BM77SPPx3MC2
Contents
1. System Configuration Note 1 Ensure VDD 10 and MCU VDD voltages are Compatible 2 Control and indication ports are configurable FIGURE 1 5 BM77 TO MCU INTERFACE EXAMPLE BATTERY Li ion Battery D 3 7V BM77 Module BAT_IN P15 STATUS_IND_1 3 2 4 3V PO4 STATUS IND 2 SW_BTN LDO33_O WAKEUP RST_N P37 VDD_IO Note 1 P34 2 8 3 63V P33 P32 LDO18 O Note 2 P31 P05 POO RTS P17 CTS PMULDO O TXD RXD P12 SCL P13 SDA P36 Y Note 1 Ensure VDD_IO and MCU VDD voltages are compatible System Configuration 2 Control and indication ports are configurable 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 7 BM77SPPx3MC2 1 12 Mounting Details The BM77SPPS3MC2 physical dimensions are shown in Figure 1 6 recommended host PCB footprint in Figure 1 7 and mounting suggestion in Figure 1 8 There should not be top copper layer near the test pin area shown in Figure 1 7 When laying out the host PCB the areas under the antenna should not contain any top inner layer or bottom copper as shown in Figure 1 8 A low impedance ground plane will ensure best radio performance best range lowest noise Figure 1 8 shows a minimum ground plane area to the left and right of the module for best antenna performance The ground plane can be extended beyond the minimum recommended as need for host PCB EMC noise reduction For best range performance keep all external metal a2. 30077 ATT HS TRA LER CBOE 5F No 5 Industry E Rd VII Hsinchu Science Park Hsinchu 30077 Taiwan R O C TEL 886 3 577 8385 FAX 886 3 577 8945 ISSC BRA te BRA ISSC Technologies cp BM 77SPPx3MC2 www issc tech com Bluetooth 4 0 Dual Mode Module Features e Complete Fully Certified Embedded 2 4 GHz Bluetooth Version 4 0 Module e Bluetooth Classic BR EDR and Low Energy LE e Bluetooth SIG Certified e Onboard embedded Bluetooth Stack e Transparent UART mode for seamless serial data over UART interface e Easy to configure with Windows GUI or direct by MCU e Firmware can be field upgradable via UART e Compact surface mount module 22 x 12 x 2 4 mm e Castellated surface mount pads for easy and reliable host PCB mounting e Environmentally friendly ROHS compliant e Perfect for Portable Battery Operated Devices e Internal Battery Regulator Circuitry e Worldwide regulatory certifications Operational e Single operating voltage 3 2V to 4 3V e Temperature range 40C to 85C Industrial e Simple UART interface e Integrated crystal internal voltage regulator and matching circuitry e Multiple I O pins for control and status RF Analog e Frequency 2 402 to 2 480 GHz e Receive Sensitivity 90 dBm Classic 92 dBm LE e Power Output 2 dBm typ Data Throughput e 3 Mbps Classic e 8Kbps LE MAC Baseband Higher Layer e Secure AES128 encryption e GAP SDP SPP GATT profiles Ante
3. E PP menos memi su LL when configured as pute internal pull up 30 EDI DO Status LED See Section1 9 ne fon Doa Ground reerence O O po 30 TRF AIO External antenna connection 50 ohm 32 END Power Ground reference O Z o O OO 33 ND Power Note 1 Pin type abbreviation A Analog D Digital Input O Output Hi 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 4 BM77SPPx3MC2 1 2 Configuring the BM77 Configuring the BM77 features can be performed using either MCU commands documented in the ISSC Flash Protocol Programmer s Guide or with the Windows UI Configuration tool and Write EEPROM tool MCU UART commands are documented in BM77SPP Command Set 1 3 UART Interface Figures 1 4 and 1 5 show Power and MCU interface examples The BM77 UART pins TXD and RXD connect to the UART pins of the host MCU It is highly recommended to use hardware flow control pins RTS and CTS The BM77 hardware flow control is disabled by default and must be configured to enable The UART Baud is configurable The available signal rates are listed in Table 4 5 1 4 Control and Indication 1 0 Pins I O pins POO PO5 P17 P31 P32 P33 P34 and P37 are configurable control and indication I O Control signals are input to the BM77 Indication signals are output from the BM77 Table 1 2 shows configurable 1 0 pin assignment to control and indication
4. RST_N 19 PTACTS 13 gt POO RTS 15 gt C 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 3 BM77SPPx3MC2 TABLE 1 1 PIN DESCRIPTION BM77SPPS3MC2 BM77SPP03MC2 cu Pin Pin Symbol Type Description qa Power Ground reference 2 5 Power Ground reference dee Power Ground si ef a TOT uF low ESR ceramic capacitor E RA e o See Section 1 6 TS a TOT Erre en comete OF ESR ceramic capacitor voltages are compatible FLEE PPP Etta SOME snron ESR ceramic capacitor ee a internal pull up Ill ceramic capacitor __ 04 DO Status Indicator 2 STATUS_IND_2 See Section 1 5 io e 00 status Indicato 1 STATUS IND 1 See Section 15 B 13 PI2 Sct DO l CSCL Do Not Connect i y O pT P13 SDA DIO CSDA DoNotConnect Z o pos 13 P17 CTS DIO Configurable Control or Indication pin or UART CTS input _ 16 A POS DIO Configurable Control or Indication pin ST mae NT ee e te See Section 1 10 OS 7 Z P amago eme See Section 1 10 RSI N Module reset PETE low internal pull up I er do _ _ LD a __ pTxD DO UART data output E pe when configured as input internal pull up Configurable Control or Indication pin LT P TO PP PS 26 24 Poo Configurable Control or Indication pin F g r O o ien ongresa nou mema palus PP ES SL when configured as input internal pull up P36 DIO poNotConnet
5. HEADER CONNECTIONS BM77 Module BAT IN BM77SPP03MC2 BT_RF GND LED1 SW_BTN P37 LDO33_O P36 VDD_IO LDO18 O P34 WAKEUP P33 PMULDO_O P32 P04 P31 P15 P12 SCL TXD P13 SDA RXD CTS P17 RTS P00 P20 P24 EAN C 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 14 BM77SPPx3MC2 3 0 REGULATORY APPROVAL This section outlines the regulatory information for the BM77SSPS3MC2 module for the following countries e United States e Canada e Europe e Australia e New Zealand e Japan e Korea e Taiwan e Other Regulatory Jurisdictions 3 2 United States The BM77SSPS3MC2 module has received Federal Communications Commission FCC CFR47 Telecommunications Part 15 Subpart C Intentional Radiators modular approval in accordance with Part 15 212 Modular Transmitter approval Modular approval allows the end user to integrate the BM77 module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation provided no changes or modifications are made to the module circuitry Changes or modifications could void the user s authority to operate the equipment The end user must comply with all of the instructions provided by the Grantee which indicate installation and or operating conditions necessary for compliance The finished product is required to comply with all applicable FCC equipment authorizations regulations requirements and equip
6. The R amp TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE marking 3 4 2 ANTENNA REQUIREMENTS From R amp TTE Compliance Association document Technical Guidance Note 01 Provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio module manufacturer s installation instructions requires no further evaluation under Article 3 2 of the R amp TTE Directive and does not require further involvement of an R amp TTE Directive Notified Body for the final product Section 2 2 4 The European Compliance Testing listed in Table 3 1 was performed using the integral ceramic chip antenna TABLE 3 1 EUROPEAN COMPLIANCE TESTING Certification Standards Article Laboratory Report Number Date po 3 1 b EN 301 489 17 V2 1 1 2009 05 EN 300 328 V1 7 1 2006 10 3 2 Notified Body Opinion 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 19 BM77SPPx3MC2 3 4 3 HELPFUL WEB SITES A document that can be used as a starting point in understanding the use of Short Range Devices SRD in Europe is the European Radio Communications Committee ERC Recommendation 70 03 E which can be downloaded from the European Radio Communications Office ERO at http www ero dk Additional helpful web sites are e Radio and Telecommunications Terminal Equipment R amp TTE http ec europa
7. 6 mm Pad Detail FIGURE 1 10 BM77SPP03MC2 RECOMMEDED PCB FOOTPRINT Top View mi AR 2 2 HE I DI DI DI DI DI DI i 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 11 BM77SPPx3MC2 FIGURE 1 11 BM77SPPO3MCS HOST PCB MOUNTING SUGGESTION ET ET ET a a F Top Copper Layer di Bottom Copper Layer 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 12 BM77SPPx3MC2 2 0 APPLICATION INFORMATION 2 2 BM77SPPS3MC2 Ceramic Chip Antenna The BM77SPPS3MC2 module contains an integral ceramic chip antenna The antenna performance on the module is shown in Figure 2 1 FIGURE 2 1 BM77SPPS3MC2 ANTENNA RADIATION PATTERN Gain dBi 5 0 2450 MHz 1 63 dBi Efficiency 71 55 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 13 BM77SPPx3MC2 2 3 External Configuration and Programming The BM77 module can be configured and firmware programmed using an external configuration and programming tool available from ISSC Technologies Figure 2 2 shows the connections between the BM77 and header J1 a standard 8 pin 0 100 2 54 mm spaced header It is recommended to include this header on the host PCB for development Configuration and firmware programming modes are entered according to the system configuration 1 0 pins see Section 1 8 FIGURE 2 2 EXTERNAL PROGRAMMING
8. Low Energy RX_IND Function Enabled TABLE 4 5 UART BAUD Crystal F dii wa Actual Baud Error Rate 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 25 BM77SPPx3MC2 4 0 ORDERING INFORMATION TABLE 4 1 ORDERING INFORMATION Part Number BM77SPPS3MC2 0007AA Bluetooth 4 0 Dual Mode Class 2 Surface Mount module with integral antenna with shield Bluetooth 4 0 Dual Mode Class 2 Surface Mount module external antenna no shield with USB cable 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 26 BM77SPPx3MC2 APPENDIX A REVISION HISTORY Revision 2 0 October 2014 Added content and editing 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 27 BM77SPPx3MC2 NOTES 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 28
9. alth Care Medical e Automotive Accessories e Home Automation e Remote Control Toys 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 1 BM77SPPx3MC2 1 0 DEVICE OVERVIEW The BM77 is a complete fully certified embedded 2 4 GHz Bluetooth version 4 0 BR EDR LE wireless module It incorporates an on board Bluetooth stack cryptographic accelerator power management subsystem 2 4 GHz transceiver and RF power amplifier see Figure 1 1 With the BM77 designers can embed Bluetooth functionality rapidly into virtually any device The BM77 provides cost and time to market savings as a self contained module solution The module has been designed to provide integrators with a simple Bluetooth solution that features e Ease of integration and programming e Vastly reduced development time e Minimum system cost e Interoperability with Bluetooth hosts e Maximum value in a range of applications The BM77 can independently maintain a low power wireless connection Low power usage and flexible power management maximize the module s lifetime in battery operated devices A wide operating temperature range allows use in indoor and outdoor environments industrial temperature range The BM77 module comes in two varieties The BM77SPPS3MC2 is a complete fully regulatory certified module with integral ceramic chip antenna and shield The BM77SPP03MC2 is a lower cost alternative with external antenna and
10. chnical standards regulated by the Ministry of Internal Affairs and Communications MIC of Japan pursuant to the Radio Act of Japan Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed Additional testing may be required e lf the host product is subject to electrical appliance safety for example powered from an AC mains the host product may require Product Safety Electrical Appliance and Material PSE testing The integrator should contact their conformance laboratory to determine if this testing is required e There is an voluntary Electromagnetic Compatibility EMC test for the host product administered by VCCI http www vcci jp vcci e index html 3 7 1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM77 module must follow Japan marking requirements The integrator of the module should refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications MIC website The BM77 module is labeled with its own technical conformity mark and certification number The final product in which this module is being used must have a label referring to the type certified module inside 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 21 BM77SPPx3MC2 Contains transmitter module w
11. e from Section 3 2 1 RSS Gen Issue 3 December 2010 The host device shall be properly labeled to identify the module within the host device The Industry Canada cer O lo ocule gt car ibh al all ses when in ftalled in the host devide otherwik the het devi mis be di tc dis lay Industry Canada certification number of the module preceded by the words Contains transmitter module or the word Contains or similar wording expressing the same meaning as follows Contains transmitter module IC 12246A BM77SPPSYC2 User Manual Notice for License Exempt Radio Apparatus from Section 7 1 3 RSS Gen Issue 3 December 2010 User manuals for license exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both This device complies with Industry Canada license exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Le pr sent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est s
12. eu enterprise rtte index en htm e European Conference of Postal and Telecommunications Administrations CEPT http www cept or e European Telecommunications Standards Institute ETSI http www etsi or e European Radio Communications Office ERO http www ero dk e The Radio and Telecommunications Terminal Equipment Compliance Association R amp TTE CA http www rtteca com 3 5 Australia The Australia radio regulations do not provide a modular approval policy similar to the United States FCC and Canada IC However BM77 module RF transmitter test reports can be used in part to demonstrate compli i vith ACMA Radi icati 4 i The BM77 module an b d as part_of the product certification an mpliance fo der For more informdtion on the E re ori i gt i ip Tegfnology Australia sales office To meet overall Australian final product compliance the developer must construct a compliance folder containing all relevant compliance test reports e g RF EMC electrical safety and DoC Declaration of Conformity etc It is the responsibility of the integrator to know what is required in the compliance folder for ACMA compliance All test reports are available on the BM77 product web page at www microchip com For more information on Australia compliance refer to the Australian Communications and Media Authority web site http www acma gov au gt 3 5 1 HELPFUL WEB SITES The Australian Communications and Med
13. finished product should include the following statement This equipment has been tested and found to comply with the limits for a Class B digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one or more of the following measures Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engineering and Technology OET Laboratory Division Knowledge Database KDB http apps fcc gov oetcf kdb index cfm 3 2 2 RF EXPOSURE All transmitters regulated by FCC must co
14. ge 22 BM77SPPx3MC2 The user s manual should contain below warning for RF device in traditional Chinese TE RR RIE E UR FRITTE EE EIA Ft AR RE RE SE ZIENENN ER JERFA AT HABIT ie BS Baas MADRE A E REAT ZTE RUBE BTR EJERE LEAT ERMA EAF EA ARE KARA TERRE EUSA DNS SRTERA eat MAAARI tai SBR ER ER IED ep era ze RI SR RA Be RAE EN Re TIR 3 9 2 HELPFUL WEB SITES National Communications Commission NCC http www ncc gov tw 3 10 Other Regulatory Jurisdictions Should other regulatory jurisdiction certification be required by the customer or the customer need to recertify the module for other reasons a certification utility is available For further regulatory Certification Utility and documentation contact ISSC Technologies Corp 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 23 BM77SPPx3MC2 4 0 ELECTRICAL CHARACTERISTICS TABLE 4 1 ENVIRONMENTAL CONDITIONS Parameter Temperature Range Operating 40C to 85C Temperature Range Storage 40C to 85C Relative Humidity Operating 10 to 90 Relative Humidity Storage 10 to 90 Moisture Sensitivity Level TABLE 4 2 ELECTRICAL CHARACTERISTICS Supply Voltage BATIN 8 Vuinputlogiclevelslow o 08 v Vu input logic levelshigh 20 36 v Vor output logic levelslow oa OV Von output logic levels high 2a ooo S RESET RESET O Vues threshold voltage 16 y Input and Tri S
15. ia Authority www acma gov au ot ovio a a icy to the United States B m tr can b din part to New ea i ente for ations Radia i 10 c p the AS NZS 4268 2008 industry standard The BM77 module test reports can be used as part of the produc 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 20 BM77SPPx3MC2 certification and compliance folder All test reports are available on the BM77 product web page at http www microchip com bm77 For more information on the RF transmitter test reports contact Microchip Technology sales office Information on the New Zealand short range devices license can be found in the following web links notices product compliance To meet overall New Zealand final product compliance the developer must construct a compliance folder containing all relevant compliance test reports e g RF EMC electrical safety and DoC Declaration of Conformity etc It is the responsibility of the developer to know what is required in the compliance folder for New Zealand Radio communications For more information on New Zealand compliance refer to the web site http www rsm govt nz 3 6 1 HELPFUL WEB SITES Radio Spectrum Ministry of Economic Development http www rsm govt nz 3 7 Japan The BM77SSPS3MC2 module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the te
16. ith certificate number CT 3 7 2 HELPFUL WEB SITES Ministry of Internal Affairs and Communications MIC http www tele soumu go jp e index htm Association of Radio Industries and Businesses ARIB http www arib or jp english 3 8 Korea The BM77SSPS3MC2 module has received certification of conformity in accordance with the Radio Waves Act Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed 5 8 1 LA S F The label on theffinal produ t whic in th The integrator of the module should refer to the labeling requirements for Korea available on th Communicationg Commission KCC website Korea The BM77 module is labeled with its own KC mark The final product requires the KC mark and certificate number of the module IC Number 3 8 2 HELPFUL WEB SITES Korea Communications Commission KCC http www kcc go kr National Radio Research Agency RRA http rra go kr 3 9 Taiwan contact Micrgchi S distributi Integration of this modu Oa pre du es installation instructions fre follo nono if obtain a gette uthority Mali tification drovided ar d 3 9 1 LABELING AND USER INFORMATION REQUIREMENTS The BM77 module is labeled with its own NCC mark and certificate number as below eo 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Pa
17. lace here 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 18 BM77SPPx3MC2 3 3 3 HELPFUL WEB SITES Industry Canada http www ic gc ca 3 4 Europe The BM77SPPS3MC2 module is an R amp TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product The BM77 module has been tested to R amp TTE Directive 1999 5 EC Essential Requirements for Health and Safety Article 3 1 a Electromagnetic Compatibility EMC Article 3 1 b and Radio Article 3 2 and are summarized in Table 3 1 European Compliance Testing A Notified Body Opinion has also been issued All test reports are available on the BM77 product web page at http www microchip com bm77 The R amp TTE Compliance Association provides guidance on modular devices in document Techniical Guidance Note 01 availa J NONE the module shall be installed in accordance with the installation instructions in this data sheet ahd shall not be modified When integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the R amp TTE Directive 3 4 1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM77 module must follow CE marking requirements
18. ment functions not associated with the transmitter module portion For example compliance must be demonstrated to regulations for other transmitter components within the host product to requirements for unintentional radiators Part 15 Subpart B Unintentional Radiators such as digital devices computer peripherals radio receivers etc and to additional authorization requirements for the non transmitter functions on the transmitter module i e Verification or Declaration of Conformity e g transmitter modules may also contain digital logic functions as appropriate 3 2 1 LABELING AND USER INFORMATION REQUIREMENTS The BM77 module has been labeled with its own FCC ID number and if the FCC ID is not visible when the module is installed inside another device then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module This exterior label can use wording as follows Contains Transmitter Module FCC ID A8TBM77SPPSYC2A or Contains FCC ID A8STBM77SPPSYC2A This device complies with Part 15 of the FCC Rules Operation is subject to the following two conditions 1 this device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 15 BM77SPPx3MC2 A user s manual for the
19. mply with RF exposure requirements KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities operations or devices comply with limits for human exposure to Radio Frequency RF fields adopted by the Federal Communications Commission FCC From the FCC Grant Output power listed is conducted This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators This transmitter is restricted for use with the specific antenna s tested in this application for Certification and must not be co located or operating in conjunction with any other antenna or transmitters within a host device except in accordance with FCC multi transmitter product procedures 3 2 3 HELPFUL WEB SITES Federal Communications Commission FCC http www fcc gov FCC Office of Engineering and Technology OET Laboratory Division Knowledge Database KDB http apps fcc gov oetcf kdb index cfm 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 16 BM77SPPx3MC2 3 3 Canada The BM77SSPS3MC2 module has been certified for use in Canada under Industry Canada IC Radio Standards Specification RSS RSS 210 and RSS Gen Modular approval permits the installation of a module in a host device without the need to recertify the device 3 3 1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements for the Host Devic
20. nna e Ceramic Chip Antenna BM77SPPS3MC2 e External Antenna Connection via RF Pad BM77SPP03MC2 Compliance e Bluetooth SIG QDID B021961 e Modular Certified for the United States FCC and Canada IC e European R amp TTE Directive Assessed Radio Module e Australia New Zealand Korea Taiwan Japan FIGURE 1 gu77SPPSIMC2 Kage econszenee BU 153 00060A BM775PP03MC2 Ra 6cDES2808909 1424 0006AA General Description The BM77 is a fully certified Bluetooth Version 4 0 BR EDR LE module for designers who want to easily add dual mode Bluetooth wireless capability to their products Delivering local connectivity for the Internet of Things loT the BM77 bridges your product to Smart Phones and Tablets for convenient data transfer control and access to cloud applications This Bluetooth SIG certified module provides a complete wireless solution with Bluetooth stack onboard integrated antenna and worldwide radio certifications in a compact surface mount package 22 x 12 x 2 4 mm It supports GAP SDP SPP and GATT profiles Data is transferred over the Bluetooth link by sending receiving data via transparent UART mode making it easy to integrate with any processor or Microcontroller with a UART interface Configuration is made easy using a Windows based GUI or directly via UART by a MCU Applications e Mobile Point of Sales mPOS e LED lighting e Wearables e Digital Sports e Fitness Devices e He
21. no shield The integrator is responsible for the antenna antenna matching and regulatory certifications The BM77 is a small compact surface mount module with castellated pads for easy and reliable host PCB mounting The module is compatible with standard pick and place equipment TABLE 1 1 BM77 MODULE FAMILY TYPES BM77SPPS3MC2 0007AA Integral ceramic chip FCC IC CE KCC NCC Japan BM77SPPO3MC2 0007AA External No E O FIGURE 1 1 BM77 BLOCK DIAGRAM BM77SPPx3MC2 Ceramic Chip Antenna BM77SPPS3MC2 External Antenna BM77SPP03MC2 IS1677SM Configurable Control and Indication I O Power Serial EEPROM 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 2 BM77SPPx3MC2 1 1 Interface Description The BM77SPPS3MC2 pin diagram is shown in Figure 1 2 and the BM77SPP03MC2 is shown in Figure 1 3 The pin descriptions are shown in Table 1 1 FIGURE 1 2 BM77SPPS3MC2 PIN DIAGRAM GND BAT_IN SW_BTN LDO33 O VDD_IO LDO18 0 WAKEUP PMULDO_O 10 P04 11 P15 12 P12 SCL 13 P13 SDA 14 3 4 5 6 T7 8 9 PO5 16 P20 18 P24 19 EAN 20 RESET 21 P17 CTS 15 POO RTS 17 FIGURE 1 3 BM77SPP03MC2 PIN DIAGRAM GND BAT_IN SW_BTN LDO33_O VDD_IO LDO18 O WAKEUP PMULDO_O P04 Pio 10 P12 SCL 11 P13 SDA 12 AN OO J O O1 R ND AAP FARA C C C C C C C C C XK PO5 14 gt P20 16 gt P24 17 EAN 18
22. ns e Use no clean flux solder paste e Do not wash as moisture can be trapped under the shield e Use only one flow If the PCB requires multiple flows apply the module on the final flow 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 8 BM77SPPx3MC2 FIGURE 1 6 BM77SPPS3MCS MODULE DIMENSIONS Top View Side View Bottom View O N N 21 2 20 1 gir y 226 18 0 shield mounting hole 13 9 12 8 11 7 10 6 9 5 8 4 Bottom View mounting hole 120 Dimentions are in millimeters Tolerances PCB Outline 0 4 mm PCB Thickness 0 06 mm Pad Detail FIGURE 1 7 BM77SPPS3MC2 RECOMMEDED PCB FOOTPRINT Top View ri ro Top Copper Keep Out Area 18 0 16 0 0 5mm 1 5mm nm F nm as gt DI DI DI DI DI 1 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 9 BM77SPPx3MC2 FIGURE 1 8 BM77SPPS3MCS HOST PCB MOUNTING SUGGESTION Top and Bottom Copper layer keep out area Edge of host PCB a a a __ 000000 F Top Copper Layer Fo Bottom Copper Layer 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 10 BM77SPPx3MC2 FIGURE 1 9 BM77SPPO3MCS MODULE DIMENSIONS Side View Bottom View Bottom View Dimentions are in millimeters Tolerances PCB Outline 0 4 mm PCB Thickness 0 0
23. ous location This radio transmitter identify the device by certification number or model number if Category II has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain greater than the maximum gain indicated for that type are strictly prohibited for use with this device Conform ment la r glementation d Industrie Canada le pr sent metteur radio peut fonctionner avec une antenne d un type et d un gain maximal ou inf rieur approuv pour l metteur par Industrie Canada Dans le but de r duire les risques de brouillage radio lectrique l intention des autres utilisateurs il faut choisir le type d antenne et son gain de sorte que la puissance isotrope rayonn e quivalente p i r e ne d passe pas l intensit n cessaire l tablissement d une communication satisfaisante Immediately following the above notice the manufacturer shall provide a list of all antenna types approved for use with the transmitter indicating the maximum permissible antenna gain in dBi and required impedance for each 3 3 2 RF EXPOSURE All transmitters regulated by IC must comply with RF exposure requirements listed in RSS 102 Radio Frequency RF Exposure Compliance of Radiocommunication Apparatus All Frequency Bands Get direct quote from Certificate and p
24. s shown in Table 1 4 P20 and P24 each have internal pull ups EAN has internal pull down TABLE 1 4 SYSTEM CONFIGURATION SETTINGS Test Write EEPROM Write Flash Firmware programming 1 11 Power Figure 1 4 shows an example power scheme using a 3 3 volt low dropout LDO regulator supplying 3 3 volts to both the BM77 BAT_IN and VDD_IO and MCU VDD This power scheme ensures that BM77 and MCU 1 0 voltages are compatible Figure 1 5 shows an example power scheme using a 3 7 volt lithium ion battery The BM77 has an internal 3 3 volt LDO regulator Battery power is applied to BAT_IN pin The regulated 3 3 volts output is on the LDO33_0 pin From the LDO33_0 pin voltage can be routed the VDD_IO pin and external circuitry including the MCU This power scheme ensures that BM77 and MCU 1 0 voltages are compatible CAUTION The internal 3 3 volt LDO current source 50 mA maximum Recommended bypass capacitor location and values are shown in Figures 1 4 and 1 5 Capacitors can be low ESR ceramic Place capacitors close to BM77 module 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 6 BM77SPPx3MC2 FIGURE 1 4 BM77 TO MCU INTERFACE EXAMPLE LDO BM77 Module BAT_IN P15 STATUS_IND_1 3 2 4 3V PO4 STATUS IND 2 SW _BTN LDO33_O WAKEUP RST_N P37 VDD_IO Note 1 P34 2 8 3 63V P33 P32 LDO18_O Note 2 P31 PO5 POO RTS P17 CTS PMULDO_O TXD RXD P12 SCL P13 SDA P36
25. signals Note that RTS can only be assigned to POO and CTS to P17 TABLE 1 2 CONFIGURATION AND INDICATION 1 0 ASSIGNMENTS DISCONNECT CONTROL DISCOVERY_CONTROL LOW_BATTERY_IND LINK_QUALITY_IND UART_RX_IND PROFILE_IND uN uN H oc O H H aa o lt lt gt 5 _ I Default SS ue ni ee ee Default Default 1 5 Status Indication 1 0 Pins I O pins P15 and P04 are Status Indicator 1 and 2 signals respectively Together they provide status indication to the MCU as shown in Table 1 3 TABLE 1 3 STATUS INDICATION P04 STATUS_IND 2 P15 STATUS_IND1 indicato Power default Shutdown state Link state no UART data being transmitted Link state UART data being transmitted 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 5 BM77SPPx3MC2 1 6 Software Button SW_BTN The Software Button SW_BTN input pin powers the BM77 on high or off low 1 7 WAKE UP WAKEUP The Wake Up WAKEUP input pin wakes the BM77 from shutdown mode active low 1 8 RESET RST N The Reset RST_N input pin resets the BM77 active low pulse for at least 63 ns 1 9 Status LED LED1 The status LED LED1 indicates e Standby e Inquiry e Link e Link Back e Low Battery e Page Each indication is a configurable flashing sequence LED brightness can also be configured 1 10 System Configuration I O pins P20 P24 and EAN place the BM77 into operation modes a
26. tate Current with Pull up Resistor Kom leakage current ao 10 A Supply Current O Supply Current Pod 70 mA RXmode 70 mA TABLE 4 3 SUPPLY CONSUMPTION CLASSIC Current Parameter avg Standby mode 2 543 Deep power down mode 0 343 Connected Sniff Master no data 0 858 mA No data was transmitted Sniff interval 500ms Connected Sniff Slave no data 0 864 mA No data was transmitted a Sniff interval 500ms size 500 Data Slave 25 597 Note 1 Classic BR EDR RX_IND Function Enabled Data transmitted at 115200 bps block size 500 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 24 BM77SPPx3MC2 TABLE 4 4 SUPPLY CONSUMPTION LOW ENERGY WCG CC nates avg LE fast advertising interval 160 ms Connectable mode standby at 0 30 sec Connectable mode interval 961 ms standby after 30 sec Deep power down mode 0 348 mA _ Connected No data connection mA No data was transmitted 0 679 oo interval 500ms connection interval 500 ms latency 2 Connected transfer data mA 13 073 Connection interval 500 ms latency 2 connection interval 500ms Connected No data connection 1 648 mA No data was transmitted interval 20ms connection interval 20 ms latency 2 Connected transfer data mA e 18 581 Connection interval 20 ms latency 2 connection interval 20ms Note 1
27. usceptible d en compromettre le fonctionnement 2014 ISSC Technologies Corp Preliminary Revision 2 0 October 24 2014 Page 17 BM77SPPx3MC2 Transmitter Antenna from Section 7 1 2 RSS Gen Issue 3 December 2010 User manuals for transmitters shall display the following notice in a conspicuous location Under Industry Canada regulations this radio transmitter may only operate using an antenna of a type and maximum or lesser gain approved for the transmitter by Industry Canada To reduce potential radio interference to other users the antenna type and its gain should be so chosen that the equivalent isotropically radiated power e i r p is not more than that necessary for successful communication Conform ment la r glementation d Industrie Canada le pr sent metteur radio peut fonctionner avec une antenne d un type et d un gain maximal ou inf rieur approuv pour l metteur par Industrie Canada Dans le but de r duire les risques de brouillage radio lectrique l intention des autres utilisateurs il faut choisir le type d antenne et son gain de sorte que la puissance isotrope rayonn e quivalente p i r e ne d passe pas l intensit n cessaire l tablissement d une communication satisfaisante The above notice may be affixed to the device instead of displayed in the user manual User manuals for transmitters equipped with detachable antennas shall also contain the following notice in a conspicu
28. way from the ceramic chip antenna at least 31 mm The BM77SPP03MC2 physical dimensions are shown in Figure 1 9 recommended host PCB footprint in Figure 1 10 and mounting suggestion in Figure 1 11 It is highly recommended to layout the host PCB as suggested in Figure 1 11 A low impedance ground plane will ensure best radio performance best range lowest noise Pin 30 BT_RF is a 50 ohm connection to an external antenna connector PCB trace antenna or component ceramic chip antenna through a host PCB 50 ohm micro strip trace This trace can be extended to include passive parts for antenna attenuation padding impedance matching or to provide test posts It is recommended that the micro strip trace be as short as possible for minimum loss and best impedance matching If the micro strip trace is longer it should be a 50 ohm impedance Figure 1 11 shows an example connection to U FL connector 1 13 Soldering Recommendations The BM77 wireless module was assembled using standard lead free reflow profile IPC JEDEC J STD 020 The module can be soldered to the host PCB using standard leaded and lead free solder reflow profiles To avoid damaging the module the following recommendations are given e Microchip Technology Application Note AN233 Solder Reflow Recommendation DS00233 provides solder reflow recommendations e Do not exceed peak temperature Tp of 250 deg C e Refer to the solder paste data sheet for specific reflow profile recommendatio
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