TLE5012BD E9200 Data Sheet (668 KB, EN)
Contents
1. 2 1 4 1 4 2 5 1 5 2 6 1 6 2 6 3 6 4 6 5 Table of Contents oe 3 List of Figures ai Bas RE velar a Rn 4 List of TableSs sees asus e RCNH ds a RR P LUCR eo d e dl ee 5 Preface an MO OE RE EE OE ae OE EE 6 Product Description ee 6 Overview aaa ER EE Ae AAA OOR STA 6 EE CAE 7 Application Example iai srne ud 0000 cc eee eee 7 Pin Configuration ss ss oara srian di kudra a aAa AN IH VERRE ERES 8 Pin Deseription RA N A SN A EE EE EE OE RER 8 Dual Die Angle Output ane 9 specification sene st aten ERR ela la Mind eU eh MARHE Re RAE Bead Hd 10 Absolute Maximum Ratings eee 10 Calculation of the Junction Temperature ee 10 Pre Configured Derivates nn 12 IF type E1200 ia ees EER Ee een ee 12 SPC type dle A E ENE AR BAG 12 Package Information nn u RA paal hennen ER Ran 13 Package Parameters neee ee 13 Package Outline anar aren RE A WNA a De 13 Footprint ee here tete le eae etu diede EI v 15 PACKING ME eh ehe eben ee 15 Ma rking EE 15 Data Sheet 3 Rev 1 1 2015 03 12 Infineon TLE5012BD List of Figures List of Figures Figure 1 1 Figure 2 1 Figure 3 1 Figure 6 1 Figure 6 2 Figure 6 3 Figure 6 4 Figure 6 5 Data Sheet PG TDSO 16 package escorrer ER ER EE ee ee he ha hm hd E 6 Pin configuration top view ene 8 Dual die angle output neee ee 9 PG TDSO 16 package dimension on 13 Position of sensing element llli hen 14 Footprint of PG TDSO 16 2 eee2. Die 2 SSC Chip Select 7 SCK2 Die 2 SSC Clock 8 IFC2 VO Die 2 Interface C CLK IIF IDX HS3 External Clock IIF Index Hall Switch Signal 3 9 IFB2 O Die 2 Interface B IF B HS2 IIF Phase B Hall Switch Signal 2 10 GND2 Die 2 Ground 11 VDD2 Die 2 Supply Voltage Data Sheet Rev 1 1 2015 03 12 TLE5012BD Infineon Dual Die Angle Output Table 2 1 Pin Description cont d Pin No Symbol In Out Function 12 IFA2 O Die 2 Interface A IIF_A HS1 PWM SPC IIF Phase A Hall Switch Signal 1 PWM SPC output 13 IFA1 O Die 1 Interface A IIF_A HS1 PWM SPC IIF Phase A Hall Switch Signal 1 PWM SPC output 14 VDD1 Die 1 Supply Voltage 15 GND1 Die 1 Ground 16 IFB1 O Die 1 Interface B IIF_B HS2 IIF Phase B Hall Switch Signal 2 1 External clock feature is not available in IIF or HSM interface mode 3 Dual Die Angle Output The bottom sensor element of the TLE5012BD is flipped relative to the orientation of the top sensor element Therefore the rotation direction sensed by the bottom element is opposite to the top element This is advantageous for safety critical applications as the two sensor elements do generally not output the same angle Figure 3 1 shows the output of the two sensor ICs for a given external magnetic field orientation top sensor output bottom sensor output 360 sensor output angle N 0 y eo eo o co o o 0
3. E SS Figure 6 1 PG TDSO 16 package dimension Data Sheet 13 Rev 1 1 2015 03 12 Infineon TLE5012BD Package Information 0 2 4 0 2 ISTANCE CHIP T TOP SIDE OF IC _ CENTER OF SENSITIVE AREA Figure 6 2 Position of sensing element Table 6 2 Sensor IC placement tolerances in package Parameter Values Unit Notes Min Max position eccentricity 100 100 um in X and Y direction rotation 3 3 affects zero position offset of sensor tilt 3 3 Data Sheet 14 Rev 1 1 2015 03 12 Infineon TLE5012BD 6 3 Footprint Package Information FODTPRINT RECOMMENDATION REFLOW SOLDERING Figure 6 3 Footprint of PG TDSO 16 6 4 Packing A BARR EHEHEH AART LARR E REFER TO
4. 625 e 12bit mode one count per 0 088 angle step e Incremental Interface A B mode 5 2 SPC type E9200 The TLE5012BD E9200 is preconfigured for Short PWM Code interface It is most suitable for steering angle and actuator position sensing Angle update time is 85 4 us e Autocalibration Prediction and Hysteresis are disabled e SPC unit time is 3 us SPCinterface is set to open drain output Data Sheet 12 Rev 1 1 2015 03 12 Infineon TLE5012BD Package Information 6 Package Information 6 1 Package Parameters Table 6 1 Package Parameters Parameter Symbol Limit Values Unit Notes Min Typ Max Thermal resistance Ri 120 140 K W Junction to air Rinse 35 K W Junction to case Ring 70 KAN Junction to lead Moisture Sensitivity Level MSL 3 260 C Lead Frame Cu Plating Sn 100 gt 7 um 1 R values only valid for both dies supplied with Von 2 according to Jedec JESD51 7 6 2 Package Outline lt N ME GE PLANE 3 111 a t E LANE a E i il il f l i El Hl El SSS 4 e H tl H i i i i i DUTER DIMENSION DOES NOT INCLUDE PROTRUSION OR INTRUSION OF 0 15 PER SIDE
5. 90 180 270 360 external magnetic field angle Figure 3 1 Dual die angle output For applications where an identical angle output of both ICs is desired the rotation direction and angle offset of one sensor IC can be reconfigured by changing the settings in the ANG_BASE and ANG DIR registers via SSC interface Data Sheet 9 Rev 1 1 2015 03 12 infin eon TLE5012BD Specification 4 Specification 4 1 Absolute Maximum Ratings Table 4 1 Absolute maximum ratings Parameter Symbol Values Unit Note Test Condition Min Typ Max Ambient temperature Ta 40 125 C qualification acc to AEC Q100 grade 1 Junction temperature Ty 40 150 C 150 C For 1000 h not additive Attention Stresses above the max values listed here may cause permanent damage to the device Exposure to absolute maximum rating conditions for extended periods may affect device reliability Maximum ratings are absolute ratings exceeding only one of these values may cause irreversible damage to the device Table 4 2 ESD protection Parameter Symbol Values Unit Notes Min Max ESD voltage Vim 4 0 kV 1 ground pins connected Vas 2 0 kV 1 Venom 0 5 kV 2 Moon 0 75 kV 2 for corner pins 1 Human Body Model HBM according to ANSI ESDA JEDEC JS 001 2 Charged Device Model CDM according to JESD22 C101 4 2 Calculation of the Junction Temperature The total power
6. eee eens 15 Tape andiReel sr aa De ste ae den PM PAESE Gp gue RES M neal ct Gn UL a ER EA ME 15 MARKING 20 BEE EO dd adden reddi de Sean ee Adee esas 16 4 Rev 1 1 2015 03 12 ec Infineon TLE5012BD List of Tables List of Tables Table 1 1 Derivate Ordering codes see Chapter 5 for description of derivates 6 Table 2 1 Pin Description 0 0002 EE EE GE ee ee ernennen een 8 Table 4 1 Absolute maximum ratings ene 10 Table 4 2 ESD protection EE EE EE EE ee Se ell Rr 10 Table 6 1 Package Parameters o 13 Table 6 2 Sensor IC placement tolerances in package onee GE Ee ees 14 Data Sheet 5 Rev 1 1 2015 03 12 TLE5012BD Infineon Product Description Preface This document is an addendum to the TLE5012B datasheet and describes the TLE5012BD dual die angle sensor For all parameters which are not specified here the TLE5012B datasheet is valid 1 Product Description Figure 1 1 PG TDSO 16 package 1 1 Overview The TLE5012BD is a fully redundant 360 angle sensor that detects the orientation of a magnetic field This is achieved by measuring sine and cosine angle components with monolithic integrated Giant Magneto Resistance iGMR elements Highly precise angle values are determined over a wide temperature range and a long lifetime using an internal autocalibration algorithm Data communications are accomplished with a bi directional Synchronous Serial Communication S
7. 78 Figure 6 4 Tape and Reel 6 5 Marking The device is marked on the frontside with a date code the device type and a lot code On the backside is a 8 x 18 data matrix code Position Marking Description 1rd Line Gxxxx G green 4 digit date code 2st Line 12BDx2xx Type 8 digits See ordering Table 1 1 3nd Line XXX Lot code 3 digits Note For processing recommendations please refer to Infineon s Notes on processing Data Sheet 15 Rev 1 1 2015 03 12 Cinfineon TLE5012BD Package Information FRONTSIDE ACKSIDE ATE CODE YN BRRRRHHH ARRRRRAE ATA MATRIX CODE G a TYPE MM r LOT CODE OCR A CODE RTK BHEHEBHSE Figure 6 5 Marking Data Sheet 16 Rev 1 1 2015 03 12
8. Cinfineon Angle Sensor GMR Based Dual Die Angle Sensor TLE5012BD Data Sheet Rev 1 1 2015 03 12 Sense amp Control TLE5012BD Infineon Revision History Page or Item Subjects major changes since previous revision Rev 1 1 2015 03 12 6 Table 1 1 package version number removed 10 Table 4 2 ESD protection modified 13 Figure 6 2 and table 6 2 updated with improved chip placement tolerance 16 Figure 6 5 added with marking on frontside and backside Trademarks of Infineon Technologies AG AURIX C166 CanPAK CIPOS CIPURSE EconoPACK CoolMOS CoolSET CORECONTROL CROSSAVE DAVE DI POL EasyPIM EconoBRIDGE EconoDUAL EconoPIM EconoPACK EiceDRIVER eupec FCOS HITFET HybridPACK PRFM ISOFACE IsoPACK MIPAQ ModSTACK my d NovalithiC OptiMOSTM ORIGA POWERCODE PRIMARION PrimePACK PrimeSTACK PRO SIL PROFET RASICTM ReverSave SatRIC SIEGET SINDRION SIPMOS SmartLEWIS SOLID FLASH TEMPFET thinQ TRENCHSTOP M TriCore Other Trademarks Advance Design System ADS of Agilent Technologies AMBA ARMM MULTI ICE KEIL PRIMECELLTM REALVIEW THUMB uVisionTM of ARM Limited UK AUTOSAR is licensed by AUTOSAR development partnership Bluetooth of Bluetooth SIG Inc CAT iq of DECT Forum COLOSSUST
9. M FirstGPS of Trimble Navigation Ltd EMV of EMVCo LLC Visa Holdings Inc EPCOSTM of Epcos AG FLEXGOTM of Microsoft Corporation FlexRay is licensed by FlexRay Consortium HYPERTERMINAL of Hilgraeve Incorporated IEC of Commission Electrotechnigue Internationale IrDA of Infrared Data Association Corporation ISOTM of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION MATLAB TM of MathWorks Inc MAXIM of Maxim Integrated Products Inc MICROTECTM NUCLEUS of Mentor Graphics Corporation MIPI of MIPI Alliance Inc MIPS of MIPS Technologies Inc USA muRata of MURATA MANUFACTURING CO MICROWAVE OFFICE MWO of Applied Wave Research Inc OmniVision of OmniVision Technologies Inc Openwave Openwave Systems Inc RED HATT Red Hat Inc RFMD RF Micro Devices Inc SIRIUS of Sirius Satellite Radio Inc SOLARIS of Sun Microsystems Inc SPANSION of Spansion LLC Ltd Symbian of Symbian Software Limited TAIYO YUDEN of Taiyo Yuden Co TEAKLITE of CEVA Inc TEKTRONIX of Tektronix Inc TOKO of TOKO KABUSHIKI KAISHA TA UNIX of X Open Company Limited VERILOG PALLADIUM of Cadence Design Systems Inc VLYNQ of Texas Instruments Incorporated VXWORKS WIND RIVER of WIND RIVER SYSTEMS INC ZETEX of Diodes Zetex Limited Last Trademarks Update 2011 11 11 Data Sheet 2 Rev 1 1 2015 03 12 Infineon TLE5012BD Table of Contents Table of Contents 1 1 1 2 1 3
10. SC that is SPI compatible The absolute angle value and other values are transmitted via SSC or via a Pulse Width Modulation PWM Protocol The sine and cosine raw values can also be read out These raw signals are digitally processed internally to calculate the angle orientation of the magnetic field magnet The TLE5012BD is a pre calibrated sensor The calibration parameters are stored in laser fuses At start up the values of the fuses are written into flip flops where these values can be changed by the application specific parameters Online diagnostic functions are provided to ensure reliable operation Table 1 1 Derivate Ordering codes see Chapter 5 for description of derivates Product Type Marking Ordering Code Package TLE5012BD E 1200 12BD1200 SP001205296 PG TDSO 16 TLE5012BD E9200 12BD9200 SP001205300 PG TDSO 16 Data Sheet 6 Rev 1 1 2015 03 12 TLE5012BD Infineon Product Description 1 2 Features Giant Magneto Resistance GMR based principle Fully redundant design with two sensor ICs in one package Integrated magnetic field sensing for angle measurement 360 angle measurement with revolution counter and angle speed measurement Two separate highly accurate single bit SD ADC 15 bit representation of absolute angle value on the output resolution of 0 01 16 bit representation of sine cosine values on the interface Max 1 0 angle error over lifetime and temperature range with activ
11. ated auto calibration Bi directional SSC Interface up to 8Mbit s Supports Safety Integrity Level SIL with diagnostic functions and status information Interfaces SSC PWM Incremental Interface IIF Hall Switch Mode HSM Short PWM Code SPC based on SENT protocol defined in SAE J2716 Output pins can be configured programmed or pre configured as push pull or open drain Bus mode operation of multiple sensors on one line is possible with SSC or SPC interface in open drain configuration 0 25 um CMOS technology AEC Q100 automotive qualified ESD gt 4kV HBM Green package with lead free Pb free plating halogene free 1 3 Application Example The TLE5012BD GMR based dual die angle sensor is designed for angular position sensing in automotive applications such as Electrical commutated motor e g used in Electric Power Steering EPS and actuators Steering angle measurements General angular sensing Data Sheet 7 Rev 1 1 2015 03 12 Infineon TLE5012BD Pin Configuration 2 Pin Configuration Center of Sensitive Area Figure 2 1 Pin configuration top view 2 1 Pin Description Table 2 1 Pin Description Pin No Symbol In Out Function 1 IFC1 VO Die 1 Interface C CLK IIF_IDX HS3 External Clock IIF Index Hall Switch Signal 3 2 SCK1 Die 1 SSC Clock 3 CSQ1 Die 1 SSC Chip Select 4 DATA1 VO Die 1 SSC Data 5 DATA2 VO Die 2 SSC Data 6 CSQ2
12. dissipation Pror of the chips leads to self heating which increases the junction temperature T above the ambient temperature The power multiplied by the total thermal resistance Rina junction to ambient yields the junction temperature Rinsa is the sum of the two components Junction to Case and Case to Ambient Ras Rinse Raca 4 1 T T AT AT Ryza X Prop Rasa X Wop X 21 pp 2 Vo X215 lo la gt 0 if direction is into IC 0 Data Sheet 10 Rev 1 1 2015 03 12 Cinfin eon TLE5012BD Specification Factors of 2 in the calculation account for the two sensor ICs in the TLE5012BD Example assuming no load on Vout Vy 5V 4 2 21 pp 28 mA AT 120 x 5 V x 0 028 4 ova 16 8 K For molded sensors the calculation with Rc is more appropriate Data Sheet 11 Rev 1 1 2015 03 12 TLE5012BD Infineon Pre Configured Derivates 5 Pre Configured Derivates Derivates of the TLE5012BD are available with different pre configured register settings for specific applications The configuration of all derivates can be changed via SSC interface A detailed table of settings of the derivates can be found in the latest TLE5012B Register Setting User Manual 5 1 IIF type E1200 The TLE5012BD E1200 is preconfigured for Incremental Interface and fast angle update rate 42 7 us It is most suitable for BLDC motor commutation e Autocalibration mode 1 enabled Prediction disabled Hysteresis is set to 0
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