UM10338 - NXP Semiconductors
Contents
1. remains with customer In no event shall NXP Semiconductors its affiliates or their suppliers be liable to customer for any special indirect consequential punitive or incidental damages including without limitation damages for loss of business business interruption loss of use loss of data or information and the like arising out the use of or inability to use the product whether or not based on tort including negligence strict liability breach of contract breach of warranty or any other theory even if advised of the possibility of such damages Notwithstanding any damages that customer might incur for any reason whatsoever including without limitation all damages referenced above and all direct or general damages the entire liability of NXP Semiconductors its affiliates and their suppliers and customer s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars US 5 00 The foregoing limitations exclusions and disclaimers shall apply to the maximum extent permitted by applicable law even if any remedy fails of its essential purpose 4 3 Trademarks Notice All referenced brands product names service names and trademarks are property of their respective owners 1 C bus logo is a trademark of NXP B V NXP B V 2011 All rights reserved User manua2. PLAGE 75 TP8 plage 75 PLAGE 75 TP9 plage 75 PLAGE 75 TP10 plage 75 PLAGE 75 TP11 plage 75 PLAGE 75 TP12 plage 75 PLAGE 75 TP13 plage 75 PLAGE 75 U1 ccm01_2251 CCM01_2251 yi hc49s 14 745MHZ BUBBLE01 Printed_Circuit_board PCB2075 1 BUBBLE02 ACME ETL305015_Spacer_M3x15 BUBBLE03 Screw_C_M3x6_Stainless_Steel BUBBLE04 OMRON Tact Switch 6x6 SMT el Capacitor C Capacitor C Capacitor C Type 293D T Capacitor C Capacitor C Capacitor C Capacitor C Capacitor C Capacitor C Capacitor C Type 293D T 9 A AA A A A A o A R 16V 1 R 16V 1 R 16V 1 R 10V 1 R 10V 1 R 10V 1 R 16V 1 R 16V 1 R2 0603 C0G 50V 5 R2 0603 C0G 50V 5 R2 0603 X7 ntal Capacitor Package C 10 R2 0603 X7 R2 0603 X7 R2 0603 X7 R2 0603 X7 R2 0603 X7 R2 0603 X7 R2 0603 X7 ntal Capacitor Package C 10 0 0 0 0 0 0 0 0 Resistor Package 0603 5 1 16W Resistor Package 0603 5 1 16W TO BE CLOSED NOT CONNECTE NOT CONNECTE NOT CONNECTE NOT CONNECTE NOT CONNECTE NOT CONNECTE NOT CONNECTE NOT CONNECTE NOT CONNECTE NOT CONNECTE NOT CONNECTE NOT CONNECTE NOT CONNECTE KKK D D D D D D D D D D D D D CANON Card Read 8 Cont
3. All information provided in this document is subject to legal disclaimers NXP B V 2011 All rights reserved User manual Rev 1 0 11 January 2011 10 of 14 NXP Semiconductors UM10338 3 2 Interface connector Description of the TDA8029 I2C Demo Board All the signals and power supply must come from the J1 connector The pin names are given in the schematics For a better representation they are described on the board on the following picture Ge DCIN VDD SDA SCL SDWN GND 0000000F B Slavel2CMute WakeUpl2C TP13 C7 TP10 PO c10 ci o 019aab241 Fig 9 Cake8029_12_D Connector pins The next table gives a description of each pin Table 1 Cake8029_12_D Connector pins description Pin number Pin name Description 1 DCIN Power supply for the DC DC converter Must be in the range from VDD to 6V 2 VDD Power supply for the main chip Must be in the range 2 7V 6V 3 SDA 12C bus Data line 4 SCL 12C bus Clock Line 5 Slavel2CMute I2C bus Line used by the TDA8029 to inform the host that there is an event 6 WakeUpl2C I2C bus Line used by the host to wake up the TDA before sending a frame 7 SDWN Shutdown pin Must be HIGH to use the TDA8029 and LOW to put the TDA8029 i
4. LO PGND PRES SBM TP7 PRES 09 ATP9GNDC_ af ce I U1 C2 220 nF CCM01_2251 100 nF ji 2 TP13 VCC c8 A TP11 RST ae 2 TP12 CLK E A TP8DCIN Doin C10 ik ATPiovup 100nF 100 nF C11 VDD 220 nF ic 1 10 uF 16V 019aab235 Fig 2 Cake8029 12 _D Schematics UM10338 All information provided in this document is subject to legal disclaimers NXP B V 2011 All rights reserved User manual Rev 1 0 11 January 2011 4 of 14 NXP Semiconductors U M1 0338 Description of the TDA8029 I2C Demo Board 2 2 Layout Top 019aab236 Fig 3 Cake8029 12 _D Layout Top view UM10338 All information provided in this document is subject to legal disclaimers NXP B V 2011 All rights reserved User manual Rev 1 0 11 January 2011 5 of 14 NXP Semiconductors U M1 0338 Description of the TDA8029 I2C Demo Board 2 3 Layout Bottom 019aab237 Fig 4 Cake8029 12 _D Layout Bottom view transparent view UM10338 All information provided in this document is subject to legal disclaimers NXP B V 2011 All rights reserved User manual Rev 1 0 11 January 2011 6 of 14 NXP Semiconductors UM10338 2 4 Components Top Description of the TDA8029 I2C Demo Board 00000000 pe e cs Oca 23 m P2 Y1 C1 C2 ST2 O 019aab238 Fig 5 Cake8029_12_D Components
5. Top view UM10338 All information provided in this document is subject to legal disclaimers NXP B V 2011 All rights reserved User manual Rev 1 0 11 January 2011 7 of 14 NXP Semiconductors U M1 0338 Description of the TDA8029 I2C Demo Board 2 5 Components Bottom 5 is a J P 00000000L 019aab239 Fig 6 Cake8029_12_D Components Bottom view UM10338 All information provided in this document is subject to legal disclaimers NXP B V 2011 All rights reserved User manual Rev 1 0 11 January 2011 8 of 14 NXP Semiconductors UM10338 2 6 Bill of Material Description of the TDA8029 I2C Demo Board BP1 int_b3s B3S_1000 co c0603 22pF Cl c0603 22pF C2 c0603 100nF 3 c293d_c 10uF_16V C4 c0603 100nF c5 c0603 100nF C c0603 220nF CT c0603 220nF C8 c0603 220nF C9 c0603 100nF C10 c0603 100nF Cil e293d_c 10uF_16V ICL sot358_1 TDA8029 J1 he14_1x8md HE14_8MD RO r0603 0 R1 r0603 33K ST2 chevron_clos CLOSED TPL plage 75 PLAGE 75 TPA plage 75 PLAGE 75 TP3 plage 75 PLAGE 75 TP4 plage 75 PLAGE 75 TPS plage 75 PLAGE 75 TP6 plage 75 PLAGE 75 TP7 plage 75
6. UM10338 Description of the TDA8029 I2C Demo Board Rev 1 0 11 January 2011 User manual Document information Info Content Keywords TDA8029 I2C Cake8029 12 _D Contact Smart Card Reader PN533 Abstract This user manual intends to describe the Cake8029_12_D This demo board is dedicated to the TDA8029 application with 12C interface The document also presents the connection between the TDA8029 board and a PN533 demo board NXP Semiconductors U M1 0338 Description of the TDA8029 I2C Demo Board Revision history Rev Date Description 1 0 20110111 First version Contact information For more information please visit http www nxp com For sales office addresses please send an email to salesaddresses nxp com UM10338 All information provided in this document is subject to legal disclaimers NXP B V 2011 All rights reserved User manual Rev 1 0 11 January 2011 2 of 14 NXP Semiconductors UM10338 1 Introduction Description of the TDA8029 I2C Demo Board 1 1 TDA8029 The TDA8029 is a complete contact smart card reader It embeds an electrical interface with all the security features needed to protect the smart card a fully compliant ISO 7816 UART and a microcontroller with complete software driving the smart card protocols 1 2 Demo Board The Cake8029_ 12 D demo board is used to test the I C interface of the TDA8029 On the board the TDA8029 is configured for this interface an
7. acts SMT KONY Quartz Crystal Low Profile Package HC49S INTER_INOX A2M320_Lockwasher_Stainless_ Steel Fig 7 Cake8029_12_D BOM HE14 Connector 1x8 Straight Male UM10338 All information provided in this document is subject to legal disclaimers NXP B V 2011 All rights reserved User manual Rev 1 0 11 January 2011 9 of 14 NXP Semiconductors UM10338 Description of the TDA8029 I2C Demo Board 3 Configuration and use 3 1 Energy Saving Mode The two configuration switch ST1 and ST2 allow to choose if the Energy Saving mode is used or not The connector connect the pin P26 25 to VDD or GND To use the ESM ST1 must be soldered and ST2 open If the ESM is not used ST2 must be soldered and ST1 unsoldered For more details on the Energy Saving Mode refer to AN10207 Ge aa gt Tee TP2 TP2 TP TP4 ma a TP4O ma A c3 F c3 4 C4 oe a et TPS mn cs pe C5 Tpg TP7 TP7 5 Tpe9 o TP9 c9 c9 TP13 TP13 J1 C7 TP10 P0 c10 C11 p J1 C7 TP10 PO c10 C11 p On o z a ESM Off b ESM On 019aab240 Fig 8 Cake8029_12_D Energy Saving Mode configuration UM10338
8. cations or additions NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information 4 2 Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable However NXP Semiconductors does not give any representations or warranties expressed or implied as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information In no event shall NXP Semiconductors be liable for any indirect incidental punitive special or consequential damages including without limitation lost profits lost savings business interruption costs related to the removal or replacement of any products or rework charges whether or not such damages are based on tort including negligence warranty breach of contract or any other legal theory Notwithstanding any damages that customer might incur for any reason whatsoever NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document including without limitation specifications and product de
9. d an email to salesaddresses nxp com Date of release 11 January 2011 Document identifier UM10338
10. d this bus is physically the only one implemented Therefore the board cannot be used with a serial interface The demo board is composed of The TDA8029 device A smart card connector An interface connector for the power supply and control signals Two configuration solder bridge To choose using Energy Saving Mode or not A reset switch to reset the TDA8029 Fig 1 wigs gt Cw S pA sown 3 4 uit Wi ror rm 19 PRES 019aab234 Cake8029_12_D UM10338 All information provided in this document is subject to legal disclaimers NXP B V 2011 All rights reserved User manual Rev 1 0 11 January 2011 3 of 14 NXP Semiconductors UM10338 2 Hardware description Description of the TDA8029 I2C Demo Board The next pages show the electrical schematics the layout and the component position of the board 2 1 Schematics J1 R1 BP1 HE14_8MD 3 No VDD 1 gt DCIN 33 kQ Ww 2 VDD i 1 3 SDA VDD SDA INT1 po F o F vee 4 gt SCL c3 A pr p oO 5 P27 a 6H INTI mA A l 7 gt SDWN 16V pa al 14 745 MHz 8 a c4 ie Ai A STI ea r el o a 3 o A ST2 S z z amp k amp pii P17 P27 TP3 SI2CM TP4 per sel Z SCL P16 PSEN VDD ALE GND EA TP5 C1 VDD SDWwN lt _2 SDWN SDWN TDA8029 TEST c5 CDEL SAM 7 TPs tl LO 100nF
11. er s Customers should UM10338 All information provided in this document is subject to legal disclaimers provide appropriate design and operating safeguards to minimize the risks associated with their applications and products NXP Semiconductors does not accept any liability related to any default damage costs or problem which is based on any weakness or default in the customer s applications or products or the application or use by customer s third party customer s Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer s NXP does not accept any liability in this respect Export control This document as well as the item s described herein may be subject to export control regulations Export might require a prior authorization from national authorities Evaluation products This product is provided on an as is and with all faults basis for evaluation purposes only NXP Semiconductors its affiliates and their suppliers expressly disclaim all warranties whether express implied or statutory including but not limited to the implied warranties of non infringement merchantability and fitness for a particular purpose The entire risk as to the quality or arising out of the use or performance of this product
12. l Rev 1 0 11 January 2011 13 of 14 NXP Semiconductors UM10338 Description of the TDA8029 I2C Demo Board 5 Contents 1 Introduction 0 cesecteeeseeteeeeseeeeeenseeeeensseeneenseeeeneas 1 1 MDABO29 MR EOT 1 2 Demo Board 2 Hardware eSCription cccccssssessseeeesseeeenees 4 2 1 SCHEMALICS wos 225s essrdeieeelesie Ma de 4 2 2 LAV OUT TOPis n 5 2 3 Layout Bottom wi ciena 6 2 4 Components TOP eeeeeeeeeeeeeeseeeeeteeeeeeseeeeneees 7 2 5 Components Bottom eceeeeeeeseeeeeeeeeeeeeneees 8 2 6 Bill of Material 0 ccccccccecceeeeeeeeeeeneeeeeeeeeeeeees 9 3 Configuration and USC ceecsseeeeteeseeeeeeeens 10 3 1 Energy Saving Mode 10 3 2 Interface Connector cccccceeeseeeeeeeeeeeetteeeees 11 3 3 Connection to a PN533 demo board 12 4 Legal information ccssseeessseeeeseseeeensseneesens 13 4 1 Definitions cccccceeeeceeeeeeeeeeeeeeeeneeeeeeeeeeeeaes 13 4 2 DiSCIAIMELS ccceeceeeeeeeeeeeeeeeeeeenteeeeeeeeteeeaee 13 4 3 Trademarks oo eeeeeeeecceeeceeeeeeeeeneeeeeeeeeeseenaeeeees 13 5 COMENTS so measa conde terea aa AEA aaraa Aan 14 Please be aware that important notices concerning this document and the product s described herein have been included in the section Legal information NXP B V 2011 All rights reserved For more information please visit http www nxp com For sales office addresses please sen
13. n shutdown mode 8 GND Power supply ground pin UM10338 All information provided in this document is subject to legal disclaimers NXP B V 2011 All rights reserved User manual Rev 1 0 11 January 2011 11 of 14 NXP Semiconductors U M1 0338 UM10338 Description of the TDA8029 I2C Demo Board 3 3 Connection to a PN533 demo board The PN533 embeds a software to be able to drive the TDA8029 The PN533 generic demo board PCB1950 1 has an external connector compatible with the connector on the Cake8029_12_D The connection between the two boards can be achieved with a simple straight cable as represented on the next picture 019aab242 Fig 10 PN533 TDA8029 Boards connection To use the board in this configuration the connection ST1 must be closed and ST2 must be unsoldered because the PN533 uses the Energy Saving Mode of the TDA8029 For more detail on this application refer to the PN533 Application Note dedicated to this association AN10758 All information provided in this document is subject to legal disclaimers NXP B V 2011 All rights reserved User manual Rev 1 0 11 January 2011 12 of 14 NXP Semiconductors UM10338 4 Legal information Description of the TDA8029 I2C Demo Board 4 1 Definitions Draft The document is a draft version only The content is still under internal review and subject to formal approval which may result in modifi
14. scriptions at any time and without notice This document supersedes and replaces all information supplied prior to the publication hereof Suitability for use NXP Semiconductors products are not designed authorized or warranted to be suitable for use in life support life critical or safety critical systems or equipment nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury death or severe property or environmental damage NXP Semiconductors accepts no liability for inclusion and or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and or use is at the customer s own risk Applications Applications that are described herein for any of these products are for illustrative purposes only NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products and NXP Semiconductors accepts no liability for any assistance with applications or customer product design It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned as well as for the planned application and use of customer s third party custom
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