BTM44x - Laird Technologies
Contents
1. UART Interface Baud Rate AT Mode Default Baud Rate 9600 bps MP Mode Default Baud Rate 115 200 bps Supply Voltage Supply 3 0V 3 3V DC VO 1 7V 3 3V DC independent of Supply USB amp UART 1 7V 3 6V DC independent of Supply Coexistence Compatibility WLAN 802 11 2 wire and 3 wire hardware coexistence schemes supported Connections Interface Surface Mount Pads External Antenna BTM440 2 Pad for 50 Ohm antenna Approvals Bluetooth Qualified as an END product FCC Industry Canada IC Limited Modular Approval BTM440 2 Full Modular Approval BTM441 3 Limited Modular Approval BTM440 2 Full Modular Approval BTM441 3 CE amp R amp TTE Meets CE and R amp TTE requirements Miscellaneous Lead free Lead free and RoHS compliant Warranty 12 Months Development Tools Development Kit Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Development board and software tools DVK BTM440 2 Dev Kit with BTM440 2 module fitted DVK BTM441 3 Dev Kit with BTM441 3 module fitted 9 Laird Technologies BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 5 MECHANICAL CONSIDERATIONS Mechanical Layout BTM440 442 Mechanical Details BTD R 003 POL 01 DO NOT SCALE NOLE PROJECTION THRD Module Package Dimensions BOTTOM VIEW SMT PADS MAIA 3AIS2. RF Shield Orientaion Mark on RF Shield amp Global pad width Pad Centre to Board edge Pad Centre to Board edge Global length of pad to edge of board Cii PCB Thickness RF Shield Height Global pitch 1NO yea TOP VIEW 37 COMPONENT SIDE 25 3 7 1 0 27 0 65 12 63 18 13 3 4 0 9 25 0 60 25 8 0 18 0 x 12 5 x 3 4mm 3 1 08 2 3 0 55 12 37 17 87 Dimension Minimum Typical Maximum A A A2 b D E Desopton BTM440 442 Module Keep Out Area An area of 1 5mm around the module should be reserved as a keep out area No other components should be placed in this area Note Development Kit Schematics for this product can be accessed from the following link DVK Schematics BIM44x Americas 1 800 492 2320 Option 2 10 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module Mechanical layout BTM440 442 Mechanical Details Pad Width 0 70 Typ Pad Length 1 65 Typ d IF OUT See Note 1 gt 1 Connect External Antenna to RF I O pin 29 with S0ohm microstrip or coplaner waveguide 2 Ensure no exposed copper under module to avoid shorting to test points on underside of module a ra 3 10 Ee ge ax E c8 co 5 J J H za S8 L ma OL X OO Les Vd uid i i EL md See note 2
3. PCB LAND PATTERN DECAL DIMENSIONS MODULE OUTLINE 3 The user may modify the PCB land pattern dimensions based on their experience and or process capability Module Keep Out Area An area of 1 5mm around the module should be reserved as a keep out area No other components should be placed in this area Note Development Kit Schematics for this product can be accessed from the following link DVK Schematics BIM44x Americas 1 800 492 2320 Option 2 11 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module Mechanical layout BTM440 442 Mechanical Details DO NOT SCALE Laird Module Package Dimensions BOTTOM VIEW SMT PADS E x E 4 BS Ze D a p v Ee WARNING Test point dimensions are for reference only DO NOT make electrical connections to these test points this will void the warranty Laird does not recommend routing on the top layer underneath the module Americas 1 800 492 2320 Option 2 12 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module Mechanical layout BTM441 443 Mechanical Details Stamp hoe atter separate boards solder thickness S ef Artenna TOP VIEW RF Shiels COMPONENT SIDE 12 Ori
4. 1 3 4 Pins 8 11 SPI related are only for Laird internal production purposes Americas 1 800 492 2320 Option 2 6 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 4 3 Physical Specifications Table 2 Physical Specifications Physical Dimensions 12 5mm x 18 0 x 3 4mm BTM440 442 12 5mm x 24 0mm x 3 4mm BTM441 3 12 5mm x 22 0 x 3 4mm BTM441 443 Weight 3 grams Environmental Operating Temperature 40 C to 85 C Storage Temperature 40 C to 85 C Miscellaneous Lead free Lead free and RoHS compliant 4 4 Electrical Specifications Table 3 Electrical Specifications Wireless Specification Bluetooth Version 2 1 EDR Transmit Class Class 2 Frequency 2 402 2 480 GHz Channa 79 channels Frequency Hopping Adaptive Frequency Hopping 4 dBm at antenna pad BTM440 2 4 dBmi from integrated antenna BTM441 3 27 dBm at antenna pad BTM440 2 27 dBmi from integrated antenna BTM441 3 Max Transmit Power Min Transmit Power Receive Sensitivity 84 dBm Range 30m Data Transfer Rate Up to 350 kbps 4 5 Operational Specifications Table 4 Operational Specifiations OPERATING CONDITIONS MIN MAX VDD_USB USB compatibility not required 1 7 3 6 VDD_USB USB compatibility required 3 1 3 6 VDD_IO 17 33 VDD_IN 3 0 33 Americas 1 800
5. 492 2320 Option 2 7 EE TA E Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 4 6 Voltage Parameters Table 5 Voltage Parameters VUSB INPUT VOLTAGE LEVELS MIN TYP MAX a 0 7VDD_USB V 2 7 lt VDD_USB lt 3 0 0 4 08 1 7 lt VDD_USB lt 1 9 0 4 0 4 OUTPUT VOLTAGE LEVELS 1 7 lt VDD_USB lt 1 9 V lout 4mA VDD_USB 0 4 V lout 4mA 0 4 OUTPUT VOLTAGE LEVELS 2 7 lt VDD_USB lt 3 0 V lout 4mA VDD_USB 0 2 V lout 4mA 0 2 Note VDD_USB must be connected to power the USB and UART interfaces Table 6 Voltage Parameters VIO INPUT VOLTAGE LEVELS MIN TYP MAX V 0 7VDD_IO V 2 7 lt VDD_l0 lt 3 0 0 4 0 8 1 7 lt VDD_lO lt 1 9 0 4 0 4 OUTPUT VOLTAGE LEVELS 1 7 lt VDD_IO lt 1 9 V lout 4mA VDD_IO 0 4 0 4 V lout 4mA OUTPUT VOLTAGE LEVELS 2 7 lt VDD_IO lt 3 0 V lout 4mA VDD_IO 0 2 V lout 4mA 0 2 Americas 1 800 492 2320 Option 2 8 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 4 7 1 0 Details Table 7 VO Details Command Interface AT Instructions set Comprehensive control of connection and module operation S Registers for non volatile storage of parameters
6. SIG document https Awww bluetooth org DocMan handlers DownloadDoc ashx doc_id 2836988vld 3 17486 To start the listing go to https Awww bluetooth org tpg QLI_SDoc cfm In step 1 select Reference a Qualified Design and enter the Declaration IDs of each subsystem used in the End Product design You can then select your pre paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page please note that unless the Declaration ID is pre paid or purchased with a credit card it will not be possible to proceed until the SIG invoice is paid Once all the relevant sections of step 1 are finished complete steps 2 3 and 4 as described in the help document Your new Design will be listed on the SIG website and you can print your Certificate and DoC For further information please refer to the following training material https Awww bluetooth org en us test qualification qualification overview listing process updates 8 3 Additional Assistance Please contact your local sales representative or our support team for further assistance Laird Technologies Connectivity Products Business Unit Support Centre http ews support lairdtech com Email wireless support lairdtech com Phone Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 Web http Awww lairdtech com bluetooth Americas 1 800 492 2320 Option 2 22 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 061
7. Stream Oriented SSP Secure Simple Pairing SUI SUBUNIT INFO Command SXXX S Register No xxx TDL Trusted Device List UART Universal Asynchronous Receiver Transmitter UI UNIT INFO Command 13 RELATED DOCUMENTS AND FILES The following additional BTM44x technical documents are also available from the Laird BTM44x product page under the Documentation tab Product Brief User Manual Firmware Release Notes Development Kit Schematics 13 1 Application Notes Getting Started Firmware Upgrade Throughput Analysis Health Device Profile Latency Optimization RF Testing Americas 1 800 492 2320 Option 2 28 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module Laird TECHNOLOGIES Laird Technologies is the world leader in the design and manufacture of customized performance critical products for wireless and other advanced electronics applications Laird Technologies partners with its customers to find solutions for applications in various industries such as Network Equipment s Telecommunications Data Communications Automotive Electronics Computers Aerospace e Military Medical Equipment a Consumer Electronics Laird Technologies offers its customers unique product solutions dedication to research and development as well as a seamless n
8. 0 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 9 ORDERING INFORMATION BTM440 Bluetooth MP Data Module external antenna BTM441 Bluetooth MP Data Module with integrated antenna BTM442 Bluetooth AT Data Module external antenna BTM443 Bluetooth AT Data Module with integrated antenna DVK BTM440 Development board with BTM440 module soldered in place DVK BTM442 Development board with BTM442 module soldered in place Americas 1 800 492 2320 Option 2 23 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 10 APPLICATION NOTE FOR SURFACE MOUNT MODULES 10 1 Introduction Laird Technologies surface mount modules are designed to conform to all major manufacturing guidelines This application note is intended to provide additional guidance beyond the information that is presented in the User Manual This Application Note is considered a living document and will be updated as new information is presented The modules are designed to meet the needs of several commercial and industrial applications The modules are designed to be easily manufactured and conform to current automated manufacturing processes 10 2 Shipping Modules are shipped in ESD Electrostatic Discharge safe trays that can be loaded into most manufacturers pick and place machines La
9. 0 4 2 2009 EN61000 4 3 2006 A1 2008 A2 2010 EN 300 328 V1 8 1 2012 06 We Laird declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995 5 EC when used for its intended purpose Place of Issue Laird 11160 Thompson Ave Lenexa KS 66219 Date of Issue October 2009 Name of Authorized Person Daniel Waters Certifications Specialist Signature Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth 20 Laird Technologies BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 8 BLUETOOTH APPROVALS 8 1 Subsystem Combinations This application note covers the procedure for generating a new Declaration ID for a Subsystem combination on the Bluetooth SIG website In the instance of subsystems a member can combine two or more subsystems to create a complete Bluetooth End Product solution Subsystem listings referenced as an example BTM44x Laird B016072 https Awww bluetooth org tpg QLI_viewQDL cfm qid 16072 Interface Cambridge B017578 https www bluetooth org tpg QLI_viewQDL cfm qid 17578 Express Consultants subsystem Ltd 8 2 Assumptions This procedure assumes that the member is simply combining two subsystems to create a new design without an
10. CML_IN PCM Data P VIO 17 PCM_SYNC PCM sync I P VIO 18 PCM_CLK PCM clock I P VIO 19 PCM OUT PCM Data O P VIO 20 RESET Module reset I P See note 2 21 GPIO4 VO for host BT Active BT_State VIO 22 GPIO2 UART_DCD VO for host VIO 23 GND 24 Unused 25 Unused See note 3 26 Unused See note 3 27 Unused See note 3 28 GND See note 3 29 ANT BTM440 442 only Antenna connection 50 ohm matched See note 3 30 GND See note 3 31 Unused See note 3 32 Unused See note 3 33 Unused See note 3 34 Unused See note 3 Americas 1 800 492 2320 Option 2 5 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 35 Unused See note 3 36 Unused See note 3 37 Unused See note 3 38 Unused 39 Unused 40 Unused 41 GND 42 GPIO1 UART_RI O for host VIO 43 GPIO7 UART_DTR O for host VIO 44 GPIO8 UART_DSR O for host VIO 45 GND 46 D Not used for AT module variants VUSB 47 D Not used for AT module variants VUSB 48 GPIO6 O for host RF_Active VIO 49 GPIO5 VO for host WLAN_Active VIO 50 GPIO3 O for host BT_Priority VIO Notes 1 Unused pins may have internal connections and must not be connected 2 Reset input is active low Input is pulled up to VDD_IN via 22k Minimum reset pulse width is 5ms 3 Pins 25 37 should be left not connected on modules with integrated antenna BTM44
11. Laird gt BIM44x Hardware Integration Guide Version 3 5 global local Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com wireless BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 1 REVISION HISTORY 1 0 9 10 2011 Initial Release 1 1 04 2012 Up to Build 240 2 0 08 2012 General Formatting 3 0 01 14 2013 Reformatting Updates to FCC IC Statements Updates to Mechanical Specs 3 1 09 Dec 2013 A Dobbing s signature added to DoC 32 02 Feb 2014 Separated document into two docs User Guide and Hardware Integration Guide 3 3 06 Feb 2014 Updated Bluetooth SIG Qualification section 3 4 18 Aug 2014 Updated shipping tray image and added module package dimension image 35 3 Sept 2014 Updated EU Declaration of Conformity for BTM441 BTM443 Americas 1 800 492 2320 Option 2 2 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 2 CONTENTS 1 REVISION Historn eee eeeeeeae ea eaae sa eee ea aeee sages cage saeaee sages eaaeeeeaaesaaesaeeeeaaeesaaesseaaesneeeeenaees 2 2 COMEM cect ees te edel Bee ie isk eden Alec I A ee 3 3 Product Description 4 3 1 Features and Renette WE iirinn en a EE Meanie elder meget Seana 4 3 2 ee ele EE 4 3 3 Bluetooth Protiles SUPPORC EE 4 4 Hardware Specifications cccccccseceeece
12. Medical and Wellness Devices External or internal antenna options Automotive Applications Comprehensive AT interface for simple ee Ae 3 3 Bluetooth Profiles Supported Alternate Packet based interface for complex programming Serial Port Profile SPP Bluetooth END Product Qualified Human Interface Device HID Profile Host Compact size and device supported Class 2 output 4dBm Health Device Profile HDP Agent supported Low power operation IEEE Device Specialization 11073 10415 Weight Scale UART interface IEEE Device Specialization 11073 10408 Thermometer EEE Device Specialization 11073 10417 Glucose Americas 1 800 492 2320 Option 2 4 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 4 HARDWARE SPECIFICATIONS 4 1 Pin Definitions Table 1 Pin definitions 1 Unused 2 GND 3 UART_CTS Clear to Send I P VUSB 4 UART_RXD Receive data P VUSB 5 UART_RTS Request to Send O P VUSB e UART_TXD Transmit data O P VUSB 7 GND 8 SPI_CSB SPI bus chip select I P VIO 9 SPILMISO SPI bus serial O P VIO 10 SPILMOSI SPI bus serial I P VIO II SPILCLK SPI bus clock I P VIO 12 VDD_USB USB amp UART supply voltage 13 VDD_IO I O supply voltage 14 VDD_IN Main supply voltage 15 GND 16 P
13. P Audio Gateway Hands Free Profile AT Command prefix Attention AVRCP Audio Video Remote Control Profile BISM Bluetooth Intelligent Serial Module CoD Class Of Device also referred to as device class Codec Device capable of encoding decoding an analogue digital signal DAC Digital to Analogue Converter CDSP Digital Signal Processor DUN Dial Up Network Profile EIR Extended Inquiry Response eSCO Enhanced Synchronous Connection Oriented Link used for Audio FTP File Transfer Profile GOEP Generic Object Access Exchange Profile GPIO General Purpose Input Output HF Hands free Role of Hands free Profile Hands free Unit HFG Audio Gateway Role of Hands free Profile Hands free Gateway HFP Hands Free Profile HID Human Interface Device Profile HS Headset Role of Headset Profile Headset HSG Audio Gateway Role of Headset Profile Headset Gateway HSP Headset Profile 1O IO Input Output Mic Microphone MITM Man In The Middle OPP Object Push Profile PBAP Phone Book Access Profile PT PASS THROUGH Command PWM Pulse Width Modulation SBC Sub Band Codec SCO Synchronous Connection Oriented Link used for Audio Americas 1 800 492 2320 Option 2 27 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module SLC Service Level Connection SPP Serial Port Profile SSO Serial
14. TTERN DECAL DIMENSIONS Module Keep Out Area An area of 1 5mm around the module should be reserved as a keep out area No other components should be placed in this area Note Development Kit Schematics for this product can be accessed from the following link DVK Schematics BIM44x Americas 1 800 492 2320 Option 2 14 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module Mechanical layout BTM441 443 Mechanical Details mes ssn mate GHOSE Som uoneonddy JIVOS LON Od Ayjigedeo sseoojd Jospue sousiiedxe 1194 UO p seq SUOISUsLUIP WUayed puel God 24 Ajlpow Aew sn aul e a NPOW JO apisuepUN UO s UIOd jeet 0 Buoys PIOAe 0 pueog o d soy UO ajnpow Jepun seddoo pesodxe ou einsuz kb uowenjers souewJoLed euuazue pue zuawdojaaap ajnpowW 104 pasn sem yoiym pueoq yy J doj n q S jnpow y wo sawo uonuyap eae zno daa euusjuy E J UJOO y Bue euuazue y ym 1 U109 y UI AjqeJajeid pue pseog o d jsoy ay jo afpa y uo p vejd aq pinoys jnpow y vuewsop d euuazue saq 104 Z uoneipes euuagzue Jedojd Hunoaye jUsAdid oO eade siy Jo Jeajo jeje Aue Jo aieMpsey Huljunow UE dao osy pseog o d jsoy ay Jo sae Aue uo eae zno daa euuazue y Ul Jaddoo ou s Jay aunsuz 4 SALON NOILYOlddY Laird Technologies 15 Americas 1 800 492 2320 Opt
15. ars qr as P a IEN i RS E Laird 5200 00022 Eis S TeS M 0 0 D gt os je 0 156 oam 2 Nar a ger gj y m cei a oe o Ert ire DO j E ggj E emmm e g i tre DO O 1 F ra ri i i h h h h h tL Ge 1 607 2797 Geer 14 007 16 097 7 197 18 207 boer 10 407 i 0 010 1 503 Lai rd Telematics Lenexa TECHNOLOGIES gt lo 7e1 1 230 0 507 Tte BTM410 11 Data Shipping Tray 12 000 ei Dez 5200 00022 E ia Dean dik Der 8 10 09 Sheet 4 1 Figure 8 BTM44x Shipping Tray Details 10 3 Reflow Parameters Laird Technologies surface mount modules are designed to be easily manufactured including reflow soldering to a PCB Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to Americas 1 800 492 2320 Option 2 24 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module ensure oven temperatures during reflow meet the requirements of the solder paste Laird Technologies surface mount modules conform to J STD 020D1 standards for reflow temperatures IMPORTANT During reflow modules should not be above 260 C and not for more than 30 300 250 Target Profile 200 Soak Min Soak Max 150 Liquidous 100 Lower Target zc Upper Target 50 Absolute Peak 0 O 20 40 60 80 100120140 160 180 200 220 240 260 280 300 320 340 360 Figure 10 Recommended Reflow Te
16. dule is installed inside another device then the outside of the device into which the module is installed must also display a label referring to the enclosed module This exterior label can use wording such as the following Contains Transmitter Module FCC ID P14411B or Contains FCC ID PI4411B Any similar wording that expresses the same meaning may be used Americas 1 800 492 2320 Option 2 18 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 7 DECLARATIONS OF COMPLIANCE 7 1 EU Declaration of Conformity BTM440 BTM442 Manufacturer Laird Technologies Product BTM440 2 EU Directive RTTE 1995 5 EC Annex IV Conformity Assessment 7 1 1 Reference standards used for presumption of conformity Article Number Requirement Reference standard s 31a Health and Safety EN 60950 1 2006 3 1b Protection requirements with EN 301 489 1 V1 8 1 f respect to electromagnetic EN 301 489 17 2 1 1 Compatibility Emissions EN55022 2006 A1 2000 A2 2006 ClassB Immunity EN61000 4 2 1995 A1 1998 A2 2001 EN61000 4 3 2002 A1 2002 32 Means of the efficient use of EN 300 328 V1 7 1 2006 10 the radio frequency spectrum 7 1 2 Declaration We Ezurio Ltd declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to wh
17. eeeeeceeeeecaaecaaecaaeceaeeeaeseeeseaeeeaeeeaaecaaecaaeeaaesaesgeeseeeseaeeeaeecaaeeaeseaeseeeseeeseeneeeeeeaes 26 TZ Glossary OF TMi wriecs ceded ccceteccecldeccthacaspeenseth cor eee a glad eek aed Ga hg ended ae aed 27 13 Related Documents and Files cccccceeeceeeeee tees ee eeeee eee ae eeeeaeeaeee ee eeeeeaaeeeeaae sa aaeseaee eases eeaeseeaaeeneeeeee 28 13 1 ele tere et 28 Americas 1 800 492 2320 Option 2 3 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 3 PRODUCT DESCRIPTION The BTM44x Bluetooth modules from Laird Technologies have been designed to meet the needs of developers who wish to add robust short range Bluetooth data connectivity to their products They are based on the market leading Cambridge Silicon Radio BC04 chipset providing exceptionally low power consumption with outstanding range They support the latest Bluetooth Version 2 1 Specification providing the important advantage of Secure Simple Pairing which improves security and enhances the ease of use for end customers With physical sizes as small as 12 5 x 18 0mm and best of class low power operation these modules are the ideal choice for applications where designers need both performance and minimum size For maximum flexibility in systems integration the modules are designed to support a separate power supply for I O To aid p
18. eeeeeeeeeeeeeeecaaecaaeceaeceeeeeeseeeseaeseaeeeaeeeaaeeaeseeeseaeseeeeseeeseeeeeeeeaaeed 5 4 1 leet 5 4 3 Physical Spe HEED geseet steet eg geSE SSES EE EES eege H 44 leie SPECITICATIOMS eege deet eege tee iesse E E 7 45 lge Ee TEE 7 4 6 Voltage Parameters xs scones iss 8 4 7 SEI 9 5 Mechanical Conslderations AEN 10 6 FCC Regulatory Statements ccecccececeeece eee ceeeeeee eee eeeaae sa eaee sees ea aeeeeaae sages eee eeeesaaeseeaaesneeeeeneeeas 17 6 1 FCC and Industry Canada Statements 0 ccccceeeceeeeeeececeeeceeeceeeeeceeeeeceeseceeeeeeessneeeesseeenseenaes 17 6 1 1 Considerations for OEM Integration 17 6 1 3 FCC Labeling requireMENt eeneg SEENEN 18 7 Declarations Of Compliance cccceecceeceeececse cess tees eeeeeeeeeseeeeeeeeaaecaaeceaeceaesaeseeeseeeseaeeseeetaaeeaesaaeseaeeas 19 7 1 EU Declaration of Conformity BTM440 BTMAAZ ne 19 7 1 1 Reference standards used for presumption of conforme 19 KT EE 19 7 2 EU Declaration of Conformity BTM441 ZBTMAAZ n 20 7 2 1 Reference Standards used for Presumption of Conformity 0 cccceceseeeteeeseeeteenees 20 72 Declaration eege geegent SE 20 8 Bluetooth Approval Sasietan anana iaae edd Le ee 21 8 1 SUleEcutegT ul e le e EN 8 2 ul eT EE EN 8 3 Additional ASSISTANCE EE 22 9 Ordering INfOrMAatiOn EE 23 10 Application Note for Surface Mount Module 24 10 1 ube elei te Le 24 102 SIPPING BEE 24 UE GE e GE EE 24 11 References oo cece cece ceee cece ee
19. entation Mark on RF shield eg Size 22 0x12 5x3 0495mm Pitch Imm Dimension Minimum Typical Maximum Notes A 2 822mm 3 0495mm 3 277mm 1 A is consist of A1 and A2 Al 0 8mm 0 9mm 1 0mm 2 A2 include solder and shield A3 2022mm 21495mm 2277mm 21 measured on stamp hole location after SE depanelization D 12 37mm 12 5mm 12 63mm D1 12 37mm 12 5mm 13 03mm E 21 87mm 22 0mm 22 13mm Module Keep Out Area An area of 1 5mm around the module should be reserved as a keep out area No other components should be placed in this area Note Development Kit Schematics for this product can be accessed from the following link DVK Schematics BIM44x Americas 1 800 492 2320 Option 2 13 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module Mechanical layout BTM441 443 Mechanical Details BTDA R 003 POL 01 DO NOT SCALE Antenna Keep Out i Area see note 1 Recommended Land Pattern Decal CH N geo se Doooooooononnd i D O e Ze eu CS 3 10 mmm mmm 98 e Ol X 00 youd uid DEL See note 2 Pad Length 1 65 Typ MODULE OUTLINE 1 Ensure no exposed copper under module to avoid shorting to test points on underside of 2 The user may modify the PCB land pattern dimensions based on their experience and or process capability PCB LAND PA
20. essly approved by Laird Technologies could void the user s authority to operate the equipment Designers should note the distinction that the FCC makes regarding portable and mobile devices Mobile devices are defined as products that are not used closer than 20cm to the human body whereas portable devices can be used closer that 20cm to the body A device may be used in portable exposure conditions with no restrictions on host platforms when the averaged output power is less than the low power threshold for an uncontrolled environment lt 60 f GHz i e 25mW for a 2 4Ghz device The Maximum Power Exposure for the BTM44x has been evaluated and found to comply with the low power threshold for an uncontrolled environment Refer to FCC document KDB 447498 for more information on RF exposure procedures and equipment authorization policies for mobile and portable devices The BTM44x comply with the FCC RF radiation exposure limits set forth for an uncontrolled environment This device and its antenna must not be co located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi transmitter product procedures These procedures could require RF exposure evaluation to be re evaluated on the complete product The installer of the this module into host equipment must ensure his equipment complies with the FCC RF Exposure requirements set forth in 47 CFR 2 1091 or 2 1093 The BTM44x comply with the RSS 102RF radiat
21. etwork of manufacturing and customer support facilities across the globe CONN HIG BTM44x Copyright 2014 Laird Technologies Inc All rights reserved The information contained in this manual and the accompanying software programs are copyrighted and all rights are reserved by Laird Technologies Inc Laird Technologies Inc reserves the right to make periodic modifications of this product without obligation to notify any person or entity of such revision Copying duplicating selling or otherwise distributing any part of this product or accompanying documentation software without the prior consent of an authorized representative of Laird Technologies Inc is strictly prohibited All brands and product names in this publication are registered trademarks or trademarks of their respective holders This material is preliminary Information furnished by Laird Technologies in this specification is believed to be accurate Devices sold by Laird Technologies are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only Laird Technologies makes no warranty express statutory and implied or by description regarding the information set forth herein Laird Technologies reserves the right to change specifications at any time and without notice Laird Technologies products are intended for use in normal commercial and industrial applications Applications requiring unusual environmental requirements such as militar
22. ich this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995 5 EC when used for its intended purpose Place of Issue Ezurio Ltd dba Laird Technologies Saturn House Mercury Park Wooburn Green HP100HH United Kingdom tel 44 0 1628 858 940 fax 44 0 1628 528 382 Date of Issue October 2009 Name of Authorised Person Andrew Dobbing Engineering Manager Signature NewS ei we Js OG Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth 19 Laird Technologies BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 7 2 EU Declaration of Conformity BTM441 BTM443 Manufacturer Product EU Directive Conformity Assessment Laird BTM410 BTM411 BTM420 BTM421 BTM430 BTM431 BTM441 BTM443 BIM461 RTTE 1995 5 EC Annex IV 7 2 1 Reference Standards used for Presumption of Conformity 3 1a Health and Safety 3 1a RF Exposure 3 1b Protection requirements with respect to electromagnetic compatibility 3 2 Means of the efficient use of the radio frequency spectrum 7 2 2 Declaration EN 60950 1 2005 2 Ed Am1 2009 Am2 2013 EN 60950 1 2006 A11 a1 2010 A12 2011 A2 2013 EN 62479 2010 EN 301 489 1 V1 9 2 2011 09 EN 301 489 17 V2 2 1 2012 09 Emissions EN55022 2010 AC 2011 ClassB Immunity EN6100
23. ion 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module Mechanical layout BTM441 443 Mechanical Details DO NOT SCALE D Chapman BTDA R 003 POL 01 Page 4of4 Laird Module Test Point Locations Lee meng a 1 a 12 o 8 6 7 T Lol SMT PADS Ia ba ml m La BOTTOM VIEW be iol H e 2 E 2 D 3 35 5 35 7 35 E x E E g o N E f a pa v 9 35 WARNING Test point dimensions are for reference only DO NOT make electrical connections to these test points this will void the warranty Laird does not recommend routing on the top layer underneath the module Americas 1 800 492 2320 Option 2 16 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 6 FCC REGULATORY STATEMENTS 6 1 FCC and Industry Canada Statements The OEM s final equipment user manual must show the following statement This device complies with part 15 of the FCC Rules Operation is subject to the following two conditions 1 This device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation 6 1 1 Considerations for OEM Integration Changes or modifications not expr
24. ion exposure limits set forth for an uncontrolled environment If this device and its antenna is co located or operating in conjunction with any other antenna or transmitter RF exposure evaluation should be re evaluated on the complete product by a qualified test house The installer of this module into host equipment must ensure his equipment complies with the Industry Canada RSS 102 RF Exposure requirements BTM440 BTM442 These modules hold a limited modular approval Approval with any other antenna configuration or layout other than that approved will necessitate additional radiated emission testing to be performed The modules were approved with the following antenna RF Solutions ANT 24G WHJ SMA OcBi Americas 1 800 492 2320 Option 2 17 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 6 1 3 FCC Labeling requirement 6 1 3 1 BTM440 BTM442 If the FCC ID is not visible when the module is installed inside another device then the outside of the device into which the module is installed must also display a label referring to the enclosed module This exterior label can use wording such as the following Contains Transmitter Module FCC ID P14410B or Contains FCC ID PI4410B Any similar wording that expresses the same meaning may be used 6 1 3 2 BTM441 BTM443 If the FCC ID is not visible when the mo
25. mperature Temperatures should not exceed the minimums or maximums presented in Table 21 Table 8 Recommended Maximum and minimum temperatures Temperature Inc Dec Rate max 3 C Sec Temperature Decrease rate goal 2 3 C Sec Soak Temp Increase rate goal 5 1 C Sec Flux Soak Period Min 60 Sec Flux Soak Period Max 90 Sec Flux Soak Temp Min 150 C Flux Soak Temp max 190 C Time Above Liquidous max 60 Sec Time Above Liquidous min 20 Sec Time In Target Reflow Range goal 30 Sec Time At Absolute Peak max 30 Sec Liquidous Temperature SAC305 217 SE Lower Target Reflow Temperature 225 C Upper Target Reflow Temperature 250 C Absolute Peak Temperature 260 C Americas 1 800 492 2320 Option 2 25 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 11 REFERENCES 1 Bluetooth Specification Version 2 1 EDR vol3 26 July 2007 http Awww bluetooth com Bluetooth Technology Building Specifications click on Core Specification v2 1 EDR 2 Serial Port Profile Specification http Awww bluetooth com Bluetooth Technology Works SPP htm link at the bottom of page Need more View the Serial Port Profile SPP 3 Bluetooth Assigned Numbers http Awww bluetooth com Bluetooth Technology Building Specifications
26. roduct development and integration Laird Technologies has integrated a complete Bluetooth protocol stack within the modules including support for multiple Bluetooth Profiles The modules are fully qualified as Bluetooth End Products allowing designers to integrate them within their own products with no further Bluetooth Qualification They can then list and promote their products on the Bluetooth website free of charge Support for Serial Port Profile SPP Human Interface Device HID profile and Health Device Profile HDP are included in the module The support of the Bluetooth Sig s Health Device Profile makes this the ideal module for develop pment of Continua compliant medical and wellness devices By default the Health Device Profile supports the ISO IEEE 11073 10415 device specialization for weigh scales but additional specializations for glucose and thermometer are available with more upon request Communication is available to the module over a serial UART utilizing either a custom Multi point Packet Protocol API or comprehensive AT commands Combined with a low cost developer s kit this ensures that the choice of Laird Technologies modules guarantees the fastest route to market 3 1 Features and Benefits 8 3 2 Applications Bluetooth v2 1 EDR Embedded Devices Adaptive Frequency Hopping to cope Phone Devices with interference from other wireless Phone Accessories devices Security Devices Secure Simple Pairing support
27. select Items per page ALL go to end of page there click on Assigned Numbers Baseband for a complete list of Profile UUIDs click on Assigned Numbers Service Discovery 4 Class of Device Generator this link might be helpful for creating a particular CoD http oluetooth pentest narod ru software bluetooth_class_of_device service_generator html Caution this tool allows selection of more than one minor device classes so make sure that only one minor device class is select and verify the result with 3 anyway 5 Bluecore 4 External Data Sheet Cambridge Silicon Radio CSR http Awww csrsupport com log in or new account required 6 Winbond 681360 Codec Board User Guide Ezurio Application Note 7 BTM44x AppNote Getting Started 8 BTM44x AppNote Firmware Upgrade 9 BTM44x AppNote Throughput Analysis 10 BTM44x AppNote Health Device Profile 11 BTM44x AppNote Latency Optimization 12 BTM44x AppNote RF Testing Americas 1 800 492 2320 Option 2 26 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module 12 GLOSSARY OF TERMS A2DP Advanced Audio Distribution Profile ACL Asynchronous Connection Oriented Link ADC Analogue to Digital Converter AGHF
28. y medical life support or life sustaining equipment are specifically not recommended without additional testing for such application Limited Warranty Disclaimer Limitation of Liability Americas 1 800 492 2320 Option 2 29 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth
29. y modification to the existing qualified subsystems This is achieved by using the Listing interface on the Bluetooth SIG website Figure 1 shows the basic subsystem combination of a controller and host subsystem The Controller provides the RF BB LM and HCI layers with the Host providing L2CAP SDP GAP RRCOMM SPP and any other specific protocols and profiles existing in the Host subsystem listing The design may also include a Profile Subsystem Bluetooth End Product Figure 1 Basic subsystem combination of a controller and host subsystem Americas 1 800 492 2320 Option 2 21 Laird Technologies Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM44X Hardware Integration Guide Bluetooth Enhanced Data Module The Qualification Process requires each company to registered as a member of the Bluetooth SIG www bluetooth org The following link provides a link to the Bluetooth Registration page https Avww bluetooth org login register For each Bluetooth Design it is necessary to purchase a Declaration ID This can be done before starting the new qualification either through invoicing or credit card payment The fees for the Declaration ID depend on your membership status please refer to the following webpage https Awww bluetooth org en us test qualification qualification overview fees For a detailed procedure of how to obtain a new Declaration ID for your design please refer to the following
30. youts of the trays are provided in Figures 8 and 9 Notes 1 Material must be capable of _ _ discharging an electro static charge ee ESD and symbol must be located Detail A Detail B as shown R0 050 Det B Pocket Wall Angles al i Pocket Comer Detail L J 920 gt 88 0 a A 2 Laird Part Number must be tre os ear 0 559 0 750 4 R050 embossed into the carrier at this SE W l seat of location p TI 3 gt TJ le ees 3 Exterior edges may be modified to 0 742 Top and Bottom Radius r 0 025 a allow for stamping tray as long as Leggztel Fi outside maximum dimension is not exceeded 4 Dimensions SN Be All dimensions are in inches unless otherwise shown 5 Tolerances xxx l 0 010 M xox 0 005 as a rf ta ef La of La Sf LA ef Pas ty of a ef L angles 1 degree e unless otherwise shown GH PR PR PES GK Pk PS Pos a uw G Li ci uo a rf La ef G ci i 2 Reference Assemblies 5 a i re ar oa RR al E h G A Da ei LA ef o gt pr CC Ee S t Eg g oms 440 0512 R E E E E E E E E E a T a co L rf Za rf La of La ef La rf La ef La ef L ct WU gt 0 708 e EK ed zk aa i T s y lt x af a s men EE a m EE t D e SS 0 143 0 512 ER rd a pd P
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