 kB 740 3 MB X 0 Y 0 1 0 DOUT Q Q Q Q Q Q Figure 46 Detection of sunny side up sh
61. faces Connection mode Shutter Parameter for control of image speed brightness Exposure can be set Sonne Come Js um Jl automatically with the Auto Configure job Jobs Name Description Author Created Image acquisition Image transmission Archiving Pre processing Cycle time 1 Jobi Basisjob Autor 02 03 2012 0 Resolution Shutter speed Quadrant vaa 640x480 cup o3 ws l 99 Auto shutter 3 O Trigger mode Gain Internal illumination _ Trigger 0 75 l o sd 0 5 9 Freerun External illumination New l Save Delete Delete all Mode Config Name Line 5 OUT Active job 1 Job1 Cycle time n a Flash 0 4 kB 40 2 MB X 0 0 T 0 DOUT Q Q j 9 9 Figure 29 SensoConfig software interface Several jobs can be stored on the camera depending on the model see Figure 3 Product line overview of VISOR Solar The jobs can be switched either by Ethernet command serial or parallel commands or via toggling a digital input VISOR Vision Sensor E 068 14505_01 Page 33 of 75 VISOR Solar User Manual C SeN SO PART Resolution Always choose the VGA 640x480 resolution since the wafers and cells have a square shape Trigger mode With choosing the trigger mode as free run your sensor will continuously take pictures this mode is preferred when you are setting up the camera Immediately you will see the results of your change
62. fer are masked using blanking regions Low value of shutter speed lower than 2 ms O O O O e Recommended o Low value of shutter speed preferably lower than 1 ms o For position detection the wafer should not move during image acquisition see below e Optimized o The center of the image is adjusted to the average wafer position o The camera has been powered on gt 1 hour before the calibration o Incase of shutter speed gt 0 5 ms Constant or no ambient light o Optionally fixed reference positions are recorded in parallel see section 5 3 6 Fiducials Width and height are defined as the maximum extension of the wafer and are insensitive against chips To determine the area of the wafer without considering potentially missing parts of chips set the control wafer area to active The additional cycle time to perform area checks is typ 16 ms with V1O in VGA resolution To determine the area activate the Area option This feature allows you to distinguish between a monocrystalline and a polycrystalline wafer in an simple way if they have different areas Most monocrystalline wafers have a chamfer the polycrystalline don t If the Area criteria is activated and causes a FAIL the sensor will stop the analysis and therefore no further parameters will be checked With the Position control menu you can choose if the sensor is checking the position of the wafer or not The default of this function is Off There are two possible
63. g Name Visor V10 your Active job 1 Jobi Cycle time n a Flash 0 5 kB 40 3 MB X 0 Y D I DOUT Q j Q e OQ 9 Figure 53 Tab Interfaces of the Output sub menu Via the nterfaces you are able to configure characteristics of the interfaces The settings are done by using the drop down lists just with a few clicks First you have to enable the needed interface then you can choose the useful settings via the Setting 1 2 column The Internal I O can be set as NPN or as PNP Output in the NPN configuration a external Pull up Resistor is needed on the Inputs Figure 54 NPN PNP Input VISOR Output Input VISOR Output Figure 54 Example of the external electrical connection of the nfernal Os For the RS 422 interface the data transfer rate have to be chosen default is 38400 When you use an External O extension here you have to tell the sensor which kind of external extension you use When using the Ethernet protocol you can choose which port is your In or Output The number of logical outputs can be changed with the spin boxes VISORe Vision Sensor E 068 14505 01 Page 62 of 75 VISOR Solar User Manual SCNSOPART 5 4 4 Timing As described before its useful to trigger the sensor to provide a synchronous image acquisition The sensor may also provide a delay between the trigger signal and the image acquisition There are two units that can be used to provide the delay The typical way will be time delay
64. g for analysis or simulation purposes UD use of SensoContig may require password entry administrator user group See user administration sl kerey JL OO xam To obtain a continuously updated live image even w Li Auto shutter Mode Config Name Visor V10 your Active job 1 Jobi Cycle time n a Flash 0 2 kB 40 3 MB X 320 Y 240 1 208 Figure 22 Camera image with the correct perpendicular mounting of the sensor image Now you can be sure your sensor is properly adjusted You are now able to check the focus VISOR Vision Sensor E 068 14505_01 Page 22 of 75 VISOR Solar User Manual 4 1 6 Focusing SCNSOPART Place a wafer under the sensor and increase the shutter speed from low values until you reach an intensity of 255 on the complete reflective foil Your screen should look like Figure 23 o SensoConfig Solar File view Options Help Dep ae Setup ges pert Job Alignment Detector Output Result Start sensor Trigger Image update Single Trigger Continuous Connection mode Online Offline Jobs Author Author Name Description 1 Jobi Job Play Configure job Created 02 05 2012 4 a New Load Save Delete Delete all Resolution 18 x G SCNSOPART Next Prev Print Home
65. he camera make sure that is possible to route all cables needed in a proper way to the camera This is simplified by our offered cables with the optional angled plug Make sure that under every operation condition no parts disturb the sight of the camera towards the wafer cell The targeted mounting situation is shown here Working distance Height of field of view Figure 13 The mounting situation VISOR Vision Sensor E 068 14505 0I Page 15 of 75 VISOR Solar User Manual C SeN SO PART The precise adjustment can be done when the camera is working with your PC and will be described later 4 1 2 Electrical connection After mechanical mounting the electrical connection is built up On top of the camera there are three connection sockets see Figure 2 The 24 VDC connection socket provides the power supply and digital O of the camera Use a cable CL12FX Xm available in 2m 5m 10m with angled or straight plug to connect the power supply of the camera and the I O with your PLC The pinning of the cable is shown in the following table 3 MEE w IN externaltrigger oS Green IN OUT IN OUT 8e Gry IN OUT AED 9 Rd OUT external illumination READY Ready for next external trigger Switchable input output VALID Indicates that the image analysis has been done and the outputs are set according to the result Figure 14 Pinning of the power supply and I O cable The I Os on pins 5 8 provides currents o
66. his telegram definition is identical for all cell test recipes it is recommended e to define a master job with a master telegram tested in conjunction with the PLC e move to section Job e do aright click on this master job to get a context menu e use copy parameters for telegram items only to transfer these to a second job Any differences in telegrams or interfaces will be indicated by a message Inconsistent telegram when starting the sensor It is recommended to use two fiducials to ensure a long term stability of the position detection VISOR Vision Sensor E 068 14505_01 Page 60 of 75 VISOR Solar User Manual SECNSOPART 5 4 Adjustment of the needed I Os via Output The configuration of the in built digital I Os are done under O mapping The sensor includes four user configurable Outputs and the data interfaces Depending on your machine configuration different settings are needed The sensor is able to communicate with the PLC of your machine via digital I Os RS 232 RS 422 Ethernet and Ethernet IP The general settings of all interfaces are done with the nferfaces tab With Timing the trigger delay and other delay times can be configured The definition of the messages sent via the data interfaces can be done with the Telegram tab SensoConfig Solar 81 x File View Options Help ioaad aeg Setup 1 SE
67. hoosing the Shape as Square which is also the default Both measured wafer dimensions are then compared to the ranges set with Height The ranges can be set using the number edit or the slider In the slider you see the excluded range as a red region the accepted range as a green region and the actual measured value as a blue line In case different tolerances shall be applied to the width and the height the parameter Shape has to be set to Rectangular Then the wafer dimensions are compared independent to the ranges set by eight and Width This dimension feature allows the user to e Distinguish between 5 and 6 inch wafers e Runa quality control of the wafer dimension as shown in Figure 34 with just 1 mm tolerance e Sort out double wafers In case two adjacent wafers picked from one box could not be separated properly and are placed together on a conveyor typically the size of the two wafers is larger than the size of a single wafer and can therefore be taken as a criterion for double wafers Notice should be spent on the following aspects to achieve highest accuracy e Necessary o Stable mechanical setup no vibrations of the wafer or camera Camera s direction of view is perpendicular to the wafer Clear edges of the wafer in the image Wafer brightness and wafer shape is set correctly Under all conditions the wafer must be entirely in the yellow search region of interest RO Visible parts of the machine close to the wa
68. ic Single Pattern Shows the taught pattern contents Trigger i of the red frame Continuous by the mask there can be masked out parts of the search area The parts which are not relevant for this examination can be painted out like using an erasor Masks can also be inverted means that parts which Connection mode Online Offline goose Configure detectors and regions Detector Basic Detector name Result Detector type Threshold Pattern 1 Wafer Wafer SSS xcs Filion 2 E 2 Pattern matching 3 Right Fiducial Pattern match Accurate Fast g Iduciai attern matching p E P Position off _ SS O A Y Edit pattern New Copy Reset Delete Delete all Mode Config Name Visor V10 your Active job 1 Job1 Cycle time n a Flash 5 3 kB 40 3 MB X 0 Y 0 1 0 pou Q O Oe Pe Figure 41 Configuring the Pattern matching detector for a round fiducial While using similar fiducials you can easily transfer your saved pattern from one Pattern matching Detector to the other with the Copy button Further information on the Pattern matching Detector can be found in the VISOR User Manual The centres of the fiducials detected by the sensor are used to define the coordinate system the coordinates of the fiducials are given out via the data interfaces of the sensors Under the Resu tsub menu the actual
69. igital outputs to distinguish between PASS and FAIL parts do not require a definition of a telegram It is recommended not to change other parameters than the enabling of the interfaces see Figure 53 Secondly an ASCII or binary telegram is composed according to the requirement of the PLC by few further clicks VISOR Vision Sensor E 068 14505_01 Page 63 of 75 VISOR Solar User Manual C SeN SO PART The settings done in the following screenshot leads to a ASCII telegram containing e Data length e g 22 o Separator j e Wafer center X position in pm e g 105870 o Separator e Wafer center Y position in pm e g 82198 o Separator e Wafer angle in Millidegrees e g 232 o Separator e Result of chip test Either P for PASS or F for FAIL O Separator o SensoConfig Solar File View Options Help Box Setup i 1 E a a SENSOPART Detector Home Prev Next Prir t Output ES Result Data output Telegram E Start sensor Configuration of data output via serial interfaces RS 422 and Ethernet as well as for archiving in cvs files Description of ASCII telegram Description of binary telegram Description of Ethernet IP Response telegram Description of Ethernet IP Request telegram Trigger Image update _ Taa Zinde Communication settings in Continuous Communication Ethernet RS422 Connection mode To Sensor Command Selectable in Tab Play SW Ver
70. ing is Dark With the Blanking region menu you can choose the number of Blanking regions inside the image to avoid effects on the wafer analysis from machine parts in the image In the image shown they appear as violet rectangles like in Figure 27 at section 4 2 2 Machine parts in the image The position of the Blanking region can be changed by drag and drop Their size is changed by drag and drop of their edges to the right position By drag and drop of the arrowhead in the rectangle you can rotate each Blanking region similar to that of the RO Please note that the blanking regions must not split the wafer completely into separate parts so called blobs All pixels of a wafer must remain connected without considering blanking regions VISOR Vision Sensor E 068 14505 01 Page 40 of 75 VISOR Solar User Manual CC SCNSOPART 5 3 3 Setting of the dimension measurement As a standard the wafer height and width is determined without extra time The result is compared to the acceptance ranges set by the user Since height and width are determined independently these values may differ a bit even when a quadratic wafer is tested A absolute accuracy better than 50 pm and a overall repeatability of a few microns can be obtained in determining the wafer dimensions Now you have to choose if you want to compare the width and the heighito two independent thresholds or to one Usually both dimensions are compared to one value by c
71. inimal integration efforts for the user The internal illumination was developed so even sunlight shielding becomes obsolete Most of the tasks like position and chip detection can be provided without any costly backlight Instead the internal high power LEDs are used in conjunction with a dedicated cost effective reflective foil Another important benefit is the small working distance of just 350 mm when testing 6 Inch wafers Thus the sensor requires very limited space which is scarce in actual production equipment The sensor can be triggered via a digital O signal or via an Ethernet command In the Advanced version additionally an encoder input is available to provide a high position accuracy when using conveyor belts with varying speed e High flexibility versatile product family The product family comprises of a wide range of models The complete product line shares the same software tools and accessories All mechanical dimensions are identical Depending on the requirement of the cell makers machines can be upgraded easily with bestfitting camera model with almost no development efforts Concluding the wide product line of the VISOR Solar provides highest flexibility and cost effective production tools available on the world vision market today Figure 1 Typical lab setups using VISOR V10 SO and an inexpensive reflective foil RF775 The position is detected from a distance of just 350 mm without any daylight protection Left tool
72. istics have to be checked or which measurements have to be done VISOR Vision Sensor E 068 14505_01 Page 35 of 75 VISOR Solar User Manual a SEN SO PART 5 2 Alignment Advanced version only This feature is available in the Advanced version only If you are using the Standard version you can skip this section The Alignment option is used when a large field o view is used and a fast preliminary position is helpful This position can be used to determine the position of a smaller region of interest ROI which causes a faster processing of all measurements and a higher throughput of the V SOR sensors 5 3 Configuration of the Detector characteristics The detector sub menu is designed to choose the method of image processing Which measurements are done and which characteristics are tested One image can be processed with one or several detectors To analyse cells typically a wafer and a busbar detector have to be implemented In case fiducials are to be considered a pattern matching detector is used for each of them The settings needed in every application of the sensor are described in the following sections until 5 3 4 Checking the thresholds with Result To implement a new measurement to be performed from the sensor a new detector has to be applied By clicking on the New button see Figure 29 when using a sensor with factory settings a new detector will be created automatically A window like this will be shown
73. line with some pads as contact to the ribbons For this purpose the number of Pads detected is shown Interrupted busbars are indicated by a higher number of pads As area all pixels belonging to pads are considered but not the spacing in between them VISOR Vision Sensor E 068 14505 01 Page 59 of 75 VISOR Solar User Manual CC SCNSOPART 5 3 9 1 Cell analysis Cells of different designs can be distinguished by setting up a job file for each of them and check for the following properties Cell types Cell property Distinguished types Detector 5 and 6 inch cells Chamfer Mono and multicristalline Wafer Area Chamfers of different sizes Cell design Busbar width Several job files can be loaded on one camera of the Advanced product line Via an Ethernet command the job for execution can be selected The quality of the following cell properties can be tested Quality criteria for cells Quality criterion Detected parameter Chip Water Chip size Chip shape Height For further parameters please contact SensoPart technical support 5 3 9 2 Stringers To make sure that only cells of the same appearance and design are combined in a string a job describing a certain cell type and running relevant quality test has to be set up Obviously the center and orientation of the busbar and cell has to become part of the telegram as well Usually stringers require a lengthy telegram interfacing them to a PLC To make sure t
74. loaded to the camera the respective item can be selected within Senso View o SensoView 192 168 30 94 File View Options Help Result Wafer This function executes the job defined on the PC and the Result statistics window is displayed with Detector list and Evaluation results Execution times are not updated in this mode as they are not available from the sensor Detailed inspection results from the detector marked in the selection list are displayed in run mode The image search and parameter zones and result graphs appear when set in the display window The parameters displayed vary according to the type of detector selected General Outputs Commands Result Statistics Jobselect Job upload Freeze EN DEDE Wafer Summary Chip overview Hole Binarization Miscellar gt 9 Current image Detector Result Score Executior Detector type z 1 Detektori 100 0 81 Wafer Center X 112 015 mm Next image Center Y i Next Failed image EM 82 585 mm Angle 0 128 Q Height 156 273 mm 9 Zoom Rec images Width 156 245 mm Q Archiving 4 gt Mode Run IP address 192 168 30 94 Mame Line 5 IM Active job 1 Waferinspecti Cycle time 103 ms Q Q Q Figure 59 Results shown to the operator using SensoView In a very convenient way the Current image the Next image or the Next failed images can be saved by simply pressing the Archiving button To avoid unintended usage thi
75. m pe D Detector Result li r Trigger Image update Trigger Continuous r Connection mode tow otin Oe aA s Configure job Jobs Name Description Author Created C 1 Job1 Job Author 02 05 2012 0 Resolution VGA 640x480 gt Play gt OO 18 x a SENSOPART Welcome to SensoConfig With this programme you can configure your VISOR vision sensor for one or several jobs in six logical operating steps Basic image setting Image brightness Adjust shutter or amplification see Job General Image sharpness Focus setting screw on the back of VISOR Job Position tracking Detectors Output Result Start Sensor Other programme functions Trigger settings Mode of connection online offline Simulation of inspection jobs using series of images filmstrip Image recording for analysis or simulation purposes d Use of SensoConfig may require password entry administrator user group See user administration To obtain a continuously updated live image even Image acquisition Image transmission Archiving Pre processing Cycle time Shutter speed Quadrar ts 99 398 0 250 ms B Trigger mode Trigger 3L 0H 00 MEN 9 Free run Gain CS so l Internal illumination External illumination Mode Config Name Visor V10 your Active job 1 Job1 Cycle time n a Flash 0 2 kB
76. me to perform this operation on a good water is 32 ms Typical chips increase the cycle time by a few ms However analysing several massive defects in one wafer this tool may take 48 ms or more VISORe Vision Sensor E 068 14505 01 Page 47 of 75 VISOR Solar User Manual C SeN SO PART 5 3 5 3 Checking the results of the Chip tools To check the results of the Chip tools press the button Result a window like in Figure 39 will be shown In the tab Summary the results of the Chip tools are shown _ Wafer DE j Chip overview Hole Chip contour Contour paints Found 1738 Chip size Deviations 14 Chip size Area exceeded 0 o 0 Chip shape 1 Hole n a J Figure 39 Tab Summary of the Result sub menu e Contour points found gives you the number of contour points used to define the contour line of the actual water The dot on the right is green if this option is active or grey if its not e Chip size Deviation gives the number of contour points which have a deviation from the calculated ideal contour of the wafer These points are listed with their exact positions in the Chip contour tab e Chip size Area exceeded provides the number of chips found on the wafer with violate both the criteria of the Chip size tool Level of chip depth and Area see section 5 3 5 1 Chip Size tool e Chip shape gives the number for the Chip shape tool section 5 3 5 2 Chip Shape tool e Hole represents the number for fo
77. n limit on the lens used is described in Figure 7 All cameras meet typical requirements using the chip shape tool However the best results optically are obtained using the 12mm or C Mount models VISORe Vision Sensor E 068 14505_01 Page 11 of 75 VISOR Solar User Manual G SCNSOPART Limits of chip detection v10 SO V10 SO A1 C 6 mm lens LFR 115 Red LO C 8 Chip size Tool Square 1 0 mm 1 0 mm Semicircle 1 0 mm 1 8 mm Blunt wid 5 1 1 0 mm 0 5 mm Blunt ved 10 11 1 0 mm 0 6 mm Triangle 30 1 2 mm 1 1 mm Triangle B 1 2 mm 1 1 mm Triangle 90 1 2 mm a mm Triangle 120 1 0 mm 0 7 mm aetting Level of Chip depth 0 6 mm 0 2 mm Chip shape Tool square 0 6 mm 0 6 mm cemicircle 0 5 mm 0 5 mm Blunt wd 5 1 0 4 mm 0 4 mm Blunt wd 10 17 n a n a Triangle 30 1 2 mm 0 8 mm Triangle 60 0 7 mm 0 7 mm Triangle 90 0 6 mm 0 5 mm Triangle 120 0 6 mm 0 5 mm Setting Angle deviation 15 157 w d Width Depth Figure 7 Typical limits of chip detection 3 2 2 Illumination amp Background For sufficient robustness against ambient light and vibrations a shutter speed below 1 ms should be used The wafer and cell can be illuminated by the camera internal LEDs or by adding a ring light such as with the red ring light LFR 115 RD 24 2L12 In cases where it is difficult to reach a sufficient shutter speed a ring light can be used in parallel to the internal light Since C Mount cameras are not
78. n time 89m5 Archiving Mode Run IP address 192 168 30 94 Mame Line 5 IM Active job 1 Wafer inspecti Cycle time 89 ms Q Q Q Figure 60 Statistics shown to the operator using SensoView For further details see VISOR user manual VISOR Vision Sensor E 068 14505 01 Page 69 of 75 VISOR Solar User Manual G SENSOPART 7 1 2 Data log The data of the sensor s telegram is usually read out by the PLC To test the precision of the VISOR sensors and the setup in the individual machine it may be useful to read out the telegram sent from the sensor This can be done with the freeware program Hercules available from the Internet http new hwg cz download sw version hercules_3 2 5 exe To get a telegram for the program Hercules first enable Ethernet in the section Output tab Interfaces Second in Output tab Telegram the following settings led to a telegram with a new line after each data set telegram LineFeed OxOA Carriage Return OxOD OxOA Ox0D Ox Ox Ox Ox Ox Ox Figure 61 Definition of an ASCII telegram to create a log file for Excel import VISOR Vision Sensor E 068 14505_01 Page 70 of 75 VISOR Solar User Manual menu of the Hercules tool the data can be submitted to a log file A typical telegram shown with the Hercules software is given here Hercules SETUP utility by HW group com UDP Setup Serial TCP Client TCP Server UDP Test Mode About Rec
79. nd sensor are in a safe operating mode press OX to continue Cay SensoFind T Sensor will stop runmade Co vau want to continue Figure 18 Warning Pop up VISOR Vision Sensor E 068 14505 01 Page 18 of 75 VISOR Solar User Manual C SeN SO PART Afterwards a window like this will be shown E 18 x SensoConfig Solar File view Options Help Decuucelmmooe HN 9B SENSOPART Alignment Home Prev Next Print Detector n Output Welcome to SensoConfig With this programme you can configure your VISOR vision sensor for one or several jobs in six logical operating steps Result Start sensor Basic image setting Image brightness Adjust shutter or amplification see Job General Image sharpness Focus setting screw on the back of VISOR Job Position tracking Detectors Output Result Start Sensor Other programme functions Trigger settings Mode of connection online offline Simulation of inspection jobs using series of images filmstrip Image recording for analysis or simulation purposes Trigger Image update Single Trigger Continuous Use of SensoConfig may require password entry administrator user group See user Connection mode administration Online Offline Fit To obtain a continuously updated live image even Configure job Jobs Name Description Author Created Char 4 L
80. nsoConfig Ra With this programme you can configure your VISOR vision sensor for one or several jobs in six logical operating steps Start sensor Basic image setting m Image brightness Adjust shutter or amplification see Job General Image sharpness Focus setting screw on the back of VISOR m Job m Position tracking m m Detectors B a B Output Trigger Image update Result Start Sensor Single Trigger E Continuous Other programme functions m Trigger settings a Mode of connection online offline y m Simulation of inspection jobs using series Online Offline Fit j i of images filmstrip Connection mode Results statistics Results Statistics Detector Result Score ms Detector type 1 wafer 100 0 inja Wafer Count Reset Wafer Summary Chip overview Hole Chip contour Center X Y 111 362 mm 89 426 mm J Pass 100 00 Angle 0 317 Fail 0 00 Minimum execution time Height 155 820 mm nja Width 156 039 mm Maximum i execution time na Area n a Average execution time nja Mode Config Mame Visor V10 your Active job 1 Job1 Cycle time n a Flash 0 4 kB 40 3 MB X 0 01 0 DOLIT Q Q Q Q Q Q Figure 36 Screenshot of the first tab of Result In the Wafer tab the main measurements of the actual image are summarized The Center position the Angle the Height Width and the Area These values are compared from the sensor to
81. of an optimal shutter speed leads to following intensity characteristics Usually the water cell is darker than the background this is the common setting for detection of cells and texturized wafers e Intensity on the background near the wafer e g on a reflective foil should be on 255 this is the maximum e Intensity on the wafer should be as low as possible a typical magnitude is between 20 and 40 Remember The intensity at the cursor position is printed on the lower right border of the window see Figure 21 In case the wafer is brighter than the background this is the common situation for wafers when not using a reflective background e Intensity on the wafer should be on 255 e Intensity on the background should be as low as possible With improving the intensity contrast the sensor performance increases The button Auto shutter will give you a first proposal for the shutter speed The optimal setting in your machine depends on the background light conditions and the job accuracy A manual fine adjustment brings you to optimal contrast settings with best sensor performance To adjust the intensity start with a small shutter speed and then bring the bright areas on your image to 255 In the bright areas the intensity should be saturated at 255 A small value for shutter speed will lead you also to small effects on motion blur Motion blur is a result of the movement of the object during the time needed to capture the image shutter sp
82. on 4 1 3 Assign IP address to the camera After the electrical connection is done the camera has to be linked to your PC To connect the VISOR Vision Sensor to a PC via ethernet the IP addresses of both devices have to correspond PC s ethernet socket not WLAN and sensor have to be in the same subnet but have different IP numbers That means their IP addresses are identical except of the number behind the last dot The default IP of the VISOR is 192 168 100 100 with Subnet mask 255 255 255 0 To establish a direct connection e g the PC must be set to a corresponding fixed IP address like follows Alternatively the sensor s IP address has to be changed The following settings are described for operating system Windows 1 Click on Start gt Control Panel gt Network Connection gt LAN Connection gt Properties gt the window Local Area Connection Properties is open 2 In the list This connection requires following elements select the option Internet Protocol TCP IP and then click the button Properties 3 In the following window see fig 15 set the desired IP address of the PC and the sub network data 4 Confirm entries with OK Example The VISOR Vision Sensor is pre set to IP address 192 168 100 100 and subnet mask 255 255 255 0 In this case the IP address may be set to any value between 192 168 100 1 and 192 168 100 254 with subnet mask 255 255 255 0 with the exception of existing IP addresses like
83. otrusions To avoid these effects there are the following software solutions e Blanking region feature found in Detector Water tab Blanking region The conveyor belt can be masked out not to influence the wafer analysis An example is shown in Figure 27 below Blanking should be used to a minimum extend only not to impede the accuracy and processing speed e gnore protrusions which is offered in the Chip size tool during Expert mode This way external defects are cut off and not considered Note The Chip shape tool always ignores protrusions e Metals transport belts in the background Wafer Miscellaneous Contour smoothing and Ignore protrusions provide a reliable analysis in Expert mode as shown in Figure 28 VISOR Vision Sensor E 068 14505_01 Page 27 of 75 VISOR Solar User Manual SCNSOPART e Use the different camera lights SensoPart offers white red and infrared illumination to benefit from the different reflectivity of the different materials Other solutions include e Try to use dark parts like anodized aluminium or black painted machine parts in the observed section of the machine e Reflections of machine parts can be reduced by increasing their distance to the wafer and camera Figure 27 Four purple B anking regions are used to blank conveyor belts The chip on the left edge is detected without any influence of the conveyor VISOR Vision Sensor E 068 14505 01 Page 28 of 75 VISOR Solar
84. ovoltaic industry Moreover any square rectangular products can be inspected The knowledge of machine vision is NOT a necessary precondition However choosing the right setup requires an overview of the abilities of the camera which this user manual is targeting to provide It guides users from their specific application to select the best fitting products and tools to implement them for highest accuracy stability and convenience For further details on the products please refer to the corresponding datasheets and documents or contact our technical support team all listed in section 9 Useful links and contacts VISOR Vision Sensor E 068 14505 01 Page 5 of 75 VISOR Solar User Manual SCNSOPART 2 Applications covered by VISOR Solar sensors 2 1 Key features Since silicon wafers are extremely fragile and have to be handled frequently before becoming solar cells they have to be checked with regard to the following properties e Wafer and cell position X Y and angle Absolute accuracy better than 50 pm and a repeatability of a few microns can be obtained Following this user manual best performance for cell inspection robot pick and place of the cells is obtained e Wafer and cell dimensions Measuring the wafer dimensions the sensor makes sure 5 and 6 Inch material is not mixed Due to the accuracy of 100 pm double layers of two wafers can be detected to be sorted out e Chips which may cause a breakage of the cell
85. own in upper part and sunny side down shown in lower part using grey level detectors The average cycle time to perform this operation is below 1 ms largely independent of the wafer properties VISOR Vision Sensor E 068 14505 01 Page 55 of 75 VISOR Solar User Manual C SeN SO PART 5 3 9 Busbar analysis For several applications the position and type of busbar needs to be detected e Tabbers stringers e Electrical tests e Print control Cell type identification For this purpose the Busbar detector has been developed It can be applied to solid busbars as well as to busbars comprising of pads as shown in Figure 47 Even busbars of MWT cells can be analysed 1 Figure 47 Analysing busbars of a pad cell To analyse the front side printing of a cell a front light illumination either by the internal LEDs or by a ring light should be applied A white homogeneous background provides best results Do not use an active backlight or a reflective foil when performing a busbar analysis To analyse cells with their busbars the following configurations may be applied e f a homogeneous background is applied the busbar detector can be combined with a wafer detector subsequently analysing the same image acquired by one job e In case no homogeneous background can be provided the busbar can still be detected due to the two detector concept But a wafer detector may not be able to separate the cell from the machine parts Thus
86. r speed Quadrants yea 640x4860 CI 5 230 ms E 99 Auto shutter 3 i 2 Trigger mode Gain Internal illumination Trigger gt 1 00 fon d 4 gt 9 Free run External illumination off New Load Save Delete Delete all Mode Config Name Visor V10 your Active job 1 Job1 Cycle time nja Flash 0 2 kB 40 3 MB X 0 Y 0 1 0 DOUT Q Q Q Q Q Q Figure 24 Camera image with the marked scroll bar Use the screwdriver supplied others may cause damage to rotate the small slotted screw focus in the rear of the camera and ensure a sharp image of your wafer The sharper the image focus the more accurate the camera will perform chip measurements and surface analysis Ideally the transition from dark to light is completed within 2 3 pixels cells on the image chip VISOR Vision Sensor E 068 14505 01 Page 24 of 75 VISOR Solar User Manual C SeN SO PART After getting a sharp image of the first corner scroll to the other corners and ensure they are sharp as well Maybe the focus needs to be readjusted to get the most sharp image of the complete wafer A sharp image looks like this SensoConfig Solar 81 x File View Options Help ooga c ll 8 9 2z B SENSOPART Alignment Home Prev Next Print Detector F Output Welcome to SensoConfig F
87. re processing time and is insensitive to very soft blunts The performance of the two alternative tools is described Figure 7 Both algorithms are able to distinguish chamfers from chips IF the chip detection is operating it is useful to check the dimensions of the wafer to sort out wafers which are broken in an ideal rectangle As stated before in section 3 3 3 Setting of the dimension measurement the thresholds of the chip detecting tools should be set up carefully with the implications of Figure 32 in mind Also check the results after setting new thresholds VISOR Vision Sensor E 068 14505 01 Page 45 of 75 VISOR Solar User Manual a SEN SO PART 5 3 5 1 Chip Size tool Using the Chip Size tool the analysis of chip is performed in two subsequent steps It detects potential chips due to deviations in the geometry fit The found potential chips may be filtered with regard of their extent to provide stable analysis results 1 The observed depth of a potential chip exceeds the threshold defined as eve of chip depth Remark for specialists The depth of a chip is determined by the size of deviation of the observed wafer edge from the turquoise marked fit of an ideal square This provided the name Chip Size tool 2 To cause a FAIL the chip additionally either violates 1 AND 2a OR 2b a above rule of chip depth for at least the number of pixels defined in Deviations per chip OR b the limit defined in Area per chip In
88. re synchronized dynamically A possible configuration to this purpose is shown in Figure 40 o SensoConfig Solar 8 xl File view Options Help Decmu ceNmsos Setup 1 Job SGNSOPARI Alignment Home Prev Next Print r Output Pattern matching detector F Result This detector is suitable for the detection of patterns of any shape even without distinctive Start sensor edges or contours Settings in tab Pattern Parameters Functions Switching Zone for the required concordance threshold ofthe pattern found with the pattern min max taught Accurate Number of search levels fast coarsening levels 0 automatic selection Higher value faster riskier overlook candidates Smaller value slower less risky all candidates Position Checks whether the pattern found is check in the right position If position check is activated the position frame is shown in blue Trigger Image update either rectangluar or elliptic Single Pattern Shows the taught pattern contents Trigger of the red frame Continuous Mask by the mask there can be masked out parts of the search area The C ti d parts which are not relevant for this er nceneon mode Me examination can be painted out like Play using an erasor Masks can also be Online Offline Fit inverted means that parts which be Configure detectors an
89. s Connection mode gt Online Offline 400 Detector name Result Detector type 1 wafer 2 Wafer New Copy Reset Delete Delete all Mode Config Name Visor V10 your Active job 1 Job1 Cycle time nja Play Configure detectors and regions Wafer 9 Chipsize Chipshape Hole Chip size Level of chip depth 1 0 mm 24 Deviations per chip 100 m Area per chip EE 6 50 mm t Calibration Flash 0 4 kB 40 3 MB X 0 Y 0 I 0 Q B SONSOPART Home Prev Next Print L3 Wafer Detector This detector is useful to check cracks ata wafer contur and measure some geometric parameter like width height position rotation angle Tab for Wafer Tab for Chip size Tab for Chip shape Tab for Hole Tab for Calibration Tab for Binarization Tab for Rectangle fit H Tab for Miscellaneous Settings at tab for Chip size Parameter Functions ip si Activate chip size Out of all detected contour points the algorithm is generating a best fit of a rectangle box In the next step all distances between the box and each contour point will he caleulated The E pour 9 Q9 Pe Figure 6 Screenshot when detecting an 1 mm deep chip of a wafer with the Chip size tool Setup of V10 SO as shown in Figure 1 The slight dependence of the detectio
90. s It is also possible to run the sensor in free run mode in the production setting with the result of a asynchronous data acquisition The better setting in your production will be the trigger mode then the sensor takes pictures when they are needed from your machine The setting of the trigger characteristics e g a time delay will be described later in section VISOR Vision Sensor E 068 14505_01 Page 34 of 75 VISOR Solar User Manual CC SCNSOPART The trigger from the machine can be simulated by the trigger button on the left of your screen Shutter Speed Use the scroll bar to adjust the right shutter soeed as described in section 4 2 3 1 Shutter speed While using the reflective foil the shutter speed as a guide will be in the order of O 2ms to give high contrast between the dark solar cell and the bright reflector see fig 4 The shutter speed can be decreased with using the Gain as described in the next break Gain Typically the default setting of 1 is sufficient when dealing with a reflective foil However if the image contrast is not high enough increasing the gain will increase the brightness of the overall image By increasing the gain a shorter shutter speed can be achieved This also lead to smaller effects of a moving wafer or machine vibration to the image quality Quadrants With this items you can choose the LEDs which are illuminated just by clicking on them This feature of the sensor allows you to avoi
91. s identified by the sensor increases and you lower the risk of production downtime caused by broken wafers If the quality criteria are too tough you get a possibility of false rejected wafers To provide a high yield you may lower yovr criteria This implies the possibility of getting a PASS result of a bad device with all the bad impacts on your production NOK device OK device Threshold y Typical High quality High yield Defect passes False reject Figure 32 Setting of the threshold parameters For typical applications in the solar industry choose a Wafer detector number 5 in Figure 37 The other kinds of detectors can be used for special tasks and will be described later or in the V SOR user manual The following description is written for the Wafer defector unless its state otherwise Before adjusting settings ensure that your wafer is complete inside of the yellow search region of interest RON of your detector image You can resize the RO with drag and drop the black dots on the edges of the RO to the needed position The change of the position of the amp O is also done with drag and drop to the needed position To rotate the RO click on the arrowhead of the arrow on the right side and rotate the amp O around the centre of the rectangle VISOR Vision Sensor E 068 14505 01 Page 37 of 75 VISOR Solar User Manual a SEN SO PART 5 3 1 Calibration For typical applications in the solar indus
92. s function must have been enabled previously by SensoConfig Job Image transmission SensoView The path of the archive can be defined within SensoView File Result archiving The archived images can be analysed in offline simulation with varied detector settings Thus the user can optimize the line without running the line during the optimization VISOR Vision Sensor E 068 14505_01 Page 68 of 75 VISOR Solar User Manual G SCNSOPART The statistics of PASS and FAIL devices is shown on a further tab Additionally the execution time is shown o SensoView 192 168 30 94 File View Options Help a SCNSOPART Home Prev Next Print Statistics Statistical data from the inspection process is displayed in the Statistics tab in run mode The statistical data displayed is identical for all types of detectors Statistical Significance parameters All evaluations Total number of inspections Good parts Number of inspections with result OK Bad parts Number of inspections with result Error Min max mean Min rnax mean execution time execution time for evaluation in ms All statistic values can be reset to zero with the Reset button vr Commands Result Statistics Job select Job upload Freeze 9 Current image Minimum Count 375 E Sms Reset Next image Next failed image Maxi aximum Pass 375 100 0095 een He 103ms Zoom Rec images Average Fail 0 0 00 executio
93. s has to be set with the slider to the value corresponding to the analysed cell Any deviation between setting and observed number of busbars will lead to a FAIL With Area per busbar the area of each busbar is compared to the limits The actual measured area is shown in the slider as a blue line see Figure 49 If the area of the busbars is not in the set range this will cause a FAIL With the slider Angle range the angle of the busbars in respect to the coordinate system of the sensor can be checked With the Position contro the measured position of the gravity centre of the busbars will be checked This is done with two possible shapes of allowed areas a rectangle or an ellipse They appear as blue areas on the screen The size and position are changed similarly to those of the ROI Activating the Overlay by switching to Busbar pixel will lead to a colouring all pixel which are considered to be part of a busbar Please note that the function of the busbar detection has been successfully verified on various known cell designs In case of very conventional cells like ones with more busbars than pads per busbar the sensor may not operate as expected VISORe Vision Sensor E 068 14505 01 Page 58 of 75 VISOR Solar User Manual C SeN SO PART After a successful detection of the busbars each busbar will be surrounded by a green computed rectangle In case of an active distortion removal the rectangle and the image may apparently devia
94. s vede Al 5 3 3 1 Measurement of wafer and cell distances sse 43 5 9 4 Checking ihe thresholds with Resull reke keke keke ke keke k reke ke kek tU ER edid 44 5 3 5 Configuration Of ehip deleciton Chips j k cdsculcak inc ken ho nro xou ome ln nek r emer bo cesse keda nc rek a nakai aapi 45 Sar To NR mt 46 ENEE VAD SIS 1 OM MN T T OT A7 5 3 5 3 Checking fiedqesuliserthe Chip 1061S cuernos esas sdeaesanceseasve fois eadein eobib beet edis abire domu ceu sume ions 48 5 3 6 Fiducials Pattern Matching Detector iiii reke keke yekeke keke keke kek r keke k ek r kek kre ke 49 suo Dr Rene ned toe E E etn Roe A A A A are ED zma 51 5 3 7 1 Holes Cracks and Stains c ccccccccscccssccccecsccesscceessccescececcceeseceesscceseceessccessececseesetseceeseceessesetseeeeasesetseceasees 53 5 3 7 2 Checking the quality of the antireflective coqling Eiii keke keke keke ke 54 5 30 Sunny SIG GOWI eee aes en tcs ee ae mmXZMU MUM MU ae MEE MEE M MMMIZ2U 2MMMMMRM UE 55 _ t vkyey aea xDDrDb DbDDDDDDTDTDTDTr rXrr o ev ked 56 foe Cale OX Efe m ene ne ee nee oe E E 60 REL Le ee ee eee er OSEE 60 DA kO NCIS NND 6 S RA BITS Te OUD RR TT 62 9 4 9 niet TO S ceci tegi oed teo ERO II oe D SEI ELOSD UNE NN DOE Du MEI EDO SD UN NN MIbDM UE MEI DOSE UN NM IM __i 62 Xe RR 63 I
95. shapes of the tested regions a rectangular or an elliptical region The position and size of the position region which appears as a blue rectangle ellipse in the camera image can be changed in the same way like the blanking region which is described above The sensor tests whether the centre of the wafer appears as a light blue cross is inside of the tested region VISOR Vision Sensor E 068 14505 01 Page 41 of 75 VISOR Solar User Manual G SCNSOPART With a controlled setup as indicated previously an absolute accuracy better than 50 ym and an overall repeatability of a few microns can be obtained for the position of the wafer The objective of this section is to guide users in obtaining the best performance in their application Moving objects may be observed by the camera as well The systematic error on the position detection can be calculated by the inbuilt trigger delay time 1 ms half the shutter speed e g 0 2 ms 2 with both values being multiplied by the transport speed e g 0 05 m s Thus in this example the output value is shifted systematically by 0 055 mm in the transport direction With the knowledge of the transport speed the PLC may compensate this effect The angle observed is compared to the Angle range The range of the accepted angle can be chosen using the slider and the number edit as before at the adjustment of the Height of the water Stable imaging conditions lead to a constant green overlay
96. sionen later Protocol Binary or Online Offline Fit 4 r Configure output IJO mapping Digital output Interfaces Timing Telegram ASCII Start Payload Trailer E Active Detector Value Min lei i separator 1 l lt Wafer Position amp Chip Wafer center X End of Telegram ANSI a 2 Wafer Position amp Chip Wafer center Y 0 So 3 Iv Wafer Position amp Chi Wafer angle Save to file Selected fields Data length Status are 4 Y Wafer Position amp Chip Detector result 0 U Reset Detector result Digital outputs Logical outputs P Execution time Active job no Checksum 4 b Down Mode Config Name Line 5 IM Active job 1 Wafer inspecti Cycle time n a Flash 0 5 kB 40 3 MB X 0 Y 0 I 0 DOLIT Q Q Q Figure 56 Definition of a typical ASCII telegram To add new results to the telegram click on the right on the button A new line in the Payload window will be shown First ensure that the check box Active is checked then choose your Defecfor in the next drop down box In the drop down menu Valve you can choose the result which is given out VISORe Vision Sensor E 068 14505 01 Page 64 of 75 VISOR Solar User Manual Q SeN SO PART In addition Figure 57 shows the fe egram definition of a Busbar Detector Ix SensoConfig Solar p Fife a x Fie View Options Help CA D j e
97. sor E 068 14505 0l Page 23 of 75 VISOR Solar User Manual G SCNSOPART To scroll the image use the scroll bars marked in Figure 24 SensoConfig Solar ji 1 a X File view Options Help ioga a a eng GD SENSOPART Alignment 1 Home Prev Next Print Detector i p F Output Welcome to SensoConfig Ta Re sult With this programme you can configure your VISOR vision sensor for one or several jobs in six Start sensor logical operating steps Basic image setting Image brightness Adjust shutter or amplification see Job General Image sharpness Focus setting screw on the back of VISOR Job Position tracking Detectors Output Result Start Sensor Other programme functions Trigger settings Mode of connection online offline Simulation of inspection jobs using series of Trigger Image update images filmstrip p a Image recording for analysis or simulation Single J purposes Triager Continuous Use of SensoConfig may require password entry administrator user group See user administration Connection mode Online Offline To obtain a continuously updated live image even w Configure job Jobs Name Description Author Created C Image acquisition Image transmission Archiving Pre processimg Cycle time 1 Jobi Job Author 02 05 2012 0 Resolution Shutte
98. sor will operate in an optimal way and is able to fulfil its targets 4 2 1 Recommended setup Reflective foil or back light High precision and robustness require a short exposure time which is a key success factor as mentioned previously Preferably this is obtained when analysing wafers by using the VISOR camera in a setup with a reflective foil RF775 as shown in Figure 7 To achieve minimal maintenance and to prevent fragments from accumulating on the foil it can be tilted to let fragments slide down Technically and commercially this setup is the most preferred solution The reflective foil can be placed freely under the water e The wafer may lay on top of the foil e The foil may be tilted towards the wafer plane e When measuring wafers on conveyor belts the foil typically may be placed several centimetres below the belts fully supporting accurate measurements For the analysis of the front side printing of cells do not use a reflective foil but a homogeneous white background In all setups using the reflective foil a backlight or a white background the wafer appears as dark and the background appears as bright 4 2 2 Machine parts in the image In the absence of an even and homogeneous background e g a reflective foil or a back light machine parts may be observed by the camera which will affect the analysis of the wafer Typical examples are conveyor belts being used to transport the wafer and which may be interpreted as chips or pr
99. te despite of a good fit The center of all busbars is always indicated as a green cross To compare it to the center of the cell activate the position control of the wafer detector and find the wafer center as a blue cross as shown in Figure 34 The results of the Busbar detector are shown in the Resu t window after selecting this detector in the list In the tab Busbar trom the Result window there are the main characteristics of the busbars The centre of gravity the angle of the set of busbars and their width and length In the Figure 50 Result tabs of the Busbar Detector the dot right of the centre values is grey because the Position contro feature is not activated The angle of the Busbars is in the acceptance range of therefore the dot right to it is green All FAILs will result in a red coloured dot Busbar Overview Centers 134 605 mm al Center Y 100 566 mm Angle 0 425 Q Length 151 842 mm Width 132 mm f Busbar Cwerview Center x mm Center Y mm Area mm Pads 134 079 152 588 146 n 134 554 100 764 160 7i 3 135 082 485 353 150 n cin ET JL Figure 50 Result tabs of the Busbar Detector The values of the individual busbars are shown in the tab Overview These values include the centre the area and the number of Pads Since some Busbars are not printed as straight line to reduce consumption of expensive silver paste they are printed as a dashed
100. the one of the PC used Internet Protocol TCP IP Properties General You can get IP settings assigned automatically if your network supports this capability Otherwise you need to ask your network adrrurestrator for the appropriate IP settings Obtain an IP address automatically Use the following IP address IP address 182 168 100 10 Subnet mask Default gateway G Use the following DNS server addresses Preferred DNS server Alternate DNS server Advanced Figure 16 IP properties To change the IP address of the sensor see use button Set of the program SensoFind being described in the next section VISOR Vision Sensor E 068 14505 01 Page 17 of 75 VISOR Solar User Manual C SeN SO PART 4 1 4 Starting up the Software SensoFind Now most excluding the fine adjustment and the focusing of the Hardware configuration steps are done and the remaining steps of the configuration of your sensor will be done with the programs SensoFind and SensoConfig With the next steps the fine adjustment of the sensor will be checked and the conditions to ensure best possible imaging conditions will be prepared First start the program Sensofind In the first opened window all connected cameras will appear in the Active sensor list If no camera appears click on the button Find on the left see Figure 77 When there is also no camera available or a connection is not possible this is likely due to in
101. the threshold and therefore the wafer gets a PASS or a FAIL result The green or grey dot gives you the information which test is activated or not It is useful to check if the values shown from the sensor are reasonable or if some misinterpretations are done e g from a wrong or old calibration VISOR Vision Sensor E 068 14505 01 Page 44 of 75 VISOR Solar User Manual G SCNSOPART 5 3 5 Contiguration of chip detection Chips As a result of sawing or handling of wafers chips may break out of them during any step of the processing In the following the chips may propagate and cause a complete breakage of the wafer and a contamination of the production lines Sharp defects like triangular ones will likely propagate Due to their shape they are called shark teeth More flat defects are called mouse bites or blunts and propagate less likely A typical requirement in production is to detect chips which exceed 1 mm The VISOR Solar sensors offer two different tools for such detections Chip Size and Chip Shape e The Chip size tool detects the deviation of the observed wafer edge from the fit of an ideal geometry The tool is easy to set up fast in operation and largely independent of the shape of the defect The tool may be used to detect the area of the chip e The Chip shape tool detects sharp edges of the contour It provides the highest sensitivity and can detect chips down to 0 5 mm However it requires mo
102. try choose at least a Wafer detector 5 item in Figure 37 The other detectors can be used for special tasks and will be described later or in the V SOK User Manual The following description is written for the Wafer defector unless it is stated otherwise Before adjusting settings ensure that your wafer is complete inside of the yellow search region of interest RO of the detector The amp O can be resized with drag and drop by shifting the black dots at the edges and corners of the RO to the needed position The change of the position of the amp O is also done with drag and drop to the needed position To rotate the amp O click on the arrowhead of the arrow on the right side and rotate the amp O around its centre When starting to use a wafer detector an initial calibration is recommended which is done by just three clicks see Figure 32 1 Goto Detector and choose the tab Calibration 2 Fora 6 inch cell or wafer just activate the mm units 3 Finally press Calibrate to wafer gt SensoConfig Solar File View Options Help c ga fo a g ga Setup Job Alignment Output Home Prev Next Print Wafer Detector F This detector is useful to check cracks at a wafer contur and measure some geometric parameter like width height position rotation angle Result Start sensor Tab for Wafer Tab for Chip size Tab for Chip shape Tab for Hole Tab for
103. ult of detector 2 on pin 8 the inverted result of detector 2 On pin 9 is the signal for the external illumination and on pin 12 the result of both detectors The targeted effect of the Output signal can be chosen just by using the drop down list When you use the Extended option on the left a logical expression can be written in the last column Logical expression to use a logical expression of the result of different detectors Some examples to write logical expressions are given in the in built help on the right I O mapping Digital output Interfaces Timing Telegram Outputs Invert NOT Logic D1 9 D2 9 Logical expression 1 Overall job result 9 amp On 9 On 9 D18D2 Standard 2 12 RDBU A 9 amp On 9 On 9 D18D2 305 PK 9 amp On 9 Off D 1 4 06 YE 9 amp Inv 9 off gt Di 5 07 EK B 9 amp Off gt On 9 D2 extended 509 GO s jo oo On Off Mode Config Name Visor V10 your Active job 1 Job1 Cycle time n a Flash 0 5 kB 40 3 MB X 0 Y 0 1 0 pou Q O Q Q Q9 Figure 52 Tab Digital Output of the Output sub menu 5 4 3 Interfaces I O mapping Digital output Interfaces Timing Telegram Name Setting 1 Setting 2 Logical outputs Enable 1 Internal I O PNP v 2 R5422 38400 o 3 External I O extension 32Outputs mm 4 Ethernet IN 2006 u 2005 f fo ee 5 EtherNet IP 0 e Mode Confi
104. ult values Since other camera models do not cause any significant optical distortion do not activate distortion removal with these models Default values are Kappa x10e 6 0 300 and Scale 0 980 Please note that just the algorithms and the overlay of their results consider a distortion removal For reasons of speed the images shown on the screen are not compensated This may yield to apparent discrepancies during the configuration but has no effect on the quality of the performance Activating Calibration Distortion removal results in 18 ms processing time e mm units All cameras operate on the basis of pixels To switch to more user friendly metric dimensions the user should activate mm units also under Defector Calibration tab e Calibration The calibration factor for the translation of pixels to mm units can be derived most easily from a wafer being exposed to the camera By default its wafer height is assumed to be 156 0 mm For 5 inch waters it should be changed to 125 mm Clicking on Calibrate to waferthe calibration factor is computed and displayed Alternatively the calibration factor can be set manually In Appendix A Test sample a water with a size of 156 mm and some chips is attached which can also be used to calibrate the sensor To reproduce the calibration factor it is recommended to use the same wafer or a longer lasting metal sheet during all calibrations Whenever the mechanical setup or the focus is adjusted the
105. und holes section 5 3 7 1 Holes Cracks and Stains At max 10 holes will be detected All found chips are listed in the Chip overview tab If the mm units option under Defector Calibration is activated all the given positions and results are in mm to find a chip on the screen it may be useful to deactivate this option To check the adjusting of your threshold it may be useful to check if all found chips are needed to identify as chips It is also possible that different settings are more useful to your production needs as discussed in section 5 3 Configuration of the Detector characteristics VISOR Vision Sensor E 068 14505_01 Page 48 of 75 VISOR Solar User Manual SCNSOPART 5 3 6 Fiducials Pattern Matching Detector Fiducials are used to trace changes of the coordinate system and to compensate for them To ensure a long term stability and reliability for accurate position detection it is strongly recommended to implement two fiducials in the machine and to detect their position Moreover is beneficial in machine configurations with two cameras one fixed and the other mobile on a robot To do this two fiducials like screws have to be placed at fixed locations fixed close to the object By detecting them with the sensor a coordinate system in a plane is fixed and all positions and measurements can be referred to that coordinate system When the fiducials are detected by two sensors their coordinate systems a
106. where the image acquisition starts some milliseconds after the trigger signal The second way provides a high position accuracy even on conveyor belts with varying speed by using an encoder input signal available only in the Advanced version In the Standard version of the sensor the time delay is determined with the 7 ming tab With Trigger Delay the time between trigger and the start of the image recording is determined The time delay between the trigger signal and the change of the output signals depending on the result of the Detector result is determined with the Digital Output tab All delays are given in milliseconds Configure output I O mapping Digital output Interfaces Timing Telegram Trigger Digital output Delay Delay Ejector result delay Signalling Valid duration 3ms B Ejector result Sms E Change on result Oms Figure 55 Tab Timing of the Output sub menu After assigning an encoder pin the delay will then be measured in encoder steps For further information see the online help on the right of SensoConfig 5 4 5 Telegram A telegram can be setup easily by a few clicks to meet the standard defined by the PLC At first ensure that the respective ports are activated In case values like positions are to be transmitted in the section Output Interfaces the Ethernet intertace becomes Enabled Alternatively serial links or the field bus Ethernet P may be enabled D
107. your Active job 1 Jobi Cycle time n a Flash 0 2 kB 40 3 MB X 0 01 0 DOUT Q Q Q Q Q Q Figure 25 Sharp image of an wafer Now all sensor adjustments are completed and the mounting of the sensor is finished The adjustments and settings done should not be changed readjustments are usually not needed VISOR Vision Sensor E 068 14505 01 Page 25 of 75 VISOR Solar User Manual G SECNSOPART 4 1 7 Configure or upload a job tile to the camera The sensor works with instructions saved in the Job File on a PC drive The Jobfile contains all settings previously defined using the SensoConfig Software Each Jobtile can be uploaded to the sensor for stand alone operation There are three principle ways to get a job file e Create a new job as described in section 5 Software configuration e load an old job file from your PC which is set up for a machine with the same configuration To do this click on the Load button on the lower and use a saved Jobfile e Connect a camera to a PC start SensoConfig and all jobs will be downloaded from the camera to the PC To upload a new Job to the sensor click on the Start sensor button on the upper left side of your window The sensor will start then to work without the need of a PC all needed information of the job file are saved on the sensor and will stay there even when the sensor is without a power supply The sensors of the Standard product line may store up to

VISOR® Solar User Manual - SensoPart Industriesensorik GmbH

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VISOR&reg; Solar User Manual - SensoPart Industriesensorik GmbH

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VISOR® Solar User Manual - SensoPart Industriesensorik GmbH