ChipEncoder Installation Manual
Contents
1. gt 01 lt L End Benching gt QO Pin Ti Benching pins O Mounting the Scale MicroE Systems linear scales should be affixed to the mounting surface Two different approaches are described below Epoxy and RTV Mounting Recommended for best accuracy Scale clamp with Make sure the mounting surtace is clean Optional scale clamps may be used to secure the scale while adhesive and dry the adhesive cures Avoid damage to the top surface Mounting clamp Mounting clamp Side view showing option al scale clamps and scale Space clamps every 75mm on scales over 150 mm in length End Benching Pin Hard epoxy QO at one corner gt A this end only Mounting clamp Benching pins RIV around entire outside edge of scale 2 Align the scale by placing the edges against the benching pins Apply a hard epoxy such as Tra Con s Tra Bond 2116 to the end of the scale at the end benching pin Apply 100 Silicone RTV adhesive around the edges of the scale This method allows thermal expansion from the benched end of the scale After adhesive curing remove the scale mounting clamps or if permanently installing clamps make sure they do not interfere with the sensor or sensor mount Two Sided Adhesive Tape Mounting Make sure the mounting surtace is clean and dry Peel the Gently place the scale on the mounting surtace Positioning adjustments can be made until the cove2. MicroE encoders contain an infrared laser diode or diodes Emitted invisible laser radiation levels have been measured to be within the CDRH Class 1 range which is not considered hazardous however to minimize exposure to the diverging beam the encoder sensor should be installed in its operational configuration in close proximity to the encoder scale before power is applied e Invisible laser radiation wavelength 850 nm e Max power 2 4 mW CW 4 8 mW CW for Mercury II e CAUTION The use of optical instruments with this product will increase eye hazard DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS MICROSCOPES EYE LOUPES OR MAGNIFIERS e All maintenance procedures such as cleaning must be performed with the MicroE encoder turned off e Do not insert any reflective surface into the beam path when the encoder is powered e Do not attempt to service the MicroE encoder Patents Covered by the following patents US 5 991 249 EP 895 239 JP 3 025 237 US 6 897 435 and EP 1 451 933 Additional patents and patents pending may apply Table Of Contents INSTALLATION INSTRUCTIONS PAGE Encoder Mounting with Linear Scale 4 Encoder Mounting with Rotary Scale 5 REFERENCE SECTION ChipEncoder Handling Considerations Solder Paste Recommendation and Reflow Profile Miscellaneous Application Notes PCB Requirements Output Signal Descriptions Downloading Instructions Installation of Linear Scales OO O ON NN amp O amp Cleanin
3. Ue UU LULU Index A A Digital Quadrature output Signals are RS 422 compatible square waves Pulses are 90 out of phase with B B outputs B B Digital Quadrature output Signals are RS 422 compatible square waves Pulses are 90 out of phase with A A outputs Index Window Index Window The Index Window defines one particular fringe on the grating surface The Index Window signal is a TTL compatible pulse and is approximately 40 ym wide note that this signal is not synchronized to the edge of the A or B signals Documentation Downloading Instructions The CE300 Data Sheet Interface Drawings and Installation Manual are available from MicroE Systems Contact us for these documents Page 8 Installation of Linear Scales Positioning the Scale Note Before beginning mounting procedure use talcfree gloves or finger cots to handle the scales Benching the scale to the system means aligning the scale by means of benching pins Pin locations are described on the appropriate interface drawing Two benching pins are recommended on the long side of the scale and one at the end as shown This is marked datum A on the interface drawing Position the benching pins in from either end 20 of the overall scale length Be sure the benching pins do not extend too high in the Z direction to prevent is the recommended location trom the edge mechanical interference with the sensor or sensor mount 0 21 lt 0 61
4. successfully integrate the CE300 s Ball Grid Array BGA package are detailed as follows IPC SM 782 land pattern standard should be used as a guide for proper land pattern design for the solder pads on the printed circuit board Due to the tight spacing between solder pads it is recommended that there be solder mask between the solder pads to prevent solder bridging and shorting to adjacent pads A stainless steel stencil 0 003 inch 0 08 mm thick is recommended for solder paste application to the printed circuit board lands Machine placement and reflow soldering of the CE300 is preferred If hand soldering is necessary soldering to the castellations should be done noting precautions in the preceding section of this manual Acetone is the recommended cleaner for the CE300 PCB Requirements The CE300 electrical interface land pattern schematic of additional required passive components and mechanical dimensions are found in the CE300 s interface drawings See page 5 for instructions on downloading intertace drawings Output Signal Descriptions PAD 1 PAD 8 PAD 20 IO QOO0CQ000 Ol PAD 13 Bottom view of ChipEncoder 2 GND 14 Si SVA G oo gt aj 70 gt 7 Z NO O I R R 6 5VA 18 7 RESERVED 5VD R R NO 21 ESERVED o0 JDC 23 A ESERVED 24 Index Window NO ND P 8 GND 20 9 DC2 DC NO ce Page A B and Index Window output from 40X encoder TELL UU
5. the KEEP OUT 2416 1 f LONE can affect the performance of the ChipEncoder Solder Paste Recommendation and Reflow Profile Page 6 250 217 200 Degrees C S Q O RT 0 60 120 180 240 300 360 Seconds 20005935 Lead Free Solder Reflow The CE300 can be soldered to your PC board using industry standard solder reflow techniques The profile above illustrates a typical temperature profile Use a temperature controlled convection or IR reflow oven and SAC305 solder paste with no clean flux in either air or an inert atmosphere N2 The temperature should be measured on the carrier board close to the CE300 parts and must not exceed 260 C CE300 s have soldered devices under the cover Therefore the rate of heating and cooling must be controlled so that it does not exceed 5 C per second to avoid thermal stressing of the devices The CE300 inputs and outputs are pre tinned palladium silver pads with the typical spacing between adjacent input output pads of 0 2mm 0 008 inches The pads are pre tinned with SAC305 solder alloy Solder material with good slump characteristics should be chosen to ensure that solder does not bridge or short during pre heating in the reflow process Hand Soldering Do not hand solder the ChipEncoder Hand soldering will cause damage Castellations are for electrical testing only Miscellaneous Application Notes The printed circuit board PCB land pattern and assembly processes necessary to
6. ChipEncoder CE300 Reflective Linear and Rotary Encoders Installation Manual and Reference Guide Oe Ves Enabling MicroE Systems Technology Manual No IM CE300 rev H Introduction MicroE Systems was founded to advance encoder technology to a level never before achieved One of our innovations the ChipEncoder is a complete encoder system on a chip It is small enough to mount directly on a customers circuit board is designed for high volume applications and is compatible with low cost auto mated assembly processes We are pleased to offer the ChipEncoder another milestone in encoder technology Precautions 1 Follow standard ESD precautions Turn power off before connecting the sensor Do not touch the electrical pins without static protection such as a grounded wrist strap 2 Do not touch the glass scale unless you are wearing talc ree gloves or finger cots Please read this installation manual for full instructions LASER SAFETY INFORMATION Mercury amp ChipEncoder This product is sold solely for use as a component or replacement in an electronic product therefore it is not required to and does not comply with 21 CFR 1040 10 and 1040 11 which pertain to complete laser products The manufacturer of the complete system level electronic product is responsible for complying with 21 CFR 1040 10 and 1040 11 and for providing the user with all necessary safety warnings and information
7. g Scales O Contacting MicroE Systems ChipEncoder CE300 Encoder Mounting with Linear Scale the electrical and mechanical specifications outlined on the intertace drawings interface drawing for either end or center index orientation See page 5 for instructions on downloading interface drawings and pages 3 4 and 5 for information about the CE300 and CE300 to PCB assembly instructions 1 The ChipEncoder CE300 should be installed on a printed circuit board PCB to 9 Attach the scale to the linear stage Reference the preferred datum on the Attach the scale to the slide with adhesive Refer to page 6 for details about the diferent methods available Be sure the grating surface of the scale faces the sensor There is to be no contact between the CE300 and the grating or damage may result ChipEncoder Linear Scale Linear Stage If you wish fo verify the encoder outputs using a digital oscilloscope to view the A B and Index Window signals please refer to page 4 for output signal descriptions The CE300 should not require any additional alignment as long as the PCB and mechanical components have been fabricated and assembled according to the mechanical dimensions and tolerances specified in the CE300 interface drawings 3 Page 4 ChipEncoder CE300 System Encoder Mounting with Rotary Scale The CE300 should be installed on a printed circuit board PCB to the electrical and mechanical specificati
8. ons outlined on the interface drawings See page 5 for instructions on downloading interface drawings and pages 3 4 and 5 for information about the CE300 and CE300 to PCB assembly instructions Rotary Scale Attach your hub scale assembly to the rotary device Refer to the interface drawing The reflective surface of the scale must face the sensor Be sure the grating surface of the scale faces the sensor There is to be no contact between the CE300 and the grating or damage may result If you wish to verify the encoder outputs using a digital oscilloscope to view the A B and Index Window signals please refer to page 4 for output signal descriptions The CE300 should not require any additional alignment as long as the PCB and mechanical components have been fabricated and assembled accord ing to the mechanical dimensions and tolerances specified in the ChipEncoder inter face drawings For scales greater than 0 59 15mm diameter Axis Alignment Tolerances 0 006 0 15mm 0 010 0 25mm Page 5 ChipEncoder CE300 Handling Considerations Note ESD precautions should be taken at all times Prior to reflow soldering particular attention must be paid to preventing ESD damage as the damage threshold is 500V 433 1 1 00 e When handling the CE300 do not allow the KEEP OUT ZONE pick up device to touch anywhere in the KEEP OUT ZONE refer to the illustration J below Scratches or digs in
9. r paper off and place the scale above the final location scale is firmly pressed down After final positioning push down on the top of the scale to secure it il Benching l j in i Hard epoxy at one corner this end only C lt Benching pins 2 Align the scale by placing the edges against the benching pins Page 9 Cleaning Scales General Particle Removal Blow off the contamination with nitrogen clean air or a similar gas Contamination Removal Use a lintfree cleanroom wipe or cotton swab dampened with isopropyl alcohol or acetone only fo wipe the surface clean Handle the scale by the edges Do not scrub the scale Contacting MicroE Systems Thank you for purchasing a MicroE Systems product You should expect the highest level of quality and support If you have any questions please call MicroE Systems for support or to obtain the ChipEncoder User Manual Data Sheet or Interface Drawings MicroE Systems World Headquarters 125 Middlesex Turnpike Bedford MA 01730 www microesy com info microesys com T 781 266 5700 F 781 266 5112 Page 0 Copyright 2011 MicroE Systems
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