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Kurt J. Lesker PVD 75

1. 5 4 Checksum Calculation lille 5 4 Command Summary aana ana aaea 5 5 Query Process 5 5 Update Process 43 53 acta ed heed Ree Ee il d EE Rel e ACRI AO E a 5 5 Query Update ES3Vel uai d dator bue a Va EG REN GRE E d Ed 2 ue Ua 5 6 Query Update tim 5 7 Query It arios ria dde aaa e ee 5 7 Beie EU WEE 5 8 Query Measurement 5 8 Query Register d cee adn a eoi oce e RE ed av EE 5 8 Update Register 0 0 0 ccc ee eens 5 8 Loop Tuning INFICON SQS 242 Operating Manual This page is intentionally blank IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Chapter 1 Introduction 1 1 Introduction The SQS 242 Deposition Control Software see Figure 1 1 works with the INFICON SQM 242 card to provide a powerful PC based thin film deposition controller that can Measure up to eight quartz crystal sensors simultaneously Control up to six deposition source supplies simultaneously CoDeposition Provide PreConditioning multiple rate ramps and feed idle phases Graph deposition rate rate deviation or power output Store process film and material parameters in Microsoft Access database Provide flexible and reliable digital I O using an inexpensive PLC PLC not provided by INFICON Figure 1 1 SQS 242 Software E S1D142 View Process SAMPLE Layer 1 of 2 Time Run 0 01 38 7 6 Time 0 01 38 Thickness ll D y
2. INFICON SQS 242 Operating Manual 2 2 6 Edit Source Sensor 25 26 27 28 Select the Source Sensor tab See Figure 2 8 Figure 2 8 Source Sensor tab Layer RateRamps Deposit Condition Source Sensar Errors Source Material Max Power Slew Fate 25 E sensor Tooling 7s Sensor 1 sensor d Sensor 3 Sensor 4 Sensor D Sensor b Sensor Y sensor Select the proper material for this film Gold Set the maximum power and slew rate that should be used for the selected material Sensor Tooling adjusts for differences in the substrate deposition and that measured by each sensor Select 100 for now 2 2 7 Edit Errors 29 30 Select the Errors tab see Figure 2 9 to control the actions taken when a sensor or deposition control error occurs You can elect to ignore errors unlikely stop deposition for this layer or continue deposition at a fixed power level Select Stop Layer for this example Figure 2 9 Errors tab Layer RateFiamps Deposit Condition Source Sensor Errors On Error Ignore a Stop Layer Timed Power Control Error Crystal Fail Crystal Quality Crystal Stability Enabled Enabled Enabled Enabled e single Hz 5000 Counts Total Hz Until a process is well established it is best to enable only the Crystal Fail error checking Uncheck the remaining error conditions IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manua
3. aana aaa aaa eee 3 3 Opera essaie UR bau eet ewes Saeed ob ae eee ee eones 3 3 INFICON 3 4 3 4 1 3 4 2 3 4 3 3 4 4 3 4 5 3 4 6 d 2 91 3 9 1 1 dS Es KE 3 5 1 4 mo 3 5 1 6 Oe lal dod ut Bod 3 5 4 3 5 4 1 3 5 4 2 3 5 4 3 3 5 4 4 3 5 4 5 3 5 4 6 3 5 4 7 dog B9 250 2 3 6 3 7 3 8 Chapter 4 4 1 4 2 4 3 4 4 SQS 242 Operating Manual REESEN E E EE SE 3 4 File PROCESS Sos uo qoem nea cee hee oca Ee ae need oe eee D Dra 3 4 File Open and Save Database 0 cee nooo 3 5 File Data E e e e Un PDT 3 5 PUGS la aaron aden de Se Ges atew chk bee Oe Gan oo ee ea ba Bae 6 ans 3 7 File User LOGIN xz ac cue exe Ed a D P deals PIG ER Ge amp God Ema ds idu 3 7 FS OEIL os eueesee es EE AURERCARGGUS 3o CER MIS ERN E EP Rad ae 3 7 elm u e ehre Ne cea e NEE EE eas 3 8 EOI PVOCESS sean rosa cineastas E REO AYES ee a oes 3 8 Layer Ke EE 3 10 Rate Ramps Tab 3 12 Deposit Tab 3 13 Condition Tab 3 14 Source Sensor Tab 3 15 EMOS a a 4 ab ee ee oe a Pos 1 5 3 4 Bor oit d da E ee a 3 16 Analog INDUS e cerradas il e a el deb cascada d 3 17 ECG 2 Un cia ak ad da tad be eee EEN 3 18 Edit ENEE 3 19 su sc v5 cone 6S o ra ss ed o e e ou 3 20 SUE A 3 21 Sensors LaD 2 acra deb m doe xc EL ra ehe dara aa ia 3 22 798 SEENEN 3 23 Ile xels TaD NEEN 3 24 Let o rear rra a E E ea nana 3 24 Card Tab 0 ce eee eee 3 28 COMIN EAD EEN 3 29 EAIC SECUN MT 3 30 JES KC e 3 30 ACCESS M
4. PC Cryo Temperature Regen Pressure When system is roughed below ATM the VAC Vacuum Switch turns green and indicates PC is under vacuum The Thermal Source s are interlocked to this switch PC Roughing Valve VACUUM MONITOR PRESSURE REQUIREMENTS Thermal Source systems are hard wire interlocked to the VAC switch The KJLC software interlock for minimum operation pressure is 5x10 3Torr although the recommended optimum pressure is 5x10 5Torr or better KURT J LESKER COMPANY 91 PVD 75 OPERATION OPERATION MANUAL MANUAL OPERATION d Before running Thermal Source manually thru Cware software Make certain that thermal boats crucible heaters wire basket filaments etc are securely fastened to thermal feed through with associated hardware before proceeding Make certain that the thermal boats crucible heaters wire basket filaments etc are not shorted against any deposition shielding or chamber wall before proceeding If using a crucible heater make certain that the ends or open heat shield surrounding the crucible are not shorted This most likely occurs when affixing the heater to the feed through post when tightening the socket head cap screw Do not change Thermal Source switch position during process This action is protected by interlocks to prevent such occurrences Make certain the deposition system is at an acceptable vacuum level before attempting deposition for best results
5. sss0s00s0ss00s000es0ssssosssssossessssssssssssossessssssssssssessessesees 86 Thermal Source Setup and Operation sessssesesecesesssoscececesesosoesecesssssoeoecessssscececeseeee 87 EE 87 EE m M m 87 Shutter speed AG LES enee TA 87 SEET ais 88 System Equipment Requirements ENNEN 88 Water PIOW SEL E sra 89 Pressure Requirements 91 OP Gl e EE 92 NWI ATCO Te EE 92 Recipe Controlled Opera ON EEN 94 Aborti Timeout and GOTO Seti 98 Material Replenis Aira al 99 CICA AINE and Maltes rca 99 Kaufman amp Robinson lon Beam Source Operation csccccscsccsscccscsccececcscsccccscceces 100 Constant Current Mode iii iia 101 Constant Voltage MO descansa poa lt pecan recae ei Oseas 103 ManualGas MOO E 105 GUT REMOCE Mode EE 105 OS OVATION EE 105 SPU CIO WA aaa 106 Film Thickness Monitor Controller ccccccscceccscceccecceccecceccecceccecceccecceccecceccecens 106 Emergerncy Olf RECOVERY E 106 Systems with Separate Control Rack amp Frame 108 System with Integrated Control Rack amp Frame 109 Recovery from Accidental Pressing of EMU 110 SE Bee ge e EE 111 Sm D OWEN WEE 113 SOMMWale Operators 115 EE e UNE 115 General GUIGCIINGS E 116 Terminology and Definitions s oiii eege eebe 117 lge eR 119 Adding a New Usera oca 120 BA MB rs RR 120 Modifying 3 Users ACCESS mt dece vd ina E Trev ues ice VP Pues eU ecd 120 RESCUES d PassWOE caet ties hiatus cube esac t ide telo pde bui i loge telis 121 Software F
6. 6 INFICON www inficon com reachus inficon com IPN 074 551 P1A Y SQS 242 Operating Manual 8 NF ICON Table Of Contents Chapter 1 1 1 1 2 L3 Chapter 2 2 1 2 2 2 2 1 2 2 2 OVES 2 2 4 2 22 2 2 6 E 2 2 8 2 3 23 4 dida 2 3 3 2 3 4 2 4 29 2 6 Chapter 3 3 1 K 9 9 Trademarks Disclaimer Copyright Introduction INTFOCUCUO oie aa rc a a e a AA e i 1 1 SQM 242 Deposition Control Card 1 2 Bn aeo 1 3 Quick Start INTOdUclO EE 2 1 Single Layer Process Setup anaana anaana ee ee 2 2 Create a New Process 0 0 0 ce ee ee eee 2 2 Edit Layer Parameters 00000 cee eee 2 3 Edit Rate ie bin r n notes Ge ea een NUR coe oes Bee eee ee 2 4 Edit Deposition 2 5 Edit Pre Post Conditioning 0 0 cc ccc eee ee 2 5 Edit Source Sensor o 2 6 Edit ErrorS 2 6 SONO HOS 22 2 vd 29d S pane Yee a ooo Sad aaa soe ee ees 2 7 Single Layer Process Simulation 0 00000 ee eee eee oo 2 7 Setup Displays 00 ee ees 2 8 Digit FP IOCESS SE e sa He ES ee oo be eee eae D RR 2 8 Preconditioning Phases 0 0 ccc ee ee eee 2 9 Deposition Phase with one Rate Ramp 000 ee eee 2 9 SOMMCY FUNCIONS 2 222052 EE EES pls caus vaa ea 2 10 Multi Layer CoDeposition Process 0 0 00 cee eee oo 2 11 Conclusion noaua aaua aeaa ran 2 15 SQS 242 Software WIWOOUCUON EE 3 1 Installation and Registration
7. INFICON SQS 242 Operating Manual 5 6 2 3 Example Response Set Process Update Failed UP NAK ERR CR Where OL Illegal Command 02 Illegal Parameter 03 Illegal Format 04 Checksum Error 05 Request Denied 06 Unknown Error 5 7 Checksum Calculation The sample code below calculates the FCS checksum of a string of characters In the code Message is a string that has been stripped of terminator and checksum characters before being passed to this routine XOR ASCII codes For i 1 To Len Message FCS Asc Mid Message i 1 Xor FCS Next i Convert FCS to two character hex string If Len HexS FCS 1 Then CalcChkSum 0 amp HexS FCS Else CalcChkSum HexS FCS NOTE While checksums may be useful for RS 232 communications they are not needed for Ethernet or ActiveX If you don t want to use a checksum replace the checksum in each command with 00 two ASCII zero Hex 30 characters The program response will contain two checksum characters which you can just ignore IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual 5 8 Command Summary NOTE Update commands except UPO2 UP10 are only valid in Stop Mode 5 8 1 Query Process OP lt paraml gt where lt paraml gt is 01 02 US 04 05 06 07 08 la 21i 30 3n 39 4n oU o 52 Process Name Example Query QP 01 Example Response QP 06 MyProc Process is MyProc Process Time
8. North America Phone 800 245 1656 ext 7311 or 7557 Fax 412 384 2745 E mail systemscustomerservice lesker com Europe Phone 44 1424 458100 Fax 44 1424 458103 E mail systemcustomerserviceeu lesker com Asia Phone 01186 21 50115900 Fax 01186 21 50115863 Email systemscustomerservicecn lesker com For all other regions contact North America customer service RECEIPT INSPECTION Depending on the tool platform and configuration the tool may be crated mounted to a wooden base or protection wrapped only In addition peripheral components shielding or any additional parts may be packaged separately Smaller packages could be located inside frames or enclosures for safe shipping If the tool is not to be unpackaged immediately upon receipt it must be stored in an enclosed dry area meeting environmental requirements as listed in the following sections d Most of the instrument racks and enclosures have locks The keys for these locks are typically attached to the tool computer located in the control instrument mounting portion of the tool in a small plastic package Visually inspect all crates and boxes for signs of shipping damage or mishandling Any significant damage must be photographed and KJLC notified immediately d DO NOT discard any packing materials until receipt inspection bas been completed If any damage is found during uncrating these materials may be needed to file shipping claims 16 KURT
9. 10 0 to 999 0 Max Power 0 0 to 100 096 Slew Hate 0 0 to 100 0 s Source Index Pocket 0 to 15 Material Parameters Name eeee ee 12 characters Density e 0 40 to 99 99 gm cm Z Factor aeuum dm mk Rm nh 0 100 to 9 900 Digital Inputs available only with PLC option Start Process Stop Process Start Layer Stop Layer Start Next Layer Zero Thickness Force Final Thickness Substrate Index Complete Source Index Complete Relay Outputs available only with PLC option Source Shutter 1 to 6 Sensor Shutter 1 to 8 All Crystal Fail INFICON SQS 242 Operating Manual All Crystal Good Process Running Process Stopped Process Active Deposit Phase Pre Cond Phase Feed Idle Phase Manual Mode Max Power Thickness Setpoint Time Setpoint Final Thickness Substrate Index Select 0 to 15 Source Index Pocket Select 0 to 15 Security User Name 16 characters Password ooo 8 characters tee EE 3 levels Computer Interface Ke EE RS 232 Ethernet Activex IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual 3 8 INI File Parameters Parameters that control operation of the SQS 242 program are stored in the SQS242 INI file Most of these are easily altered within the program and updated automatically However a few of the parameters cannot be changed within the program Use a text editor to alter the para
10. 26 sigm Sigma Start Process Turn On Open Opening UNES NE 27 Sigma Sigma Process Stopped Check On Open Opening JAT 28 Suppy Setpoint SetValue n nn fo 29 jSupy EBon jTumof CosedCosng 30 Suppy Joo Turn On Open Opening 31 Motors Platen Motor On TumOf Closed Ciosing 32 Motors continuous Turn Off dosed Cosin KURT J LESKER COMPANY 77 PVD 75 OPERATION MANUAL UNDERSTANDING THE KL 6 RECIPE Step 1 Step 2 Steps 3 8 Steps 9 11 Steps 12 14 Steps 15 27 Steps 28 30 Steps 31 32 78 Always the first step in a recipe sets which Abort Recipe should be run in the event a step that has an AT Abort on Time fails Waiting for a desired base pressure before deposition will run In this case it is 5x10 6Torr Sets up Crucible for EB 3 6 Checks crucible is in position 8 Set up substrate rotation Sets EB setpoint to zero and turns on EB HV Sets up Shutter mapping launches Sigma program and requests that Sigma load a process 18 22 Zero Setpoint and turn off EB HV Turn off motor KURT J LESKER COMPANY OPERATION MANUAL PVD 75 265 MODEL EXAMPLE Following is an example of how to manually run a 265 model E Beam through CWare In this example the E Beam system has 6 pockets Pocket one has a carbon crucible loaded with Titanium pellets 1 First Select Crucible 1 by pressing Cru Pos1 button When Crucible is in position
11. MKS Tor 8 00E 2 PC High Vac Valve EJ Enim CLOSED PC High Vac Throttle ENS mTorr OFF OPEN Start Cryo Regen Recording Start K Operation System Maintenance 8 00E 2 Overtemperature Ove LIA Temp Beete This icon is only visible when the heater is deg C over temperature Temperature Setpoint Click to enter Enter the desired temperature setpoint value Enter the desired temperature setpoint for Auto Mode When Auto Mode is enabled this value is used in conjunction with the Ramp Rate box to achieve the desired temperature Auto Mode Setpoint Auto SP Click to enter deg C value EA NOTE If a ramp rate is desired it must be entered PRIOR to entering the desired temperature 140 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ICON OR DATA FIELD ACTION RESULT Heater Setpoint Enter the desired heater output as a ercentage of full scale Click to enter H E value When Auto Mode is disabled the heater can be controlled by power setpoint Enter the desired ramp rate to be used during Auto Mode in degrees C per minute Once a ramp rate is entered followed by a new Temperature Setpoint the heater will Ramp Rate ramp to the desired value Le SE NOTE The ramp rate starting point is the DM CURRENT Temperature Setpoint NOT the current actual temperature To avoid delays in achieving the desired ramp temperature be sure to set the Temperature Setpoint
12. Mikron Pyrometer PC Pfieffer Tubo Pump Controller PC Pfieffer Turbo Pump On PC Pfieffer Turbo Pump Speed SP PC Pfieffer Turbo Pump Variable Sp Platen Motor Platen Motor Acceleration Platen Motor D Platen Motor Direction Platen Motor Encoder Counts Platen Motor Gear Ratio Operation System 25 550 2000 25 RPM S S 550 0 2000 16 Counter 521 PC Pfieffer Turbo Speed o rr RN i i Platen Motor Position 200 0 DEG Platen Motor Referenced 0 Platen Motor Velocity El Generate Data Log Suspend Screen Updates OPERATION MANUAL xl en Steg ABORT Recipe Database Run Recipe AGT Normal Start PC Pump own Normal Start PC Mert Normal Normal Rotation Start Recording Start Help NR d This screen is primarily used for troubleshooting It is recommended that operators other than the system administrator do not have access to this screen Users can be denied access to this screen based upon their login parameters see the System Users Screen and the Security section of this manual A CAUTION Forcing string inputs can override interlocks When system troubleshooting is complete you must remember to reset un force signals 150 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ICON OR DATA FIELD ACTION RESULT Signal Click to select or All String Outputs and Inputs are listed in Signal deselect alphabetical order Outputs Initial Valu
13. Not in stock CS Critical Item In stock R Reference and information only W Wear based on customer use VACUUM HARDWARE IN LEAD PART NUMBER DESCRIPTION CATEGORY QUANTITY STOCK TIME oro fers e rons jomeweima RSR o om peu a o 3 nooo meng Inn lt lt lt lt lt mn Copperaskewece S R ro 1 O A A gt E Nomen EA AA O O mamm aF100AlCenteringRing vionoRins R Y 1 EA ATA ee aman a E Xo lt lt lt lt lt lt KURT J LESKER COMPANY 201 PVD 75 OPERATION MANUAL rem maan A mem rmwes e e 3 xw wewecemone e 3 O Ring For 3 8 Vac Coupling 2 4 Vac Coupling O Ring 3 SS Plug 1 8 Vacuum Coupling SS Plug 3 4 Vacuum Coupling lt lt lt SS 4WVCR6400 ny FVCR to 4 Swagelok Adapter pn N 6Days As Required meo psn OO CR RC RN E73 wee mn In Y e temer soc pussamkop A Some An Rees sexos essen Tv Cn feft mm nmn ln sm fusse SERGE woss atentas RY o moss pwsmmem e Y 3 B 600 SETS 3 8 Brass Ferrule Set NES 1 VACUUM MEASUREMENT amp CONTROL PART NUMBER DESCRIPTION QUANTITY 390410 0 YG T 390 Combination Gauge Hot lon Pirani PTR26950 Pirani Gauge QF16 VACSWITCH1 Vacuum Switch Y MVCR 1179A01312CR1BV Mass Flow Controller O 100 sccm 626B 1TLE Capacitance Manometer 0 1 Torr SS 4BK 1C Inline Vent Valve Swagelok SS 4BK V511C Inline Process Gas Valve FVCR S
14. Tas58 a Preheat gently lo okas Film reacts in ap n4z Sodum Bergh MaBr HI 320 400 Q RF Preheat b z n 1641 Sodium Chiride Nati 801 217 530 G TaWMo Q RF Copper oven litle decomposilon Preheat Lu n 1 544 Spinel i a0 6 Iu x RF n17 Statum S Se 238 259 3X0 4B P WWW W we RF Wels but no alloy with WI Ta Mo Film reacts in air SrmfumChkrie Sr g5 3x5 d m e m n 1 650 Stontum Fluaride Sf i43 44 AND a Ab RF n1442 Stantum Oxide So 249 5 47 i Mo ALO RE Reacts wih WiMo n 1810 n247 Tima F RF Tin 5n 220 Th 6g 87 ST E Mo OW W Abs DC Wels Mo Low spuller power Ta liner for E beam Tin Oxide S 160 S 65 0 E Ww W WO QAO RERFR Using W fms low in O Ov diza in air n 2 0 Tin Saleride S G a RF Tin Sulfide Sn amp 88 Q RF Tin Telusde a RF Titanium Tic DC Tis TE TiN G TiO G Tianum N Oxde TO 180 426 I F WM W RF RFR Loses Op Oxides in air Ta gives fms TO n 2 616 2 903 T wW 340 19 217 2407 257 G DC Films hard and adherent 240 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 emp C for Given Evaporation Techniques Vap Press Torr Thermal Sources Material Symbol MP C SID o W7 10 107 E Beam Boat Coll Basket Crucible Sputter Comments RF RF Tungsten Baride WB 290 07 E ESCHER Tungsten Caib
15. The following example demonstrates the procedure to manually run the Thermal Source through Cware 92 1 2 3 4 With the Evap button Off or not depressed change the Evap Set Point value and Ramp Rate U s value to 0 if not already in that state Select which source you would like to run either Source SW1 or Source SW2 by depressing the appropriate button This button will turn green when On or energized Depress the Evap button to energize the power supply This button will turn green when On or energized Once energized the operator can increase power in two manners with and without a ramp rate a Ramp Rate Operation The operator must enter a value from 0 100 in the Ramp Rate U s text box This box interprets the value entered in Units per Second After performing this function the operator then will enter a value from 07100 into the Power text box This value is interpreted as O to 100 available power This order of steps will increase the output power to the thermal sources utilizing the ramp rate entered until the maximum power has been reached Once this maximum has been reached the Ramp Rate text box will revert to a 0 To reduce power utilizing the ramp rate perform the function in the same order Enter a Ramp Rate value first then a power KURT J LESKER COMPANY OPERATION MANUAL PVD 75 wer is entered first then U Powet the Ramp Rate th
16. button located on the KRI Auto Controller repeatedly until the desired program number is selected as indicated by the numbered red LED s From the KRI Auto Controller press and hold the white Acquire Setpoints Button until the red numbered LED that was selected stops flashing To Turn the lon Source Off 1 From the KRI Discharge Controller press the white Enable Standby button to Standby 2 From the KRI Filament Controller press the white Enable Standby button to Standby 3 From the KRI Auto Controller press the white Enable Standby button to Standby 4 Restarting the ion source in the Gas Only mode consists of enabling the KRI Auto Controller KRI Filament Controller and KRI Discharge Controller in that order Slight variations in discharge voltages may be seen while the source is reaching operating temperature The variations should be acceptable for most cleaning or ion assist applications 102 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 CONSTANT VOLTAGE MODE The operating condition selected for this demonstration is with a 2 5 A 150 V discharge which is Constant Voltage Mode operation The following conditions are based on a vacuum pump speed of 1600 liters per second Operating parameters for other pump speeds and gases can be found in the lon Source Manual Note that the operating range of the ion source may be limited by the vacuum facility pump speed or other p
17. lt output gt lt value gt Note lt layer gt 0 is active layer where lt paraml gt is 01 P Term 02 I Term 03 D Term 04 Shutter Delay Status 0 1 05 Shutter Timeout 06 Shutter Accuracy 07 Control Error Status 07172 08 Control Error Accuracy 09 Rate Sampling Status 0 1 2 10 Sample Accuracy 11 Sample Time 12 Sample Hold 13 Ramp 1 Power 14 Ramp 1 Time 15 Soak 1 Time 16 Ramp 2 Power 17 Ramp 2 Time 18 Soak 2 Time 19 Feed Power 20 Feed Ramp Time 21 Feed Time 22 Idle Power 23 Idle Ramp Time 24 Output 1 6 2 Source Index obsolete 26 Max Power Z1 Slew Rate 28 Material 3n Tooling n nl to Si 40 AutoSoakz 071 5 8 5 Query Utility QU lt param1 gt DI SOM242 DLL Version 02 SOM242 Mode 0 1 03 SOM242 Period 04 SOM242 Filter 05 SQM242 Number of Cards Installed 06 Front Panel Enabled 0 1 07 Application Visible 0 1 tl SQS 242 Software Version TZ SQS 242 Operating System 13 SQS 242 Computer Name INFICON INFICON SQS 242 Operating Manual 5 8 6 Update Utility QU lt param1 gt lt Index gt 02 SQM242 Mode 0 1 03 SQM242 Period 04 SOM242 Filter 06 Front Panel Enabled 0 1 07 Application Visible 0 1 08 Full Scale Output Index 1 to 6 14 Application On Top 0 1 5 8 7 Query Measurement QM lt param1 gt ln Output n Power n 1 to 6 2n Output n Rate on Output n Thickness 4n Output n Deviation 5n Sensor n Rate n 1 to 8 6n Sens
18. 172 1 2 3 4 5 6 Click on the Recording Start button near the lower right corner of any Runtime Engine screen The caption of this button will change to Recording Stop and it will illuminate green each time data is written Clicking it again will stop recording data Recorded data is saved in a Microsoft Database format The file path is C Program Files Lesker Customer Name Data RecordingD mdb The data is saved in a table named tblRecordingData Data can be accessed by opening the database using Microsoft Access and then double clicking the table file The first two fields in this table are generated by the software for system use The remaining fields are the recorded system signals including a Date Time stamp Data can be exported or extracted using Microsoft Access Tools KURT J LESKER COMPANY OPERATION MANUAL PVD 75 DATA LOGGING SIGNALS 1 Navigate to the System Screen You can select signals to Data Log from the Discrete Analog or String screens 2 Click the Suspend Screen Updates System Strings Copyright 2009 Kurt J Lesker V4 33124 MKES979 SP3 Direction Value MKS979 Atmosphere Cal MKS979 SP3 Enabled Status MES979 Auto Initialize 1 00E 0 MES979 Cal Gas Type i 258 MEKS979 Transducer Status Hot cathode MES979 Degas On MES979 Transducer Temperature MES979 Emission Current MES979 Transducer2 Temperature 5 000E 00 MES979 Enable Control SP MES979 WRG
19. Active or In Posn will turn green Figure 1 FIGURE 1 2 Open Sigma SQS242 Monitor software this will be used to record deposition rate Start gt Programs Sigma Instruments gt SQS242 Monitor OR with Sigma SQS242 CoDep running read rate by pull down View Sensor Readings Do not run both SQS242 CoDep and SQS242 Monitor programs at the same time 3 Press deactivate the EB Off and EB HV Off buttons 4 Press activate the EB On and EB HV On buttons Figure 2 KURT J LESKER COMPANY 79 PVD 75 OPERATION MANUAL FIGURE 2 EB Power Setpoint is displ perage for the 265 model E yed in percentage The max am Beam is generally set to 750mA there ore 10 setpoint power is 75mA 5 Increment the power setpoint Emission Current slowly making sure the beam is centered in the pocket Open the E Beam shutter once material begins to melt Adjust the power setpoint to obtain the required rate of evaporation 6 When deposition is complete ramp back down EB power setpoint 7 When setpoint is zero press EB HV On button and EB On button 8 Press EB Off button and EB HV Off button NOTE You must press EB HV Off to turn EB HV Off 80 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 RECIPE CONTROLLED DEPOSITION EXAMPLE WITH SIGMA 265 MODEL E BEAM Equipment T est Type Equipment Equipmentitem EquipmentltemOperation Value Recipe Set Abort Recipe Ebeam Shutter urn Off C
20. Click the Return to Recipe button to return to the main Recipe Database screen To delete a step in a recipe 1 2 3 4 Use the navigation buttons on the Recipe Database screen to choose the recipe to edit Left click in the leftmost block next to the step number of the recipe step you wish to delete the entire row should be highlighted black Press the Delete Key on the keyboard The sequence number for the deleted step is now missing If you wish to renumber the remaining steps use the Reorder Items button then press the Re Number button To add a step to a recipe 1 2 3 Use the navigation buttons on the Recipe Database screen to choose the recipe to edit You must first add the step AFTER all of the other steps in the recipe When the required step is complete follow the steps above labeled change the order of the steps in the recipe to place the new step in its proper position KURT J LESKER COMPANY 171 PVD 75 OPERATION MANUAL IMPORTING RECIPES 1 2 3 4 5 6 7 8 9 Copy the RecipeD mdb file from the source system to your C Program Files Lesker directory Start the system and access the recipe database Select configuration Click on the Import Recipe drop down box Select the recipe to import by clicking on it You will be prompted to accept the import Click on OK The new recipe is imported to your system Click the Update VB button RECORDING DATA
21. PVD 75 OPERATION MANUAL LOGIN LoGOUT BUTTON Logout K L Super User The Login Logout Button appears at the top right of all runtime screens This button allows the user to login or logout of the software This icon also displays the login name and security level of the current user ABORT BUTTON ABORT The Abort Button appears at the top right corner of all runtime screens Pressing it activates an abort condition LIGHT TOWER The Light Tower appears in the top right corner of all screens When the topmost bar is illuminated red a red alarm condition is present The second bar will light yellow to indicate a yellow alarm The third bar will light green to indicate that a recipe is running The bottom bar will light blue to indicate a normal status no alarms are present and no recipes are running NAVIGATION BUTTONS RUNTIME SOFTWARE Operation Vacuum Deposition Motion Cooling Heating Motion System Discrete Analog Strings Ethernet 10 This set of Navigation Buttons appears on the Runtime Software screens They are used to navigate the major screen groups Each button opens a new screen with a different set of information or data 124 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 NAVIGATION BUTTONS SYSTEM DATABASE 7 Help Recipes A Recorded Data 3 Action Log Interlocks Sigma Data Sets Ow Configuration System Users This set of Navigation Buttons appears at the top of the Sy
22. Unlimited Sensors Dual 1 to 8 4 Dual FOQUICES x ici re 1to6 Layer Parameters FI 2452644400 ene oes ERE Any defined QUIDUE ee Ge oo eee eee eee 1 to 6 leoi TEEN Sensor s Timed Power Analog Input SetPoint oo 0 00 to 999 99 A s 0 00 to 100 00 Power 0 00 to10 00 V dc Final Thickness 0 0 to 999 9 kA Time EndPoint O to 30000 s Thickness EndPoint 0 0 to 999 9 kA Start Mode Auto Manual Source Indexers 6 Index 1 16 Layer Indexers 3 Index 1 16 Rate Ramp Start 0 0 to 999 9 kA Rate Ramp Time 0 to 1000 s New Rate 0 00 to 999 99 A s Film Parameters MISI MEM 12 characters Ramp Time 1 2 0 to 30000 s Soak Power 1 2 0 0 to 100 0 Soak Time 1 2 O to 30000 s Shutter Delay Time 0 to 200s Shutter Delay Error 0 0 to 30 0 E TEM eras dad 1 to 9999 IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual NE 0 to 999 9 s D ferm ee 0 to 99 9 s Control Error anana aana naaa Ignore Stop Hold Control Error Set 0 to 30 0 Feed Ramp Time 0 to 30000 s Feed Power 0 0 to 100 096 Feed Time oooomoo 0 to 30000 s Idle Ramp Time 0 to 30000 s Idle Power 0 0 to 100 0 Tooling Sensor 1 to 8
23. 5 FT dnas Motor Jog Value n nn i Velocity SP rw m Motor Go 2 _On Open a Continuous Opening 11 Motors Platen Motor Velocity Check Value gt n nn Value gt n nn wa gem Supply 2 A _On Open E Supply Opening ET Power Power Supply2 Ramp Set Value n nn al ES ie TI m Supply2 Output Value n nn i a Supply Setpoint au mt Supply2 Output inui Value n nn mE E Supply Power Gauge Capman Pressure SP Pressure SP Set Set Value n nn n nn Sg Gauge Capman Pressure Check Pressure lt n nn Saamea Ean 7 8 Recipe Dwell N Seconds n or HH MM SS 19 Shutter Source Shutter 2 Turn On Open Opening Shutter Substrate Shutter Turn On Open Opening Recipe Dwell N Seconds n or 2000 HH MM SS 22 22 Shutter Substrate Shutter Turn Off Closed KURT J LESKER COMPANY mm PVD 75 OPERATION MANUAL frmRecipeltems E E nana SE e pm mm mamm utter Source Shutter 2 Turn_Off Closed Ver EN PI ES Supply2 Ramp Value n nn P Supply Rate Pr D Ae Supply2 Output Value n nn i o Supply Setpoint TI a Supply2 Output p Value lt n nn i di Supply Power LI me Supply 2 E _Off Closed uu Supply Closing Pr a I Motor Go n _Off Closed kl a Continuous Closing 29 Gauge Capman Pressure SP Set Set Value n nn n nn EE GT Se Seconds m B MFC MFC1 MFC1 Mode Set Set Value n nn n nn Valve Gas Injection Turn Off Closed CIE E SI JI Valve PC High Vac Th
24. H 2 T 5 g B LI wn So 2 EI bi Q o gt A E EA EN ES Rate A s Dev Thick kA Power Gold Sample 15 0 2 0 950 e Silver Sample H 100 0 0 565 46 1 INFICON SQS 242 Operating Manual The six Soft Keys provide easy access to the common operating functions A single tabbed dialog box provides all of the settings required for a thin film process Material parameters sensor source setup pre post conditioning and error conditions are all visible on a single dialog box Process settings numeric data and graphical displays are displayed during all phases of deposition The SQS 242 software stores process parameters in a Microsoft Access compatible database The SQS 242 software can be controlled from another computer using the RS 232 or Ethernet command protocol 1 2 SQM 242 Deposition Control Card The SQM 242 is a PCI expansion card for use in computers running the Microsoft Windows operating system See Figure 1 2 Each card measures up to four quartz sensors via BNC inputs and supplies the control signal for two evaporation sources via a 74 stereo phone plug Up to six SQM 242 cards can be installed in a computer A single SAM 242 piggyback card with four analog inputs and two control outputs can also be installed Figure 1 2 SQM 242 Card Consult the separate SQM 242 card Operating Manual for detailed information on installing and using the SQM 242 and the SAM 242 c
25. Lesker Company Kurt PVD 75 THIN FILM DEPOSITION SYSTEM OPERATION MANUAL Data and information herein are subject to change without notice Contact the Kurt J Lesker Company for the latest version of this manual This manual contains drawings and technical instructions that are proprietary by the Kurt J Lesker Company These items are not to be reproduced published or distributed to a third party without written consent from the Kurt J Lesker Company The Kurt J Lesker Company assumes no liability for damages to customer facilities or personnel resulting from misuse or misapplication of the unit Kurt J Lesker Company Version 8 0 November 2012 CORPORATE HEADQUARTERS EUROPEAN HEADQUARTERS ASIAN HEADQUARTERS Kurt J Lesker Company Kurt J Lesker Company Ltd Kurt J Lesker Shanghai Trading Co 1925 Route 51 15 16 Burgess Road Building 63 Lane 1000 Jefferson Hills PA 15025 Hastings East Sussex Zhangheng Road USA TN35 4NR England Pudong New Area Shanghai Phone 800 245 1656 Phone 44 1424 458100 201203 P R China Fax 412 384 2745 Fax 44 1424 458103 Phone 01186 21 50115900 Fax 01186 21 50115863 CONTACT Us California USA 925 449 0104 Canada 800 456 2476 Hungary 36 1383 5322 Germany 08000 012 843 Warranty EE 1 Trademarks 3 Service Information sonnan a 5 EIERE 7 General ET d de E 8 Utility Requirements ora EE 9 Safety dl Le Sica 10 Satin aa 11 Operator Responsibilities mund eek eos
26. ONLY Power up and verify per the Power Distribution Schematic that all devices are plugged into appropriate outlets on the power distribution unit or plug strip s in order to satisfy circuit breaker assignments Verify that plumbing into and out of pump is correct and that the pump has been filled with oil if applicable Verify that the chamber motors and shutters are not obstructed and move freely Verify that all required communication and power connections to the system computer are connected and working properly Start up the system control software refer to the Software Operation section Verify all set points heaters power supplies etc before starting the pump down sequence KURT J LESKER COMPANY 33 OPERATION MANUAL PVD 75 OPERATION OVERVIEW Once the system has been successfully installed the required utility connections have been made and the start up procedure completed the system is ready for operation Prior to operating the system read through and become familiar with all instructions and with the schematics provided in the appendices There are three modes of system operation e Manual no computer interface or automated processes are provided e Computer Control a computer interface is used to operate the system manually e Recipe Driven Computer Control a complete computer control software package allowing for process control and creating and running recipes This is the highest level of
27. Only qualified personnel should perform component substitutions modifications to or service on the system d KJLC assumes no responsibility for equipment additions or modifications without KJLC s written consent In house performance of component repair or replacement during the warranty period without direction or approval from KJLC Systems Support can result in termination of the warranty KURT J LESKER COMPANY 11 PVD 75 OPERATION MANUAL SAFETY GUIDELINES 1 High voltage and electrical energy hazards exist for the power distribution cabinet and all power supplies A DANGER High voltage and electrical energy hazards can cause serious injury or death through electrical shock Avoid contact with power supplies and all power distribution hardware All personnel involved with power supply service or maintenance must have appropriate electrical training Service and maintenance personnel must read each component part manual before working on the equipment to determine the potential present on each circuit Power must be disconnected and the equipment must be grounded before service or maintenance work is performed Never work alone on live electrical circuits You must be within sight or calling distance of another employee who has the proper qualifications Do not wear rings wristwatches or other jewelry on your person while working on live electrical circuits Wear eye protection while working on live electrical circuitry where a
28. PVD 75 OPERATION MANUAL ICON OR DATA FIELD ACTION RESULT MFC Correction Factor Corr Factor 1 39 Click to enter value MFC Range Range SCCM Click to enter value Capman Pressure Capman Pressure MIA vi Capman Pressure Setpoint Lapmar Pressure SP Display only Click to enter value mT arr Capman Range Lapmar Range Click to enter text mT arr Wide Range Gauge Wide Hange Gauge Display only Sets gas correction factor for corresponding MFC as a function of nitrogen calibration Refer to gas controller manual s or web site s for gas correction factor tables Sets flow range of corresponding MFC in sccm max nitrogen flow Indicates Capman pressure in mTorr Sets desired chamber pressure in mTorr NOTE Requires one MFC in Mode 4 and corresponding gas valve open Sets the range of the capacitance manometer in mTorr NOTE Maximum value is typically 1000 mTorr Indicates wide range gauge pressure in Torr NOTE DO NOT adjust PID values for pressure control loop while in Pressure Control Mode Capman Pressure Proportional Term Lap Pres di Click to enter value 132 Sets proportional term for pressure control loop The proportional term determines the amount of change in gas flow to compensate for the difference between desired pressure and actual pressure the greater the proportional term the quicker the flow will change to adjust for pressure differences lar
29. Set MFC1 mode to 4 Set Capman pressure set point to 5 mTorr Wait for turbo speed to slow and pressure to stabilize this will take several minutes Select the Deposition screen Turn on DC power supply output see Figure 5 Set power supply ramp rate typically 10 20 watts per second Set power supply output set point to desired power If the voltage reads zero even though the power supply indicates current the source or cable is short circuited Switch off the power supply and take the proper corrective connecting measures see Troubleshooting section in KJLC TORUS manual Once the short is repaired repeat steps 2 9 A voltage reading of 600 1000 volts with no current could indicate several problems Turn off the power supply and follow the procedures outlined in the Troubleshooting section of the KJLC TORUS manual KURT J LESKER COMPANY 55 PVD 75 56 FIGURE 5 OPERATION MANUAL KURT J LESKER COMPANY OPERATION MANUAL PVD 75 DC SPUTTERED PROCESS EXAMPLE frmRecipeltems a EE eis P Recipe Set Abort Set Abort Recipe Abort Process Process i a WRG Pressure a Value lt n nn m LESE PC t Vac Throttle Turn EE Opening Valve PC High Vac Throttle Check_On Open EE 3 oa aa MFC1 MFC1 Mode Set SetValue n an n nn Valve Gas Injection Turn On Open a 7 Gauge SE Pressure SP Set SetValue nnn n nn 8 Gauge Capman Pressure Pressure Check Pressure gt n nn A
30. Term The integral term controls the time constant of the loop response A small term say 1 to 3 seconds will smooth the response of most loops D Term The differential term causes the loop to respond quickly to changes Use 0 or a very small value 1 x Term to avoid oscillations Shutter Delay It is often desirable to assure stable process control before the substrate shutter opens Enabling shutter delay requires that the system reach the programmed shutter delay Accuracy and maintain that accuracy before deposition begins If the accuracy is not reached within Wait seconds the process halts If INFICON SQS 242 Operating Manual accuracy is achieved and maintained for Hold seconds then the substrate shutter opens and deposition begins The Thickness reading is zeroed at the end of the shutter delay period Rate Sampling Rate sampling can extend the life of crystals With rate sampling the deposition rate is sampled for a period of time then the sensor shutter is closed Power is then held at the same level as the final power setting during the sample period Continuous selects no sampling the sensor shutter remains open during deposition Accuracy Based sampling opens the shutter until the desired accuracy is reached leaves the shutter open for Sample time then closes the shutter and holds power constant for Hold time Time Based sampling opens the shutter for a fixed period of time then closes it for a fixed ti
31. The OK button will then appear Click OK or press the enter key on the keyboard The dialog box will disappear and the Login Logout button will now display the username and the security access level of the logged in user At this point basic system operation is available to the user pumping venting sample loading unloading process selection and process execution It is usually a good idea to pumpdown the system upon startup unless the system has a cryo pump that requires regeneration in which case pumpdown initiation must wait until the pump is ready Running the standard PC Pumpdown process puts the system into a known state that is typically desirable before selecting and running a deposition process d Prior to running any process assure that all system connections have been properly made and all related documentation has been reviewed Refer to the Overview amp Definitions section of Software Operation for details regarding the function of Icons and Command Button processes KURT J LESKER COMPANY 167 PVD 75 OPERATION MANUAL STANDARD RECIPES A recipe is a collection of commands that can be used to perform a set routine Many recipes are pre programmed for customers These programmed recipes can be modified or copied then modified to suit your specific application The standard recipes involve basic functions such as abort routines pumping venting testing wafer transfer etc Use the Recipe Dat
32. are available for R amp D applications A cover plate obscures the pockets not in use to prevent vapor cross talk Multipocket sources are particularly convenient when depositing multilayer films on a single substrate Evaporants often spit and must be heated in a series of ramp soak steps in order to reach evaporation temperature The melt presents a high temperature source that thermally radiates the substrate KURT J LESKER COMPANY 65 PVD 75 OPERATION MANUAL SAFETY A DANGER DO NOT operate or service the E Beam source or power supply before reading and understanding the E Beam operation manuals A DANGER After power has been disconnected wait for at least 3 minutes before starting work on the power supply to allow the capacitors to discharge themselves Also use the grounding rod to discharge the capacitors and high voltage feed thru before coming in contact with them FIGURE 1 1 Visually inspect equipment daily for water leaks and equipment condition 2 Remove excess deposition from around the crucible and gun d Excessive flaking around the crucible or heavy coatings of deposition material on top of the e gun can cause the gun to arc affect the beam or operate improperly 66 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 SETUP The shutter limits or speed of open close may need to be adjusted over time SHUTTER SPEED ADJUSTMENT 1 2 3 4 5 6 Start by closing the speed adjustment v
33. close to the actual temperature then set the desired ramp parameters and finally the target temperature Over Temperature Indicator Owr E Display only Monitors for an over temperature condition When Auto Mode is enabled this field Temperature Indicator displays the current temperature control Temp setpoint If a ramp rate has been specified deg E Display only Api this field displays the temperature setpoint EN as it ramps up rather than the final target temperature Enter the Proportional coefficient for the Auto Mode temperature control loop The control loop is immediately changed The P term determines the change in heater Proportional Coefficient Click to enter output power applied to compensate for p GT value differences between actual and desired temperature Typically larger P terms are required for greater thermal mass CAUTION Disable Auto Mode while adjusting PID parameters KURT J LESKER COMPANY 141 PVD 75 OPERATION MANUAL ICON OR DATA FIELD ACTION RESULT Enter the Integral coefficient for the Auto Mode temperature control loop The control loop is immediately changed Integral Coefficient Click to enter value CAUTION This term does not typically need to be adjusted from its factory default value Disable Auto Mode while adjusting PID parameters Enter the Derivative coefficient for the Auto Mode temperature control loop The control D Request Click to enter loop is immediately changed
34. lt n nn BENE Sigma Sigma Load Process Turn On Open Opening A 31 sigma Sigma Start Process Turn On Open Opening EA A 32 sigma Sigma In Process Check On Open Opening Dy wes 33 Sigma Sigma In Process Check Off Closed Closing 1 34 Supply Rate SetValue nnn 100 35 Supply Setpoint Set Value 2 n nn Fgh 36 Supply EBOn Turn off Closed Closing 37 Supply gon Turn On Open Opening 38 Supply EBHVOn Turn off Closed Closing 39 Supply _ EB HV Off Tun On Open Opening 40 Motors Continuous Turn Off Closed Closing IL E Motors Planet Motor On Turn_Off Closed Closing eS E 00 Im KURT J LESKER COMPANY PVD 75 OPERATION MANUAL UNDERSTANDING THE 265 MODEL RECIPE Step 1 Steps 2 3 Steps 4 13 Steps 14 25 Steps 26 33 Steps 34 39 Steps 40 41 82 Always the first step in a recipe sets which Abort Recipe should be run in the event a step that has an AT Abort on Time fails Close both shutters To ensure that no deposition reaches the substrate before material conditioned and required rate obtained Sets Platen and Planet position Sets angle of substrate and rotation Turns off all other crucibles Step 19 turns on Crucible 1 which is the pocket needed for this deposition 14 19 Checks Crucible is in Position 20 Sets Setpoint to zero 21 Turns on EB HV 22 25 Steps 26 27 set up the Sigma shutter mapping St
35. rs Kal Wo Te BL ann GE 224 OUTS ELI TE 225 What ER QUISAS IM E 225 Outgassing Rate e E 225 Biesen 225 Reduce OUIBdSSITIB E 225 lee n E EE 226 Whatis HEEN sr Ee 226 Throughput let 226 Measuring I NTOUR DUT ues ee Deeg 226 Gas Load Eat Ne TT EE 227 eiweg eier EE 227 PUMP DOWN DEI VT 228 Manual Calculations EE 228 Computer Calculation sa 228 SIOWPUMPAOWA serian 228 Unit CONVErSIiOn Tables side 231 Material DepoSILIOR sn 234 Periodic Table OF the Elements asian E ea 242 Drawing Package OPERATION MANUAL PVD 75 WARRANTY EQUIPMENT WARRANTY AND REMEDY COMPANY warrants that the Equipment fabricated and furnished by COMPANY hereunder shall be free from material defects in workmanship and materials If any of the Equipment fabricated and furnished by COMPANY materially fails to conform to the warranty set forth in the preceding sentence CUSTOMER s remedy shall be limited at COMPANY s option to either i repair or replacement of the non conforming Equipment F O B point of repair or replacement with shipping charges prepaid by CUSTOMER or ii repayment of the portion of the contract price paid by CUSTOMER attributable to such non conforming Equipment Dismantling and reinstalling work is excluded from this Equipment Warranty and Remedy SERVICES WARRANTY AND REMEDY COMPANY warrants that any engineering design or software development and programming services furnished under COMPANY s proposal or quotation will conform to sta
36. see Figure 6 4 Set MFC1 mode to 4 5 Set Capman pressure set point to 5 mTorr 6 Wait for chamber pressure to stabilize d Most target materials can be sputtered with an Argon pressure of 1 to 15 millitorr but some materials will require a higher pressure 7 Select the Deposition screen Turn on DC power supply output See Figure 5 8 Set power supply ramp rate typically 10 20 watts per second 9 Set power supply output set point to desired power 54 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 10 If the voltage reads zero even though the power supply indicates current the source or cable is short circuited Switch off the power supply and take the proper corrective connecting measures See Troubleshooting section in KJLC TORUS manual Once the short is repaired repeat steps 2 9 A voltage reading of 600 1000 volts with no current could indicate several problems Turn off the power supply and follow the procedures outlined in the Troubleshooting section of the KJLC TORUS manual VARIABLE SPEED TURBO PUMP SYSTEM NO HIGH VACUUM VALVE 1 2 3 4 5 6 7 8 9 10 Pump down the vacuum chamber to high vacuum The choice of base pressures is left to the user and determined by acceptable impurity levels Select the Vacuum screen Set turbo pump speed to 50 see Figure 4 Select the Gas screen Open source gas valve or gas injection valve depending on system configuration see Figure 6
37. 1M Quartz Lamp Socket FCM Lamp Quartz 1000W 120VAC E S O V026 Exhaust O Ring 1 1 4 ID 1 16 Viton 8080255K001 Absorber SC or 8200 Compressors QLH1000 Substrate Heater Assembly includes QJ 1M and FCM KTIN 18G 18 Inconel Sheathed K Type T C PLATEN INCLUDING BIAS OPTION W C FTAWCUO94 OFHC Copper Wire 094 DIA W W W KURT J LESKER COMPANY 203 PVD 75 OPERATION MANUAL Substrate Holder Clip Substrate Holder Clip Hardware 4 40 x 0 25 Substrate Holder Clip Washer 4 Home Switch Assembly includes PM K24 Photoelectric Sensor for CA4101MTRHSW Timing Belt 60 Teeth Platen Rotation Timing Belt 65 Teeth Platen Rotation Timing Belt 70 Teeth Platen Rotation Hex Nut Alumina 8 32 RF End Conductor Alumina Insulator RF End Conductor Alumina Insulator Elbow RF Conductor Alumina Leg Cover 273 0010 1 S 3 4 x 3 8 inch Ceramic Standoff 6 32 Threads Ceramic Insulator Tube x 20 inch Z Shift Lubricant 5 ml Syringe ROCOL KLFDHC100 Rotary F T Inner Shaft O Ring O V037 KLFDHC100 Rotary F T Outer Housing O Ring HIGH TEMP PLATEN ASSEMBLY 550 800 C Box HEATER Reference Schematics PLA 2806 and HTR 3230 IN LEAD PART NUMBER DESCRIPTION CATEGORY QUANTITY STOCK TIME PLATEN INCLUDING BIAS OPTION N8 32A Hex Nut Alumina 8 32 PLA 28S039 RF End Conductor Alumina Insulator PLA 28S051 Ceramic Insulator Tube x 21 75 inch A6R3 060037 Timing Belt 60 Teet
38. 735610 1 1 868 x 10 2409x107 3613x 10 1 868 1 kale 0 9678 0 8807 9 807 x 10 28 959 3997 x1 imbar 9869x10 1x1 1x 10 2 953 x 10 04015 imTor 1316x10 13332x 105 133 3927x10 5352x10 1Pa 9868x105 1x10 10 2953x10 4 0146 x 10 6 805x 10 6895x107 6895 x 10 2 0 2768 1 Tor 1316 x10 1333x107 1333x10 397x107 05352 1 0197 x 10 1 3595 x 10 1 0197 x 10 7 031 x 10 1 360 x 10 7 3556 x 1 7 5006 x 10 7 5006 54715 x 16 14 223 1450 x 10 1934 x 10 1 4504 x 10 3 8067 x 10 100 0 13332 6 8948 x 10 13332 x 10 1934 x 10 1 7 3556 x 1 0 72006 1x10 7 5006 x 10 Pumping Speed Units 1 CFM 1 28 317 0 47185 1 69902 2 8317x10 1 Limin 3 5311x107 1 1 666 7x10 6 0x10 0 001 1 Us 2 11887 60 1 36 0 06 1 nrhr 0 5885 16 667 0 27778 1 1 6667x10 1 mimin 35 311 1 000 16 667 60 1 micron L s molecules s Torr L s 1 scm 1 12 667 4 4807x107 16887 12667x107 1 micron L s T 88510 1 3 5374x10 0 1333 0 001 1 malecules s 2232010 282010 1 3769x100 282710 1 Pals 0 5922 7 50 2 653x1017 1 7 xi 1 Torr L s 78 95 1 000 35371019 1 33310 1 Note 1sccm 1 0916 atm ccimin at 25 C micron L s 1 atm co s 1 0 1013 1 Pama s 9 869 1 1 TorrL s 1 316 0 1333 1 mbar Ls 0 9869 0 1 1 micron Lis 1 316x107 133210 Outgassing Rate Units PaL m s 0 76 1 50 0 75 0 001 hud 1 013 10 1 333 1 333105 7 6x10 7 50x10 1000 750x107 1 Torr Lier
39. ABOVE Maintenance K5979 SP1 Direction K5979 SP2 Direction K5979 SP3 Direction KS979 Gas Correction Feedback MKS979 Device Type MKS979 Firmware Version MKS979 Manufacturer MKS979 Hardware Version MKS9 9 Serial Number MKS9 9 Transducer Temperature MK5979 Transducer2 Temperature MKS979 Active Filament MKS979 MicroPirani Pressure MK5979 Gas Type Value ra 75 in ce LO LO Ew LO co E Mo o 2 Ei Bk 3 o g an Q e MKS979 Degas Status MKS979 Filament Status MKS979 SP1 Enabled Status MKS979 SP2 Enabled Status ME MKS979 SP3 Enabled Status 8 Logout KJLC Super User Exit 1 MKS979 Hot Cathode Pressure MKS979 WAG Pressure MKS373 SP1 Value MKS373 SP2 Value MKS373 SP3 Value MKS373 Hist Value MKS979 Hist2 Value MKS979 Hist3 Value MKS979 SP1 Direction Value MKS979 SP2 Direction Value MKS979 SP3 Direction Value MKS373 Enable Control SP Status MKS979 Protect SP Status PVD 75 xl Start Main Process Help d This software screen provides an interface allowing the user to communicate with the MKS979 gauge Also see the component manual for additional details ICON OR DATA FIELD Control On Off OFF Set Points MESS 8 AF SP Feedback MESSY Device Type KURT J LESKER COMPANY Click to activate ACTION RESULT Turns on and off the corresponding MKS979 control
40. Be sure all devices exposed to operating personnel are electrically connected grounded and protected properly Before turning on the electrical power to the source check to ensure that the anode and the cathode of the TORUS source are isolated and the chamber the body of the electrical connector and the anode Dark Space Shield and Body are grounded KURT J LESKER COMPANY 51 PVD 75 SETUP OPERATION MANUAL Over time the shutter open close speed may need adjusted 1 2 3 4 5 6 Close the shutter speed adjustment valves clockwise see Figure 1 Toggle the shutter to open the shutter should not open yet Check which airline has pressure on it and slowly adjust the other speed valve counter clockwise until the shutter opens Toggle the shutter to close the shutter should not close yet Slowly adjust the other speed control valve counter clockwise until the shutter closes Recheck the shutter open and close and adjust the speed valves so that the shutter operates smoothly Shutter speed adjustment valves FIGURE 1 SYSTEM EQUIPMENT REQUIREMENTS Typical sputtering systems will have the following interlocks Water Flow Sensors For Each Sputter Source Vacuum Switch When the water supply and return valves are open the water flow switch should be satisfied resulting in the flow switch changing from gray to green 52 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 When cooling water
41. C CLAMP ALUMINUM QF16 CAST 1 2 amp 3 4 PT1000F25 5 CLEAR REINFORCED HOSE ASSEMBLY 1 ID QF25 SFT PT1500F40 5 CLEAR REINFORCED HOSE ASSEMBLY 1 1 2 ID QF40 5FT 32 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ADDITIONAL UTILITY CONNECTIONS The previous information listed the basic components and parts that may be needed in the installation of your new KJLC system Various configurations may require specific connection components to complete the installation process Please reference the system schematics and utility documentation to determine exact system requirements START UP Prior to the start up and operation of any system equipment the intended operator should review the individual equipment manuals and this Operation Manual 1 2 3 4 5 6 7 8 9 10 Ensure that all utilities are properly installed per the previous section With all of the power distribution unit s secondary circuit breakers off turn on the main circuit breaker Systems with 3 phase power should determine that all phase lights on the power distribution unit are illuminated Verify that the start stop circuit is on and that all EMO buttons are not triggered reset by pulling out and rotating Leave the system in a stopped state when this test is complete Turn off the power switches on all instrumentation and plug strips Start the system power and turn on the breaker s for the instrumentation outlet strip s
42. Care should be taken to assure that cleaning agents and cleaning procedures do not form a negative reaction with the materials used in the deposition chamber Refer to MSDS for handling instructions Run off from deposition component cleaning may be poisonous and requires appropriate disposal d As part of the preventative maintenance of the system all heater bulbs and their connections should be inspected periodically KURT J LESKER COMPANY 181 OPERATION MANUAL PVD 75 PREVENTATIVE MIAINTENANCE SCHEDULE Maintaining your system according to the schedules and procedures given in this document will help to keep your system operation trouble free while preserving your investment When your system needs maintenance your service representative is specially trained in customer service and providing technical support for your unique system The following information should be used when customer service is required North America Phone 800 245 1656 ext 7311 or 7557 Fax 412 384 2745 E mail systemscustomerservice lesker com Europe Phone 44 1424 458100 Fax 44 1424 458103 E mail systemcustomerserviceeu lesker com Asia Phone 01186 21 50115900 Fax 01186 21 50115863 Email systemscustomerservicecn lesker com For all other regions contact North America customer service Actual maintenance intervals may vary depending on tool use The schedules and procedures in this document are based on projected normal usage a
43. Clicking on the signal value will toggle its state l Click to activate and will also change the state of the Signal Value corresponding equipment For example clicking on the Gun2 shutter Signal Value is the same as clicking on the actual shutter indicator on the Operation Deposition screen Displays the current state of the Signal State corresponding discrete input at system tartup l Click to force signal SR Signal State Discrete inputs can be forced by clicking on the corresponding Signal State Indicates whether or not the current signal is Is Forced forced Ee Display only 2 Dorce False Unforced signal True Forced signal Generates a table in the folder C Program Files Lesker Company Name Data Click to activate Generate Data Log Datalog mdb The table name is the date and time the table was created Generate Data Log Suspend Screen Updates Stops the constant screen update to allow the Click to activate l Suspend Screen Updates user to easily select signals to be forced KURT J LESKER COMPANY 147 PVD 75 OPERATION MANUAL ANALOG SCREEN 0 0E 0 11 50 31 AM 8 4 2006 i ker Logout KJLC Kurt Lesker eng i See geen Discrete Analog Strings Ethemet IO Analog Outputs Recipe Database Cap Pres D DS 05 100 00 mTorr Run Recipe Cap Pres I 2 2 000 1 SCCM Start PC Pump own Cap Pres P 6 6 000 0 SCCM Start PC Vent HEHHE Capman Pressure SP 0 0 mTorr Power Supplyl Outp
44. Close the tank or wall supply valve put the gate valve in the throttle position open system gas valve s and fully open needle valves When finished close all system gas valves open the tank or wall supply valve and adjust line pressure to gt 5psig and lt 15psig Verify that the system is under high vacuum Verify that required gas is hooked to the system Put the high vacuum valve in the throttle position Open the gas inlet valve and the appropriate gas channel valve s and set the gas flow chamber pressure to the desired setting This setting usually lies between 1 5 and 15 mTorr for deposition or 100 and 400 mTorr for glow discharge When finished close the gas inlet valve and the gas channel valve s and set gas flow chamber pressure to zero Turn off throttle valve full open A DANGER Use appropriate safety measures for gas type s selected to prevent personal injury or equipment damage 48 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 AUTO PRESSURE CONTROL 247 250 1 2 3 4 5 6 7 8 9 10 11 12 13 14 If hooking up the system for the first time or changing to a new tank proceed to step 2 If using a previously used set up go to step 6 Use only clean lines to connect gas to the system Purge gas lines while connecting Pump down the system Pump out gas supply lines Close the tank or wall supply valve throttle the gate valve open system gas valve s and fully o
45. Communicates the value entered with the Click to enter text No action MKS979 gauge Provides feedback as to the status of the corresponding reading from the MKS979 gauge 143 PVD 75 OPERATION MANUAL Kurt Lesker Logout KILC Kurt J Le ompany 0 00 05 Closed Off Ent Super User ABORT Version 2 23 Vacuum Deposition Motion Heating Cooling Sigma O 505 242 Crystal Status Power and Source Map Dutput Sigma Launch 242 Sigma Simulation Mode aie Su Xtal O de PWS Recipe Database Output 1 coi REES ER 1 6 PWS 1 6 l Dutput 2 2 7 Ebeam Sigma Control Sigma States ILI EK gg Ei EL E 8 Evap Output 3 Sigma Start Process p so EE coo MIN O E Stat PC Pump OFF oK Output 4 Layer ES Crystal 4 KE Eg ES Start PC Vent Sigma Stop Process EE EB Crystal 5 Shutter Control m OFF OKT Crustal 6 Not Mapped Shutter Map 14 Substrate Subst Index MN y 1 10 Source Shutter 1 10 15 lon Source Crystal 7 Jl 16 Ebeam Interface Status MI 12 XTL2 19 DualxTL1 47 Evap Crystal 8 13 xXTL3 20 DualxTL2 18 XTL4 Delay Shutter Mapping Sigma Delay Process Info Phase OK Sigma Data Set Number i Sigma Conto Request e mmm asi Shute Manor Signa Process Name TER st gt Sigma Film Nene E or Operation System d CWare provides a basic interface for the Sigma Recording Start Help AN controller Refer to the S
46. Deposition build up or flaking on shutters vacuum wash and dry thoroughly Film Thickness Monitors continued Check to ensure shutter operates smoothly over its full Proper shutter operation range of motion In the open position no portion of the crystal should be covered Inspect for proper crystal material Deposition of certain materials may require use of certain Refer to manufacturer s manual types of crystals Any pressure rise in an adjacent chamber upon venting another chamber Rising Clean the sealing surfaces and pressure in an adjacent chamber could clean or replace the seal indicate a leak across the valve Assure proper alignment and Z shift connection prop g tighten Clean all motion surfaces If this does not correct the problem Smooth rotation in directions of travel the guide shaft may be distorted or the guide bushing may need to be replaced Chamber Isolation Valve Cassette Stages KURT J LESKER COMPANY 187 PVD 75 OPERATION MANUAL ALL MODULES COMPONENT INSPECT FOR COMMENTS Adjust clean and lubricate Bearings should be lubricated Gears Wear debris or misalignment Components with Fumbling 25 6 Bushings Bearings should move freely though their full range of and gears should remain Bushings motion unlubricated however all particulate should be removed Replace all worn parts Wear or debris on RF contact components and surfaces Contact springs must be fully Remove all par
47. Deposition screen 2 Turn the KRI Discharge Controller off via rocker switch manually 3 Turn the KRI Filament Controller off via rocker switch manually 4 Turn the KRI Auto Controller off via rocker switch manually 5 Turn the Source Gas valve off for the lon Source FILM THICKNESS MONITOR CONTROLLER Please refer to the Film Thickness Monitor Controller manual for detailed information on operating this device This manual can be found in the supplemental documentation binder d Operator is responsible for setting density and z ratio based on material Operator is also responsible for calibrating tooling factor based on characterization runs EMERGENCY OFF RECOVERY d Emergency Off button would have been pressed due to a hazardous condition Before recovery of system ensure that hazard no longer exists What happens when the EMO Switch is activated All power to the system is immediately shut off The only component left energized is the System Power Distribution Unit Pulizzi Figure 1 The systems Monitor and PC will stay powered on for approximately 15 min They are powered by the onboard Uninterruptable Power Supply UPS Also if the system has a Cryo its temperature controller will be powered by the UPS See Figure 2 106 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 FIGURE 1 SYSTEM POWER DISTRIBUTION UNIT PULIZZI Cryo Lakeshore Temperature Controller Power CH Battery Backup surge Protection WA
48. Gold Sample E Rename Bew Delete Copy Deposit Condition Source Sensor Errors Shutter Delay Rate Sampling l Enabled Continous r Accuracy Accuracy Baz n SE C Time Based IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Film A dropdown box that selects the film parameters displayed in the edit film dialog box Rename Edits the name of the selected film New Creates a new film Delete Deletes the currently selected film from the database A film cannot be deleted if it is used in ANY process To delete a film you must first delete the film from each process where it is used Copy Creates a duplicate of the currently selected film The function of each Edit Films tab and its associated controls are identical to those detailed in the Edit Processes section Please consult section 3 5 1 on page 3 8 for that information 3 5 3 Edit Materials The Edit Material dialog see Figure 3 16 provides the functions needed to build a materials database In addition to the functions listed below the main dialog box SoftKeys provide capabilities to add edit delete materials Figure 3 16 Material dialog ef Material xl Rename New Delete Material Density Z Factor qm soc Rename Edits the name of the selected material New Creates a new material Delete Deletes the currently selected material from the database A material cannot be delete
49. HADRON COLLIDERS Moving electrons or ions from here to there as in x ray tubes beam lines mass spectrometers etc demands high vacuum Why Because electrons ions will be deflected by attach to or ionize any residual gas molecules they encounter Vacuum creates conditions in which charged or uncharged particles can be moved around without collision MIRRORS Evaporating aluminum as a thin coating on glass or plastic makes a wonderful headlamp reflector DVD or rear view mirror But try evaporating aluminum in air and the result is aluminum oxide a white substance not noted for its reflective properties Vacuum prevents chemical reaction with air CAMERAS All good camera lenses are coated with an anti reflective layer so the maximum amount of light arrives at the film or digital processor By contrast architectural glass is coated with partially reflective layers for visible or infra red wavelengths Any oil or water vapor absorbed on the glass surface prior to coating ruins the process Vacuum helps removes absorbed contamination from surfaces HALLOWEEN MASKS Vacuum forming is a common process for making plastic Halloween masks compartmented lunch trays and disposable razors The plastic sheet is heated to a deforming temperature and the air removed between it and a metal mold Vacuum removes air to create a differential pressure NEON SIGNS Neon signs contain neon and other gases for different colors electrical switch
50. Kurt Lesker 00 22 Closed 0n Exit ESI ABORT Vacuum Deposition Gas Motion Cooling Heating Capman Pressure Pressure Control Capman Capman Recipe Database Pressure SP Range 100 00 mTorr 0 mTorr 00 mTorr sky Source2 Gas V pe Run Recipe Wide Range Gauge 7 Cap Pres 10E1 Tor Cap Pres D 02 Start PC Pump Start PC Mert sk Sourced Gas Start LL Pump Mode 0 MFC flows at the current flow set point Mode 1X MFC is slaved to MFC X Mode 4 MFC controls flow to match the capman set point MFC Modes Start LL Vent Setpoint Flow Cor Range SCCM SCCM Node Ratio Factor SCCM wa Sr qe pr fo MFC2 fo oo0 0 fo 100 E o0 MFC3 fo o00 0 fo 100 D Dm Start Transfer 2 E Gas Injection a HEEE Argon Etch Recording Start Operation System Help ICON OR DATA FIELD ACTION RESULT MFC Setpoint Setpoint SECM Click to enter value ol Sets MFC flow in sccm NOTE Applies to Independent Mode only Display only Indicates gas flow from corresponding MFC Sets mode of operation for corresponding MFC Click to enter value Mode 0 Independent Flow Mode Mode 1X Slave Mode X master Mode 4 Upstream Pressure Control Mode Sets MFC flow as a percent ratio of master MFC Ratio channel Slave Mode Ratio 2 Click to enter value MM Sets MFC contribution as a percent of full range PID Pressure Control Mode KURT J LESKER COMPANY 131
51. Layer and Rate Ramp tabs must be set for each layer in a process Settings on the remaining four tabs Deposit Condition Source Sensor and Errors correspond to the Film that was selected on the Layer tab This allows a Film s settings to be used in a number of layers without the need to individually adjust each layer IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual 2 2 4 Edit Deposition 18 Select the Deposit tab See Figure 2 6 Figure 2 6 Deposit tab Layer RateRamps Deposit Condition Source Sensor Errors Shutter Delay Rate Sampling Enabled Continous ACCUFacsy t Eun 10 00 a C Time Based Wait Hold sample Hold Dec Dec 3 00 SEE Sec 19 Set gain P Term to 55 20 Set time constant I Term to 0 7 21 Set dead time D Term to 0 22 Be sure Shutter Delay Enabled is not selected 23 Set Rate Sampling to Continuous 2 2 5 Edit Pre Post Conditioning 24 Before deposition begins the source material is often brought to a ready state by slowly raising the evaporation source power Select the Condition tab and set each parameter to the values shown in Figure 2 7 Figure 2 7 Condition tab Layer RateRamps Deposit Condition Source Sensor Errors Fre Condition Post Condition Lomp Pur Ramp Pur Feed Power Idle Power 15 00 50 00 a E Auto o Ramp Time Rampe Time Ramp Time Ramp Time Sec SEC SEC Soak Time cCnakz Time Feed Time SEC SEC Sec
52. Pressure MES979 Enable Set Pointl Platen Motor Errors MES979 Enable Set Point2 Platen Motor Moving MES979 Enable Set Point3 Platen Motor Referenced Operation DATALOG SCREEN 1 KURT J LESKER COMPANY 173 PVD 75 OPERATION MANUAL 3 Highlight the signal names that you would like to Data Log x E SS ystem Strings Copyright 2009 Kurt J Lesker V4 33124 i Signal Value MES979 SP3 Direction Value BELOW e Been e 0 Nu oe E zm e Ber MES979 Enable Control SP Tor MES979 Enable Set Point GE 005 MKS979 Enable Set Point3 0 0 0 Dperation DATALOG SCREEN 2 174 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 4 Click Suspend Screen Updates to deactivate 3 System Strings Copyright 2009 Kurt J Lesker V4 33124 Lesker F Logout KJLC Kurt J Lesk EX TL ERUTTTLZN Closed Off Exit Super User ABORT Version 4 33124 Discrete Analog Strings Ethernet I0 L String Ouiputs Siring Inputs MES979 AF SP 1 1 MES979 SP3 Direction Value MES979 Atmosphere Cal 0 0 MES979 SP3 Enabled Status 0 Normal MES979 Auto Initialize 0 0 MES979 SP3 Value 1 00E 0 Normal MES979 Cal Gas Type 0 0 MES979 Time On 258 Normal MES979 DAC SP 0 0 MES979 Transducer Status Hot cathode Normal MES979 Degas On 0 0 MES979 Transducerl Temperature 2 89E 01 Normal MES979 Emission Current 1 l MES979 Transducer2 Temperature 2 530E 02 Normal MES979 Enabl
53. Pressure SP Start PC P Cubs Shutter D Substrate Heater Ramp Rate fo mTorr E ia 24 Substrate Heater Temperature Start PC Vent Power stats ipid Poner i DC Setpoint Units U s Ww W Bias Watts Volts Amps Start LL Pump Power Supply 1 n Watts fo ooo0 ooo0 ooo0 Start LL Yent Source Configuration Power Supply 2 OFF fo Watts fo nno Et 0 0 Material Target KWHrs Start Transfer afer E EE B EN 77E2 Power Supply 3 OFF 10 Watts 0 0001 0000 0 0 NEE 5 f Ed Power Supply 4 OFF 0 Watts fo ooo0 Lt ooo0 Source3 Material fa E 6 0E 2 Source4 Material fa H 7 08 2 PON Mate al o b Ea Power Supply 6 OFF fo Watts fo ooo0 0000 ooo0 Recording Start Operation System Help ICON OR DATA FIELD ACTION RESULT Shutter Indicators da8dddH d Green Open Display only Gray Closed Source Switches OFF Click to activate Turns respective source switch on off Source Material Target material is displayed on the i Click to enter current ve mme Operation Deposition screen and target material l AO recorded in process and manual datalogs Source Power Supply Click text to map source to a particular na l Mapping p will increment accordingly when the d Target prose anota ied respective power supply is on and has am switch position if OSitive output power applicable B PSP The mapped source k
54. Process Database The SQS 242 normally starts with the last active process displayed If that process is not found a Database Open dialog is displayed Main Display As you operate the SQS 242 the six SoftKey labels along the left of the dialog box will change to display appropriate functions Along the top of the display is a menu of less commonly used functions This menu is available only when the SQS 242 is stopped i e not running a deposition process Simulate Mode Simulate mode allows you to familiarize yourself with SQS 242 operation and test process recipes Simulate Mode will be used for the remainder of this chapter If the first SoftKey is labeled START SIMULATE then the Simulate mode is active Otherwise click the Edit menu selection along the top of the display then click System On the Card tab click the Simulate button Select the Close SoftKey to activate Simulate mode INFICON SQS 242 Operating Manual 2 2 Single Layer Process Setup We will build a simple single layer process as an introduction 2 2 1 Create a New Process 1 Click Edit gt gt Process 2 Click New See Figure 2 1 Figure 2 1 Process Edit dialog box Process Edit Sample Save Rename lew Delete Copy Layer Out Film cetPt Gold Sample Cut Layer iwer Sample 15 Copy Layer Paste d ET Thickness Time Layer RateRamps Deposit Condition Source Sensor Errors Film Output Input
55. Process Edit dialog aM Process Edit Sample Save Rename Delete Loopy T Layer Out Film Thickness Time Gold Sample Cut Layer wiwer Sample Copy Layer Paste Layer Paste Collep Layer RateRamps Deposit Condition Source Sensor Errors Film Output Input Gold sample Output 1 Sensor s c etPt Final Thick DEE EndFt m EndFt System Setup ATS k Auto Start Continuous Source Substrate LIserl Iserz CS Manual None None None None B Po Indexers Index Index Index Index Controls along the top of the Process Edit dialog box apply to the entire process Process A dropdown box that selects the process to be edited Defaults to the current process Below the process dropdown a listing of each layer assigned to the Process CoDeposition layers are listed with the same layer number but a different output Rename Edits the name of the selected process New Creates a new process Since every process must have at least one film the first film of the currently selected process is used Delete Deletes the selected process from the database There is no undelete Copy Creates a duplicate of the currently selected process IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Layers List To select a process layer click on it in the Layers list Cut Copy Paste the selected layer as described below Cut Layer Rem
56. Pump own PC Turbo Vent Valve 0 0 PC Turbo No Fault Start PC Vent Power Supply 1 0 0 Srel Flow Switch Roughing Pump 0 0 Substrate Heater Not Over Temp Source Shutter 1 0 0 Vacuum Sa PC Source Shutter 2 0 0 Source SW 0 0 Source SW2 0 0 Substrate Heater 0 0 Rotation Start Substrate Heater Auto 0 0 gt Recording Start g 1 Operation System Help e T 3 BI Ei T o E a o ei d This screen is primarily used for troubleshooting and selecting datalog items It is recommended that operators other than the system administrator do not have access to this screen Users can be denied access to this screen based upon their login parameters see the System Users Screen and the Security section of this manual A CAUTION Failure to follow the proper preventative maintenance procedures could result in premature failure of the system or components A CAUTION Forcing discrete inputs can override interlocks When system troubleshooting is complete you must remember to reset un force signals 146 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ICON OR DATA FIELD ACTION RESULT Signal Click to select or All Discrete Outputs and Inputs are listed in Signal deselect alphabetical order Initial Value Displays the initial condition of the Display onl corresponding discrete output at system Initial Value p ay y See 5 H y Displays the actual current state of the corresponding discrete output Signal Value
57. RF power supply output see Figure 5 Set power supply ramp rate typically 10 20 watts per second Set power supply forward power set point to desired power Check for the presence of a plasma if there is no plasma raise the pressure to 50mTorr of argon in the process chamber If still no plasma briefly go to manual tuning on the matching network and return to auto tuning If there still is no plasma briefly open the source shutter Another method is to fire up another source in the chamber if available which will help ignite the plasma d If the sputtering source is being powered through a cable connected from the matching network monitor the temperature of this cable and the connectors for excessive heating Excessive heating can be caused by low impedance at the sputtering source This results in high current loads through this power transmission cable Please contact a Kurt J Lesker Company Applications Engineer for further discussion if cable temperatures exceed 80 C 11 When a plasma has been established reduce the gas pressure to the required setting KURT J LESKER COMPANY 59 U RE MFC Mode setting for Auto Pressure Control set to 4 60 FIGURE 6 OPERATION MANUAL Source Gas Valve KURT J LESKER COMPANY OPERATION MANUAL PVD 75 RF SPUTTERED PROCESS EXAMPLE frmRecipeltems EquipmentltemOpera Equipment T T E t JE tit quipment Equipmentltem Ge VEI GRST Rede Set
58. Sensor Relays 2 and 4 will close when Shutter Delay is entered INFICON SQS 242 Operating Manual If the software is configured for dual sensors the relay operation is considerably different Dual sensors use pairs of sensors i e Sensor 1 and 2 or Sensor 3 and 4 With Sensors 1 or 3 selected the associated relay contacts are open If a Crystal Fail is detected the relay contacts for the failed sensor will close to select the second sensor in the Dual Sensor assembly for the duration of the film Xtal All Good and Xtal All Fail Relays These two relays provide an indication of the general health of your sensors If the Xtal All Good Relay is closed then all enabled sensors are returning a valid reading If the Xtal All Fail Relay is closed none of the enabled sensors are returning a valid reading Process Stopped and Running Relays These relays indicate the overall status of the process The Process Running relay closes as soon as Start Process is selected by front panel or digital input and opens when Abort Process is selected Even if a layer is stopped within a process the Process Running relay remains closed until the last film of a process has finished The Process Stopped relay contacts behave in the inverse manner Layer Stopped and Running Relays The Layer Running relay closes as soon as Start Layer is selected by front panel or digital input and opens when Stop Process is selected The Layer Stopped re
59. TECH j System SUPV Exit TECH j Security SUPY Main Form Settings TECH j 3 6 View Menu The View menu controls the appearance of the main display Film Settings Displays hides a ribbon of commonly accessed process settings along the right of the dialog box Additional process parameters are available in the Edit menu When displayed the settings ribbon allows the user to easily modify process settings during deposition without leaving the main dialog box Changes are made to the current process and the process database immediately In CoDeposition first click on the desired film to display its parameters Film Readings Displays hides film deposition readings along the bottom of the dialog box Readouts of Film Rate Deviation Thickness and Power are displayed simultaneously for each of the active outputs The rate deviation and thickness readings displayed represent an average of the quartz sensors assigned to each film Sensor Readings Displays hides a pop up window of sensor rate thickness remaining life and frequency readings Unlike the main dialog box s Film Readings this display is the raw data coming from each sensor In addition the output i e PID control loop that each sensor is assigned to is displayed Sensor assignments are established on the Sensor tab of System dialog box A P in the Control column indicates the sensor is the primary sensor of a dual sensor pair S indicates a secondary sensor An
60. TIMEOUT EXAMPLE Equipment E E E E SEQ Equipment Equipmentitem quipmentltemOperation Test Value GRST Recipe 3 Recipe Items Detail TimeOut for Wait eq TimeQutllessage Crucible Mot in Position Goto Sequence No if 999 999 Abort if Timeout Timeout SkipRecipeltem Ramp Units sec Notes not for display ABORT IF TIMEOUT SET UP Step 1 Set the Abort recipe Abort Process Steps 2 4 Turn off crucible positions 2 3 and 4 Step 5 Turn on crucible position 1 Step 6 Check step Recipe will verify that Crucible In Position is on for 60 sec If Crucible In Position signal fails to be on when checked feedback that says pocket is in position then it will run the Abort Process Recipe as 999 is inputted in GotoSequence 84 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 MATERIAL REPLENISHING A DANGER DO NOT operate or service the E Beam before reading and understanding the E Beam operation manual Failure to comply may result in danger to user damage of equipment and void the warranty 1 Follow the E Beam shutdown procedure as outlined in the manufacturer s operation manual 2 Vent the vacuum chamber 3 Ground all high voltage F T with the discharge rod 4 Replenish crucible Crucible should generally not be filled with material by more than 2mm above the crucible edge At least one third of the crucible volume should remain filled during the process CLEANING AND MAINTENANCE A DANG
61. Update VB Geh have been made Updates Visual Basic with any changes that KURT J LESKER COMPANY 161 PVD 75 CONFIGURATION Recipes Configuration E d V Recorded Data Action Log 34 Interlocks 2 Sigma Data Sets ow Configuration H System Users Import Interlock Items 9 Help EE Recipes Use v S AITAITA ITAIT AITAITA AA CN ME ME NE I Update VB Name Mumeric String ChamberPressureTrip 0 CryoCold 40 CryoHot 288 CyoRoughingPressweTnf DI DepositHeightHigh MO FO CaesiumOPScaling2 0 03 65 DCHuttingerDCPowerLimi 0 OPERATION MANUAL 12 x Type a question For help amp x Import Recipe Import Sigma Data Get This screen contains important setup information that affects and enables computer control of the system The only field that customers should change is the RecordingRateDefault Changes to any other data on this screen should only be made by KJLC Engineers or under the guidance of a KJLC Engineer ICON OR DATA FIELD ACTION RESULT Recording Rate Default Recording ateD efault 5 value Click to enter Enter the rate in seconds at which the computer should record system data 162 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 SYSTEM USERS Recipes System Users E 181 x Help EE Recipes Recorded Data 4_ Action Log 34 Interlocks Sigma Data Sets ow Configuration By System Users Type a questi
62. Verify that the top SoftKey label displays START SIMULATE If START PROCESS is displayed follow the instructions at the end of section 2 1 to enable simulate mode Press the START SIMULATE SoftKey to start the process The process will start with preconditioning i e Ramp1 Soak1 Ramp2 Soak2 as shown in Figure 2 11 Once preconditioning is complete the process will enter the Deposit phase Figure 2 11 Preconditioning f SID142 View Thick kA Power 0 006 50 0 You may want to select ABORT SIMULATE then START SIMULATE several times to familiarize yourself with the on screen displays during preconditioning You may also want to use the settings ribbon to adjust parameters while the process is running IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual 2 3 3 Preconditioning Phases Because we selected Automatic in the View menu the graph displays Output Power during preconditioning then switches to Rate during the deposition phase As shown in Figure 2 12 the initial deposition rate was 10 A s until a thickness of 400 kA Then the deposition rate was ramped up to 15 A s and held until the desired final thickness of 1 000 kA was achieved At this point this single layer process is finished Figure 2 12 Deposition Rate IST LR EVA View Process SAMPLE Time Run 0 01 29 7 78 YA NEXT Rate A s BEYA EA Thick kA Power SETTING Gold Sample 15 0 0 0 790 56 9 2 3 4 Deposition Ph
63. and processor speed e Data log will continue to run until Recording Stop is depressed e Entries have a time date stamp KURT J LESKER COMPANY 177 PVD 75 OPERATION MANUAL After data logging is stopped 1 Goto C drive 2 Goto Program files 3 GotoLesker 4 Goto Company name XYZ 5 Go to Data 6 Goto Datalog mdb The table name is the date and time the table was created e Data log puts the logged information into cells e These cells can be saved as an Excel file to make graphs etc d This should only need done once at the beginning to clean out old signals or if there is an error caused by two of the same line item It is imperative to click Data Log before clicking the Record Start and Record Stop If Data log is not clicked first the data will only APPEND to the last table Next click Generate Data log to create a new table The Datalog mdb file will not open from its current location when the Cware software is up In order to view the data log files while Cware is operating the user must copy not cut the entire datalog mdb file and place it in another location for example in My Documents to open the file and gain access to the tables SHUTDOWN Pressing the Exit button at the top right of any Runtime Software screen will close both the Runtime Software and the System Database nit d If running Sigma shut Cware down first and then Sigma 178 KURT J LESKER COMPANY OPERATION MANUAL PVD 7
64. apply Rocol grease on lead screws and Fomblin 25 6 on all bearings If lubrication does not correct the problem the guide shafts or lead screw may be distorted or the guide bushing may need replaced Replace the guide shaft or lead screw as required Verify wire connections and replace wiring or the switch if required Replace the bellows at or before 10 000 cycles of operation Replace the lead screw and drive nuts at or before 10 000 cycles of operation Clean adjust and lubricate Bearings should be lubricated with Fomblin 25 6 If the shaft is misaligned adjust the bearings to ensure normal travel KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ALL MODULES COMPONENT INSPECT FOR COMMENTS External cable connection shorting When External power cables are removed and reinstalled Thoroughly clean the connector Power conductive particulate can begin to insulator from all particulate or Connections accumulate inside the connector on the replace the cable insulator Manufacturer s recommended maintenance Refer to manufacturer s manual Assure vacuum line connections Poor fore line pressure Leaking vacuum lines are tight and the exhaust port is or blocked exhaust ports can affect pumping free from blockage Fore line performance pressures should be logged for reference Mechanical Pumps Inspected by Date AUTHORIZED SIGNATURE KURT J LESKER COMPANY 197 PVD 75 OPERATION MANUAL 30 DAY MAINTENANC
65. automation available MANUAL OPERATION The procedures described on the following pages are for manual operation of the system and its components d There may be sections of this manual that describe optional features that are not included in your system configuration Please disregard these sections KURT J LESKER COMPANY 35 PVD 75 OPERATION MANUAL PUMPDOWN PROCEDURES This section describes pumpdown procedures for various system configurations CRYOPUMP WITH LOAD LOCK CHAMBER 1 2 3 4 5 6 7 8 9 10 11 12 Verify all connections to the system are made Power water process gas vent gas and vacuum connections to mechanical pump should be checked Verify that the cryo pump is cold and ready for use lt 20K If not refer to Cryo Regeneration procedure Refer to the On Board manual for On Board cryo pump regeneration procedure Verify that both the process chamber and the load lock chamber are at atmosphere If not refer to the Chamber Vent procedure Open the load lock isolation valve If operating the system for the first time open the capacitance manometer isolation valve if installed and any gas isolation valves Start the system roughing pump and verify that the foreline pressure is less than 1 Torr Open the roughing valve Open load lock gate valve if applicable System roughs through the load lock turbo pump Rough the system to approximately 500 Torr as read by
66. based on a patented modified Penning Discharge Principle which incorporates powerful permanent magnets and specific pole pieces to configure the sources magnetic field just above the plane of the target The result is a combination of film uniformity deposition rate target utilization operation at lower vacuum chamber pressures and efficient power usage With a TORUS source movement of the secondary electrons emitted during sputtering are confined by an electrical field and a strong magnetic field the TORUS captures electrons released near the target concentrates them and employs them to develop higher sputtering power Resultant films are uniform homogeneous and small grained they have high density low void area with high specularity reflectance and are free of radiation damage and broken bonds SAFETY e Aproper earth ground connection is required to avoid electrical shock and fire hazards e Great care must be taken to ensure the following ALL sources of high voltage are isolated prior to connecting disconnecting equipment ALLhigh frequency sources are isolated prior to handling any equipment connections e Lack of proper coolant flow to the source can be potentially harmful to the user and will damage the sputtering source Visually inspect equipment daily for water leaks and equipment condition ELECTRICITY The TORUS source operates with high voltage DC pulsed DC and RF industrial power supplies
67. box and the Setpoint text box turns On Power Supply Steps 13 14 Sets Ramp Rate text box to 5U s and enters a value of 20 in the Setpoint text box Steps 15 16 Sets a dwell time of 60 seconds and checks that the Setpoint is gt greater than 19 5 after the dwell time has elapsed Steps 17 19 Additional 30 second Dwell time for material temp to equilibrate and turn On or activation of both Evap and Substrate shutters Steps 20 22 Deposition dwell for 60 seconds followed by closing of the Substrate and Evap shutter Steps 23 24 Sets Ramp Rate text box to 5 U s and enters a value of 0 in the Setpoint text box Steps 25 26 Sets a dwell time of 60 seconds and checks that the Setpoint is lt less than or equal to 1 after the dwell time has elapsed Step 27 Turns Off the Power Supply Step 28 Turn Off motor Go Continuous KURT J LESKER COMPANY 95 PVD 75 OPERATION MANUAL RECIPE CONTROLLED DEPOSITION WITH SIGMA frmRecipeltems zm Equipmentltem EquipmentitemOperation EAu pment Test siii ert Recipe Ge Abort Recipe Abort Default Default Gauge MKS979 WRG x Value lt n nn Pressure Motors Platen Motor Jog Set Vi Value n nn Velocity SP E Motors Platen Motor On Turn _On Open Opening Motors Platen Motor Go Turn_On Open Opening Continuous Power Power Supply1 Set Value n nn Supply Ramp Rate 11 Power Power Supply1 Set Value n nn 0
68. cal rt angle steradian 1571 microinch angstrom 254 spherical rt angle sphere 0 125 micromicron angstrom 0 01 cal rt an h 0 25 micron angstrom 10000 steradian sphere 0 07958 mil inch 36802 steradian hemi 0 1582 mil em 0 0025 siere liter 10 milliliter enr 1 fons short lb 2000 millimeter mil 39 37 tons short kg 907 2 millimeter micron 1000 tons metric lb 2205 millimeter inch 0 03937 tons metric kg 10 millimeter angstrom 10 tons bon lb 2240 millimicron angstrom 10 tons long kg 1016 minute seconds an 60 watt kilowatt 36802 minutes ang radian 2 909x107 watt fi4b sec 0 7376 mnt int 1 55x10 watt hmm 44 25 mm en 0 01 watt ergs sec 10 mir circular mil 1 874x10 watt Btu min 0 05692 nanometer micron 10 watt hour kilogram meter 367 1 ahmis mil ft microhm in 0 06524 watt hour Dh 2655 ohms mil ft microhm cm 0 1662 watt hour Btu 3414 ounces fluid liter 0 02957 weber maxwell 10 KURT J LESKER COMPANY 233 PVD 75 OPERATION MANUAL MATERIAL DEPOSITION alumina Temp C for Given Wap Press Torr Thermal Sources 10 10 10 a Coll Basket Crucible Comment Aumnum A een 20 67 BH i100 Er q W TB DN Z DN DC AloysWTaMo Flash evap or use BN crucible Aluminum Anfimonide Ab 1080 43 S RF Aaen Sb S 668 279 M5 45 P Mo Ta Mo Ta Mo Ta DN C Rakh RF DC Sublmes rapdly at low temp Antimony Ode SO 6 S 52 20 G A BH BNA RFR Decamposes on W n 209 218 235 Antimony S
69. control PID values can be changed manually on the Operation Gas screen or in a recipe to accommodate various throttle valve positions MASTER SLAVE OPERATION Master Slave relationships are ratiometric based on flow Multiple levels of this relationship are supported so that an MFC slaved to one channel could also be master to another The flow of a given slave channel is based on the actual flow of the corresponding master channel not the setpoint of the master In this way if the master channel is not flowing correctly or is otherwise limited the gas composition remains correct Additionally if a given slave flow is limited based on that MFC s range the flow setpoint for the corresponding master is limited to maintain the desired gas ratio SLAVE MODE EXAMPLE Mode 11 for MFC 2 slaves MFC 2 to MFC 1 The flow setpoint for MFC 2 actual flow of MFC1 x the ratio of MFC2 So if MFC1 actual flow 100 sccm and MFC 2 ratio is 50 MFC2 flow setpoint 50 sccm SLAVE MODE NOTES A channel cannot be slaved to itself If this is requested the channel will be set to Independent Mode with a flow setpoint of zero A circular slave relationship is not allowed If two channels are slaved to each other the highest number MFC is set to Independent Mode with a flow setpoint of zero If the setpoint for a slave channel is greater than its range the setpoint for the slave is limited to its maximum and the corresponding setpoint for the mas
70. covers substrate This is the closed position This eliminates unwanted deposition on the substrate It also minimizes eliminates cross deposition If the shutter is not in the closed position rotate the shutter feedthrough knob to close the shutter Rotate shutter feedthrough knob to open the shutter MANUAL PNEUMATIC SHUTTER PROCEDURE 1 2 3 4 5 46 Verify that the shutter covers deposition source This is the closed position This eliminates unwanted deposition on the substrate It also minimizes eliminates cross deposition If the shutter is not closed rotate the shutter by either loosening the shutter actuator bracket clamp and rotating the actuator external or loosening the shutter blade clamp and rotating the shutter blade internal If the shutter blade clamp is loosened make sure to re position the shutter height to its original offset To open close the shutter actuate the switch on the valve panel Refer to Valve Panel Operation procedure If the shutter speed control setting opens closes the shutter too slowly quickly the speed can be adjusted on the shutter assembly with the speed flow control valve KURT J LESKER COMPANY OPERATION MANUAL PVD 75 SAMPLE BIAS SETUP AND OPERATION d The z shift must be in fully retracted position before running bias 1 2 3 4 5 6 7 8 9 10 11 12 13 Verify the presence of a wafer in the platen and system is under vacuum Tu
71. e Desorbing gas from a saturated trap e Desorbing gas from a cryogenic trap with a falling cryogen level e Deliberately injected gas required by the process The rate at which molecules enter into the chamber s gas phase from all these sources is called the chamber s gas load GAS LOAD UNITS Gas load is a mass flow rate and is measured in units of volume x pressure per unit time such as Torr liters per second T L s mbar liters per second mbar L s Pascal cubic meters per hour Pa m h Torr liters per minute T L m or std cubic centimeters per minute sccm 224 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 OUTGASSING WHAT IS OUTGASSING In a well designed well constructed vacuum system in the absence of deliberately injected gas the major contributor to the gas load is the desorption of gases vapors from the vacuum surfaces outgassing More specifically the outgassing rate is the amount of gas leaving some unit area of surface in unit time OUTGASSING RATE UNITS Any combination of units for pressure volume area and time can be used but there are just three combinations commonly quoted e Torr x liter per square centimeter per second mostly in the USA e millibar x liter per square centimeter per second mostly in Europe e pascal x cubic meter per square meter per second the SI unit NOTE By manipulating units the last combination can be transformed into the seemingly bizarre but correct Wim and is
72. flash might occur DO NOT WEAR CONTACT LENSES RF power supply connection 2 High frequency hazards exist at the RF power supplies connections A DANGER P High frequency fields may cause irregular performance of pacemakers which can cause abnormal heartbeat or death Persons with pacemakers should avoid exposure to all processes involving the high frequency hazards 12 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 3 E NIME WER OFF 3 The permanent magnets create magnetic field hazards A DANGER o Magnetic fields may cause irregular performance of pacemakers which can cause abnormal heartbeat or death Persons with pacemakers should avoid exposure to all processes involving the magnetic field hazards A CAUTION Strong magnetic fields can destroy watches or magnetic cards Keep watches magnetic cards and other metal objects away from magnetic field hazards Do not use magnetic tools when performing service or maintenance work on the system 4 Chemical hazards exist when potentially harmful chemicals are introduced or emitted from the system A DANGER Exhaust gas may be poisonous and may require special measures of elimination Ensure adequate ventilation and appropriate exhaust regulation when working with potentially poisonous exhaust gases Deposition sources may emit poisonous gases if not maintained properly Read all safety data sheets and follow the documented maintenance proced
73. flow rate is adequate the sensor will be green If flow rate is below minimum requirement the sensor will be FIGURE 2 WATER FLOW SENSORS FLOW SWITCH The cooling flow sensors are factory set and are not adjustable The setting of each sensor is marked on the label The water flow sensors are located on the cooling water return manifold KURT J LESKER COMPANY 53 PVD 75 OPERATION MANUAL MANUAL OPERATION THROUGH CWARE at El Logos ABORT Vacuum Deposition Gas Heating Cooling Motion PC WRG LL wRG Recipe Database PC Vent Val dae pe Shimadzu Turbo Pump Speed PC High Vac Valve Start PC Pump Start PC Vent Xn PC Turbo A site Start LL Pump Start LL Vent When chamber is pumped below atmosphere the vacuum switch VAC turns to green indicating that the chamber is under vacuum All sputter generators are interlocked with this switch Run Recipe CLOSED PC High Vac Throttle AT SPEED pe Pes Sm Gas Ring Start Transfer TT NA LL Turbo Back FIGURE 4 DC SPUTTERING 3 POSITION HIGH VACUUM VALVE SYSTEM 1 Pump down the vacuum chamber to high vacuum The choice of base pressures is the decision of the user and determined by acceptable impurity levels 2 Select the Vacuum screen Set high vacuum valve to throttle position see Figure 3 3 Select the Gas screen Open source gas valve or gas injection valve depending on system configuration
74. for saving the process database to floppy disk for backup or for making trial changes without affecting your working database Process databases are saved in Microsoft Access format Once again a pop up keyboard may appear If you want to browse just select Cancel from the pop up keyboard 3 4 3 File Data Logging Logs data from a deposition process to a disk LOG file There are four options for file naming and logging See Figure 3 7 Log File Select None to disable data logging If Overwrite is selected the last run of the process is saved as FileName LOG where FileName is the name shown in the FileName text box Subsequent runs overwrite the log file If Append is selected each run is appended to FileName LOG If Run is selected each run of the process is saved as a separate file under the format FileName_Run LOG Changing Run on this dialog box will also change the Run displayed at the top of the main program dialog box INFICON SQS 242 Operating Manual Figure 3 7 Data Logging Log File Events to Log None End Deposit Phase C Overwrite End Each Phase Append 1 0 Events C Rung Timed Sec Filename E Sensors E le S EUN Analog Inputs select View Readings tyymmdd log Format is Text g Cancel Spreadsheet Normally the log file is saved to the folder where the program is installed If desired you can click Select and navigate to a different folder Log file
75. i 1 13 Power PowerSupply1 Set Value n nn I mmm ME E 14 Power Power Supply1 Value n nn bk ud Supply Output Setpoint 15 Recipe Dwell N Seconds n or 60 pem m ws o o 16 Power Power Supply1 m Value gt n nn m WW Supply Output Setpoint Recipe Dwell N Seconds n or a ET A 18 E Shutter Evap Shutter Turn_ On Open Opening its 19 Shutter Substrate Turn On Open Opening Shutter 20 Recipe Dwell N Seconds n or HH MM SS 21 21 Shutter Substrate rum Off Closed Closing 94 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 frmRecipeltems E Equipmentltem EquipmentltemOperation mmh jo Shutter at Shutter Evap Shutter n Off Closed Closing Power PowerSupply1 Set Value n nn be Rate 5 Power PowerSupply1 Set Value n nn m i Setpoint i W Recipe Dwell N Seconds n or N E MMESS i udi Power Power Supply1 Check Value lt n nn i e Supply Output Setpoint wg Power me Supply 1 bw _Off Closed Closing i Supply P Motors Ben Motor Go DESEN B Continuous UNDERSTANDING THE CWARE RECIPE Step 1 Always the first step in a recipe sets which Abort Recipe should be run in the event a check step that has an AT Abort on Time fails Step 2 Waiting for a desired base pressure before deposition will run In this case 5x10 5Torr Steps 3 6 Sets up appropriate source switch closes system shutters Steps 7 9 Set up substrate rotation Steps 10 12 Zero s the Ramp Rate text
76. is first started it displays a progress bar during startup then a User Login dialog box see Figure 3 4 NOTE The SQS 242 software ships with one pre assigned user The user name is Super with no Password Figure 3 4 User Name User Mame Super Password Cancel User Login Select a User Name from the drop down box type in the Password then click OK to start the program INFICON SQS 242 Operating Manual 3 4 Menu If your software is configured for keyboardless operation an on screen keyboard will appear as shown below You can use your normal keyboard or mouse to type the password then click Enter See System Setup SQM 242 Setup later in this chapter to enable or disable the on screen keyboard see Figure 3 5 Figure 3 5 On screen Keyboard Enter Password a ammm Eg drug PE PA 23 d el as Vc fad JRA BOL PA LM Qe pep foe NEL cara ae _ An Access Level is associated with each User Name The Access Level controls which software functions are available to each user For example only users with an Access Level of Supervisor can add new users See the Security section of this chapter for information on setting up users The remainder of this chapter covers the purpose and operation of each software function arranged by menu selections For a more operational approach consult the previous Quick Start chapter Menus The menus along the top of the main dialog box provide acces
77. layer The combination of an output and its input defines the deposition control loop for the selected layer The Input selection can significantly alter operation of the deposition phase as described in the following discussion on the SetPt parameter IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual SetPt The function of the setpoint parameter depends on the Input dropdown If Sensor s are used as the input the setpoint is Rate in A s This sets the initial Rate setpoint for the selected layer Rate is controlled by the PID parameters for the film assigned to the layer If no rate ramps are defined for the layer this is the rate setpoint for the entire layer If the Input selected is Timed Power the setpoint is shown as Power This sets a fixed 9o output Power during deposition In Timed Power the Time Endpoint establishes the length of time for the deposition cycle The layer will end when either the time endpoint is reached or when the Final Thickness is reached whichever occurs first If one of the SAM 242 analog inputs are selected the setpoint is in volts or the analog input s corresponding user defined units The layer will end when either Time Endpoint or Final Thickness is reached whichever occurs first See the Analog Inputs section later in this chapter for a discussion of programming for analog inputs Final Thickness Sets the endpoint thickness for the layer When final thickness i
78. not recommended for use due to potential internal oxidation and residue that may contaminate the chamber and disrupt sensitive processes It is recommended that each individual gas connection to the system have its own shut off valve in a location close to the inlet connection Systems using individual bottled gasses within short distances of the system do not need shut off valves since valves are typically located on the gas bottles EXHAUST CONNECTIONS Depending on the types of processes being performed and or applicable safety regulations some systems may need to have their exhaust port connected to an exhaust system This prevents hazardous gases or particles from getting into the lab space The two main connections are cryo pumps and mechanical pumps During the regeneration of a cryo pump the trapped gases are expelled through the rear vent valve KJLC installs an exhaust adapter to these valves for ease of connection Mechanical pumps will exhaust all gases present in the chamber being evacuated KURT J LESKER COMPANY 31 PVD 75 OPERATION MANUAL PUMP EXHAUST MECHANICAL PUMP EXHAUST Typical exhaust connections DESCRIPTION KJLC SYSTEM CONNECTION CUSTOMER SUPPLIED CRYO PUMP QF16 OR 3 8 HOSE FITTING QF16 OR 3 8 HOSE CONNECTION MECH PUMP QF16 QF25 OR QF40 PUMP DEPENDENT QF16 QF25 OR QF40 PUMP DEPENDENT SYSTEM QF16 OR QF25 PUMP DEPENDENT QF16 OR QF25 PUMP DEPENDENT Exhaust vent supplies QF16 075
79. of 6 outputs simultaneously Use this dropdown to assign a physical output to a display output FS Out The input voltage required by the deposition source power supply to produce 100 output power Positive or negative full scale values are possible Color Selects the color used to graph and display output data Test Output Useful for testing output wiring and Full Scale voltage settings Select an output then click Full Scale to set the SQM 242 card output to its Full Scale voltage Click Zero to return the selected output to O volts INFICON SQS 242 Operating Manual 3 5 4 2 Sensors Tab Figure 3 19 Sensors tab at System Setup Default Rename w Delete Copy Outputs Sensors Analog Indexers xi Card Comm Physical Monitor Mame Sensor Dual Output E ensar Output Sensor d p d Output 1 y RRRRRWRR Name A meaningful name assigned to each sensor For clear display keep the name to less than 8 characters Physical Sensor Up to six SQM 242 cards physical sensors 1 to 24 may be installed in a computer However the SQS 242 software can display a maximum of 8 sensors simultaneously Use this dropdown to assign a physical sensor to a display sensor Dual Indicates that a pair of sensors is set up as primary secondary duals When a primary sensor fails the SQS 242 switches to the secondary sensor Monitor Output Select the output that eac
80. of the system as required A KJLC Service Representative can assist you in assuring the tool is ready for start up d KJLC requires a minimum of 2 weeks notice for scheduling a start up Additionally ifa start up was purchased as part of the contract then any items removed for shipment will be re installed by the KJLC engineer during that time However if the customer has the ability to re install some items this should be coordinated with KJLC and can make the Start up and training period more productive During the start up period the KJLC engineer may need full access to the tool outside of normal working hours including evenings and weekends Unattended overnight operation of the tool will also be required All relevant permissions and security clearances must be in place to facilitate these requirements During this period the intended system operator s should be present at all times for training and to assist the KJLC engineer whenever necessary Upon completion of the start up and training a final acceptance document should be signed by the KJLC engineer and authorized customer representative KURT J LESKER COMPANY 15 PVD 75 OPERATION MANUAL The following are general facility requirements utility requirements connection details and typical parts required for site preparation If you have any questions regarding these requirements please contact the applicable Process Equipment Division PED Customer Service Department
81. partied The manufacturer s warranty for such Equipment parts or components if any shall be assigned to CUSTOMER without recourse to COMPANY The foregoing warranties shall not apply to designs materials or specifications furnished or specified by CUSTOMER and incorporated into the Equipment THE EXPRESS WARRANTIES AND REMEDIES SET FORTH IN THIS SECTION ARE EXCLUSIVE AND ARE CONDITIONED UPON TIMELY NOTIFICATION BY CUSTOMER THEY ARE GIVEN BY COMPANY AND ACCEPTED BY CUSTOMER IN LIEU OF ANY AND ALL OTHER REMEDIES WARRANTIES AND GUARANTEES EXTOUCHED OR IMPLIED AND IN LIEU OF ANY IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ALL OF WHICH ARE HEREBY SPECIFICALLY EXCLUDED AND DISCLAIMED COMPANY neither assumes nor authorizes any representative or other person to assume for it any obligation or liability other than such as is expressly set forth in this section Any change modification extension or addition to the foregoing warranties remedies or limitations shall not be binding upon COMPANY unless in writing and duly executed by an authorized officer of COMPANY 2 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 TRADEMARKS Every attempt has been made to identify the owner of product trademarks and registered trademarks that appear in this manual Changes of company ownership affecting the named trademark holder may not be identified TX Baratron Conflat Cryo Torr E Delrin EcoDry Fomblin Inco
82. period 50 mTorr total 9 Ifthe ROR is greater than 50 mTorr re purge the cryo pump check for leaks and repeat steps 5 and 6 If not open the rough valve and pump to initial pressure 10 Close the cryo pump roughing valve and start the cryo pump 11 The cryo pump is ready for use when the second stage array reaches a temperature of 20K or lower 42 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 PNEUMATIC VALVE PANEL OPERATION 1 Locate the valve panel in instrument rack 2 Locate the switch that coincides with the device to be actuated i e valve shutter etc 3 Actuate the switch to the desired labeled position on open off close A CAUTION Use caution when changing the state of any valve check that it will not affect any state of the system adversely to avoid serious equipment damage SAMPLE TRANSFER PROCEDURES SAMPLE LOADING 1 Make sure that a sample and carrier are loaded on to the LRP end effecter fork and that nothing is loaded onto the platen assembly 2 Make sure that the load lock chamber is pumped down to at least 100 mTorr 3 Open the isolation valve between the load lock and process chambers 4 Jog the platen rotation to accept sample transfer Align the two ceramic stand offs on the platen assembly via the viewport 5 Open the substrate shutter if applicable 6 Lower the platen assembly to the bottommost position using the hand wheel on the transfer z shift located on the c
83. rate will zero FIGURE 3 6 When ramp down to setpoint has completed press EB Off button 7 Press EB Off button NOTE Only when you press EB Off does the EB HV turn off 76 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 RECIPE CONTROLLED DEPOSITION EXAMPLE WITH SIGMA 6 E BEAM pum Hi am Set Abort Recipe Abort Process ST an een ic recae eii vals cam roms ar 3 Supply cruPos2 fumoff CiosediCiosing a Suppy pe JTwnOffCosedCosng 5 Suppy crupos4 JTunOffCosedCosng 6 Sg CuPs1 Turn On Open Opening 7 JL Recipe Dwell bus 5 1 8 Supply Crucible in Position Check On Open Opening AT 9 Motors SP Set Value nm CONI NNI 10 Motors Platen Motor On Turn On Open Opening a Motors Continuous Turn On Open Opening 12 unn setpoint SeVaue nm 0 13 spy Joo Turn off Closed Closing 14 Supply Joo TumOwOpeyOpming 15 Jans Mapini Set Value nm 26 16 Sigma Mapini stVaue nm n4 17 Jans Mapig2 Setvale mm fe 18 Sigma Sigma Launch 242 Turn On Open Opening 19 Recipe Del SSecons PT 20 Sigma Sigma Control Request tVaue nm Jo 21 Reape Dwell Seconds 22 Sigma Sigma Control Request_ Set Value n nn Titanium 23 Recipe Dwell 3 Seconds 24 Sigma Sigma Stop Process Wan off Closed Closing 25 Redpe Dwel Bseods
84. read by the process chamber convection gauge Refer to gauge controller manual for convection gauge operating instructions Close roughing valve Open the hivac gate valve to the cryo pump When the process chamber convection gauge is below 1 0e 3 mTorr turn on the ion gauge Refer to gauge controller manual for operating instructions Turn off roughing pump At this point the vacuum system is under vacuum and ready for use Refer to individual component manuals for operation of gas flow equipment and gauging equipment KURT J LESKER COMPANY 37 PVD 75 OPERATION MANUAL TURBO PUMP WITH LOAD LOCK CHAMBER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Verify all connections to system are made Power water process gas vent gas and vacuum connections to mechanical pump should be checked Turn on the mechanical rough pump and wait for the foreline pressure to reach less than 1 Torr Refer to gauge controller manual for convection gauge operating instructions Open the process chamber turbo backing valve and turn on the turbo pump Wait for the turbo to reach full speed Verify that both the process chamber and the load lock chamber are at atmosphere If not refer to the Chamber Vent procedure Open the load lock isolation valve If operating the system for the first time open the capacitance manometer isolation valve if installed and any gas isolation valves C
85. should not be touching the top of the dark space shield and should be parallel to the target face when closed A distance of 1 16 to 1 8 from the top of the dark space shield and bottom of the shutter blade is required When open there should be no interference with other components or the substrate Deposition build up on the main cathode insulator Visually inspected at each target Proper alignment of cathode shutters in the open and close position E BEAM MODULES COMPONENT INSPECT FOR COMMENTS Stray beam damage to hearth or nearby Adjust filament or beam sweep shielding pattern Refill t depleted Sufficient material available in the hearth S e ebe ee went crucibles Spillage or deposition of the material on Remove all excess material and hearth particulate Smooth operation of the hearth indexer Clean rotary drive and seals Filament condition Replace as required KURT J LESKER COMPANY 191 PVD 75 OPERATION MANUAL CENTRAL DISTRIBUTION MODULES COMPONENT INSPECT FOR COMMENTS Usage If the total travel is over 4 000 m the bearings must be replaced The rollers should be cleaned or replaced if worn The bearings Linear Rack amp should be inspected and Pinion LRP lubricated with Fomblin 25 6 If Smooth movement within the full range of cleaning and lubrication do not motion correct the problem replace the bearings Check that the pinion gear is correctly engaging with the rack and replace the pinion g
86. supply return manifolds for the switch to register flow The flow switch is normally closed KURT J LESKER COMPANY 69 PVD 75 OPERATION MANUAL When the water supply and return valves are open the water flow switch should be Satisfied To ensure the flow switch on the CWare Cooling screen will change from gray to green when satisfied FIGURE 2 If the water supply and return valves are fully open and the flow switch is not shown as made on CWare check that the water pressure and flow rate meet specifications If the utilities are within spec call the KJLC Service Department for assistance 70 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 VACUUM MONITOR PC Vent Valve PC Cryo Temperature Regen Pressure ot E PC Roughing Valve FIGURE 3 E Beam systems are hard wire interlocked to the VAC switch When the system is roughed below ATM the VAC Vacuum Switch turns green and indicates PC is under vacuum The KJLC software interlock for minimum operation pressure is 5x10 4Torr although the recommended optimum pressure is 4 x 10 5 Torr or better EXTERNAL COVER SWITCHES Depending on the type of E Beam installed in the system there are external cover switches that will need to be made Please refer to the manufacturer s user manual for specific location of these switches There are two types of external switches for two common models the 265 and KL 6 e Telemark cover switches e KL 6 cover swit
87. the 4 screws and remove the ring When removing a target of magnetic material carefully slide the target to one side and pick it up do not attempt to pry magnetic targets from the cooling well This may result in permanent damage to the cooling well Place a new target on to the source ensuring all parts are perfectly clean If installing a magnetic target take extra care that fingers or parts of a glove do not get pinched between target and source as the magnets are very powerful Tighten the hold down ring screws evenly do not over tighten screws The dark space shield of the TORUS source has three machined slots which ensure 080 dark space on top of the 1 8 3 16 and 1 4 targets Loosen the three 8 screws and reposition the dark space shield to the correct slot when changing the target do not over tighten the 3 screws After installing a target check shutter operation and clearance between the shutter and sputter source Refer to the KJILC TORUS manual for complete detailed instructions regarding target change KURT J LESKER COMPANY 63 PVD 75 64 OPERATION MANUAL Loosen 3 screws to remove dark space shield FIGURE 7 Loosen target hold down ring screws twist and remove ring 2 source shown Remove screws completely on 3 or larger sources FIGURE 8 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 CLEANING AND MAINTENANCE A sputter source will require c
88. the Gain to 180 Offset to 32 and Units to DegF The SQM 242 will display setpoints and measurements associated with the analog input in degrees F To leave the analog input display in Volts set Gain 1 and Offset 0 Name A meaningful name assigned to each analog input For clear display keep the name to less than 8 characters Gain The gain term for transforming voltage to measured units This is the m term in y mx b Offset The offset term for transforming voltage to measured units This is the b term in y mx b Units The units that you wish to display for the analog input INFICON SQS 242 Operating Manual 3 5 4 4 Indexers Tab Figure 3 21 Indexers tab M System Setup x Defautt Rename Hew Delete Copy Outputs Sensors Analog Indexers vol Cara Comm source Indexers Layer Indexers Complete Timeout Complete Timeout Signal sec Signal sec 3 Substrate 3 User 3 sere Testlndexer Index Source fo Moye Source Indexers A unique source indexer pocket rotator is available for each output used The source indexer moves at the beginning of each layer Layer Indexers Three layer indexers are also available Layer indexers also move at the beginning of each layer Layer indexer values are useful for control of substrate indexers or other external process equipment NOTE The Layer Indexer names the range of values and the first en
89. the currently selected displayed recipe KURT J LESKER COMPANY 153 PVD 75 OPERATION MANUAL ICON OR DATA FIELD ACTION RESULT Export Recipes Copies all recipes to C Program Click to activate Files Lesker Customer Name Excel Export Files Recipe Sets xls Update VB Updates the list of available recipes that will Click to activate be seen in the Runtime Software and updates Update VB m i changes to recipes in the Runtime Software Reorder Items Opens a new screen that allows the user to Click t tivat Reorder Items adis change the order of programmed commands Copy Recipe Beete Copies the selected recipe and prompts for a Copy Recipe new name Include in VB List l Check this box to include the selected recipe S i Click to activate 2 MN Include in VB List w in the Run a Recipe menu Operator Can Use Check this box to allow Operators to run the Click to activate Operator Can Use selected recipe Process Engineer Can Use Check this box to allow Process Engineers to Click to activate Process Eng Can Use run the selected recipe User Display only Current logged in user of recipe Owner Display onl Original writer of selected recipe wne KLG KIG P Pav only B i G Goto sequence number Click to enter R Ramp rate value S Skip T Timeout 154 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 REORDER ITEMS Recipes KIL E 81 x 3 9 Help EE Recip
90. the measured pump down time FIVE HOURS EVERY TIME Convince yourself the system does not leak and then using VacTran model the system Check that the calculated pump down time is similar to the measured one If not add outgassing sources roughly modeling the real parts in the chamber until the pump down time equals 5 hours Now you have two options A B Reduce the gas load by either a modeling the removal of non essential components or reducing surface areas or b modeling a reduced outgassing rate achieved by baking or plasma cleaning this is usually the least expensive option to improving pump down times If little can be done about the total gas load play what if games with the model by changing pumps and conductances to see what must be done to improve the pump down time This is always an expensive option KURT J LESKER COMPANY 229 PVD 75 OPERATION MANUAL SLOWLY GOTTEN WORSE Time to consider maintenance issues A B C D E F G Is the fluid in any oil sealed pump contaminated with a vapor Are the foreline or system traps overloaded Is something inside the chamber thermally decomposing Have the fill full sensors of an LN2 trap changed position Are the chamber walls contaminated with oil from the pumps Are o rings aging due to high temperatures Does the cryo pump need regeneration More potential issues can be added but the real question is can the main cause be detect
91. the new Silver Sample film assigned to Layer 3 3 Add a CoDep Layer Select Layer 3 in the layers list then click Cut Layer Now select Layer 1 Click Paste CoDep The Silver Sample film will be added below Gold Sample as a codeposition layer Your setup should match Figure 2 13 Figure 2 13 Added CoDep Layer Process Edit Sample Save Rename Delete Copy T Layer Out Film cetFt Thickness Time Gold sample Cut Layer iber Sample 10 Gold Sample 10 Copy Layer Paste Collep Layer RateRamps Deposit Condition Source Sensor Errors Film Output Input Gold sample Output 1 Sensor s oetPt Final Thick p EndFt EndFt cystem Setup As LA Auto Start Continuous Manual Indexers Source Substrate LIsert LIzerz None None None None Index Index Index Index INFICON SQS 242 Operating Manual We now have two layers in our process Layer 1 has Gold being deposited from source Output 1 and Silver is being codeposited on Output 2 Layer 2 is Gold alone HINT It s easiest to copy a layer then paste several temporary layers of that type as additional layers Next assign the films and outputs that you want to each of these additional layers Now use Cut Layer on the temporary layers and Paste CoDep to assign the film to the desired codeposition layers Remember that each film in a codeposited layer must be assigned to a different source output Re
92. the pump s ability to permanently remove gas from its inlet port Conductance Conductance Total Conductance C1 C2 ICA 1102 10 10 5 L sec 10 100 9 1 L sec 10 1 000 9 9 L sec 10 10 000 9 99 L sec 10 100 000 9 999 L sec 10 1 000 000 9 9999 L sec Series Conductances Series conductances are added as reciprocals 1 Ctotal 1 C1 1 02 1 C3 Given Narrow Tube 120 L s C1 Angle Valve 230 L s C2 Large Pori 1 400 L s C3 The total conductance is 1 Coe 1 120 1 230 1 1 400 1 Ce 0 0083 0 0043 0 0007 1 Cue 0 01339 Cus 1 0 01339 Total Series Conductance 74 6 L s Parallel Conductances Using two conductances simultaneously between two chambers or between a chamber and pump is not common but such arrangements do occur and are easily calculated Suppose the two tubes have conductances of 1 800 L s and 2 300 Us The total conductance is Qua C1 C2 Cs 1 800 2 300 Total Parallel Conductance 4 100 L s KURT J LESKER COMPANY 221 PVD 75 OPERATION MANUAL PUMPING SPEED UNITS Pumping speed is a volumetric flow measured in units of volume per unit time specifically liters per second L s cubic feet per minute cfm cubic meters per hour m h or liters per minute L m As with conductance expressing pumping speed as volumetric flows has the benefits that pumping speed and conductances can be combined by simple math see Effective Pumping Speed PUMPING SP
93. the rate ramps list Existing rate ramps are shifted down Delete Ramp Deletes the selected rate ramp Move Up Shifts the selected rate ramp up one position Move Down Shifts the selected rate ramp down one position Start Thickness The thickness that triggers a timed ramp to a new rate Start thickness should be greater for each subsequent ramp and less than the final layer thickness otherwise the rate ramp is ignored IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Ramp Time The time in seconds to ramp to the new rate If the rate ramp is too fast a PID control error may be generated New Rate The new deposition rate setpoint for the selected layer 3 5 1 3 Deposit Tab The Deposit tab contains parameters that directly affect the deposition phase of the process cycle See Figure 3 11 Figure 3 11 Deposit tab eh Process Edit Ei Sampe Seve H Rename New Delete Copy Layer Out Film Thickness Time Cut Layer silver Sample 15 Gold Sample 15 Copy Layer Paste Layer Paste Collep Layer RateRamps Deposit Condition Source Sensor Errors Loop Shutter Delay Rate Sampling P Term Continous e o o C Time Based sample Hold SI Dec P Term Sets the gain of the control loop High gains yield more responsive but potentially unstable loops Try a value of 25 then gradually increase decrease the value to respond to step changes in rate setpoint
94. the system for the first time open the capacitance manometer isolation valve if installed and any gas isolation valves Open the high vacuum valve System roughs through turbo pump Start the system roughing pump and verify that the system pressure is decreasing Rough the system to approximately 200 mTorr as read by the process chamber convection gauge Refer to gauge controller manual for convection gauge operating instructions Turn on the turbo pump Refer to the turbo pump manual for complete operation instructions When the turbo pump is at speed and the process chamber convectron gauge is below 1 0e 3 Torr turn on the ion gauge Refer to gauge controller manual for operating instructions At this point the vacuum system is under vacuum and ready for use Refer to individual component manuals for operation of the gas flow equipment and gauging equipment VENT PROCEDURES This section describes the various system vent procedures TURBO PUMP VENT 1 2 3 4 5 6 7 8 Verify that all source and heater supplies are turned off Turn off the ion gauge filament Turn off all gas flow Turn off the turbo pump Close turbo backing valve Turn off the mechanical pump Open the vent valve if applicable Wait until the system reaches atmospheric pressure The convectron gauge can be used as an estimation however this may have some degree of error At this point the vacuum system is at atmosphere The c
95. the total tube length the underestimation may be extreme In such cases calculate the conductance of the small diameter and large diameter section as separate tubes and combine them in series see Combining Conductances F Conductance of Tube liters sec for air at 25 C 2 4 8 12 16 0 514 0 359 0 232 0 172 0 137 0 1 0 367 0 246 0 188 0 132 0 085 0 063 0 050 0 029 0 2 1 466 0 986 0 753 0 527 0 340 0 252 0 200 0 117 0 3 3 300 2 217 1 664 1 184 0 764 0 567 0 451 0 263 0 4 5 866 3 943 3 013 2 106 1 358 1 008 0 802 0 468 0 5 9 166 6 160 4 708 3 291 2 122 1 575 1 253 0 731 0 6 13 200 8 872 6 779 4 739 3 057 2 269 1 805 1 052 0 7 17 970 12 080 9 228 6 449 4 161 3 088 2 45 1 432 0 8 23 410 15 770 12 050 8 424 5 436 4 033 3 208 1 871 0 9 29 700 19 960 15 250 10 660 6 879 5 105 4 061 2 368 1 0 36 660 24 640 18 830 13 160 8 492 6 302 5 013 2 922 2 0 146 600 98 560 15 340 52 650 33 970 25 210 20 050 11 690 3 0 330 000 221 700 166 400 118 400 16 420 56 710 45 110 26 300 4 0 586 600 394 300 301 300 210 600 135 800 100 800 80 210 46 770 5 0 916 600 616 000 470 800 329 100 212 200 157 500 125 300 73 100 6 0 1320 00 887 200 677 900 473 900 305 700 226 900 180 500 105 200 7 0 1797 00 1208 00 922 800 644 900 416 100 308 800 245 700 143 200 8 0 2347 00 1577 00 1205 00 842 400 543 600 403 300 320 800 187 100 9 0 2970 00 1996 00 1525 00 1066 00 687 900 510 500 406 100 236 800 10 3666 00 2464 000 1883 000 1316 000 049 200 630 200 501 300 292 200 KURT J L
96. to the bulkhead fitting or Mass Flow Controller MFC located in the rear of the system The General Assembly and Process Gas Schematics should be referenced Before installation purge all newly constructed gas lines to remove all loose materials Also be sure to remove any remaining burrs from the tube edges before connecting to the system BULKHEAD CONNECTION MFC CONNECTION Stainless steel electro polished tubing should be used to supply process gases with the following characteristics e 5 7 psi 35 48 kPa e 99 999 purity e lt 5um particle filtration d Sharp bends should be avoided when using electro polished tubing Sharp bends can introduce micro cracks on the inside diameter of the tubing and be a potential source of contamination 30 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 Typical process gas connections MFC VCR 1 4 MALE VCR 1 4 FEMALE VCR MFC SWAGELOK SS 4WVCR6400 ADAPTER 1 4 O D TUBE NEEDLE VALVE SWAGELOK 1 4 SWAGELOK TUBE FITTING 1 4 O D TUBE NOTE Tube fitting connections should be avoided when connecting process gases whenever possible Process gas supplies SST 0025CI TUBING 316L SST RIGID 1 4 OD 035 WALL ELECTROPOLISHED SS AWVCR6400 ADAPTER SS 1 4 FVCR TO 1 4 OD TUBE SWAGELOK 4FVCR N NUT FEMALE VCR CAJON SS 1 4 4FVCR GL GLAND VCR CAJON STAINLESS STEEL 1 4 TUBE SOCKET 4XVCR GAC GASKET VCR CAJON COPPER 1 4 d Copper tubing is
97. voltage is at its maximum reading as indicated on the Discharge Volts display From the KRI Discharge Controller use the white Select button to select Amps From the KRI Discharge Controller turn the Setpoint Adjust Knob until the discharge current is set to 2 5 amps as indicated on the Discharge Amps display From the KRI Auto Controller press the white Enable Standby Button to Enable From the KRI Filament Controller press the white Enable Standby Button to Enable From the KRI Discharge Controller press the white Enable Standby Button to Enable From the KRI Auto Controller adjust the gas flow using the Gas Adjust Knob until the discharge voltage is approximately 120 V as read from the KRI Discharge Controller Operate the on source for at least 10 minutes to clean any contaminates from the ion source that may have been introduced while at atmosphere KURT J LESKER COMPANY 101 PVD 75 OPERATION MANUAL 21 The discharge voltage as read from the KRI Discharge Controller will vary slightly during this time Adjust the gas flow from the KRI Auto Controller after the 10 minutes to obtain a discharge voltage of approximately 120 V as read from the KRI Discharge Controller d At this point the operating conditions can be saved as a program on the KRI Auto Controller to be used later in the Manual Gas mode To save this program first press the white Program Select
98. 1 Soak Time 1 O Tooling Factor 2 150 D 0 99 9 D 1 Rise Time 2 US Tooling Factor 3 100 Soak Power 2 0 Tooling Factor 4 100 Process Name Al dual Soak Time 2 Tooling Factor 5 100 Layer No 1 Shutter Delay Tooling Factor 6 100 Film Name Al dual Accuracy Tooling Factor 7 100 Material Name Al dual Time Out secs Tooling Factor 8 100 Layer Start Mode Auto Idle Ramp O Idle Power O Deposition Rate 2 Sensor 1 Output 1 El le EE 3 Final Thickness 999 Sensor 2 Output 3 x sac Thickness Spt O Sensor 3 Output None E EES Density 27 Sensor 4 Output None Z Ratio 1 08 Sensor 5 Output None zl Se T Max Power 100 Sensor 6 Output None zl Sample O Sensor 7 Output None zl HoldTime x Sensor 8 Output None zl All Sigma Data settings can be viewed and maintained using this screen d Refer to the Sigma manual for further details regarding data set parameters ICON OR DATA FIELD ACTION RESULT New l l Click to activate Creates a new data set Navigation Buttons H d l Use these buttons to select the first previous Click to activate last or next data set E Ld Delete l l Click to activate Deletes the selected data set Delete Export to Excel l Export Click to activate Exports the selected data set to Excel Copy Dataset Click to activate Creates a copy of the selected data set Copy DataSet i Update VB
99. 10 07 on the PLC Relays 9 to 12 correspond to Omron relays 11 00 to 11 03 IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Figure 4 3 Omron PLC Output Wiring E F UV l V J TT H L pu A Led boo La i ZU WAS 250 VACI ZU VAL Z VU YOC 4 VL Omron PLC output wiring is illustrated in Figure 4 3 Notice that some relays i e 02 03 and 04 05 06 07 share a common terminal NOTE The internal 24 V dc 3 A supply of the Omron PLC is NOT adequate to serve as the supply shown in the diagram above Indexer I O Indexers from different manufacturers use a variety of pocket decoding schemes The PLC monitor program adapts information from the SQS 242 program to a specific indexer The two most common indexer decoding schemes are illustrated below Binary Pocket Select Each pocket requires a dedicated relay That is 8 pockets require 8 relays The CPM2A Basic PLC monitor program assigns relays 11 00 to 11 03 to operate a 4 pocket indexer of this type Binary Coded Pocket Select Pockets are selected by a value that is the binary representation of the pocket That way fewer relays are required For example 16 pockets can be selected with only four relays The CPM2A BCD monitor program assigns relays 11 00 to 11 03 to this function Please contact INFICON for information on your indexer Other Digital I O Depending on the PLC model used additional relay and input pins are availab
100. 2 above shall be effective for a period ending twelve 12 months from the date of performance of the services KURT J LESKER COMPANY 1 PVD 75 OPERATION MANUAL WARRANTY CONDITIONS AND LIMITATIONS CUSTOMER s right to enforce the foregoing warranties is expressly conditioned upon CUSTOMER notifying COMPANY in writing during the Warranty Period of any alleged non conformity or defect stating specifically the nature of the alleged non conformity or defect COMPANY shall have the right upon such notification to review inspect and or examine the Equipment indicated by CUSTOMER and CUSTOMER shall make the Equipment available to COMPANY for such purposes The foregoing warranties shall not apply if COMPANY s review inspection or examination discloses that the Equipment i has not been installed maintained or operated in accordance with COMPANY s instructions ii has been used by CUSTOMER in a manner or for applications not recommended by COMPANY iii has been repaired altered or modified by CUSTOMER iv has been subjected to other than normal use storage handling installation operation or maintenance or v has been damaged by fire act of God any cause covered by CUSTOMER s insurance or any other event or occurrence not caused by COMPANY The foregoing warranties shall not apply to Equipment or parts or components thereof which are not manufactured or processed by COMPANY or which are purchased by COMPANY from another party or
101. 5 AINA es PERSONNEL QUALIFICATIONS All personnel performing maintenance procedures must have appropriate training Vendor supplied instructions and operator manuals should be reviewed prior to maintenance or operation of any equipment or hardware GENERAL RECOMMENDATIONS 1 Priorto the installation of any assembly it is good practice to review the list of parts and ensure all parts are on hand 2 Prior to installation of any copper gasket or o ring ensure the gasket o ring and sealing surface are free from defects and debris 3 Wipe all gaskets and flanges clean with isopropyl alcohol prior to installation to assure Cleanliness 4 When applying vacuum grease to an o ring be cautious not to apply too liberally A thin even film is sufficient 5 Prior to tightening any QF or Conflat type flanges ensure that the o ring or metal gasket is centered and seated properly 6 When assembling be sure to use proper vacuum cleanliness techniques i e wearing clean gloves hair nets and beard masks and using lint free wipes 7 Use a non stick lubricant such as Molybdenum mixed with isopropyl alcohol on all stainless steel to stainless steel hardware mounting For internal mounting only a vacuum compatible lubricant such as Boron Nitride should be used 8 Supplemental Manuals and Information should be reviewed prior to installation or operation of any equipment or hardware KURT J LESKER COMPANY 179 PVD 75 OPERATION
102. 58 Ib water in 27 68 Ib water ft 0 01602 Ib water min sec 2 66910 Ib ft eter 1 488 us imr 4 Ba ils ft water 0 01602 If Ib rr 6944x10 Ibin grams cm 178 6 Ibin bife 144 Ibin kg nr 703 1 Ibin in Hg 2 036 Ibin ft water 2 307 Ibin atm e 0 06804 55 1 0 155 liter uart liquid 1 057 liter pint liquid 2 113 liter gallon 0 2642 liter in 61 02 liter f 0 03531 liter min ec 4403x10 liter min sec 588510 met hotcandle 1 m min mileshour 0 03728 m min kmhour 0 06 mimin sec 0 05468 m sec milesimin 0 03728 m sec kmimin 0 06 m sec km hr 36 m sec ft sec 3 281 m sec ft min 196 8 m sec mileshaur 2 237 m sq mile 3861x10 m ft 10 764 m quarts liquid 1057 m ts liquid 2113 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 Weights amp Measures To Convert Into Multiply By To Convert Into Multiply By m gallon 264 2 radians sec revolutionssec 0 1592 m int 61024 radians sec mm 94549 m ft 35 31 revalutan radian 6283 m em 105 revolution quadrant 4 maxwell kiloline 36802 revolution degree 360 megaline maxwell 10 revalutions sec mpm 60 mater inch 39 37 revalutions sec radians sec 6283 meter feet 3 2808 revolutions sec degrees sec 360 meter angstrom 10 rpm revolutions sec 0 01667 mhas mil ft megmhos in 1528 rpm radians sec 0 1047 mhos mil ft megmhos cm 6015 rpm degrees Sec 6 microhm cr ohms mil ft 6 015 seconds le radian 4 848x10 microhment microhms rr 0 3837 solid angle steradian 1257 microhm rr m crohrm cm 2 54
103. 75 OPERATION MANUAL RECORDED DATA sis 9 Hep Recipes AJ Action Log 34 Interlocks Sigma Data Sets Ow Configuration RB System Users Type a question for help 2 x Export start Time Stop Time Description View Delete Sigma Log Files n E Ww test 1 L1 E test 2 l 1 17 2006 4 40 11 PM 117 2006 4 40 12 PM 0601171640 Sh 0 00 00 E el M This screen displays recorded system data and provides the user with a means to maintain the data See the CWare Operation section for further instructions ICON OR DATA FIELD ACTION RESULT Delete l l Click to activate Deletes the selected data set Delete Export l Click to activate Exports the selected data set to Excel Export Start Time l l Start Time Display only m start time of the corresponding pictus Shows the stop time of th di z ows the stop time of the corresponding Stop Time Displ x d data set Description Shows the unique system generated name for Description Display only a data set This name can be edited by the test 1 user View Views the selected data set in the table format Click to activate View of an Access database Delete Sigma Log Files Sicko desu TS FEN ick to activate eletes Sigma Log Files Delete Sigma Log Files e E KURT J LESKER COMPANY OPERATION MANUAL PVD 75 Recipes Action and Event Log WE E xj a Help EEjRecipes Recorded Data ActionLog 34 Interlocks Sigma Data Sets ow Configur
104. AD s i eoa ues 6 ERE Os OSE E ES HERMES dies SRE EEO 3 31 VIEW MCN a a a 6s 54044 Ra EEN Geek Ro RR eke Eer REOR AL AE d dea oe ka d 3 32 Software Specifications 3 33 INI File Parameters 3 37 Digital UO INTOQUCION EEN 4 1 PLC Installation llle 4 1 PLC Setup and Test EEN 4 4 93 PLC POQaMMINDO EE 4 4 IPN 074 551 P1A IPN 074 551 P1A Chapter 5 5 1 dud dod 9 4 5 5 9 9 1 es ede 5 6 5 6 1 5 6 1 1 SD LZ 5 6 2 5 6 2 1 5 6 2 2 9 6 2 3 5 7 5 8 5 8 1 5 8 2 3 0 0 9 8 4 5 8 5 9 8 6 5 8 7 5 8 8 9 0 9 Chapter 6 W SQS 242 Operating Manual 8 INFICON Communications Idee Le Le IV iio mantra aia de e a a Ea ia 5 1 Serial Interface 0 ee eee 5 1 Ethernet Interface o oooooooor ee ee ee eee 5 1 ActiveX COM Interface lille 5 1 SQS 242 Comm Program 5 2 Setup for RS 232 or Ethernet anaana aaa oo 5 2 Setup for Active X Control 5 2 Communicating with the SQS 242 Program 000 00 eee 5 2 ais o L 5 2 Query Command Format o o ooooooooo ee ee 5 3 Example Software Version Query 0 0 0 cc none 5 3 Example Response to Software Version Query 5 3 Update Command Format 0 0 0 0 eee ee ee 5 3 Example Set Process Update 0 0 ccc ee es 5 3 Example Response Set Process Update Succeeded 5 3 Example Response Set Process Update Failed
105. Abort Set Abort Recipe Abort Process Process Ed PC aiiud Vac Throttle Opening Valve PC High Vac Throttle Check_On Open Opened Opening MFC MFCi MFC1 Mode Set Set Value n nn Set Value n nn nn de EM Gas Loc Turn On Open Opening Gauge Capman Pressure SP Set Value n nn E Capman Pressure Pressure Check Pressure gt n n Pressure gt n nn e 5 12 mE Motor Jog Value n nn E Velocity SP ENG Platen Motor Go Turn On Open i cnr a m Motor Platen Motor Platen Motor Velocity Check Value gt n nn Value gt n nn Ga Power Power Supply 3 Turn_On Open E ge Za m FT I die Supply3 Output Value n nn e i Supply Setpoint rm m Shutter 3 t NM Opening E Nu Missa Supply3 DC Bias mE Value n nn mE E Supply Recipe Dwell 1 1Secod TE Source Shutter 3 Turn Off Closed ef m Gauge Capman Pressure SP Pressure SP Set Set Value n nn Set Value n nn n nn Gauge Capman Pressure Check Pressure lt n nn Recipe Dwell N Seconds n or HH MM SS 20 Shutter Source Shutter 3 Turn On Open Opening Recipe Dwell N Seconds n or 2000 HH MM SS KURT J LESKER COMPANY PVD 75 OPERATION MANUAL frmRecipeltems Eo Lip mentine pet Equipment T Shutter Source Shutter 3 Turn_Off Closed Closing 23 Power Power Supply3 Output Set Value n nn 0 R Supply Setpoint 24 Power Power Supply3 Fwd Check Value lt n nn 5 GT LIE uten a det 25 Pow
106. Crucible Germanium Telluride GeTe Hn5 6 0 381 Wu W Q ALO RF Gass Schol Be d A0 Ex Gad Pu 104 82 DN M7 112 Ex W AhO4 BN YC W DC Films soft Adhesi n poor Low rate for smooth fins indium in 157 730 AH 37 Te Ex W Mo W Gr AkO DC Nets W and Cu Mo liner OK RF at1530 C 0301 236 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 emp C for Given Evaporation Techniques Vap Press Torr Thermal Sources Material Sy MP C m 10 107 E Beam Boat Coll Basket Crucible Reacts wih W Mo OK n 1 38 Magnesium odie Mgb 6X D 443 x k RF Magnesum Die MO 28 358 130 6 CAO RER REvap in iF TO W gives wolafle oxides m 17 KURT J LESKER COMPANY 237 PVD 75 OPERATION MANUAL emp C for Given Evaporation Techniques Vap Press Torr Thermal Sources MP C m W 10 E Beam Boat Coll Basket Crucible Sputter Manganese Mn 124 5 720 DN 52 647 G W TaMo W W X AbO4BeO DC Weit 55 W MaS 130 Mo Mercury Ha 39 115 4 4 ccm Mercury Sulfide H BA S 810 m E Math RF Decomposes n 2 85 320 Mo T 102 1592 182 217 Ex a DC Films smooth hard Preheat ganfly to MohtdemmBodde MB 210 7122 E E ce dm RF RF RF Ex DC G RF G Ex W Necke Beri HBr 8 50 hi RF Nemendium MS 1425 amp B
107. E ALL MODULES COMPONENT INSPECT FOR COMMENTS Pumping performance Over time the pum dicis inis Regenerate all the cryo pumps can become saturated Cryo Pump Manufacturer s recommended maintenance Refer to manufacturer s manual Replace bushing or drive Wear on bushings and drive couplings j l P coupling Hoist Assembly Clean and lubricate bushings Debris on bushings and drive couplings and drive couplings with a heavy duty bearing lubricant Poor fore line pressure or extended pumpdown times when using oil sealed pumps Chamber integrity Comparing periodic RGA Compare a new scan to the scans with a baseline scan can help identify baseline scan and save for RGA Scan potential problems that could affect pumping reference Leak check or clean performance and film quality the system as required Inspected by Date AUTHORIZED SIGNATURE Mechanical Pump Replace foreline trap adsorbent material Zeolite 198 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 90 DAY MAINTENANCE ALL MODULES COMPONENT INSPECT FOR COMMENTS Wear Seals and bellows should be inspected Pneumatic or replaced at 250 000 cycles Process induced Replace seals and bellows at or Manual contamination and bake out temperature before 250 000 cycles of Valves above 150 deg C may shorten service intervals operation significantly Wear or debris on the hoist yoke bearings Clean adjust and lubricate with Components should move freely a h
108. E2 3 You may want to do this several times to get an average response time reading Displaying the Rate graph will also help Twice the measured time is the step response time TIMESR TIMESR is typically 0 7 to 1 5 seconds for E Beam evaporation 5 to 20 seconds for thermal evaporation Press Abort Process then Manual Auto to return to Auto mode Follow these steps to set the loop PID parameters INFICON SQS 242 Operating Manual 6 Set PID Values In the Edit Process Deposition tab set P 25 I TIMESR D 0 Assure that all Conditioning values are set to zero Save the values and close the Edit Process dialog Press Start Process and observe the Power graph The power should rise from 0 and stabilize near PWRDR with little ringing or overshoot If there is more than about 10 overshoot lower the P Term If the time to reach PWRDR is very slow increase the P Term A lower Term will increase response time a higher value will eliminate ringing and setpoint deviations It is unlikely you will need any D Term Continue to Start the process and adjust PID until steady state response is smooth and the step response is reasonably controlled You don t need to totally eliminate ringing during the step if the steady state response is smooth Preconditioning will minimize step changes Set Preconditioning The power level you recorded as PWROR is the power where deposition just begins That s a good value for Ramp 1 power PWRDR o
109. EED CURVES Various standards organizations in the US Europe and Asia have specified methods for measuring pumping speed As far as we are aware all suggest capping the pump with a small volume dome at its inlet port and monitoring the pressure at various gas flow rates into the dome from a calibrated mass flow controller The results are plotted as pumping speed enge een vs pressure as shown in Figure 2 Figure P Because a pump s pumping speed is measured under ideal conditions its numerical value will be unobtainable in a practical system the connection between any pump and any chamber affects the pumping speed see Effective Pumping Speed DISPLACEMENT AND CAPACITY Unfortunately many mechanical pump manufacturers quote a value called free air displacement or capacity for their pumps The units are volumetric flow rate and the value is easily mistaken for a measured pumping speed However displacement capacity appears to be a theoretical pumping speed the pump might have if the gas had no mass or viscosity negotiated the entrance port and constrictions into the pumping mechanism instantaneously and did so without turbulence or boundary layer effects Why pump manufacturers indulge in such an exaggeration is unknown It only confuses those attempting vacuum calculations We strongly suggest displacement capacity values be ignored or in the absence of a measured pumping speed multiplying displacement by 0 75 to get an ap
110. ER SB832037P TMLOOSC 4001 SB832062P TMLOOSC 6001 O V216 TMLOOSC 5001 TMLOOSC 4002 TMLOOSC 6002 TMLOOSC 6005 O V259 O V281 TMLOOSC 4004 TMLOOSC 6004 TMLOOSC 6006 O V262 O V281 THERMAL SOURCE Top Shield Bolts Long Dss Top Target Bolts Long Target Clamp Insulator O Ring Insulator Seal Short DSS Top 3 5 x 8 source Short Target Clamp 3 5 x 8 source Membrane 3 5 x 8 source Target Flange O Ring 3 5 x 8 source Flange O Ring 3 5 x 8 source Short DSS Top 5 x 8 source Short Target Clamp 5 x 8 source Membrane 5 x 8 source Target Flange O Ring 5 x 8 source Flange O Ring 5 x 8 source W W W C C W C C W W IN LEAD DESCRIPTION CATEGORY QUANTITY STOCK TIME 18 NOTE Tungsten boats are supplied as standard Depending the on the material being evaporated other types of boats or heaters are available Reference drawing A0015177 PART NUMBER PVD75SW3B PVD75CCS SB440025VP SB37516050 1618002 7 SB37516100VP O V216 FSCINSOO1 FSCINSOO2 EVS8DO10W EVS7005TA EVSSO10 EVCH1 EVCH5 EVCH12A EVC1AO EVCIBN DESCRIPTION 3 Boat Shutter Weldment Cross Contamination Shield Cross Contamination Shield Hardware 3 Boat Buss Bar Hardware 3 8 16 x Relay 600A 24 VDC Electrical F T Hardware 3 8 16 x 1 Electrical F T O Ring FTT0013754 Small Teflon Insulator Large Teflon Insulator Tungsten Boat 4 L X 1 W X 1 4 Deep Tantalum Boat 3 L X 3 4 W X 1 8 De
111. ER DO NOT operate or service the E Beam before reading and understanding the E Beam operation manual Failure to comply may result in danger to user damage of equipment and void the warranty 1 Follow the E Beam shutdown procedure as outlined in the manufacturer s operation manual 2 See manufacturer s operation manual for general maintenance of individual components GLOSSARY ABBREVIATION DESCRIPTION Crucible Position EB HV E Beam High Voltage KURT J LESKER COMPANY 85 PVD 75 OPERATION MANUAL LTE HTE FURNACE OPERATION A DANGER DO NOT operate the LTE HTE Furnace before reading and understanding all pertinent component manuals 1 Inspect all electrical connections between the LTE HTE Furnace power supply and LTE HTE Furnace source and all in vacuum electrical and vacuum connections to the LTE HTE Furnace source 2 Place a loaded crucible into the pocket of the source and ensure that the cover is installed properly into the source base Ensure that the loaded crucible is centralized in the source cover A DANGER Some low temperature evaporation materials are known carcinogens Refer to all MSDS sheets for safe handling and appropriate breathing equipment and ventilation 3 Checkto see that LTE HTE Furnace source is positioned correctly to deposit on the substrate 4 Evacuate chamber to 5 0e 06 Torr d Although the LTE HTE Furnace will work under any high vacuum condition it is recommend
112. ESKER COMPANY 219 PVD 75 OPERATION MANUAL COMBINING CONDUCTANCES Since a component s conductance in molecular flow is independent of pressure and is quoted as a volumetric flow conductances for various components can be combined in series or parallel If two chambers are connected together by a a narrow tube on chamber 1 b a right angle valve and c a large port on chamber 2 their separate conductances can be combined as reciprocals to give a total conductance between the two chambers see sidebar Series Conductances Notice that the total conductance is much less than any individual conductance In addition look at the table Here just two conductances one variable and the other fixed at 10 L s are added together The Total Conductance column demonstrates a critical rule in series conductances the smallest conductance rules Alternatively if two chambers are connected by two tubes of different diameters each tube has its own conductance To determine the total conductance between chambers simply add the conductances together see sidebar Parallel Conductances COMPUTER CALCULATIONS A component s conductance in continuum or Calculating Conductance transitional flow depends on gas pressure The conductance of an orifice a hole in an and uses different equations than those infinitely thin plate is determined as follows governing molecular flow Calculating Measure the orifice s radius in centimeters conductances
113. GELOK CONNECTOR BRASS 10MM TUBE OD X 3 8 MNPT B 15M0 1 8 FITTING MALE CONNECTOR BRASS 15MMT X 1 2 MNPT 4429K424 FITTING HEX BUSHING BRASS 1 MNPT TO 1 2 FNPT Systems can be fitted with individual cooling systems KJLC does offer water chillers as part of the system Standard KJLC offered units are as follows Other units are available Consult KJLC Sales for proper size and cost KJLC PART NUMBER DESCRIPTION TT100 10T31H CHILLER CLOSED LOOP 10 000 BTU 6 GPM AT 60 PSI AIR COOLED TT100 15 T41 CHILLER CLOSED LOOP 15 000 BTU 8 GPM AT 60 PSI AIR COOLED TT150 15 T41 CHILLER CLOSED LOOP 15 000 BTU 8 GPM AT 60 PSI WATER COOLED TT10015C2005 CHILLER CLOSED LOOP 15 000 BTU 15 GPM AT 60 PSI AIR COOLED NOTE GPM Gallons per minute PSI Pounds per square inch If purchased as part of the system contract KJLC supplied chillers require the use of a glycol water solution The general recommendation is a 2 1 mix of water to glycol solution Use only distilled or purified water in chillers to prevent damage to internal chiller and system components Check with individual chiller manufacturers or the applicable service guides for further information 26 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 KJLC CHILLER COMPONENTS 5304K57 HOSE RUBBER BLACK 1 ID 200 PSI 25 FT 5304K721 HOSE RUBBER BLACK 1 1 2 M F NPT 10 FT KJLEGG1 ETHYLENE GLYCOL HEAT TRANSFER FLUID 1 GALLON KJLEGG5 ETHYLENE GLYCOL HEAT TRAN
114. Gold sample Output 1 Sensorfs c etPt Final Thick TimeEndPt T hk EndFt System Setup 10 00 1 000 0 000 Default 3 KA Sec LA AS 7 Auto Start Indexers Continuous Source Substrate Izerl Iserz femel None None None None User Prompi Index Index Index Inchex 3 Type a new process name using your keyboard or the on screen keyboard Click Enter to save the new process name See Figure 2 2 Figure 2 2 Keyboard Process Enter New Name Sample Savel The Process Edit dialog box will display the setup data for the active process IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual 2 2 2 Edit Layer Parameters 4 10 11 12 Click Layer to display the layer parameters See Figure 2 3 Figure 2 3 Layer tab Layer RateRamps Deposit Condition Source Sensor Errors Film Output Input Gold sample Output censors gt e1Pt Final Thick Time EndPt Thk EndPt system Setup AS k SEC kA Auto Start f Continuous Source Substrate User Usere fc None None Wone gt None User Prompi El Index Index Index Index Indexers A Film is basically a material plus the settings that will control its deposition Select Film Gold Sample We will be simulating a quartz sensor input that is controlling the deposition rate of Output 1 Select Output Output 1 Select Input Sensor s Clic
115. In Timed Power the output is set to the power level that last yielded a rate reading within the Control Error 9o deviation setting 1096 deviation if Control Error is disabled The program then calculates the estimated thickness based on that rate and the deposition elapsed time When the calculated thickness reaches thickness setpoint deposition stops 3 5 1 7 Analog Inputs Normally the SQS 242 software uses SQM 242 card quartz sensor inputs to measure or control rate and thickness The SAM 242 Analog Input Card extends this capability to allow measurement and control on DC voltage based process variables such as temperature transmitters pressure flow controllers Analog input based control is treated for the most part identically to quartz sensor based control Considerations for using an analog input are discussed below Layers Tab In the Inputs dropdown select one of the Analog inputs In the Outputs dropdown select the output that is to be controlled Enter the desired setpoint Normally this setpoint is in Volts but can be converted to other units e g degrees or PSI in the Edit System Analog dialog box Use Time Endpoint to stop the analog layer after a set time Otherwise a Sensor input programmed as a Codep layer can control the layer endpoint Final Thickness and Thickness Endpoint settings have no effect for an analog input INFICON SQS 242 Operating Manual If Continuous Start is selected the analog i
116. J LESKER COMPANY OPERATION MANUAL PVD 75 CHAMBER VOLUME A B C D E F Is the chamber volume very large and the rough pump speed very small Does the chamber contain very large surface areas and is the high vacuum pump small Is the high vacuum pump s base pressure close to 1 x 10 6 Torr Are the chamber walls clean or dirty oily pitted or corroded Does the high vacuum pumping port have the same I D as the high vacuum pump inlet Is the high vacuum pumping port s length more than 3 times its D FIRST PUMP DOWN A B C Patience The initial pump down removes the loosely bound vapor layers absorbed on every surface Regard it as vacuum conditioning Pump the system for several hours let up to atmosphere with dry nitrogen and pump down again Then if the pumpdown still takes five hours consider B and C Examine the simple things that can cause long pump down check for leaks with a leak detector regenerate the foreline trap check that gas inlet valves are fully closed consider the outgassing characteristics of the construction materials check that the cross over pressure is appropriate for both rough and high vacuum pumps check if the foreline pressure is at an acceptable value for the high vacuum pump Did someone goof in the original design Check using a computer modeling program such as VacTran When you allow for typical outgassing rates are the results consistent with
117. J LESKER COMPANY OPERATION MANUAL PVD 75 Inspect all tip and impact indicators attached to the system crate 1 Prior to shipment tip indicators are placed on the walls of each crate 2 Prior to shipment impact indicators are placed on or near each major component i e instrument rack deposition chamber etc 3 H any indicator has been set off KJLC should be notified immediately Assure that the content of each crate and package match the supplied Packing List Refer to Packing List included with shipment If any discrepancies occur between the received parts and the Packing List KJLC should be notified immediately KJLC will not take responsibility for any missing items after 3 days of shipment arrival A CAUTION When possible chambers are shipped under vacuum to preserve their integrity and cleanliness Care should be taken to ensure viewports or F T s are not damaged which could produce an unsafe condition UNCRATING A CAUTION The system crating contains screws and nails for construction Caution should be exercised during uncrating to assure no injuries occur from sharp edges or splitting wood 1 Carefully remove the crate lid and inspect the condition of internal tip and impact indicators 2 If applicable unscrew the internal braces from inside the crate that surround the instrument rack and system for support see Figure 1 3 Carefully remove sidewalls of crate 4 f applicable unscrew the lo
118. MANUAL MAINTENANCE MATERIALS AND ACCESSORIES ITEM DESCRIPTION ELECTRICAL ASSEMBLY Wire Stripper Sizes 8 22 AWG Wire Cutters Precision and heavy duty Sizes 22 10 AWG Standard Terminal Crimper Precision Screwdrivers MECHANICAL ASSEMBLY Sizes 1 4 inch 3 4 inch SAE Socket Set Metric Socket Set Sizes 6 mm 17 mm 1 4 inch amp 3 8 inch 1 A inch amp 3 8 inch Sizes 1 4 inch 3 4 inch Ratchets Ratchet Extensions SAE Wrench Set Metric Wrench Set Adjustable Wrench Sizes 6 mm 17 mm Small amp Large 1 amp 2 1 amp 2 1 16 inch 3 8 inch Phillips Head Screwdriver Slotted Screwdriver SAE Hex Key Set Metric Hex Key Set 1 5 mm 10 mm Standard 1 4 inch 3 8 inch Slip Joint Pliers Tube Cutter Metal amp Plastic RECOMMENDED SUPPLIES Isopropyl Alcohol Used for final cleaning Acetone Used for initial degreasing Alconox Vacuum cleaning solution Alpha Wipes Lint free wipes Molybdenum Disulfide Used for lubrication of hardware Vacuum Grease Used on o rings to ensure proper seal Boron Nitride High temperature lubricant Y D QD uU D O O 5 et Di O et et 5 D A C x et D UN ES D C O 3 o D 5 lt h O O x o D gt 5 ga 5 h O x 3 D O 5 Ha 80 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 COMPONENT PREVENTATIVE MAINTENANCE The individual component manufacturer s recommended preventati
119. ME 2 Y Y Y EN Wwkassono Fuse 5X20MM 250V 125A Time Delay w yv WKAss7 NO Fuse 5 X 20MM 2A 250V Time Lag AA 2 2 ES Ise resm sammes w Y 2 1N4007 T Diode 1N4007 DO 41 1000V 1A i E EE IECN KURT J LESKER COMPANY 209 PVD 75 OPERATION MANUAL FNQ R 1 4 Fuse Class CC FNQ 1 4A FNQ R 1 2 Fuse Class CC FNQ 1 2A FNQ R 1 Fuse Class CC NDQ 1A FNQ R 2 Fuse Class CC FNQ 2A FNQ R 3 Fuse 3A Class CC LFJLS30 Fuse Class J No Delay 30A C9A41DX24VDC Relay 4P 24 VDC 700 HLTIZ24 Relay SPDT 24 VDC 250 V 6A Relay Socket D2 16TD1 2 D205 16 Discrete Output Module D2 32ND3 D205 32 Discrete Input Module D2 32TD1 D205 32 Discrete Output Module F2 04THM D205 Thermocouple Module F2 8ADADA 2 Analog Output Module H2 EBC D205 Ethernet Port Module L0024478 SCR 0 10 V SC E03G24VDC Contactor 10A CS10 241 24 VDC power supply SAPCBALDDIS Discrete Circuit Board C mi KC SAPCBALDANA Analog Circuit Board 210 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 APPENDIX VACUUM TECHNOLOGY WHAT IS VACUUM Commonly the word vacuum is applied to an enclosed volume containing gas at a lower pressure than the surrounding atmospheric pressure So many applications processes and products involve vacuum that attempting to classify them appears futile However using very broad definitions vacuum applications fit into six headings LARGE
120. PLE SAVE Layer 1 of 1 Phase Shtr Delay Time Run 0 00 31 32 Time 0 00 31 Time 0 00 31 Progress Film Rate A s E ES Ka EN eposition Control Software IPN 074 551 P1A 4 INFICON O P E R A T N G M A N U A 305 242 Deposition Control Software IPN 074 551 P1A Tt INFICON Opening The Field To New Ideas www inficon com reachus inficon com 2011 INFICON Trademarks The trademarks of the products mentioned in this manual are held by the companies that produce them LabVIEW is a trademark of National Instruments Z Match and SQS 242 are trademarks of INFICON GmbH Access ActiveX Windows and Microsoft are registered trademarks of Microsoft Corporation All other brand and product names are trademarks or registered trademarks of their respective companies Disclaimer The information contained in this manual is believed to be accurate and reliable However INFICON assumes no responsibility for its use and shall not be liable for any special incidental or consequential damages related to the use of this product Due to our continuing program of product improvements specifications are subject to change without notice Copyright 2011 All rights reserved Reproduction or adaptation of any part of this document without permission is unlawful Warranty WARRANTY AND LIABILITY LIMITATION Seller warrants the products manufactured by it or by an affiliated company and s
121. R in the Control column indicates that the sensor is being used only for rate control A T indicates the sensor is used only for Final Thickness endpoint detection An M indicates the sensor is being used to monitor but not control the output These options are selected on the Sensor tab of System dialog box IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual NOTE The Sensor Readings dialog box can be sized to also show SAM 242 card analog input readings and digital I O information The digital I O information is useful for troubleshooting I O problems during setup Rate Graph Fixes the main graph to deposition rate Deposition rate is useful during the shutter delay rate ramp and deposition phases During other phases the power output graph is usually more useful Deviation Graph Fixes the main graph to display percent deviation from the rate setpoint Rate deviation is useful for fine tuning the PID control loop Power Graph Fixes the main graph to output power Output power is directly adjusted during the PreConditioning feed and hold phases Output power is also useful during the deposition phases to detect error conditions which cause oscillations Be sure the Full Scale voltage is set properly in the SQM 242 Setup menu Sensors Graph Normally the graph displays output or film based information The Sensors Graph selection displays the rate readings from each individual sensor assigned to a
122. RNING Severe shock hazard 21139 pulpiti power rs ne oven when lion ERIC cimi abil cm gota Tie tan LIPS of wee Lies frei panel OM OFF sere Surge Protection e FIGURE 2 UNINTERRUPTABLE POWER SUPPLY i ragi KURT J LESKER COMPANY 107 PVD 75 OPERATION MANUAL SYSTEMS WITH SEPARATE CONTROL RACK amp FRAME Turn this switch clockwise to START position Power will be restored to system components FIGURE 3 1 Reset the activated EMO switch by turning it clockwise or pulling it out 2 Rotate switch from On position to Start position This returns power to system components 3 Turn on system UPS see Figure 2 4 Turn on system PC let Windows boot up 5 Once in Windows open CWare 108 KURT J LESKER COMPANY OPERATION MANUAL SYSTEM WITH INTEGRATED CONTROL RACK amp FRAME 1 2 3 4 EMO Switch Depress the EMO switch located at front of mainframe Turn on system UPS see Figure 2 It may need to charge for a few minutes before next step Turn on system PC let Windows boot up Once into Windows open CWare KURT J LESKER COMPANY PVD 75 109 PVD 75 OPERATION MANUAL RECOVERY FROM ACCIDENTAL PRESSING OF EMO In the event of an accidental EMO a quick recovery can be performed by 1 2 3 4 5 Resetting the EMO that was activated If system is a PVD or NANO go to step 3 If the system is a CMS see Figure 3 and turn switch on Main Power Control str
123. SFER FLUID 5 GALLON COMPRESSED AIR PNEUMATICS Most tools and all computer controlled tools require a clean dry compressed air supply for actuation of valves shutters and other motion related components y XM RH 1 a J P u A 1 D a E E r MX A N z d A f 1 AY X 4 t i g 2 z le OO S s r S E E e A elt el z O e 2 R z z I Li zaj st of E 2 oi lt r te tios SI e D iS e lt lt CS Ef gt el e st Sti esl 55 ep ej ej A ES KI vt ufo por SR 2l amp z 93 82 2215151513215 hal BM oe AA Ka kee be e eel 5 2 5 seb ejos i S 4 4 e a e e L ER Gul E 8 PNEUMATIC CONTROLS Make the required connection to the bulkhead fitting or the backside of the pressure regulator located in the rear of the system The General Assembly Schematic and utility document should be referenced Before installation purge all newly constructed utility lines to remove all loose materials such as thread compound PTFE and tapes Also be sure to remove any remaining burrs from the tube edges before connecting to the system KURT J LESKER COMPANY 27 PVD 75 OPERATION MANUAL BULKHEAD CONNECTION PRESSURE REGULATOR The compressed Air supplied to the system is to be Clean Dry Air CDA The air is to be free of dirt moisture and compressor lubricating oils It is recommended that an air oil separa
124. SQS 242 responds to both Query and Update commands with a response that indicates the results of the command request The SQS 242 program never initiates communications It only responds to commands from the host IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual 5 6 1 Query Command Format lt command gt lt paraml gt lt paramn gt lt Chksum gt lt CR gt 5 6 1 1 Example Software Version Query QU 11 44 lt CR gt where a QU 11 44 lt CR gt Message start character Separator Query Utility command Separator Parameter 11 SQS 242 Software Version Separator Checksum see section that follows on checksums Carriage Return ASCII 13 5 6 1 2 Example Response to Software Version Query COU LACO 2 15672 ACR Response to Software Version query where Q QU lt ACQ gt Query Acknowledged ASCII 06 221 Message Software Version oeparator OC Checksum actual checksum varies with different versions lt CR gt Carriage Return ASCII 13 5 6 2 Update Command Format a commandos paramlss 5 Dpa fammg sdataog Cchksum s cR 5 6 2 1 Example Set Process Update QUP 11 MyProcess 44 CR where Es UE Update Process command separator DI Parameter 01 Set Process oeparator MyProcess Data separator T Checksum lt CR gt Carriage Return ASCII 13 5 6 2 2 Example Response Set Process Update Succeeded GUP lt ACO gt PP lt CR gt
125. ST 0025CI Tubing 316L SS OD Electro polished As Required SGO600MV ON Gate Bonnet O ring Set SGPO600 Series Gate Valve SGO800MV ON Gate Bonnet O ring Set SGPO800 Series Gate Valve SG1000PV ON Gate Bonnet O ring Set SGP1000 Series Gate Valve SG1200PV ON Gate Bonnet O ring Set SGP1200 Series Gate Valve ROUGHING BACKING PART NUMBER QUANTITY PFEGL9150F25 1 PFEGL915 AV 104200 AV 068304 TAR4CS100QF 202 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 zm wesmawsummsws de a eem Iuesemeg e N Rm a were memes reo Ly el SSES DEE PFI843 PFI813HF25 40 Polyester Element E HIVAC TURBO PUMP N N LEAD PART NUMBER DESCRIPTION CATEGORY QUANTITY STOCK TIME PMO16207AU HiPace 80 Centering Ring with Screen ISO RON 25 Days PMO16211 U HiPace 300 Protective Screen ISO 100 Ed 25 Days PMO16339 HiPace 700 Protective Screen 8 CF RN 20 Days HIVAC CRYO PUMP IN LEAD PART NUMBER DESCRIPTION CATEGORY QUANTITY STOCK TIME 8080250K036 Purge Gas Heater For Cryopump 230V i 4 CHAMBER DOOR IN LEAD PART NUMBER DESCRIPTION CATEGORY QUANTITY STOCK TIME CN TE a cl n cars ETE n mw 1 ovs neen a nn O V473 O Ring 24 x 1 4 Chamber Seal 3 Juge a Low TEMP PLATEN ASSEMBLY 150 550 C QLH LAMPS Reference Schematics A0025397 A0038879 and A0038851 IN LEAD PART NUMBER DESCRIPTION CATEGORY QUANTITY STOCK TIME HEATER QJ
126. Sigma Data Sets ow Configuration amp System Users Type a question for help 8 X New 4 gt Show All subrecipe Delete Export All Recipes to XL Name Abort AutoRegen Owner KJLC KJLC Include in VB List yj Operator Can Use _ Process Eng Can Use User KILCKILC Update VB Reorder Items Copy Recipe Seq Type Equipment Equipmentltem EquipmentltemOperation Equipment Test Value GRS PC Regen Pirani Tum Off Closed Closing PC Cryo Purge Valve Tum Off Closed Closing PC Cryo Regen Valve Tum Off Closed Closing Source4 Gas Turn Off Closed Closing This screen provides the user with an interface for running and maintaining recipes See the CWare Operation section for further instructions i ICON OR DATA FIELD ACTION RESULT New Recipe l l Ss Click to activate Starts a new blank recipe Use these buttons to select the first previous Click to activate SE Des last or next recipe in the recipe list Click the arrow to display a list of programmed Drop Down Recipe List i Click to activate recipes You can then select one from the list TEEN Toggles between Show All and Show Main and Click to activate dictates what list of recipes will be shown in the Drop Down Recipe List box Show All Show ALL Sub Recipe Checking this box will allow the chosen recipe Click to activate i Sub Recipe to be used as a step in other recipes Click to activate Delete SE Deletes
127. Sigma process only This is typically used to map a substrate shutter Deposit Shutter Mapping Deposit Shutter Mapping Click to enter value Transfers the Sigma process setup Click to enter value associated with this number from the Recipe database to the Sigma software Sigma Data Set Number Loads the target process Type the name of the process you want to run then Enter If there is an associated process name in the Sigma software this is the process that will Sigma Control Request Click to enter value New Process run when you click on Sigma Start Process Sigma Last Message Displays the last message sent to Cware Display only EG from the Sigma software Sigma Process Name SC New Process Display only The current process is displayed Sigma Film Name The Sigma specific name of the current file is Display only joe displayed Refer to the Sigma Data Sets section and the Sigma manual for descriptions of additional icons included on the Operation Sigma screen KURT J LESKER COMPANY 145 PVD 75 OPERATION MANUAL SYSTEM DISCRETE SCREEN 0 0E 0 11 49 53 AM 8 4 2006 a r Logout KILC Kurt J Le Lesker 0 00 01 Closed Off e Super User ABORT Version 2 19 Discrete Analog Strings Ethernet IO Discrete Outpuis Recipe Database Signal State Is Forced Gas Injection 0 0 Diff Pump Temperature Switch Run Recipe 8161011 PC Turbo Backing Valve 0 0 PC Turbo At Speed Start PC
128. Supply Output Setpoint Power Power Supply 1 Turn On Open Opening Cam NED Sigma Sigma Launch 242 Sigma Launch 242 242 Turn On Open Opening Turn On Open Opening Sigma Sigma Shutter Set Value n nn E Delay Mapping 1 15 Sigma Sigma Shutter Set Value n nn Deposit Mapping 1 Sigma Sigma Control Set Value n nn Ag EVAP 4KW Request Sigma Sigma Stop Turn_Off Closed Closing Process 3 Recipe Dwell 3 B Seconds Sigma Sigma Load Turn c Process 20 Sigma Sigma Start Turn_On Open Opening Process 21 Sigma Sigma In Process Check On Open Opening AT Se Sigma Sigma In Process Check Off Closed Closing La Power Power Supply1 Set Value n nn Supply Ramp Rate Power Power Supply1 Set Value n nn Supply Output Setpoint Power Power Supply 1 Turn_Off Closed Closing Supply 26 Motors Platen Motor Go Turn_Off Closed Closing Continuous 96 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 UNDERSTANDING THE SIGMA CONTROLLED CWARE RECIPE Step 1 Step 2 Steps 3 6 Steps 7 9 Steps 10 12 Steps 13 15 Step 16 Steps 17 18 Steps 19 20 Step 21 Step 22 Steps 23 24 Step 25 Step 26 Always the first step in a recipe sets which Abort Recipe should be run in the event a check step that has an AT Abort on Time fails Waiting for a desired base pressure before deposition will run In this case 5x10 5Torr Sets up appropriate source switch and closes system shutters Sets up s
129. TE X SOURCE Y EXAMPLE This station setpoint is intended for systems with single or multiple platens For example a station setpoint of 14 on a system with one platen signifies that platen 1 the only platen should move to deposition source or position 4 A station setpoint of 25 on a system with 4 platens signifies that platen 2 should move to deposition source or position 5 d Setting a new station setpoint places a value in the motor position setpoint in inches or degrees depending on the type of axis but the Move to Position button must be pressed before the motor will actually move 138 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 COOLING SCREEN K Kurt J Lesker unning Time ICON OR DATA FIELD ACTION RESULT Flow Switch es Green On Display only Gray Off KURT J LESKER COMPANY 139 PVD 75 OPERATION MANUAL HEATING SCREEN Operation Heating Copyright 2009 Kurt J Lesker V4 33124 Kurt J Lesker Es Logout KJLC ea y 0 01 18 01 Closed Off Super User ABORT Version 4 33124 Vacuum Deposition Das Cooling Platen Motion LRP Motion D Heater Control Temp ee On Off Auto SP Auto SP RR deg Temp Temp Current degt degC ZSP C Min p D degC degC A Alarm Recipe Database Substrate Heater OFF OFF EN EJ EN EM Ea EA EN EM E Run Recipe Start PC Pump Start PC Vent Start LL Pump Start LL Vent PC Pressure PC Cryo Temperature Start Sample oa Start Sample nloa
130. There are several benefits to using an external PLC for I O First noisy high voltage wiring can be placed near the control sources rather than routed into the controller s equipment rack Only a single serial cable runs from the PLC to the controller The PLC also provides electrical isolation for the process controller And finally the PLC s ladder logic programming provides fail safe process protection and allows I O to be easily tailored to each end user s installation 4 2 PLC Installation A CAUTION The Omron PLC uses a special RS 232 cable as shown in Figure 4 1 Do not use a standard serial cable Damage to the PC or the PLC could result Figure 4 1 Omron PLC RS 232 Cable SID 142 Serial Port PLE Port INFICON SQS 242 Operating Manual Mount the PLC controller near the devices it is controlling and sensing Connect the PLC to a properly grounded power source See the PLC User Manual for detailed PLC mounting and connection information Connect the serial cable supplied from the PLC serial port to your computer serial port Input Wiring The 0 0 to 0 11 inputs on Omron PLCs correspond to Inputs 1 to 12 in the SQS 242 software Omron PLC input wiring is shown in Figure 4 2 Figure 4 2 Omron PLC Input Wiring Output Wiring The PLC output relays are mapped to output events using the SQS 242 software s Edit System dialog I O Events tab NOTE Relays 1 to 8 in the SQS 242 software correspond to relays 10 00 to
131. a KURT J LESKER COMPANY 231 PVD 75 Weights amp Measures Btu Btu kilowatt hour 2 929x10 Btu tb TIT 6 Btulminute watt 17 57 calorie ule 4184 calone Btu 3 968 calorie kg horsepower hr 1 558x10 calorie kg tb 3086 calories kg kilowatt hour 1 162x10 circular mil enr 5 067 x10 circular mil int T 854x10 circular mil sq mil 0 7854 cm mil 393 7 em inch 0 3937 cm angstrom 10 em ff 1 07 6x10 om circular mil 1 57 4x10 cm int 0 155 em 2 642x10 cm im 6 102x10 em uarts liquid 1 057x10 com liter 10 cm f 3 531x10 om pints liquid 211300 coulombs in coulombs cnr 0 155 degree angle minute 60 degree angle second 3600 degree angle radian 0 01745 degree sec dantec 0 01745 degree sec revolution sec 0 002778 degree sec rpm 0 1667 dyne pound 2 218x10 dyne gram 1 020x10 dyre bar 10 ecm 1 en kg meter 1 020x10 em gram cm 1 020x10 en fiAb 7 316x10 en kg calorie 2 380010 em joule 107 en Btu 9 466x107 engssec Btu min 5 691x10 ergsisec kilowatt 10 ergsisec ft4b min 4 42x10 feet cm 30 48 feet mete 0 3048 ftAb meter kilogram 0 1383 ft4b om gram 13 826 ft4b omdyne 1 356x10 232 Multiply By ft in 14 ft nr 0 0829 ft enr 929 ft Ib water 62 4 ft liter 28 32 ft t liquid 59 84 ft eme 2 B32x10 ft in 1728 ft nr 0 02832 ft uart liquid 29 92 ft llon T481 ft p 0 03704 ft min gallon sec 0 1247 feimin onmr sec 471 8 f min liter sec 0 4719 allon wart liquid 4 gallon l
132. abase screen to view or modify the steps in a recipe RUNNING RECIPES A list of available recipes is displayed by pressing the Run Recipe button from any Runtime Engine screen Recipe details can also be viewed from the Recipe screen of the System Database The list of available recipes is limited by the access level of the logged in user and if the Include in VB List box is checked See System Users and Recipes screens in the Overview amp Definitions section for further details d Skipping certain steps may cause damage to equipment and is done so at the operator s own risk To run a recipe from the Runtime Software screens 1 Click the Run Recipe command button found on the right side of any Runtime Software screen Abort AutoRegen Abort Default Abort LL Pump Abort LL Vent Abort PC Pump Abort PC Vent Abort Process AutoRegen AutoRegenLite Disconnect Process Gas Line STANDARD RECIPES 168 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 2 Select the desired recipe from the list with a single left click of the mouse A green box appears below the list just above the Cancel button Abort CDC Pump Abort CDC Vent PowerSupplies Ramp Test SetPoints Cancel 3 Clickthe green box to start running the recipe Clicking Cancel will close the Run Recipe pop up box 4 When the recipe starts a dialog box will appear The top half displays the recipe name and step number The bottom half displays the cu
133. ach of the six possible outputs is associated with a unique source indexer These values are sent to the digital I O PLC at the beginning of each layer INFICON SQS 242 Operating Manual Substrate Index If using a substrate indexer assigns the substrate to one of 16 possible values These values are set at the beginning of each layer User1 User2 Index These additional values are output to the PLC for use as needed Common applications are to select external equipment configurations The Index names the range of values 0 to 15 or 1 to 16 and the first entry can be customized by editing entries in the SQS242 INI file See section 3 8 3 5 1 2 Rate Ramps Tab Rate ramps cause changes to the deposition rate over time under PID control Each rate ramp has a starting thickness an elapsed time to ramp to the new rate and a new rate setpoint Each process layer can have an unlimited number of rate ramps See Figure 3 10 Figure 3 10 Rate Ramps tab eh Process Edit Sample Save Rename Delete Copy Layer Out Film Sett Thickness Time Gold Sample Cut Layer iber Sample 15 O Gold Sample 10 Copy Layer Layer RateRamps Deposit Condition Source Sensor Errors Ramp Gier hick RampTime MewRate start Thickness Insert Ramp K Delete Ramp ET EE Wm 00 Move Up Move Up New Rate Move Down Down ATS Insert Ramp Inserts a new rate ramp for the selected layer at the selected position in
134. al as required If the crucible is cracked it must be replaced Bead blast to remove build up Deposition build up or flaking vacuum wash and dry thoroughly Remove all particulate and wipe internals with isopropyl alcohol and lint free wipes If any internals Check rotation of feeder require additional bead blasting or mechanical cleaning those parts must be properly vacuum washed and dried prior to re installation Pellet Feeder Remove all particulate and wipe internals with isopropyl alcohol and lint free wipes If any internals Operation of the cassette indexer require additional bead blasting or mechanical cleaning those parts must be properly vacuum washed and dried prior to re installation 190 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 SPUTTER MODULES COMPONENT INSPECT FOR COMMENTS Bead blast and clean thoroughly to remove contamination Check N type connection for particulates Water leaks Refer to cathode manual Deposition build on target clamp screws Over Replace as required Silver time deposits will form in the screw heads plated hardware is required to and make removal difficult avoid galling Gun short circuit to earth Remove deposition using a fine scotch brite or mechanical polishing technique Care must be taken to protect all o ring Cathodes SEBES sealing surfaces Replace as required Chimney and target hold down rin y B 5 Refer to cathode manual installation The shutter
135. all a power cord SO type or use a hardwire setup conduit with individual wires from an appropriately sized and protected distribution panel to the power distribution unit If separate drops are required the General Assembly drawing should be referenced Verify that all instrumentation and all devices requiring line power are labeled configured appropriately for the system line voltage 120 or 208 etc It is recommended that a wall mounted power disconnect switch be mounted near the system and used as the main connection point for the incoming system power Depending on the configuration of your system components such as pumps compressor and instrument racks may be located separately from the main system This may require interconnect cables to be run between the main system and remote item Depending on your local regional or national safety regulations you may be required to provide additional protection for those interconnects such as conduit or cable trays Check with your facilities manager for code specific regulations on power installation service disconnects and interconnecting installations STANDARD ELECTRICAL CONNECTORS Each KJLC Vacuum System comes with a power connection receptacle built into the system electrical rack The mating power plug connector is shipped with the system Below are the standard configurations for mating power plug Power designations for each plug are listed above in the Electrical Power Connectio
136. alves clockwise See Fig below Toggle the shutter to open the shutter should not open yet Check which airline has pressure on it and adjust the other speed valve counter clockwise slowly until the shutter opens Toggle the shutter to close the shutter should not close yet Adjust the other speed control valve counter clockwise slowly until the shutter closes Recheck the shutter open and close and adjust the speed valves so that the shutter operates smoothly KURT J LESKER COMPANY 67 PVD 75 OPERATION MANUAL SHUTTER LIMIT ADJUSTMENT Adjustable limits E BEAM SHUTTER Use the two adjustable limits shown above to set the open and closed position of the shutter SYSTEM EQUIPMENT REQUIREMENTS Each E Beam system needs the following interlocks to be satisfied in order to work e Water flow sensors e Vacuum monitor e External E Beam cover switches Drawer door power F T cover switch and power cable cover interlocks to be closed 68 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 WATER FLOW SENSORS Located on the water return line of the system s water manifold E Beam water flow switches Water valves in OPEN WATER MANIFOLD Depending on the type of E Beam system installed there may be 1 water flow switch or two flow switches in series as shown above One flow switch is for the magnet cooling the second switch is for the crucible cooling the valve needs to be in the OPEN position on both
137. andard Kurt J Lesker Company thin film deposition systems All information illustrations and specifications in this manual are based on the latest product information available at the time of printing KJLC reserves the right to make changes at any time without notice Any duplication of this manual in whole or in part without express written approval from Kurt J Lesker Company is strictly prohibited KURT J LESKER COMPANY 7 PVD 75 OPERATION MANUAL GENERAL SPECIFICATIONS l 47 1194mm wide x 35 889mm deep x 75 F System Footprint nominal 1905mm high Cabinet Construction Carbon Steel Fully Enclosed Gray Powder Coat Finish Chamber Volume nominal 75 liters Configuration 4 356mm wide x 14 356mm deep x 24 610mm high Construction D Shaped 304L Stainless Steel with O ring Sealed Hinged Aluminum Front Door Substrate Fixturing Base on selected options Platen Size Up to 12 305mm diameter Rotation optional Variable up to 20 RPM Cooling optional Water or LN LN static only Heating optional Quartz Lamp or Resistive Element Heating Temperature Range 150 600 C optional Deposition Capability optional Process Gas optional 2 Channels Needle Valves or Mass Flow Control System Control Standard PC Based HMI with CWare Software Optional Recipe Control and Datalogging Warranty 12 months after shipment Certifications optional CE markin
138. ards IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual 1 3 Digital I O Digital I O for the SQS 242 software can be provided through an inexpensive external programmable logic controller PLC see Figure 1 3 This allows the PLC and the associated I O wiring to be placed in a convenient location in a wiring cabinet A single serial communications cable runs to the computer The PLC provides electrical isolation fail safe operation and extensive I O processing capabilities through its ladder logic programming Figure 1 3 Programmable Logic Controller PLC INFICON SQS 242 Operating Manual This page is intentionally blank IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Chapter 2 Quick Start 2 1 Introduction This chapter will provide a general overview on how to setup the SQS 242 deposition control program 1 2 Power On the Computer Start the SQS 242 software from Start Menu gt gt Programs gt gt INFICON gt gt SQS 242 Codep User Login Dialog Box The SQS 242 displays a progress bar during program startup then a User Login dialog box Select a User Name from the drop down box enter the Password then click OK See section 3 5 5 on page 3 30 for more information on users passwords access levels and registration NOTE The SQS 242 software has one pre assigned user by default The user name is Super with no Password
139. ase begins immediately after deposition is complete It holds output power at the level and time required to wire feed new material Idle The Idle phase follows the Feed phase 3 5 1 5 Source Sensor Tab The Source Sensor tab controls the physical setup of the deposition system See Figure 3 13 Figure 3 13 Source Sensor tab eh Process Edit Ej Sample Save Rename New Delete Copy Layer Out Film SsetPt Thickness Time Gold Sample Cut Layer iber Sample 15 O Gold Sample 10 i Copy Layer Layer RateRamps Deposit Condition SOUrcef gt ensor Errors Source Material Slew Hate Gold l SC sensor Tooling Gi Sensor 1 Sensor d Sensor 3 Sensor 4 sensor Bb Sensor b Sensor d sensor H Material Selects the physical deposition material for the film selected on the Layers tab Selecting a material sets the Density and Z Factor as defined in the Edit Materials dialog box INFICON SQS 242 Operating Manual Max Power The maximum output power allowed for the selected output The full scale output voltage is a function of the deposition power supply input specifications and is set in the Edit System menu Outputs tab Max Power controls the maximum of the full scale power that can be used by this film in all phases PreConditioning Deposition and Feed Idle Slew Rate The maximum power change allowed on an output per second If rate ramps or PID power requirements exceed this value an error wi
140. ase with one Rate Ramp You should adjust the PID parameters on the setting ribbon then Start Stop the process several times to become familiar with their effect on control loop response NOTE In Simulate Mode a deposition rate is not measured until the output power exceeds 50 INFICON SQS 242 Operating Manual 2 4 SoftKey Functions As you have seen the SoftKey functions remain constant during deposition Spend a few minutes to become familiar with each of these SoftKey functions START PROCESS Starts the first layer of a process when START is pushed If AUTO gt MAN is shown on the third SoftKey AUTO mode the process starts PreConditioning If MAN AUTO is shown on the third SoftKey MANUAL mode the process immediately starts in the Deposition phase ABORT PROCESS Aborts the process The process can only restart at the first layer START LAYER Starts a stopped layer or a layer that has been designated Manual Start in the process database Starts the layer based on the state of the AUTO gt gt MAN SoftKey as described above STOP LAYER Stops the current layer Also changes the function of the first SoftKey to NEXT LAYER NEXT LAYER Abandons the current layer and moves to the next layer in the process If it is the last layer of a process the same as pushing ABORT PROCESS AUTO gt MAN When AUTO gt MAN is pushed the source output is set to manual control You may adjust the output using the sett
141. ate AUTHORIZED SIGNATURE 200 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 SPARE PARTS LIST The following is a list of recommended spare parts for a standard PVD 75 system and should be used for reference purposes only The system schematics Operation Manual Component Manuals and Preventative Maintenance Schedule should be reviewed for more details and components specific to your system Spare parts and accessories that have not been supplied by KJLC have also not been tested and approved by us The fitting and or use of such products could therefore negatively affect the design characteristics of your machine KJLC accepts no liability for damages arising from the use of non original parts and non original accessories SS refers to stainless steel and A refers to aluminum products All dimensions are in inches unless otherwise specified In Stock refers to items typically kept in stock at our main warehouse in Pennsylvania Availability of these items is subject to change and may or may not be in stock at our satellite offices Most in stock items will ship within 1 to 2 days of order receipt Expediting services are available For up to date availability and ordering please visit www lesker com Lead Time refers to the typical time required to manufacture or acquire items not normally kept in stock Please refer to the following category descriptions when ordering spare parts C Consumable Keep on hand CNS Critical Item
142. ation H System Users Type a question for help 2 amp x Delete Logged In Logged Out Time Logged in Num Recipes Recipes Used 5 27 2005 5 29 59 PM 5 Thermal 1 Al PC Vent PC Pump 28 2005 10 20 04 AM 3 PC Pump Thermal 1 Al Abort Default 28 2005 10 46 25 AM 0 28 2005 10 48 43 AM 0 28 2005 10 59 02 AM 0 28 2005 11 00 13 AM 13 Thermal 1 Al Thermal 1 Al Thermal 1 Al 3 29 2005 9 24 29 AM 0 3 29 2005 9 40 16 4M 4 Ba pre condition Ba pre condition Interlock Thermal Source 6 ON Turn Water On III 29 2005 10 06 29 4M 12 Ba pre condition Ba pre condition Thermal 1 Al 3 29 2005 2 19 41 PM 0 3 29 2005 2 23 01 PM 0 3 29 2005 2 24 12 PM 0 3 29 2005 2 30 36 PM 0 3 29 2005 2 32 31 PM 2 Interlock LLR Isolation Valve Open Stop the Rotation aaaaaa All user actions that have occurred since the last shut down can be viewed and maintained using this screen See the CWare Operation section for further instructions ICON OR DATA FIELD ACTION RESULT Delete Click to activate Click to remove all entries in the Action Log Delete Click to export a copy of all entries in the Action Log to C ProgramFiles Lesker Customer Name Excelfiles Click to activate Person Lover Displays the login name of the person using Person siu the system for the corresponding login entry Logged In Shows the date and time that the user logged Display only l Logged In into the system Logged Out Shows the date and time that the user logg
143. ccscccsccecsoneees 181 Component Repair Replacement nnns 181 Process Chamber ee TEE 181 Preventative Maintenance SCHeECUuIeC cccccccccccccccccccccccccccccccscccccccccces 183 Sortware MaiIntenallce ninia AA 185 Maintenance pon VentlhB acacia 186 E ET dE TEE 194 Dav Wid INCOM DINGO E 196 30 Day Mamtenante iii 198 90 Day Maintenance sii a 199 Yearly Manten NC iris 200 Spare Paris lo 201 A UE 211 Vacuum Technol iii ii 211 ET aabt 211 Large Hadron ee re aso ri 211 Vulle E PP UU TT aaouteaneaauneteeanbecteaetenst 211 Cameras EE 211 R NNEN 211 NEON SIBIIS adios 211 A M I aO Re UE M 212 POS UN fte e E MH 212 WTAE IS HE 212 Grand Scala E 212 NANOS CAC TT E 212 Pressure Una Ee 213 Basic NEO EE 214 IID CTD CIS Oy EE 214 MS RN NECI EE 214 A In epe er donus tv inti uas MY 214 Reducing Pressure 215 EE EE 215 teg ler EE EE 215 TOUR gre DT EE 216 Biel 216 Vacuum DOS tU e et erst M I TU d 217 CONGUECANGCE EE 218 Practical Interpretar 218 Coriduetdhce UNS as 218 Calculatine COMGUCTAN CES E 218 NV aa CS ge EE 219 COMBINING Conductance Sron na a N 220 Computer Calcula OA Sacar io 220 PUM ONG AA AA AA ds 221 PUMPING Interpretation AS 221 PUMPINE SDSedDfilbs A 222 Pumping Speed CUVE Srnie a in 222 Displacement and Capacity EE 222 Effective Pumping Speed EPS sccsscsscescescescecceccesceccecceccecceccecceccecceccsccecessescens 223 What EPS oa U 223 EE 223 GAS LOA iii 224 Whatis 4Ogs LOdO KEE 224
144. ce it into storage by selecting the checkbox 3 Select EXPORT to put these files into an Excel spreadsheet and place them in C Program Files Lesker PVD75 ExcelFiles As the machine operates the data log information stored in the database will continue to grow The database file size should not exceed 2 gb Offload data as necessary to maintain a database file size 4 Delete unwanted recorded data less than 2 gb by selecting the check boxes and Datalog selecting DELETE 5 Locate the Action Log tab 6 Export the Action Log to a separate file All files not deleted in Item 4 will be copied to your new location 7 Delete the original Action Log from the system PC There are 3 main logging databases They 1 Open the Compact database are RecipeD RecordingD and LogD These located at C Program databases will grow in size over time and Files Lesker PVD75 Data Compacting you will need to compact them on a regular basis When the size of the database 2 Select the database you wish to reaches 80 mb a compact procedure must compact be performed Inspected by Date AUTHORIZED SIGNATURE KURT J LESKER COMPANY 185 PVD 75 OPERATION MANUAL MAINTENANCE UPON VENTING ALL MODULES COMPONENT INSPECT FOR COMMENTS Deposition Bead blast to remove build up Shielding Deposition build up or flaking vacuum wash and dry Shutters thoroughly Bead blast to remove build up vacuum wash and dry thoroughly As
145. cess chamber vent valve Wait until the system reaches atmospheric pressure Close the process chamber vent valve At this point the vacuum system is at atmosphere The top plate can now be opened Refer to manufacturers manuals to make sure all equipment is in a safe mode 40 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 PROCESS CHAMBER VENT 1 Close the hivac and roughing valves as applicable 2 Turn off the ion gauge 3 Close the capacitance manometer isolation valve if applicable 4 Zero all process gas channels 5 Close all process gas shut off valves 6 Open the nitrogen gas vent valve 7 Wait until chamber pressure reaches 1 atmosphere 760 Torr 8 Close the vent valve LOAD LOCK CHAMBER VENT 1 2 3 4 5 6 7 Close the load lock isolation valve Turn off the load lock turbo pump Wait for the turbo pump to slow to 50 Close the load lock roughing valve Open the load lock vent valve Wait until the load lock pressure reaches atmosphere Close vent valve KURT J LESKER COMPANY 41 PVD 75 OPERATION MANUAL CRYOPUMP REGENERATION PROCEDURE The following section describes the cryo pump regeneration procedure A Cryo Torr cryo pump periodically requires a regeneration cycle to return it to its original operating capabilities Gasses captured from a vacuum chamber and trapped in the cryo pump through the condensation and cryo adsorption is held primarily in an ice like form A regenera
146. ches KURT J LESKER COMPANY 71 PVD 75 OPERATION MANUAL Drawer door switch Cover switch for power feedthrough cover FIGURE 4 The 265 control panel LED will indicate if the cover switch is not made When the Drawer door is made CWare will display EB Door Closed Figure 5 PC Ven Valve PC Cryo Temperature Regen Pressure lt Go s 7 mm t E a CH lt n d ms E A CLOSED PC High Vac Throttle OFF EA FIGURE 5 72 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 High voltage output cable cover KL 6 COVER SWITCHES OPERATION Manual running of E Beam through CWare d On initial start up of a system follow the Initial Start Up given in E Beam Operator Manual E Beam Evaporator section pages 39 42 Before running E Beam e Do not change High Voltage HV during process If HV is changed E Beam limits will need to be reset as done in initial start up Failure to reset limits will result in Beam operating outside of crucible and could result in damage of equipment The high voltage output cable cover must be in place correctly to make the cover switch before the High Voltage can be turned on If not the Interlock LED on the front panel will not turn on e It is recommended that a crucible not be filled with material by more than 2mm above the crucible edge to prevent Pocket Jamming Error At least one third of the crucible volume should remain filled durin
147. ck to activate All Analog Outputs and Inputs are listed in alphabetical order Displays the initial condition of the corresponding analog output at system startup or shutdown Displays the actual current value of the corresponding analog output Clicking on the signal value will display an alphanumeric keypad that allows the signal value to be changed This will also change the value of the corresponding equipment For example changing the value of the MFC1 SP is the same as changing the set point on the Operation Gas Screen Displays the corresponding signal s unit of measurement Displays the current value of the corresponding analog inputs Analog inputs can be forced by clicking on the associated Value for the corresponding signal A pop up alphanumeric keypad is displayed for data entry Displays whether or not the current signal is forced Forced Corresponding signal is forced Normal Corresponding signal is normal Generates a table in the folder C Program Files Lesker Company Name Data Datalog mdb The table name is the date and time the table was created Stops the constant screen update to allow the user to easily select signals to be forced 149 KURT J LESKER COMPANY PVD 75 STRINGS SCREEN 0 0E 0 11 50 57 AM 8 4 2006 Kurt J Lesker eegene mme pany Comp 0 00 02 Closed Off Version 2 19 System Strings Discrete Analog Strings Ethernet I0 String Ouipuis
148. d checkout of the SQS 242 before connecting your digital O See Chapter 4 for detailed information on wiring the SQS 242 for digital I O INFICON SQS 242 Operating Manual A WARNING Care should be exercised to route cables as far as practical from other cables that carry high voltages or generate noise This includes other line voltage cables wires to heaters that are SCR controlled and cables to source power supplies that may conduct high transient currents during arc down conditions A typical deposition cycle for a thin film is shown in Figure 3 2 The cycle can be broken into three distinct phases pre conditioning ramp soak deposition and post conditioning feed idle Figure 3 2 Typical Deposition Cycle kamp Soak Ramp Soak Shutter Deposit Idle 1 End of 1 J gt Delay Process During pre conditioning power is applied to prepare the source material for deposition The first ramp soak preconditioning phase is used to bring the material to a uniform molten state The second ramp soak phase is typically set to a power that is near the desired deposition rate When pre conditioning ends PID rate control of deposition begins Initially the substrate material may remain shuttered until the desired deposition rate is achieved shutter delay Once the control loop achieves the desired rate the shutter opens and deposition begins Multiple deposition rates rate ramps can be programmed When the desired t
149. d if it is used in ANY process To delete a material you must first delete each film where it is used Material Selects a material to edit Density Sets the density for this material Material density has a significant impact on deposition calculations Z Factor Sets the Z Ratio a measure of a material s effect on quartz crystal frequency change Z Ratio has no effect on measurements when using a new crystal If the Z Ratio for your material is not known using crystals with gt 80 life will eliminate the effect of the Z Ratio term INFICON SQS 242 Operating Manual 3 5 4 Edit System The System Setup dialog Figure 3 17 configures the SQS 242 software to the physical setup of your deposition system Several settings that control the overall operation of the program are also accessed in System Setup The combination of sensor input and control output assignments known as a System Setup are stored in the SQS 242 database Most systems will have a single setup that applies to all processes However complex systems may use several different system setups within a single process NOTE Settings on the Outputs Sensors Analog and Cards tabs are unique for each System Setup Settings on the Indexers I O and Comm tabs apply to all System Setups Output colors are also common to all setups Figure 3 17 System Setup dialog M System Setup Ej Chamber Rename New Delete Copy Outputs sensors Analo
150. dition tab and the Silver Sample layer Set each parameter to the values shown in Figure 2 15 Figure 2 15 Condition Tab for Silver Sample Layer Layer RateRamps Deposit Condition Source Sensor Errors Pre Condition Post Condition Rampl Pwr Rampe 2 Feed Power Idle Fewer 25 00 55 00 E E vo Auto Hampl Time Ramp Time Sec Sec Soak Time Soake Time Feed Time E oo Sec Sec Sec INFICON SQS 242 Operating Manual 8 Save Edits Click Close Form or press the first SoftKey to save this two layer codeposition process Answer Yes if it displays the Do you want to change message box to make this the current process 9 Start Process Press the START SIMULATE SoftKey to start the first layer preconditioning phases Note that two outputs are displayed for this codeposition layer Preconditioning of the two materials is entirely independent If the preconditioning of one layer takes longer than the other the start times are adjusted so that the end times coincide When preconditioning ends codeposition of the two materials begins Your response should be similar to the graph shown in Figure 2 16 your vertical scale may be slightly different The slight ringing on the waveforms indicates some further tuning may be desired However this is an example of a reasonably well tuned loop Figure 2 16 Start Process Response 3 SID142 View Process SAMPLE Layer 1 of 2 Time Run 0 01 38 7 6 Ti
151. down time 20 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 GROUNDING SYSTEM A correct grounding system is necessary to ensure safe and proper operation of the deposition system KJLC systems have been tested and are built to EMC Electro Magnetic Compatibility standards using the highest level of grounding determined for a system An electrical and earth ground are required ELECTRICAL GROUND A standard electrical ground that runs with the power cable to the main power disconnect power plug This ground can be incorporated into the same SO cable supplying power to the system and must meet minimum requirement specifications as outlined by applicable state and local electrical codes EARTH GROUND BEST RECOMMENDED The grounding system is comprised of dedicated grounding electrode s providing 3 ohms resistance or less see earth ground installation below and connection from it to the deposition system using copper strap see below for description or copper tube with equivalent surface area This level is a requirement for RF or E beam systems GOOD The grounding system is comprised of dedicated grounding electrode s providing 25 ohms resistance or less see earth ground installation below and connection from it to the deposition system using copper strap see below for description or copper tube with equivalent surface area A solid conductor wire can also be used as listed in the table below ALTERNATIVE For equipment in
152. e 2 Append 3 Run 52 DataLog Interval in seconds set Bit 3 in Command 53 below o3 DataLog Events bit weighted integer Bit 0 End Deposit Phase Bit 1 End Each Phase Bit 2 I O Event Bit 3 Timed Bit 8 Every Reading Bit 9 Sensor Readings Bit 10Analog Readings 5 8 3 Query Update Layer ROL lt param1 gt lt layer gt lt output gt f UL lt paraml gt lt layer gt lt output gt NOTE A layer value of zero sets returns data on the current layer where lt paraml gt is qu Film Name Example UL 01 1MyFilm New Film set Layer 1 MyFilm to NewFilm 02 Setpoint s V or Power 03 Start Thickness kA 04 Time SP mm ss 05 Thickness SP kA 06 Start Mode 071 07 Substrate Index obsolete O to 15 08 Layers in Process query 09 Scart Prompt 250 characters or less 10 Phase of the requested output query in Ramp n Start Thickness n 1 to 9 kA 2n Ramp n Ramp Time n 1 to 9 mSS 3n Ramp n New Rate n 1 to 9 s 41 Layer Indexer 1 Index O toO Lo 42 Layer Indexer 2 Index t 15 43 Layer Indexer 3 Index 0 to 15 44 Source Indexer Index to I5 45 Input Type Sensors 0 TimedPower 1 Analogl 4 2 5 46 System Configuration 47 Source Indexer Done 0 1 48 Layer Indexer 1 Done 0 1 49 Layer Indexer 2 Done 0 1 50 Layer Indexer 3 Done 0 1 IPN 074 551 P1A IPN 074 551 P1A SQS 242 Operating Manual 5 8 4 Query Update Film QOF param1 layer output QUE lt param1 gt lt layer gt
153. e id B Adjust belt tension being excessively stressed and distorting drive shafts 194 KURT J LESKER COMPANY OPERATION MANUAL ALL MODULES COMPONENT Hoist Operation Chamber Pressure Linear Rack amp Pinion LRP Shutters Baratron Zeroing Inspected by Debris due to wear on the internal bushing Chamber base pressure A significant increase in the chamber base pressure can indicate a leak to atmosphere or a failed water connection Deposition build up will also affect chamber pressure Pumping performance should be monitored and logged Smooth movement within the full range of motion Optimal substrate and source shutter speed and travel limits Check that each baratron gauge is set to zero AUTHORIZED SIGNATURE KURT J LESKER COMPANY PVD 75 INSPECT FOR COMMENTS Clean all motion surfaces and apply a heavy duty gear lubrication to the drive screw If lubrication does not correct the problem the guide bushing may need replacing Leak check the system and repair any vacuum leaks Remove deposition from internal components If the total travel is over 4 000 m the bearings must be replaced The rollers should be cleaned or replaced if worn The bearings should be inspected and lubricated with Fomblin 25 6 If cleaning and lubrication do not correct the problem replace the bearings Check that the pinion gear is correctly engaging with the rack and replace the pinion gear if
154. e Control SP 0 i UNDER Torr Normal MKS979 Enable Set Pointl 0 0 Platen Motor Errors 0 Normal MES979 Enable Set Point2 0 0 Platen Motor Moving 0 Normal El MES979 Enable Set Point3 0 0 Platen Motor Referenced 0 Normal Generate Data Log peration System UNDER DATALOG SCREEN 3 d It is important to highlight suspend again to deactivate Otherwise two instances of the same data will be created due to scan time This will confuse the Datalog and cause an error NOTE The same protocol must be followed for each screen or tab Click Suspend Screen Updates highlight signal names to Data Log and click Suspend Screen Updates to deactivate Otherwise only the screen that action is performed on will Datalog KURT J LESKER COMPANY 175 PVD 75 OPERATION MANUAL 5 Once all components are selected for datalogging through the various screens click Generate Data Log System Strings Copyright 2009 Kurt J Lesker 4 33124 Kurt J Lesker n s LI Logout KJLC ABORT Super User nitial Value zg zg Units i Signal Value Units MES979 AF SP MES979 SP3 Direction Value BELOW MES979 Atmosphere Cal MES979 SP3 Enabled Status 0 T MES979 Auto Initialize MES979 SP3 Value 1 00E 0 MES979 Cal Gas Type MES979 Time On mm waste waste On MES979 Transducer Temperature 2 89E 01 MES979 Emission Current MES979 Transducer2 Temperature 2 370E 02 MES979 Enable Control SP MES979 Enable Set Pointl a Plat
155. e Displays the initial condition of the 5 T splay only corresponding string output at system startup or shutdown Displays the actual current value of the corresponding string output input Clicking on the signal value will display an Signal Value alphanumeric keypad that allows the signal Click to activate value to be changed This will also change the Signal Value value of the corresponding equipment For example changing the value of the Platen Motor Home Offset is the same as changing the set point on the Operation Motion Screen Units l Displays the corresponding signal s unit of l Display only pray P 5 9B Units measurement Displays whether or not the current signal is Inputs Status forced Di Status SE On l l Forced corresponding signal is forced Normal corresponding signal is normal Generates a table in the folder C Program Generate Data Log Files Lesker Company Name Data Click to activate l Generate Data Log Datalog mdb The table name is the date and time the table was created Suspend Screen Updates Stops the constant screen update to allow the Click to activate l Suspend Screen Updates user to easily select signals to be forced KURT J LESKER COMPANY 151 PVD 75 OPERATION MANUAL ETHERNET I O SCREEN 152 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 RECIPE DATABASE c3 9 Help EBRecipes amp Recorded Data Action Log 34 Interlocks
156. e requirements 88 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 WATER FLOW SENSORS Usually located on the water return line of the system water manifold see picture below WATER FLOW SENSORS Depending on the number of Thermal Source s the system has it may or may not be equipped with water flow switches If equipped there may be more than one water flow switch installed along with a common flow switch When the water supply and return valves are open the water flow switches should be satisfied This can be confirmed by checking the cooling screen in Cware The flow switch will change from gray to green when satisfied KURT J LESKER COMPANY 89 PVD 75 OPERATION MANUAL EE ri UU i E no C ny IAA Svasitecn ban Ein S E ct EE T Lope Ji GEET E Dess EE ERR 5 AAA E Ee frre 5 Arn ei OSAT C TAO l AAT CA aT lr Ur reen 7 In gt DI ie gw Ve V ETLULTIC Set ing Ti Interlock Activated Logout KILE gt pary 0 00 00 Interlocks Disabled on Config Screen D gara User ABORT a Po gt Run Recipe Start PC Pump Recording Start ann WATER FLOW COOLING SWITCH If the water supply and return valves are fully open and the flow switch is not shown as made on Cware illuminated green then check that the utilities water pressure and flow rate meets spec If the utilities are within spec then call KJLC Service Dept 90 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 PC Vent Valve
157. e serious injury or death if not avoided This notation is only used for extreme situations A CAUTION This notation indicates a potentially hazardous situation that may result in injury if not avoided It is also used to alert against unsafe practices that may result in damage to the equipment d This notation is used to highlight any technical requirements operations procedures or conditions that should be emphasized 10 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 SAFETY Safe use of the system requires familiarity with the individual system components and adherence to the safety precautions presented in this section Each operator must have appropriate training and all supplemental component manuals should be reviewed prior to the use of the equipment OPERATOR RESPONSIBILITIES Safe operation is the responsibility of the system user 1 2 3 4 5 The operator must adhere to all safety notes cautions and dangers presented in this manual All system component manuals are included The operator must adhere to all safety recommendations presented in each of these manuals Failure to comply with these and all precautions violates the safety standards of intended use of this system and may impair the protection provided by the system The Kurt J Lesker Company assumes no liability for failure to comply with these requirements Please contact KJLC Systems Support prior to attempting any modifications
158. e soft Rate a d proceed directly to the ware will ignore the Ramp 6 Power entered b No Ramp Rate Operation The operator can enter a value 07100 in the 96 Power text box Performing this function will allow the output Power to immediately increase to the percentage of Power entered without a Ramp Rate Interlock Activated Logout KJLC Interlocks Disabled on Config Screen E Sa ABORT AAA AAA gt gt A The picture above depicts Source SW1 energized the Evap Power supply energized via the On button a ramp rate of 5U s entered and the Setpoint box ramping up KURT J LESKER COMPANY 93 PVD 75 OPERATION MANUAL RECIPE CONTROLLED OPERATION RECIPE CONTROLLED DEPOSITION WITHOUT SIGMA frmRecipeltems E Equipmentltem EquipmentltemOperation zer Recipe Set Abort Set Abort Recipe Abort Default Default Gauge MKS979 WRG Check Value lt n nn E Pressure I3 Source Source SW2 Turn _Off Closed Closing 4 Source Source SW1 Turn On Open Opening EE E NONEM Turn _Off Closed Closing Shutter Substrate Turn Off Closed Closing Shutter Motors Platen Motor Jog Set Value n nn Velocity SP E p Motors Platen Motor On Turn_ On Open Opening Motors Platen Motor Go Turn_On Open Opening Continuous 10 Power Power Supply1 Set Value n nn 0 um mer rt 1j Power PowerSupply1 Set Value n nn Pr zeg Setpoint i Power Power Supply 1 Turn On Open Opening NR
159. e software operates on a Windows based computer with a mouse keyboard and standard CRT flat screen monitor or optional touchscreen monitor KURT J LESKER COMPANY 115 PVD 75 OPERATION MANUAL GENERAL GUIDELINES CWare enables the user to run the tool manually or in an automated fashion as well as provides system and process feedback 116 All actions and selections are done with a single mouse click or single push of the finger in the event of a touchscreen monitor There are NO double click actions on any Runtime screen All buttons are typically two state radio buttons that can be either up or down When a button is visible it indicates either the state of a request to turn ona device the state of a sequence or the active navigation screens Typically a button that is pressed or down indicates that the user or a process is requesting the respective device to turn on A button that is not pressed or up signifies a device that is being requested to turn off Devices that can be turned on or off typically have an indicator or icon inside their respective control buttons While the state of the button indicates whether or not a device is requested to turn on or off the color of the indicator or icon inside the button notifies the user of the actual state of the device Color definitions for each button or indicator can be found in the section of the manual that corresponds to the screen on which it appears A
160. ear if worn Degradation of Dicronite coating A worn coating can increase the risk of failed transfer or a substrate holder binding within the fork assembly Recoat when worn Contact the Transfer Forks manufacturer for information 192 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 THERMAL MODULES COMPONENT INSPECT FOR COMMENTS e E l B ild Deposition build up or flaking on shutters can piast to remove pulaUp vacuum wash and dry source covers and chimneys thoroughly Check for a short to ground Sources Heater Check for an open circuit on the source base and chamber Check for cracks and replenish material as required If the Crucible SS crucible is cracked it must be replaced Bead blast and clean thoroughly Excessive deposition or flaking die to remove contamination Bead blast and clean thoroughl Check rotation of feeder nas SES Pellet Feeder to remove contamination Fill with pellets where Material Charge P consumed Bead blast and clean thoroughl Operation of the cassette indexer un SR to remove contamination Inspected by Date AUTHORIZED SIGNATURE KURT J LESKER COMPANY 193 PVD 75 OPERATION MANUAL DAILY MAINTENANCE ALL MODULES COMPONENT INSPECT FOR COMMENTS Repair and reseal with Teflon Signs of leakage at all connections tape Other types of thread sealant must be avoided Water Flow Bulges or signs of failure in hoses Replace hoses Proper flow indication I
161. eavy duty gear lubricant Replace if worn Hoist Rotation Wedge Tool Blade Drive Clean adjust and lubricate with Fomblin 25 6 Replace if Wear and debris Components should move freely Bearings y worn LOAD LOCK MODULES COMPONENT INSPECT FOR COMMENTS Wear on latch bearings or spacers Replace bearings and spacers Door Wear on hinges or improper door alignment Replace or adjust hinges Damage to o ring Replace o ring Inspected by Date AUTHORIZED SIGNATURE KURT J LESKER COMPANY 199 PVD 75 OPERATION MANUAL YEARLY MAINTENANCE ALL MODULES COMPONENT INSPECT FOR COMMENTS Calibration Refer to manufacturer s manual Calibration Refer to manufacturer s manual Pumping performance Tip seal should be Replace tip seals at or before Mechanical replaced after 9 000 hours of operation 9 000 hours of operation Pump Manufacturer s recommended maintenance Refer to manufacturer s manual Turbo Pumps Manufacturer s recommended maintenance Refer to manufacturer s manual Degradation of Dicronite coating A worn Transfer coating can increase the risk of failed transfer Recoat when worn Contact the Forks or a substrate holder binding within the fork manufacturer for information assembly Scale or residue buildup in cooling lines Build Cooling Lines up can reduce cooling water flow which could affect the lifetime of the components Flush with a de scaler or cleaner and replace as required Inspected by D
162. ect the Manual Gas mode using the Operating Mode Button Select the program to run using the Program Select button Enable the program by pressing the Enable Standby button on the KRI Auto Controller Press the Enable Standby button again to stop the program and put the units into Standby 3 All of the setpoints can be adjusted before or after the KRI Auto Controller is enabled as in the gas only mode d Operation in manual mode does not use interlocks 4 Saving a program is the accomplished in the same manner as described above for the Gas Only operating modes GUI REMOTE MODE OPERATION 1 Turnon the lon Source Gas valve for the lon Source and evacuate the line to the MFC supplied with the lon Gun 2 Determine that system base pressure is acceptable 3 Turn on the KRI Auto Controller via rocker switch manually 4 Turnon the KRI Filament Controller via rocker switch manually 5 Turnon the KRI Discharge Controller via rocker switch manually 6 From the KRI Auto Controller select the program that is desired to run 7 From the KRI Auto Controller select Remote mode 8 From the KRI Auto Controller change the Operating Mode to Manual Gas 9 Turnon the lon Source via the GUI Deposition screen 10 Thisaction will run the Program in remote mode using the Cware interlocks KURT J LESKER COMPANY 105 PVD 75 OPERATION MANUAL SHUTDOWN 1 Turn the lon Source off via the GUI
163. ed Display only Logged Out out of the system KURT J LESKER COMPANY 157 PVD 75 OPERATION MANUAL ICON OR DATA FIELD ACTION RESULT Shows the elapsed time that the Time Logged In en a Ae Time Logged in ISplay only corresponding user was logged into the system Shows a count of the number of recipes that Number of Recipes Bes Steen E Num Recipes ISplay only were used by the corresponaing user login name 158 Recipes Used Lists the recipes that were used by the Display only i Recipes Used corresponding user login name KURT J LESKER COMPANY OPERATION MANUAL PVD 75 INTERLOCKS E laj xi 9 Help EE Recipes Recorded Data Action Log Show ALL Hide Skips Equipment Interlock Valve Valve Interlock Valve Valve Interlock Pump Valve Interlock Pump Valve Interlock Pump Pump Interlock Valve Valve Interlock Valve Pump Interlock Valve Pump Interlock Valve Valve Interlock Valve talua Equipmentitem New Operation Only LL Iso Valve Open LL Iso Valve Close New Operation Only LL Iso Valve Close LL Iso Valve Open New Operation Only LL Turbo Pump LL Turbo Vent New Operation Only LL Turbo Pump LL Turbo Back New Operation Only LL Turbo Pump Roughing Pump New Operation Only LL Turbo Vent LL Turbo Back New Operation Only LL Turbo Vent LL Turbo Pump New Operation Only LL Turbo Back LL Turbo Pump New Operation Only LL Turbo Back LL Turbo Vent New Opera
164. ed Fortunately in most cases the answer is yes so attach an RGA Of course there are drawbacks RGAs are not cheap and you must learn to interpret spectra But as a vacuum diagnostics tool the RGA has no equal SUDDENLY GOTTEN WORSE A B 230 Check your vacuum system s logbook What did you last do Change a flange or gasket Add a component Change the pump fluid Then check that the change did not cause a leak increase the outgassing rate or reduce the effective pumping speed If the sudden increase in base pressure occurs after the first chamber bakeout or after three or four pump downs following system commissioning when no changes have been made then make another leak check of the whole system Real leaks are easily blocked by ice the effect of vacuum on water trapped in the leak during the final chamber cleaning or a combination of machining oils and residues When the blockage evaporates or disperses suddenly the chamber has a leak that was previously not there KURT J LESKER COMPANY OPERATION MANUAL UNIT CONVERSION TABLES Pressure Units PVD 75 Bar dynesicm in Hg in Water 1 atm 1 101325 10132510 209012 406 78 1bar 0 9869 1 ix 1 2953 401465 1 dyneler 9869x107 1x 10 1 2953x10 4 0146 x 10 1 1 03322 10197 1 0197 x 10 101325 1000 14 6 14 504 1 4504 x 10 1 01325 x 1 1 x 105 0 1 760 750 06 75006 x 10 1 in water 2458 x 10 2401x10 2401x10
165. ed that is capable of providing adequate cooling to system components as identified in the utility requirements document and tool schematics Supplied water should have the following characteristics e Minimum temperature of 5 above dew point 77 F 25 C max e lt 50 um particle filtration e pH level between 6 8 Typical Requirements MAXIMUM INLET MAXIMUM PRESSURE MINIMUM HOSE DEVICE PRESSURE DIFFERENTIAL DIAMETER 2 6 GPM SYSTEM EE A 70 PSI 65 PSI 0 750 INCHES CRYO 0 5 GPM COMPRESSOR 1 9 L MIN GE 65 PSI 0 375 INCHES NOTE GPM Gallons per minute L min Liters per minute PSI Pounds per square inch 24 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 PRESSURE DIFFERENTIAL This is the pressure difference between the inlet water supply and the outlet water supply If the pressure differential between the inlet and outlet is not high enough reduced flow through the system will result If a reduced flow is encountered system operation may be affected due to inadequate cooling of components or loss of flow to system interlocks d It is recommended that a main inlet and outlet water shut off valve be installed on systems that are connected to a house chiller system If a cryo compressor is connected to the same small chiller as the KJLC system it is required that a shut off valves are installed on the compressor inlet and outlet lines If the system is being cooled by a larger house water system these valves are not r
166. ed to start at a pressure of lt 5 0e 06 Torr 5 Precondition the material in the crucible by raising the temperature of the source to a temperature or power level just below the appearance of rate on the deposition monitor 6 Let source stabilize at precondition temperature for at least 5 minutes 7 Heat source to desired deposition rate by raising the temperature or power level on the supply 8 Open the substrate source shutter and O the thickness monitor d Refer to film thickness control monitor s operating manual for detailed instructions 9 When the desired thickness is achieved on the monitor close the shutter and reduce heat in the source 10 Allow source to cool prior to venting system A DANGER Use caution when removing the substrate from the chamber it may be hot 86 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 THERMAL SOURCE SETUP AND OPERATION EVAPORATION is the process whereby atoms or molecules in a liquid state or solid state if the substance sublimes gain sufficient energy to enter the gaseous state The thermal motion of a molecule must be sufficient to overcome the surface tension of the liquid in order for it to evaporate that is its kinetic energy must exceed the work function of cohesion at the surface Evaporation therefore proceeds more quickly at higher temperature and in liquids with lower surface tension SAFETY A DANGER DO NOT operate or service the Thermal Source s be
167. eds gas flows pressure temperatures power supply feedback signals etc ANALOG OUTPUTS AO system Output that can have many different numerical values positive or negative both integer and decimal Analog Outputs include motor speed setpoints gas flow setpoints heater temperature and ramp setpoints power supply setpoints etc DiscRETE INPUT DI system Input that can have only one of two values i e on off 1 0 opened closed Discrete Inputs include vacuum switches flow switches gate valve positions etc DISCRETE OUTPUTS DO system Output that can have only one of two values i e on off 1 0 open close Discrete Outputs include valves pumps power supply enable signals heater enable signals shutter open close signals etc STRING INPUTS Can be Discrete or Analog and are used primarily for communication with serial devices STRING OUTPUTS Can be Discrete or Analog and are used primarily for communication with serial devices DOWNSTREAM PRESSURE CONTROL IMODE method of pressure control mode whereby effective pumping speed is varied and gas flow is held constant to achieve a desired pressure The point of pumping is referred to as being downstream relative to the means of gas introduction HMI Human Machine Interface This refers to the computer control screens utilized by the operator to run the tool and monitor system status MFC Mass Flow Controller This refers to a device for introducin
168. either direction along the tube and a maximum probability of heading diametrically across the tube The more surface hits a molecule makes the less likely it is to complete the journey quickly and the lower is that component s conductance CONDUCTANCE UNITS Conductance is a volumetric flow measured in units of volume per unit time specifically liters per second L s cubic meters per hour m3 h cubic feet per minute cfm liters per minute L m etc Expressing conductances as volumetric flows has two benefits a conductances can be combined by simple math see below and b in the molecular flow regime a component s conductance is constant and independent of pressure CALCULATING CONDUCTANCES The time to calculate conductances is before any vacuum component is purchased The approximate operating characteristics of a soon to be built or about to be modified system should be known while it is still a scratch pad idea When the system is constructed it is a trivial matter to reduce conductance but an expensive re build to increase conductances that are too low 218 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 MANUAL CALCULATION Since conductance in molecular flow is independent of pressure and since most high vacuum applications are in molecular flow the calculations discussed here and in the sidebar are appropriate only for that flow regime Two books edited by J M Lafferty are invaluable when making conductance calcula
169. en Motor Errors m ares MES979 Enable Set Point3 DATA LOG SCREEN 4 176 KURT J LESKER COMPANY OPERATION MANUAL K Operation Vacuum Copyright 2009 Kurt J Lesker V4 33124 Kurt J Lesker Logout KJLC t J Company 2 21 44 12 Closed Off Ext Super User ABORT Version 4 33124 d HR IH Vacuum Deposition Das Cooling Platen Motion KJLC 979 Recipe Database y PC Vent Valve PC Cryo Temperature Regen Pressure sk EE inm EM NLIS n PC High Vac Valve Start PC Pump E Start PC Vent PC Cryo Purge Valve PC Cryo Regen Gas Injection Valve PC Roughing Valve Start Cryo Regen Recording Start DI Roughing Pump DATA LOG SCREEN 5 6 Click Recording Start to begin recording Data will be recorded at the specified number of seconds To change the specified data collection rate e Click Configuration through the Recipe Database button NOTE This may already be open and located on the bottom toolbar and cannot be closed only minimized Closing it will cause it to automatically reopen e Recording Rate Default AND Recording Rate Minimum should be set to the same time interval The data collection interval can be changed at this point ensuring that the Recording rate default AND Recording rate minimum are the same e 5 seconds is typically the fastest rate desired for scanning One second intervals are possible however data logging uses considerable space
170. ep SIO Baffle Box Source Crucible Heater 2 3 4 L X 1 1 4 W X 5 8 Deep Crucible Heater 4 L X 1 3 4 W X 1 1 8 Deep Crucible Heater 3 1 2 L X 1 1 8 W X 1 Deep Aluminum Oxide Crucible for EVCH1 Boron Nitride Crucible for EVCH1 KURT J LESKER COMPANY QUANTITY 1 WE WE ee e WE DES Ge WS 207 PVD 75 OPERATION MANUAL EVC5AO Aluminum Oxide Crucible for EVCH5 and EVCH12A LTE SOURCE LEAD PART NUMBER DESCRIPTION CATEGORY QUANTITY STOCK TIME EVCEF AAO Aluminum Oxide Crucible 1c 30 Days EVCEF 10AO Aluminum Oxide Crucible 10cc IE EB ME eeN 30 Days EVCBBN Boron Nitride Crucible for EVCH5 and EVCH12A IN EVCEF 30AO Aluminum Oxide Crucible 30cc E BEAM SOURCE KL 6 amp KL 8 NOTE Fabmate liners are supplied as standard Depending the on the material being evaporated other types of liners are available IN LEAD DESCRIPTION CATEGORY QUANTITY STOCK TIME N PART NUMBER SHU A0020780 Shutter Blade EVCFABEB 4 KL 6 Fabmate Crucible Liner 4 Pocket As Required As Required EVCFABEB 22 KL 6 Fabmate Crucible Liner 6 Pocket EVCFABEB 32 KL 8 Fabmate Crucible Liner 4 Pocket 45 Days As Required As Required 15 Days EVCFABEB 29 KL 8 Fabmate Crucible Liner 6 Pocket 1 700310 Filament Block Assembly Bent Filament EBKL1 703000 Filament Set 5 pcs Bent Filament 1 700317 Ceramic Insulator Bent Filament 1 703022 Screw Set Bent Filament 1 700314 Filament Cla
171. eps 28 30 request Sigma to load a process named Titanium Test and verifies if the correct process has been loaded Steps 31 33 run process called Titanium Test Note For the Go To Step 33 the time needs to be set longer than it takes for the sigma process file to finish Zero Setpoint then turn off EB HV and EB Turns off motors KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ABORT IF TIMEOUT AND GOTO SETUP When creating a recipe you can set an Abort if Timeout or Goto from the GRST column This can be created by clicking inside the cell on the GRST column of the step you want to add the Abort if TimeOut AT or GoTo GT The following box will appear 8 Recipe Items Detail TimeOut for Wait Ed TimeQutldessage Crucible Not in Position Goto Sequence No if 999 999 Abort if Timeout Timeout SkipRecipeltem n Ramp Units sec Notes not for display TimeOut for Wait User can limit the number of seconds the recipe will check at this step TimeOutMessage User information message Goto Sequence No if Timeout This is the step number the recipe will go to next when TimeOut for Wait hits zero If the user inputs 999 the abort recipe last set usually set at step 1 will run when TimeOut for Wait hits zero SkipRecipeltem If checked the step will be ignored when recipe is running Ramp Units sec Not used Notes not for display Not used KURT J LESKER COMPANY 83 PVD 75 OPERATION MANUAL ABORT IF
172. equipment malfunction a control error occurs Control error 9o is the accuracy that must be exceeded for the specified time in seconds to trigger a control error Use shutter delay accuracy to assure adequate process control before entering the deposition phase Crystal Fail Establishes the number of bad readings i e O Hz from a sensor that generates a Crystal Fail condition If a crystal fails the PID loop will send the source supply to max power Therefore it is unlikely you will ever want to disable this error Crystal Quality Each time the rate deviation for this film exceeds the value a counter is incremented Each time the rate deviation is within the 9o value the counter is decremented to zero minimum If the counter exceeds the Counts value during the entire layer deposition an error occurs Crystal Stability When material is being deposited a crystal s frequency normally drops At the end of crystal life sensor frequency may briefly mode hop to higher frequencies Single Hz is the largest single positive frequency shift allowed Total Hz is the sum of positive shifts allowed during a film s deposition On Error When an error condition occurs three actions are possible Ignore the error and let the PID loop attempt to maintain rate control Stop the layer and allow the user to fix or manually control deposition The last choice Timed Power uses the last good Rate Power settings to estimate rate and thickness
173. equired Before installation purge all newly constructed utility lines to remove all loose materials such as thread compound PTFE and tapes Also be sure to remove any remaining burrs from the tube edges before connecting to the system 1 Connect the supply cooling water to the BLUE water supply manifold see photos below PATER RETURN 4 EE SUM SHUT OFF VALVES WATER MANIFOLD CONNECTIONS SYSTEM COOLING WATER SUPPLY RETURN 2 Connect the water return line to the WHITE return manifold 3 Run cooling water to the cryo compressor if applicable A CAUTION The system vacuum integrity should be verified prior to the flowing of cooling water Introducing water prior to verifying vacuum integrity may cause system flooding or difficulty locating vacuum leaks in water lines However all customer supplied water connections up to the system water manifolds should be verified prior to the flowing of any water KURT J LESKER COMPANY 25 PVD 75 OPERATION MANUAL Typical cooling water connections DESCRIPTION KJLC SYSTEM CONNECTION CUSTOMER SUPPLIED SYSTEM COMPONENTS 1 INCH FNPT 1 INCH MNPT CRYO COMPRESSOR 0 5 INCH FNPT 0 5 INCH MNPT NOTE Connections are for Supply and Return lines System cooling supplies KJLC PART NUMBER DESCRIPTION PETO25B TUBING POLYETHYLENE 1 4 OD BLUE PETO25R TUBING POLYETHYLENE 1 4 OD RED PVCBTO25 TUBING PVC NYLON REINFORCED 1 4 ID 3 32 WALL B 10MO 1 6 FITTING SWA
174. er 2 Bit 2 is Source Indexer 3 Bit 3 is Source Indexer 4 Bit 4 is Source Indexer 5 Bit 6 is Source Indexer 6 Relays 1 16 Bit 0 is Relay 1 etc Inputs 1 12 Bit 0 is Input 1 etc Layer Index Register Bits 0 3 are BCD of Layer Indexer 1 Bits 4 7 are BCD of Layer Indexer 2 Bits 8 15 are BCD of Layer Indexer 3 Layer Indexer Done Flag Bit 0 is Layer Indexer 1 12 Indexer Done 0 Not Done Bit 1 is Layer Indexer 2 Bit 2 is Layer Indexer 3 INFICON SQS 242 Operating Manual This page is intentionally blank IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Chapter 5 Communications 5 1 Introduction The computer interface capabilities of the SQS 242 program allow operation from an external computer via Ethernet or RS 232 serial communications and a simple ASCII command set Programs running on the same computer can also control the SQS 242 program using ActiveX and the same ASCII command set Parameters may be read Query commands while the process is running but can only be changed Update commands while the process is stopped Changes to the structure of a process e g add or delete layers are not allowed from the computer interface 5 2 Serial Interface Connect a serial cable from the serial port of the computer the SQM card is installed on to another computer s serial port The cable required is a DB9 female to female with pins 2 and 3 crossed commonly referred to a
175. er Power Supply 3 Turn_Off Closed Supply Closing 26 E Motor Go ocv all Continuous Closing Recipe Dwell N Seconds n or CO 28 Gauge Capman Pressure SP Set Set Value nmn n nn 29 Recipe Dwell MORE Seconds E ES MFC MECH Mode Set Set Value n nn n nn Valve Gas Injection Turn_Off Closed Closing Valve PC High Vac Throttle Turn_Off Closed Closing 33 Valve PC High Vac Valve Check_On Open AT Opened Opening d The above example is an RF sputter deposition The main differences to a DC sputter recipe are e The gas pressure will normally need to be higher when igniting the plasma e When checking for the presence of a plasma check for a voltage greater than 50 see step 14 62 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 d Before working on any sputter source ensure that all electrical power is removed from the power supply generator TARGET CHANGING Installing changing targets 1 2 3 4 5 6 7 8 9 10 Turn off sputter source power supply Turn off power supply main distribution panel circuit breaker Switch to the deposition screen open the source shutter It may sometimes be necessary to remove the shutter blade to make target removal install easier Loosen the 3 screws supporting the dark space shield and remove the shield see Figure 7 For a 2 source loosen the 4 screws of the target hold down ring see Figure 8 For a 3 or 4 source remove
176. es Recorded Data Action Log 34 Interlocks Sigma Data Sets Ow Configuration SR System Users Type a question for help e x Chose Item to MOWE Chose Item to INSERT ABOVE Lr PC Regen Pirani Tum Off Closed Closing PC Regen Pirani Tum ff Closed Closing 2 Valve PC Cryo Purge Valve Tum Off Closed Closing 2 Valve PC Cryo Purge Valve Tum ff Closed Closing 3 Valve PC Cryo Regen Valve Turn Off Closed Closing 3 Valve PC Cryo Regen Valve Tum Off Closed Closing 4 Valve Sourced Gas Turn_Off Closed Closing 4 Valve Source4 Gas Turn_Off Closed Closing Return To Recipe Re Number Move Use this screen to correct the order of steps in a saved recipe To access this screen click on Reorder Items on the Recipe Screen See the CWare Operation section for further instructions ICON OR DATA FIELD ACTION RESULT Chose Item to Move Click the step in the column on the left that Click to activate Chose Item ta MOE needs to be moved Click the step in the column on the right that Chose Item to Insert Above Click to activate the chosen step from the left table needs to L hase Item to INSERT ABOVE be placed before Moves the location of the step selected on the Click to activate left Re Number i Clicking this button corrects the numerical Click to activate He Number order of each command Return to Recipe Click to activate Click to return to the recipe screen Return To Recipe KURT J LESKER COMPANY 155 PVD
177. es and the datalog mdb file is stored To access the datalog mdb file double click it Or if the software is running open MS Access from the Start menu and browse to this file then open it d It is the responsibility of the customer to periodically backup the system software and database as well as remove or archive the datalog information d KJLC does not recommend using CDRW discs or storing multiple backups on a single CD BACKING UP SYSTEM DATA 1 Stop the system software from running 2 Launch Nero CD burning software 3 Add the C Program Files Lesker directory of data to be saved to CD 4 Burn the disk RESTORING SYSTEM DATA 1 Stop the system software 2 Copy the Lesker directory from the backup disk to C Program Files 3 Right click on the restored Lesker folder and un check the Read Only attribute box 4 Apply this to the current folder sub folders and files KURT J LESKER COMPANY 121 PVD 75 OPERATION MANUAL SOFTWARE UPGRADES Periodically KJLC will address performance issues with the Runtime Software or add features to the Runtime Software as well as the database Depending on the nature of the changes KJLC may request that the customer send KJLC a recent backup of their software to facilitate creating a software revision that may be installed by the customer Some revisions pertaining to software performance and existing features will be available to the customer at no charge other revisions will be availab
178. even if the user does not own the recipe 9 Also in the VB Other Access box choose a level of security for the new user e Operator Can only run recipes that have been assigned to Operators e Process Engineer Can only run recipes that have been assigned to Process Engineers e Super User Can run modify and delete any recipe This is the highest level of security DELETING A USER To delete a user simply select that user from the Find Existing System User box and then click the Delete User box The deleted user s recipes and any other associated data will still be available MODIFYING A USER S ACCESS At any time the access parameters for a user can be changed Simply select that user from the Find Existing System User box and then modify the parameters as required 120 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 RESETTING A PASSWORD To change the access parameters for a user simply select that user from the Find Existing System User box and then check the Clear Password button The password will be re chosen by the user when they log in the next time and must consist of at least one character SOFTWARE FILE STRUCTURE amp MAINTENANCE KJLC CWare consists of two components Runtime Software and Microsoft Access database files The exe and supporting files are located in this folder C Program Files Lesker Your Company Name The data directory in the path mentioned above is where supporting database fil
179. f the proper flow is being supplied or shut OFF but the indicator Remove clean or replace the is not correct the flow switch may be clogged flow switch or defective Compressed Setting of recommended pressure at each Adjust regulator to the correct Ai module Min 70 psig Max 100 psig value Setting of recommended vent pressure at each Adjust regulator to the correct Nitrogen module Set to 10 psig value Setting of recommended cryo purge pressure Adjust regulator to the correct at each module Set to 40 psig value Setting of recommended pressure at each Adjust regulator to the correct module for each gas Set to 10 psig value Inspect compressed air regulator pressure Adjust regulator to the correct reading on each module Set to 80 90 psig value Manufacturer s recommended maintenance Refer to manufacturer s manual Cryo Pump Process Gas Supply Pressure Cryopump 2nd stage temperature Regenerate if gt 20K Main shaft seal contamination If the main shaft seal becomes contaminated the pump will begin to make a loud clunking noise This requires purging of the He lines with UHP He Remove deposition or replace Viewports Deposition coating cracks or defects the viewport if cracked or chipped Signs of wear cracks or excessive debris below Replace belt belt Drive Belts Belt tension The belt should be tight but not Refer to manufacturer s manual to the extent when the pulleys or gears ar
180. field KURT J LESKER COMPANY 163 PVD 75 OPERATION MANUAL ICON OR DATA FIELD ACTION RESULT Start Form Start Form Recipes SOY Click to activate Password Click to activate Password Clear Password Click to activate Clear Password Delete User Click to activate Delete User Recipe Database Access Recipe Database Access Recipes Recorded Data Action Log Interlocks Click to activate Sigma Data Sets Contiquration System Users VB Mainform Access VB Manto Access hf Operation rz System Click to activate 164 Use this drop down list to choose which screen form should be the opening screen for the selected user Enter the password for the selected user Removes the existing password for the selected user Deletes the selected username Use this list of checkboxes to assign availability of the System Database screens to the selected user Use this list of checkboxes to assign availability of the Runtime Software screens to the selected user KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ICON OR DATA FIELD ACTION RESULT Use this list of checkboxes to assign availability of software screens to the selected user VB Other Access VB Other 4ccess Operate if Running Recipe Allows the user to operate heaters shutters on the runtime Can change ANY recipe software screens while a recipe is running Iv Operate if Running Recipe Can change ANY recipe Can amend a
181. film s Initial Rate to your desired rate and Final Thickness to a large value say 10X your desired Final Thickness Select the proper Sensor s Output and Material Set Max Power to 100 and Slew rate to 100 Disable all errors except Crystal Fail Set On Error to Stop Layer Test the Setup Press Auto Manual to start the layer in Manual mode Slowly turn the control knob to a power of 10 and verify that your power supply output is about 10 of full scale Continue to turn the control knob until a Rate A s above 0 is shown Again verify that the power supply output agrees with the SQS 242 Power reading If the readings don t agree check your wiring and process setup In particular verify that the System Outputs Full Scale voltage agrees with your power supply input specifications Determine Open Loop Gain Slowly adjust the control knob until the Rate A s reading approximately matches your Initial Rate setting Record the Power reading as PWRDR power desired rate Slowly lower the power until the Rate A s reading is just at or near zero Record the zero rate Power reading as PWROR Determine Open Loop Response Time Calculate 1 3 of your desired rate RATE1 3 and 2 3 of the desired rate RATE2 3 for this layer Slowly increase the power until Rate A s matches RATE 1 3 Get ready to record the loop s response to an input change Quickly adjust Power to PWRDR Measure the time for the Rate A s reading to reach RAT
182. for password confirmation If the Password box is left blank no Password is needed for that user to login NOTE User names and passwords are limited to A Z 0 9 and space Passwords are a maximum of 8 characters 3 5 5 2 Access Tab The Access tab allows Supervisors to assign which program functions are available to each of the three Access Levels When a program function is assigned to a particular access level it is automatically available to higher access levels In Figure 3 26 every user has access to the File Process menu and the File Exit menu Only Supervisors have access to the Edit System and Edit Security menus The remaining menus are assigned TECH access They will be available to TECH and SUPV users but not to USER access users The settings along the right side of the Main Form can be viewed by any user but values can only be edited by TECH or higher access Those who login with USER access can select and run processes but they cannot edit process parameters TECHs can also select and run processes because those functions are assigned to a lower level access However TECHs can also edit process parameters Only Supervisors can change System Setup or Security assignments INFICON SQS 242 Operating Manual Figure 3 26 Access tab at Security Users Access File Menu Edit Menu Process USER J Process TECH Open Save TECH Film TECH D atal og TECH Material TECH J Print
183. fore reading and understanding the operation manual 1 Visually inspect equipment daily for water leaks equipment condition 2 Thermal equipment operates with a low voltage high current power supply Make certain that proper LOTO procedures are followed prior to servicing A DANGER Use caution when removing the substrate from the chamber it may be hot SETUP Over time you may need to adjust the shutter limits or soeed of open close SHUTTER SPEED ADJUSTMENT 1 Start by closing the speed adjustment valves clockwise See Fig below 2 Now toggle the shutter to open The shutter should not open yet 3 Check which airline has pressure on it and adjust the other speed valve counter clockwise slowly until the shutter opens 4 Now toggle the shutter to close The shutter should not close yet 5 Adjust the other speed control valve counter clockwise slowly until the shutter closes 6 Recheck the shutter open and close and adjust the speed valves so that the shutter operates smoothly KURT J LESKER COMPANY 87 PVD 75 OPERATION MANUAL SHUTTER LIMIT ADJUSTMENT Speed adjustment valves Adjustable limits Using these two adjustable limits shown above you can set the shuttered position closed and open position SYSTEM EQUIPMENT REQUIREMENTS Each Thermal Source s system needs the below interlocks to be satisfied in order to work e Water Flow Sensors if equipped e Vacuum monitor e System Pressur
184. g Indexers vol Cards Comm Physical Mame iie FS Out Color Output 1 fi Test Output Output 2 E 5 00 gt Dupus H Full Scale Duput4 L 8 Zero Outputs f4 Controls along the top of the System Setup dialog box apply to the selected system setup System Setup A dropdown box that selects the setup to be edited Defaults to the current setup Rename Edits the name of the selected setup New Creates a new system setup based on the existing default setup Delete Deletes the currently selected setup from the database If the setup is used in a process an error message Is displayed Copy Creates a duplicate of the currently selected system setup IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual 3 5 4 1 Outputs Tab Figure 3 18 Outputs tab M System Setup Chamber Rename w Delete Copy 1 Outputs Sensors Analog indexers Cards Comm Physical Mame TR FS Out Color Output 1 fi Test Output Output 2 E 5 09 i E fouputs H Full Scale ER 10 00 Output 5 Output 6 10 00 Name Assigns a name to each displayed output For clear display keep the name to less than 8 characters Physical Output Up to six SQM 242 cards physical outputs 1 to 12 and a single SAM 242 card physical outputs 13 and 14 may be installed in a computer However the SQS 242 software can display and control a maximum
185. g CSA NRTL Shipping Weight estimated exclusive of packing material Sputtering Up Down or Evaporation Up 1 800 Ibs 816kg 8 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 UTILITY REQUIREMENTS 1 System Power Configurations a b c d e North America Europe Asia 208 220VAC 1 phase 50 60Hz 3 wire 30 amps North America Optional 208 220VAC 3 phase 60Hz 5 wire 60 amps Electron Beam Gun 2 4 Power Drop if applicable 208 220VAC 1 phase 60Hz 4 wire 40 amps Europe Asia Optional 380 400VAC 3 phase 50Hz 5 wire 30 amps Electron Beam Gun 2 4 Power Drop if app 380 400VAC 3 phase 50Hz 5 wire 30 amps 2 System Utilities a b c d e f Main System Water typ 2 0 6 0 gpm 7 6 22 8 l min 7 9 pH 50um particle filtration 1 FNPT Cryogenic Compressor Water 0 5 gpm 1 9 l min 6 8 pH 50um particle filtration 4 FNPT Compressed Air 80 psi 552 kPa 4 tube connection Chamber Vent 10 psi 69 kPa 4 tube connection Cryo Purge 40 psi 276 kPa 4 tube connection Process Gas 5 7 psi 35 48 kPa 4 VCR connection 3 Communications Analog Modem Port and or 10 100 Ethernet Port optional RJ type connector KURT J LESKER COMPANY PVD 75 OPERATION MANUAL SAFETY SYMBOLS The following safety symbols will be used throughout this manual A DANGER This notation indicates an imminently or potentially hazardous situation that may caus
186. g process gas at a controlled variable rate typically in units of sccm standard cubic centimeter per minute PID CoNTROL Proportional Integral Derivative Control A type of control used in closed loop feedback systems See Operation Gas section for more information RECIPE an automated sequence that consists of one or more steps or recipes The steps specified in a given recipe are executed in a pre defined increasing numerical order RUNTIME SCREENS the portion of the HMI associated with the Runtime software as opposed to the system database forms These are the screens most often used when operating the tool RUNTIME SOFTWARE the control software responsible for I O system interface control logic recipe execution and a majority of the HMI STEP the part of a recipe that sets and checks system I O Steps can be thought of as the building blocks for recipes KURT J LESKER COMPANY 117 PVD 75 OPERATION MANUAL SYSTEM ABORT in case of a dangerous situation when the System Abort button is pressed on the HMI or the system is aborted as the result of a Red Alarm or device communications error all processes are stopped and all Discrete and Analog Outputs are set to their default startup state as configured by the system database Typically most Discrete Outputs are turned off and most Analog Output setpoints are set to zero SYSTEM DATABASE a Microsoft Access database that contains recipes user informa
187. g the process e When process starts user should ensure the E Beam is centered inside the crucible e System must be in Automatic Remote mode KURT J LESKER COMPANY 73 PVD 75 OPERATION MANUAL KL 6 EXAMPLE Following is a general example of how to manually run the KL 6 E Beam through CWare For this example the E Beam system has 4 pockets Pocket 1 has a carbon crucible loaded with Titanium pellets 1 Select Crucible 1 by pressing Cru Pos1 button When Crucible is in position the feedback will turn green Figure 1 shutters SERES ERE Flaten Control PC Pressure Gas Flow Sigma Substrate Shutter EE Velocity We So en State e Closed ES E e Velocity um n gms Dual TL 1 Shutter RPM Pese ap pue NEM EB Fa ok Gr MEER NEN ball tale Power Shutter Shutter Ra Fwd Ril mp Ww Closed Oper E Powe Rate Power Power DC FE Setpoint Unite U s Wa Mw BiayV Watts Vols Amps E beam Shutter uy EB Dn OFF Ea EA Crucible Indexer OFF EB Dm FIGURE 1 2 Open Sigma SQS242 Monitor software this will be used to record deposition rate Start gt Programs gt Sigma Instruments gt SQS242 Monitor OR with Sigma SQS242 CoDep running read rate by pull down View gt Sensor Readings d Do not run both SQS242 CoDep and SQS242 Monitor programs at the same time 3 Press the EB Off button and then press the EB On button Note that the EB HV feedback will appear green HV is now turned on d EB On cann
188. ge P terms can lead to instability This is the most critical term for tuning the pressure control loop Typically as the throttle position increases greater conductance higher effective pumping speed the P term must be increased to achieve the desired pressure greater change in gas flow is required to affect a pressure change KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ICON OR DATA FIELD ACTION RESULT Capman Pressure Integral Sets integral term for pressure control loop Click to enter value This term typically does not need to be changed from its factory default value Capman Pressure Sets derivative term for pressure control loop Derivative Term Click to enter value This term typically does not need to be changed Cap Pres DUE from its factory default value Refer to the Operation Vacuum section for descriptions of heater control icons included on the Gas screen KURT J LESKER COMPANY 133 PVD 75 OPERATION MANUAL GAS CONTROL OVERVIEW The software supports control of up to 4 MFCs in flow or pressure control modes Only one MFC can be designated as the master for upstream pressure control but any of the remaining MFCs can be slaved to the master Any MFC can be set for independent or slave flow mode at any time The ranges for the gas flow and pressure hardware can be changed in appropriate maintenance levels to accommodate modifications by the customer Additionally pressure
189. gear is backfilled with SF6 to prevent arcs and all fluorescent lights are backfilled with mercury vapor Vacuum removes air in preparation for backfilling with an appropriate gas vapor or liquid KURT J LESKER COMPANY 211 PVD 75 OPERATION MANUAL CLEAN SURFACES Tribology experiments the science of wear and friction of clean surfaces often starts with breaking a crystal under vacuum to get a clean surface that has no absorbed contaminants If the chamber s pressure is one millionth of an atmosphere the initially clean surface is coated with a mono layer of residual gas within 1 second If the chamber is at one billionth of an atmosphere the time increases to 1000 seconds Vacuum reduces the flux of the residual gas on a surface PRESSURE WHAT IS PRESSURE Since vacuum is described as a reduced pressure we must have some understanding of what pressure means There are two ways of presenting it a every day experience with atmospheric pressure and b what is really happening at the molecular level GRAND SCALE The layer of air surrounding the earth is not thick roughly 100 km compared to the earth s diameter of 12 800 km However a column of air 1 square 6 45 cm at sea level projected to the top of the atmosphere weighs about 14 7 pounds 6 7 kg on the average day Expressed another way this air column creates a pressure at sea level of 14 7 pounds per square inch psi 1 035 kg cm But air is a fl
190. h Platen Rotation 204 KURT J LESKER COMPANY OPERATION MANUAL A6G3 065037 Timing Belt 65 Teeth Platen Rotation Timing Belt 70 Teeth Platen Rotation Z Shift Lubricant 5 ml Syringe ROCOL KLFDHC100 Rotary F T Inner Shaft O Ring O V037 KLFDHC100 Rotary F T Outer Housing O Ring HIGH TEMP PLATEN ASSEMBLY 550 850 C PBN ELEMENT STYLE EPICENTER Reference Schematics ECP MS 001B ECP HMCA 001B ECP MS 002B ECP HMCA 002B EC SA 007 EC SA 008 and EC SA 011 PART NUMBER DESCRIPTION EC SA 011 Earth Contact Assembly EC RBC 049 RF Bias Plunger Assembly Contact Pad EC SA 008 RF Bias Plunger Assembly 4 inch Platen EC SA 007 RF Bias Plunger Assembly 6 inch Platen IFTHGO13052 H N Type Feed Thru 50 ohm 4095 211 Type K 1 16 Inconel Sheath Grounded T C HM 100 PGG ELEMENT HM 150 PGG ELEMENT HM 100 SSIC ELEMENT HM 150 SSIC ELEMENT HM HSK 100PGG Pyrolitic Graphite on Graphite Heater Element 100 mm 4 inch Pyrolitic Graphite on Graphite Heater Element 150 mm 6 inch Silicon Carbide Coated Graphite Heater Element 100 mm 4 inch Silicon Carbide Coated Graphite Heater Element 150 mm 6 inch Spares Kit for 100 mm Heater Module HM HSK 150PGG Spares Kit for 150 mm Heater Module RMF 052 Moly Wire 0 5 mm FRM 001 M4 Tantalum Nut FRM 002 M4 Moly Washer HE 001 M4 Grafoil Washers EC HMP 004 Moly Conductor CC M 001 Ceramic Spacer 6 x 4 x 4 5 m
191. h sensor is positioned to measure The rate and thickness displayed by the sensor will be calculated based on the material assigned to the selected output Control Checkboxes Click Rate to assign the sensor to the PID rate control loop for the assigned output during deposition Click Thk to use the sensor for Thickness endpoint detection Typically you will check both boxes so that the sensor controls to rate setpoint and detects the thickness endpoint If multiple sensors are assigned to control the same output the sensor readings are averaged when calculating rate and thickness Uncheck both boxes to have a sensor monitor an output without controlling deposition rate or stopping when final thickness is reached IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual 3 5 4 3 Analog Tab Figure 3 20 Analog tab M System Setup Chamber Rename New Delete Copy Outputs Sensors Analog Indexers vol Cards Comm Mame Convert DC olts to your units using olts x Gain Offset Units The SAM 242 analog input card measures DC voltages in the 10 volt range These voltages may represent temperature flow or any other process variable The analog tab allows you to modify the display to show values in the desired units using a linear y mx b transformation For example assume you have a temperature transmitter that sends OV at 0 C and 1V at 100 C To display temperature in F set
192. hamber door can now be opened Refer to individual component manuals to make sure all equipment is in a safe mode KURT J LESKER COMPANY 39 PVD 75 OPERATION MANUAL LOAD LOCK VENT 1 2 3 4 5 6 Turn off the on gauge filament Turn off the turbo pump Close the roughing valve Open the turbo vent valve Wait until the system reaches atmospheric pressure Close the turbo vent valve At this point the vacuum system is at atmosphere The load lock door can now be opened Refer to manufacturers manuals to make sure all equipment is in a safe mode TURBO WITHOUT LOAD LOCK VENT 1 2 3 4 5 6 7 8 Turn off the ion gauge filament Verify that all gas valves are closed and all source and heater supplies are off Verify that the heater is 809C Turn off the turbo pump Close the foreline valve Ensure the pump speed is lt 80 C If applicable open the turbo vent valve Wait until the system reaches atmospheric pressure Close the turbo vent valve At this point the vacuum system is at atmosphere The top plate can now be opened Refer to manufacturers manuals to make sure all equipment is in a safe mode TURBO AND CRYO PUMP WITH LOAD Lock CRYO PUMP WITHOUT LOAD LOCK VENT 1 2 3 4 5 6 7 Turn off the ion gauge filament Verify that all gas valves are closed and all source and heater supplies are off Verify that the heater is 809C Close the hivac valve Open the pro
193. hamber top plate 7 Extend the LRP by rotating the knob on the LRP s rotary feedthrough 8 Visually align the sample carrier with the counter bore on the sample platen using the chamber viewport 9 When the carrier is aligned raise the platen assembly using the transfer z shift until the carrier is lifted from the LRP end effecter fork This is considered the Transfer Position 10 Retract the LRP completely until it reaches the mechanical limit 11 Raisethe transfer z shift to the uppermost position so that the platen is engaged in the heater assembly 12 Close the load lock isolation valve between the load lock and the process chamber A CAUTION Use caution when jogging the platen rotation while the LRP is extended to avoid serious equipment damage Use caution when raising and lowering the z shift when the LRP is extended to avoid serious equipment damage Open the substrate shutter before lowering platen assembly KURT J LESKER COMPANY 43 PVD 75 OPERATION MANUAL SAMPLE UNLOADING Transfer Z Shift Load Lock Isolation Valve Sample Carrier b RS Retracted I EE n poen E Gester x A EO N E a n i Linear Rack amp ut Load Lock Sample Carrier amp Sample Pinion LRP Chamber Fork Extended Platen SAMPLE UNLOADING COMPONENTS 1 Make sure that nothing is loaded onto the LRP end effecter 2 Make sure that the load lock chamber is pumped down to at
194. he Sigma In Process step has not initiated after 15 seconds the Abort Recipe will run and the message written in the TimeOutMessage box will be displayed Sigma Process not Started e Inputting the value of 999 in the Goto Sequence No if Timeout textbox will run the Abort Recipe 98 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 MATERIAL REPLENISHING 1 2 3 4 5 Allow the thermal source boat crucible wire filament etc to adequately cool prior to venting the Chamber Make certain the thermal source is Off or de energized and that both the Ramp Rate U s and Setpoint boxes have 0 values entered Vent the Vacuum Chamber to atmosphere Turn off the associated circuit breaker for the thermal source Replenish the thermal source with applicable material CLEANING AND MAINTENANCE 1 2 3 4 5 6 7 Allow the thermal source boat crucible wire filament etc to adequately cool prior to venting the Chamber Make certain the thermal source is Off or de energized and that both the Ramp Rate U s and Setpoint boxes have 0 values entered Turn off the associated circuit breaker for the thermal source Use Scotchbrite brand or equivalent to remove deposition from thermal source feedthrough points Sandblast deposition shields and shutters to remove condensate Adequately clean sandblasted materials shutters deposition shields with IPA a
195. he General Assembly schematic should be referenced There should also be adequate air flow around the equipment It is recommended that the ambient temperature be maintained as below MINIMUM 60 F 16 C MAXIMUM 85 F 30 C Relative humidity should be less than 65 non condensing The combination of the ambient temperature relative humidity and inlet water temperature must not result in any condensation on any of the water cooled components Additionally large temperature changes can affect the pressure readings when operating at UHV pressures This is due to o ring permeation and material temperatures out gassing A CAUTION If condensation does occur serious damage to the equipment may occur In addition a safety hazard could be created KJLC equipment racks may include cooling fans and ventilation holes at the top and or rear Please allow adequate spacing for air flow Also refer to all system component Operation Manuals for additional ventilation requirements as detailed by the manufacturer Care must also be taken to ensure the tool is not placed in a location that can be exposed to corrosive harmful materials or excessive vibration sources such as nearby cranes elevators folding doors and heavy machinery d If the mechanical pump is not integrated into the system framework keep the distance between the pump and system to a minimum A longer roughing line will reduce the effective pumping speed and increase pump
196. he Run Recipe list from the Runtime Software screens d Recipe GoTo on Fail Goto Sequence No if 999 999 Abort if Timeout Timeout IF THIS BOX IFTHISBOXCONTAINS THEN 999 and there is an abort recipe in The user defined abort recipe in step step 1 of the recipe 1 will run iii ane erai P EES The Abort Default recipe will run in step 1 of the recipe A f EE ER It goes to the ee number indicated Lo o Or is blank or is blank A Timeout ATimeout Message Box will appear Box will appear 170 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 MODIFYING RECIPES Any saved recipe can be modified It is strongly suggested that you copy a recipe and modify the copy using a new recipe name If you need the original recipe it will still be saved as it was before you started d When modifications are complete you must click Update VB for the changes to be applied in the Runtime Software To change the order of the steps in a recipe 1 2 3 4 5 6 Use the navigation buttons on the Recipe Database screen to choose the recipe to edit On the Recipe Database screen click the Reorder Items button On the left side of the screen click the recipe step that needs to be moved On the right side of the screen click the recipe step that the chosen step on the left needs to be placed BEFORE Click the Move button Both lists display the changed order and the steps have renumbered automatically
197. heric pressure Green some level of vacuum Pressure Display onl pray ong Indicates wide range gauge pressure in Torr Capacitance Manometer Display only Indicates capacitance monometer pressure in mTorr Indicates process chamber temperature in degrees Celsius Temperature Display only Degas Disblav onl Green Degas mode on DEGAS Pop Gray Degas mode off LL Chamber Pressure Display only Indicates wide range gauge pressure in Torr KURT J LESKER COMPANY 127 PVD 75 OPERATION MANUAL ICON OR DATA FIELD ACTION RESULT Green LRP is fully retracted End of LRP End of Travel Travel LRP EOT SERGE Illuminates to On color if active and Off color if inactive Click to activate Turns on off the corresponding equipment Filament Disolav onl Green hot filament on FILMNT d ce Gray hot filament off 128 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 DEPOSITION SCREEN 1 0E 1 1 21 19PM 12 20 2005 Lesker Logout KJLC Kurt J Le ompany 0 00 02 Closed Off Super User ABORT Vacuum Deposition Gas Motion Cooling Heating Shutters Heater Control Platen Control Pressure Gas Flow Gun3 Shutter Velocity Wide Range Gauge PC Recipe Database Substrate Heater ON Setpoint IER MFC1 sP 0 000 0 T ext3 1 DE 1 Torr 0 o00 0 Gun2 Shutter Gun4 Shutter OFF Substrate Heater Auto Velocity O dd Run Recipe RPM 100 00 mTorr MFC3SP 0 000 0 250 0 0 E ES Substrate Heater Temp Sp Capman
198. hickness is reached the evaporation source Is set to feed or idle power At this point the process may be complete or deposition of another film layer may begin Up to six separate films can be codeposited within a single layer There is no practical limit to the total number of processes layers or materials that can be stored in the process database IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual 3 2 Installation and Registration The SQM 242 card can be installed before or after the SQS 242 software Consult the separate SQM 242 card User s Guide for installation information To install the program insert the disk or CD ROM Click Start then Run then type d Setup where lt d gt is the drive you are using Click OK to begin installation and follow the on screen prompts When installation is complete you may be prompted to restart the computer To start the SQS 242 program click Start gt gt Programs gt gt INFICON gt gt SQS 242 If you see this Registration dialog box appear see Figure 3 3 you have a older version of the SQS 242 software contact INFICON for the latest version which removes this registration requirement Figure 3 3 Registration Dialog Box 505 242 Registration a This software is not regsitered and will expire in 30 runs l Registration information is an the CUROM sleeve Press OK to REGISTER or CANCEL to SKIF registration 3 3 Operation When the program
199. ide WC 280 176 1480 170 220 Ex E gt Tungsten Disulide W i120 D 5 uu E E RF N Se Uranium Il Code 11 0 130 D 80 W W RFR Decomposes al 1 300 Cte UO Vanadium Borde W 240 510 gt a S S RF Vanadium Carbide ve 280 57 im RF Vanadium Made VN 733 63 s A ERR Vanadium V Oide YO 198 8 4M HS os ERR Soutler perlered D d Zirconium Nitride ah 50 70 RF RFR R evap in 10 T Ns Zirconium Dote Z0 20 59 220 G W PER Loses Op Films dear and hard n2 B 26 220 ZwoiumSkkde 250 250 458 zz RF n 192 196 197 200 Jomse Zrj 1700 48 RF KURT J LESKER COMPANY 241 Periodic Table of the Elements IIIA IVA VIA VIA E Mo Mi Me l 14 007 15 558 15 16 VIIB VIIB pm E KE SCH E GC Cu Zn E E As MO ee 65 38 Fe 74 059 Ag Cd in E E 1064 107 87 11241 BILE pne ER iu 5 l E Bi A an F 3 e 20050 Sea rk EY MIB IVB VB VIB US G Rp EE H g T E x Gaseous Site W Liquid Stage Solid State 7 Synthaticaly Prepared For a more comprehensive periodic table we recommend this link http www webelements com webelements index html O P E R A T N G M A N U A L z SQS 242 Process SAM
200. igma manual for details regarding function and data set parameters ICON OR DATA FIELD ACTION Sigma Launch 242 Click to activate Sigma Simulation Mode Click to activate Start Stop Process Click to activate Sigma Zero All Thicknesses OFF OK Indicator Click to activate Display only 144 RESULT Initiates the Sigma deposition control software Simulates Sigma processes in the absence of Sigma hardware Initiates the currently loaded Sigma process Zeros the Sigma thickness Lights green when Sigma acknowledges communication with CWare KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ICON OR DATA FIELD ACTION RESULT Map the power supply to the corresponding Power Supply Mapping Sigma deposition source number FW Example If a 1 is entered The Sigma process output Power setpoint will be transferred to the outpoint setpoint for KJLC deposition power supply 1 Mapping Click to enter value Map the desired shutter to the Sigma delay shutter control signal Controls the opening Data Shutter Mapping and closing of the corresponding shutter Delay Shutter Mapping Click to enter value Shutter will open for the Shutter Delay and Deposit phases of the Sigma process only This is typically used to map a source shutter Map the desired shutter to Sigma deposit control signal Controls the opening and closing of the corresponding shutter Shutter will open for the Deposit phase of the
201. ile Structure amp Maintenance eee eese eene enean nens nnnnnns 121 packing Up System Data ee o Quir o Mode detur 121 Restoring System Data a E 121 Software MIO e EE 122 COMMON fl Te E 123 ODE ge e ME 126 Vacuum SEFC NEE 126 DED OSIEOM SEFC aem cR 129 aS o Eelere 131 EE ERR ei ee TEE 134 Master Slave Operation EE Cose oues Lob er A dt eden 134 WE Ee A ON EE 134 MOtON IE sis RO TOT OT mem 135 Substrdte x SOUL Ce le E 138 oy a aye o q pene eae eee errata erent rea Sat Rr LM M Ra aT 139 Heating Screen nas 140 MKS979 Gale PR 143 e EQ 144 M EI EE 146 DISEFETO SEO 146 a AA nn A 148 SUES IC NARA 150 Ethernet A A vosnaaauah etiem aane etum en te EN ieee 152 Recipe Database e n cS 153 Reorder TEC INS saree ITO TD TT NP 155 Recorded dt EE 156 FACTION LOE T M 157 A e o nn 159 PMA Dat dis A AAA AAA 161 Sei RETTEN 162 SVS CCID SOUS Sal 163 CWare Stan UD EE 166 SNA ARCOD E pera te Lu IMEEM HMM a CM Re eR 168 FAIS Leite 168 WV d elef ae e 170 Modine e 171 Importing RecIDOS toan tbe nem retten tono tre tinm tete oi ida pu ardt ditus 172 Recording Data daa 172 Bata Login ENa ate TT 173 See EE 178 MAIN CCN ANCE cons 179 Personnel Qualifications ico 179 General Recommendations 179 Maintenance Materials and Accessories scsscsccsccscescsccsccsceccscssceccnccsceccnccecscees 180 Component Preventative Maintenance cscccsccccccsccccccccccscccsscesccec
202. ilowatt hours counter KURT J LESKER COMPANY 129 PVD 75 OPERATION MANUAL ICON OR DATA FIELD ACTION RESULT Displays current i i pray The kilowatt hours counter increments kilowatt hours for a Sourca Kilowatt Hours ETH accordingly based on the output state of KWH rs the corresponding power supply UE Click to zero or preset the kilowatt hours counter The counter is set accordingly and increments from the preset value Power Supply On Off Click to activate Turns respective power supply on off PS Output Setpoint Enter the desired power supply output Setpoint Click to enter value setpoint in Watts also see Ramp Rate M below PS Ramp Rate Enter the desired power supply ramp rate Ramp in units per second H Click to enter value a NOTE Set Ramp Rate PRIOR to setting the output setpoint Power Supply Feedback Fwd HH Power Power OC W Mw Bias V l l Display only Displays current power supply status wats Wolts Amps Refer to the Operation Heating section for descriptions of heater control icons included on the Deposition screen Refer to the Operation Gas section for descriptions of gas and pressure control icons included on the Deposition screen Refer to the Operation Motion section for descriptions of platen control icons included on the Deposition screen 130 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 GAS SCREEN 1 0E 1 1 40 41 PM 12 20 2005 r Lesker Logout KI
203. ings ribbon Because the PID loop is not running you can manually set the output power to different levels and observe the associated deposition rate MAN gt AUTO Returns the output to PID loop control If the process is running ABORT PROCESS and STOP LAYER shown on the first two SoftKeys deposition continues If the process is stopped sets the output to zero and awaits a start command ZERO Resets the thickness reading to zero NEXT FILM Sequences the setting ribbon through each Film in a codeposition layer NEXT SETTING When the settings ribbon is shown sequences the setting knob action through each of the displayed parameters IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual 2 5 Multi Layer CoDeposition Process Our final example builds on the previous sections If you have modified the setup of your process return to section 2 2 Single Layer Process Setup on page 2 2 and adjust the process to those values When your single layer process matches section 2 2 complete these steps 1 Duplicate a Layer Open the Edit Process dialog box Click on Layer 1 click the Layer tab then click Copy Layer Now click Paste Layer A duplicate Gold Sample film will be added as Layer 2 Click Paste Layer again to add a third Gold Sample layer 2 Select a CoDep Film Select Layer 3 in the layers list Select Films Silver Sample Select Output gt gt Output 2 The layers list will update to show
204. ion THIS WARRANTY IS MADE AND ACCEPTED IN LIEU OF ALL OTHER WARRANTIES EXPRESS OR IMPLIED WHETHER OF MERCHANTABILITY OR OF FITNESS FOR A PARTICULAR PURPOSE OR OTHERWISE AS BUYER S EXCLUSIVE REMEDY FOR ANY DEFECTS IN THE PRODUCTS TO BE SOLD HEREUNDER All other obligations and liabilities of Seller whether in contract or tort including negligence or otherwise are expressly EXCLUDED In no event shall Seller be liable for any costs expenses or damages whether direct or indirect special incidental consequential or other on any claim of any defective product in excess of the price paid by Buyer for the product plus return transportation charges prepaid No warranty is made by Seller of any Seller product which has been installed used or operated contrary to Seller s written instruction manual or which has been subjected to misuse negligence or accident or has been repaired or altered by anyone other than Seller or which has been used in a manner or for a purpose for which the Seller product was not designed nor against any defects due to plans or instructions supplied to Seller by or for Buyer This manual is intended for private use by INFICON Inc and its customers Contact INFICON before reproducing its contents NOTE These instructions do not provide for every contingency that may arise in connection with the installation operation or maintenance of this equipment Should you require further assistance please contact INFICON
205. ions Pressure Number Mean Free Particle Flux Time for a of an Atmosphere Torr Density cm Path cm cm sec Monolayer sec 1 1 000 0 76 2 7 X 10 0 0065 2 9x 10 3x 10 1 10 000 7 6 x 10 2 7 X 10 0 065 2 9 x 10 3x 10 1 100 000 7 6 xX 10 2 7 X 10 0 65 2 9 x 10 3X 10 1 1 000 000 7 6 x 10 2 7 X 10 6 5 2 9 x 10 3X 10 1 10 000 000 7 6 x 10 2 7 X 10 65 2 9 x 10 3x 10 1 100 000 000 7 6 x 10 2 7 X 10 650 2 9 x 10 3x 10 ULTIMATE PRESSURE Vacuum pump manufacturers gives two specifications pumping speed and ultimate pressure also called ultimate vacuum The ultimate pressure is measured by capping the pump s inlet and finding the equilibrium pressure after operating the pump for many hours Because it is measured under ideal circumstances it is crucial to remember that a chamber connected to this pump will never reach the quoted ultimate pressure Perhaps worse pump manufacturers measure the ultimate pressure of mechanical pumps using a McLeod gauge that cannot measure vapors such as pump oil and water Consequently the so called ultimate partial pressure of a rotary vane pump may be quoted in the 10 Torr range causing much confusion when the practical ultimate pressure using a gauge that responds to oil and water vapor is two decades higher FLOW REGIMES The mean free path described above and the chamber component dimensions determine the gas s flow conditions or flow regime If the mfp is e Very short compared
206. ip to START position Main Power Control not on PVD or NANO Wait 10 seconds and exit CWare Wait 10 seconds once CWare has closed Restart the CWare software Failure to restart this software may result in serial devices not responding to user requests Examples of possible problems would be values in motor text box on motion screen will disappear See Figure 4 and cryo pump temp or Turbo speed may read zero This occurs because they are on a serial connection When the communication is broken it needs to be re established again with a CWare restart If the message below appears the system EMO is still activated or power has not been restored to the Wide Range Gauge MKS979 This message will prevent CWare from functioning until EMO has been reset and power has been restored to the device 110 An action cannot be completed because a A component MK59791 is not responding Choose Switch To to activate the component and correct the problem Switch To Retry FIGURE 4 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 SYSTEM SHUTDOWN Kurt J Lesker Logout KJLC Kurt J Lesker 0 00 04 50 Closed Off No Super User ABORT Version 4 33124 9 Deposition Gas Heating Cooling Platen Motion LAP M tion Exit Button User must be Recipe Database ew logged in to perform this fu nction Run Recipe PC1 LL1 Pressure Differential LL Vent Valve ELZE sky F A iliav Open PC Cryo P
207. is a comma delimited line of data If Text is selected the data is formatted for easy reading The first few lines of the LOG file is a heading that illustrates the file format and content NOTE To use a different delimiter than a comma change the SQS242 INI file so that under the DataLog section the LogDelimit entry shows the character you want to use To use a TAB character type the word Tab See section 3 8 on page 3 37 3 4 4 File Print Print Process Prints the parameters for the current process to the system printer Select Print to File in the Printer Setup Menu to print the data to a file Print Setup Selects and modifies the current system printer 3 4 5 File User Login Displays the User Login dialog box so that a different user may log in The existing user is logged off automatically The user Access Level changes immediately to that of the new user See the Edit Security section for more information on Users Passwords and Access levels 3 4 6 File Exit Exits the SQS 242 deposition control program and saves the current data INFICON SQS 242 Operating Manual 3 5 Edit Menu 3 5 1 Edit Process A process is a sequence of thin film layers Multiple films deposited in the same layer are known as CoDeposition The Process Edit dialog box see Figure 3 8 provides the functions needed to develop a thin film deposition process from the database of existing films and materials Figure 3 8
208. iter 3 78 gallon eme 3785 allon t liquid B gallon ft 0 1 gallon lb water 8 34 gallon in 231 gallon m 3 785x10 gallon min Wiese 0 064 gallon min ft sec 2 2 28x10 gauss lines irr 6452 ilbert am m 0 7958 ram oF 0 03527 gram dyne 980 7 gram lb 2 205x10 gram calorie Btu 3 968x10 ram cm meter i ram cm ule 8 B Tx10 ram cm ft lb 7 233x10 gram cm erg 980 7 gram cm Btu 8 302x10 ram cm calarie 2 344x10 gramiem Ib in 5 amp x10 gramen Ib circular mil ft 3405x107 gramer mz 0 03613 gramer bfe 62 43 h horse metric 1014 horsepower watt 745 7 in ft 6 944x10 ir enr 6452 ir sq mil 10 irr mire 645 2 irr circular mil 1 273x10 ir t 00346322 irf uart liquid 0 01732 irf liter 1 639x10 irr gallon 4 329x10 irr nr 1 639x10 ir ft D T8Tx10 in enm 16 39 inch angstrom 2 54x10 inch cm 2 54 oule watt hour 2 T18x10 oule meter 0 102 aule calorie 2 3890x10 OPERATION MANUAL le ftAb 0 7377 joule en 10 lg Bu 9486107 tons sho 110210 kilogram lb 22046 kilogram force dyne 3980665 kilogram meter kilowatt hour 2 724x10 kiloline maxwell 10 kilometer mile 0 6214 kilometer feel 3281 kilowatt fetlbisec T3T 8 kilowatt timin 4 425x10 kilowatt Btu minute 569 kilowatt hour ram meter 3 871x1 F kilowatt hour joule 3 8x10 kilowatt hour ftAb 2 855x10f kilowatt hour Btu 15 km hour mimin 1667 km hour mile hour 0 6214 km hour sec 03113 km hour ft min 54 88 kmihour cm sec 27 T8 kin ft 1 076x10 Ib water gallon 0 11
209. ition Refer to LRP Setup and Operation procedure 4 Rotate the knob wheel on z shift to achieve the desired position Z shift is located either on the top plate or on the bottom of the chamber THREE MAIN Z SHIFT POSITIONS e Full open Extended to accept the wafer carrier e Full closed Retracted to engage the heater e Transfer The point where the wafer carrier is engaged in the platen and lifted free from the forks A CAUTION Use caution when moving the platen z shift while the LRP is extended to avoid serious equipment damage Do not rotate while the top plate of the system is open to avoid injury and or equipment damage Do not move the platen z shift while the substrate shutter is closed to avoid serious equipment damage KURT J LESKER COMPANY 45 PVD 75 OPERATION MANUAL SAMPLE HEATING SETUP AND OPERATION 1 2 3 Verify the presence of a substrate on the platen and that the system is under vacuum The temperature will be controlled with a heater controller Refer to heater controller manual for further details on operation A CAUTION Do not vent while heater temperature is gt 80 C to avoid injury or equipment damage Use caution when removing the substrate from the chamber it may be extremely hot SUBSTRATE SHUTTER SETUP AND OPERATION The following section describes substrate shutter setup and operation MANUAL SUBSTRATE SHUTTER PROCEDURE 1 2 3 Verify that the shutter
210. ity KURT J LESKER COMPANY 225 PVD 75 OPERATION MANUAL THROUGHPUT WHAT IS THROUGHPUT Pump manufacturers supply pumping speed vs pressure curves for each pump Multiplying pumping speed at some pressure by that pressure gives a measurement called throughput or sometimes pump throughput It is essentially a measure of the quantity of gas the pump removes from its inlet in unit time where the word quantity can be substituted by amount mass or number of molecules THROUGHPUT THROUGHPUT UNITS Throughput is a mass flow rate and is measured in units of volume x pressure per unit time such as Torr liters per second T L s mbar liters per second mbar L s Pascal cubic meters per hour Pa m h Torr liters per minute T L m or std cubic centimeters per minute sccm IMEASURING THROUGHPUT One method of measuring calculating effective throughput is to measure calculate the EPS from the chamber see above and multiply that value by the chamber pressure As an example the measured EPS is 83 L s when the chamber s working pressure is 5 x 10 Torr The effective throughput is then 83 L s x 5 x 10 Torr which is 4 15 x 10 Torr L s Another measurement method is listed under Tech Info at www lesker com 226 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 GAS LOAD amp THROUGHPUT COMPARISON amp CALCULATIONS The gas load was defined above as the total amount of gas entering the system while thro
211. ity The flux of air at 760 Torr and 02 C is 2 9 x 10 eme 214 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 REDUCING PRESSURE If we remove some molecules from an enclosed container initially at 760 Torr what happens to number density mfp and particle flux The easiest quantity to understand is number density If we remove half of the molecules from the container the number density goes from 2 7 x 10 cm to 1 35 x 10 cm If we remove 99 of the original molecules the number density is 2 7 x 10 cm still a huge number The table shows the relationship between pressure number density mean free path flux and the time taken to completely cover a clean surface with a monolayer for air at room temperature With respect to the monolayer coverage it depends on particle flux molecular diameter and the sticking coefficient of the gas molecules on the surface The numbers given are for air which has an average molecular diameter of 3 7 and the sticking coefficient is 1 on a clean unheated surface BASE PRESSURE When a chamber has no leaks has no gas deliberately flowing into it and has been pumped for several days the pressure reaches an equilibrium value called the base pressure In truth because the pressure approaches equilibrium asymptotically and the outgassing rate undergoes exponential decay even after a long time under vacuum the chamber theoretically will never quite reach a stable pressure But variation
212. k SetPt then adjust the rate setpoint to 10 A s Adjust Final Thickness to 1 000 k NOTE Time and Thickness Endpoints won t be used for this example System Setup determines the physical inputs and outputs that are used and displayed on the dialog box For now use the Default system setup Manual Start causes this layer to wait for user input before beginning An optional user prompt is possible We won t use any indexers for this example so select None INFICON SQS 242 Operating Manual 2 2 3 Edit Rate Ramps A thin film deposition process consists of one or more layers of material evaporated onto a substrate Figure 2 4 illustrates a complete deposition cycle for a single layer Refer to this diagram as we set the remaining parameters lt may be desirable to vary the deposition rate during a layer For example to deposit slowly at first then more quickly once the initial material is deposited Figure 2 4 Complete Deposition Cycle for a Single Layer End of oe Se Ec Soak Shutter Deposit Idle Preece Delay 13 Click Rate Ramps See Figure 2 5 Figure 2 5 Rate Ramps tab Layer RateRamps Deposit Condition Source Sensor Errors Ramp StafThick RampTime NewRate Start Thickness Insert Ramp Delete Ramp iD UO a Move Up see Move Down 15 00 As 14 Click Insert Ramp 15 Set Start Thickness to 0 400 k 16 Set Ramp Time to 5 seconds 17 Set New Rate to 15 is NOTE Settings on the
213. l 2 2 8 Save Edits 31 Select the Close Form SoftKey to save this one layer process If you are prompted Do you want to change answer Yes to make this the current process 32 Your new single layer process is now the active process in the main window Notice the process layer and time information above the graph 2 3 Single Layer Process Simulation If you have followed this chapter you are ready to simulate a deposition process First take a look at the information provided on the main dialog box See Figure 2 10 Figure 2 10 Information on Main Dialog Box Process Layer Phase Name Number Name Elapsed Time Elapsed Time Time Elapsed Remaining Run Number Percent Complete EJ SQS 242 File Edit View Help Process Sample Layer 1 of 2 Phase Stop Layer Time Run 0 00 56 14 Time 0 00 56 Time 0 00 01 0 00 19 Progress Rampl Pwr Rampi Time sec Ramp2 Time e sec Soak2 Time E Film Rate A s Dev Thick kA Power sec Gold Sample 0 01 0 0 0 0000 0 0 Operating Film Film Soft Keys Measurements Settings INFICON SQS 242 Operating Manual 2 3 1 Setup Displays Click the View menu and make sure that these options are selected Film Settings Film Readings Automatic Note that the settings ribbon along the right side of the dialog box displays the pre conditioning parameters you entered in the previous section 2 3 2 Start Process
214. l PLCs can be controlled from a single computer Comm Port by connecting their expansion ports The slave address of each such PLC is usually set by a rotary or dip switch and must be unique Single PLC systems usually use Address 0 Consult your PLC User Manual If the PLC is found at the selected Comm Port and Address the COMM LED on the PLC will flash continuously The PLC model is displayed below the address 3 5 4 6 Card Tab Figure 3 23 Card tab at System Setup x Defaut Rename New Delete Copy Outputs Sensors Analog indexers LU Card Comm Display Period Filter Last Output 0 25 E C Normal Ser AM Card 1 Rev 2 01 TES Huge Displayed cede Sens DUT ENSE Card 3 Rev 0 00 6 100000 Graph Card 4 Rev 0 00 Hz Continuous Card 5 Rev 0 00 Init Freg x Axis Width Card 6 Rev 0 00 6000000 em Analog Rew 2 01 Hz DLL Return 0 00 Min Fred Front Panel E Enabled UE Y Axis Height Mode In Normal mode the SQS 242 gets readings from the SQM 242 card s In Simulate mode the SQS 242 generates simulated readings even if a card is not installed This is useful for testing new processes and learning the software The firmware revisions of the installed SQM 242 cards are listed below the mode buttons A value of O indicates the card is not installed Analog Rev refers to the revision of an SAM 242 card if installed DLL Return is the status of the SQM 242 card s Windows drivers DLL return va
215. lay contacts behave in the inverse manner Deposit Phase Relay This relay indicates that you are in the deposit phase of a film It is like having the two Source Shutter Relays connected in parallel If you have shutter delay enabled this relay will wait until the end of the shutter delay before going active Pre Cond Phase Relay This relay closes for the preconditioning phases Ramp1 Soak1 Ramp2 Soak2 of a film Soak Hold Phase Relay This relay closes for the Soak and Hold phases after deposition Process Active Relay This relay action is similar to the Process Running relay except it will open if the process is temporarily halted for any reason e g a Manual Start layer Manual Mode Relay Closes when the program is placed in Manual mode IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Max Power Relay Closes when any control voltage output is at the programmed maximum power level Thickness Setpoint Relay This relay will become active when the Thickness Setpoint is reached This is a programmable process parameter Time Setpoint Relay This relay will become active when the Time Setpoint has been reached This is measured from the beginning of the deposit phase and is a programmable parameter Test The Test section provides a simple means of testing I O wiring To close a relay select the desired relay button then click Set Click Clear to open the relay contacts Inpu
216. lbar of the System Database Screen 3 The following screen should appear This image cannot currently be displayed KURT J LESKER COMPANY 119 PVD 75 OPERATION MANUAL ADDING A NEw USER 1 Click the New User button 2 Choose a unique Log in Name for the new user and type it in the User Log in Name box This is the field that will get captured during datalogging 3 Complete the SurName last name FirstName and Initials boxes with the person s actual name and initials 4 Using the drop down menu choose which software screen should appear first when this user logs onto the system 5 The password is chosen by the user when they log in for the first time and must consist of at least one character 6 Inthe set of checkboxes labeled Recipe Database Access choose the database screens that this user should be allowed access to A CAUTION Access to the Interlock Screen should only be granted to the Super User level System Administrator No Operators or Process Engineers should be allowed access to the Interlocks Screen 7 Inthe set of checkboxes labeled VB Mainform Access choose the screens that this user should be allowed access to 8 In the set of checkboxes labeled VB Other Access choose the appropriate boxes a Operate if Running Recipe allows the user to operate heaters shutters on the runtime software screens while a recipe is running b Can change ANY recipe Can amend any recipe
217. ld only be made at the intended point provided at the vacuum chamber or frame using stainless hardware to make connection Refer to the system General Assembly drawing for location A CAUTION Do not use water pipes for the grounding electrode RESISTANCE r Oft TYPICAL 25 ohms MAX VACUUM SYSTEM 3 4 DIA x BR LONG ld COPPER ROD E BEAM 3ohms FIGURE 3 EARTH GROUND REQUIREMENTS A CAUTION Failure to connect the system to a sufficient earth ground could cause severe damage to system components and or auxiliary electronic control equipment and will void the warranty GROUNDING IVIAINTENANCE Resistivity should be verified using a calibrated ground resistance tester following accepted measuring methods The grounding electrode should be checked at least once per year to assure correct resistance and that all points of connection are tight UTILITY CONNECTIONS Refer to the General Assembly Schematic and Utility Requirements Document for your specific tool requirements 22 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ELECTRICAL A CAUTION Ensure facility power feed is off and locked out prior to installation Follow the applicable codes for proper wire size power feed and grounding requirements The electrical requirements for your tool were calculated using the requirements of the installed components Reference the applicable power distribution schematics for details Inst
218. le for other functions i e source indexer operation Please contact INFICON INFICON SQS 242 Operating Manual 4 3 PLC Setup and Test In the SQS 242 software select Edit System then the I O tab Set the Address to match the PLC Address usually 0 Set the Comm Port to the serial port you are using The COMM LED on the PLC should flash several times a second when the Address and Comm Port are set properly The Test section of the I O tab provides a means of testing your PLC communications and digital I O wiring To set a relay on the PLC go to the Digital I O tab and find which I O event is assigned to that relay On the PLC tab select the same event in the test dropdown then click Set The assigned Relay should close Click Clear to open the relay The Indexers tab of the Edit System dialog box allows you to move a source or substrate indexer Select the index i e pocket to activate then click the appropriate move button 4 4 5 3 PLC Programming The PLC runs a small ladder logic program that communicates with the SQS 242 software This program transfers external relay and input states from the PLC connecting block to internal PLC registers The SQS 242 software reads writes to those registers The preset functions of the SQS 242 software will be adequate for most applications If you need to perform additional logic functions they can be programmed using Omron s CX Programmer software Contact INFICON for m
219. le for purchase as an option Typically upgrading the Runtime software involves copying a new Customer Name folder from a CD provided by KJLC to the computer s CA drive refer to Software File Structure and Maintenance section Follow the instructions included with the revision CD for loading software upgrades 122 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 COMMON ICONS These common icons appear throughout the Runtime software screens Some icons appear on every screen others only where specified TIME AND DATE BANNER 4 2E 8 12 00 05 PM 12 15 2005 The Time and Date Banner appears at the top left of all runtime screens The current Windows time and date is displayed RUNNING TIME INDICATOR 0 00 03 The Running Time Indicator appears at the top left of all runtime screens The time displayed here is the elapsed time that the software has been up and running since the last shut down LEGEND INDICATORS Clozsed Oft The Legend Indicators appear at the top left of all runtime screens The status of a corresponding active or inactive signal is indicated here SOFTWARE VERSION Version 2 23 The Software Version box appears at the top left of all runtime screens This box displays the current CWare software revision EXIT BUTTON Exil The Exit Button appears at the top right of all runtime screens Pressing this button closes both the runtime engine and the system database KURT J LESKER COMPANY 123
220. leaning after a period of time due to material build up If left too long flaking can occur resulting in arcing and shorts 1 Turn off sputter source power supply 2 Turn off power supply main distribution panel circuit breaker 3 Switch to the deposition screen open the source shutter 4 Loosen the 3 screws supporting the dark space shield and remove the shield 5 Remove the screws of the target hold down ring and remove the ring 6 Clean the dark space shield and hold down ring The best method for removing deposited material is with bead blasting E BEAM SOURCE SETUP AND OPERATION The electron beam e beam source high deposition rates and large evaporant capacity make it convenient for production scale coating machines Solid evaporants such as powder granules lumps or shaped plugs are placed in the source s copper hearth or in a hearth liner A high electron flux generated by a hot filament placed below the source is extracted and electrostatically and magnetically bent focused on the top of the evaporant The electron beam s energy raises the evaporant s surface temperature Often the beam is rastered to increase the evaporation area Since the evaporation area is surrounded by a cooler often solid evaporant unlike other thermal sources the e beam source s vapor plume is largely uncontaminated by crucible material Production scale e beam sources are usually single pocket one hearth Multipocket sources 4 or 6 hearths
221. least 100 mTorr 3 Open the isolation valve between the load lock and process chambers 4 Jogthe platen rotation to accept sample transfer Align the two ceramic stand offs on the platen assembly via the viewport 5 Open the substrate shutter if applicable 6 Lower the platen assembly to the transfer position using the hand wheel on the transfer z shift located on the chamber top plate 7 Extend the LRP by rotating the knob on the LRP s rotary feedthrough 8 Adjust the platen height if necessary so that the fork can be extended under the shoulder of the sample carrier 9 Jog the LRP so that the fork is fully engaged with the carrier 10 When the fork is aligned lower the platen assembly using the transfer z shift until the carrier is lifted off of the platen 11 Retract the LRP completely until it reaches the mechanical limit 12 Raisethe transfer z shift to the uppermost position so that the platen is engaged in the heater assembly AA KURT LESKER COMPANY OPERATION MANUAL PVD 75 13 Close the load lock isolation valve between the load lock and the process chambers A CAUTION Use caution when jogging the platen rotation while the LRP is extended to avoid serious equipment damage Z SHIFT SETUP AND OPERATION 1 Verify the platen rotation is in a safe position Refer to Sample Rotation Setup and Operation procedure 2 Verify the substrate shutter is open 3 Verify the LRP is in a safe pos
222. ll alphanumeric fields will appear as green text with a black background when not q a Tiwi REN accessible The alphanumeric Filo ez rs ESEAS interf h h il e RR field is clicked The maximum fel els of gt d mini f h ear numer varbiearedepleed REENEN at the upper right within the ap pop up screen while the signal Ok Cancel name appears at the left of the title bar The availability of the Runtime Software Screens is based upon the parameters set for the logged in user See the Security Section for further details This manual is intended to provide information regarding the operation of ALL features currently available in CWare Not all features screens are available on every system Disregard the manual sections for the features screens not included in your system configuration Power Supply1 Output Setpoint x Tool Tip Text is displayed for all controls and indicators on all screens Without clicking place the mouse cursor over the control or indicator to see the Tool Tip Text KURT J LESKER COMPANY OPERATION MANUAL PVD 75 TERMINOLOGY AND DEFINITIONS ACCESS FORMS the portion of the HMI associated with the system database These forms or screens are used when developing processes recipes and configuring the Runtime software ANALOG INPUTS Al system Input that can have many different numerical values positive or negative both integer and decimal Analog Inputs include motor spe
223. ll occur Sensor Tooling Adjusts for sensor measured deposition rates that differ from the substrate deposition rate For example if the sensor sees only 50 of the substrate rate set the value to 200 Setting Tooling to 0 causes a sensor to be ignored for this film The System Setup selection on the Layer tab establishes which sensor s are visible Only those sensors mapped to the layer s output are visible 3 5 1 6 Errors Tab Several source or sensor error conditions are possible during deposition This tab establishes the program s response to errors See Figure 3 14 NOTE It is best to leave all error settings except Crystal Fail disabled until you are confident of the stability and repeatability of your process Figure 3 14 Errors tab eh Process Edit Ej Sample Save Rename New Delete Copy Layer Out Film sett Thickness Time Gold Sample Cut Layer iber Sample D Gold Sample Copy Lawyer Paste Laver Paste WoWep Layer RateRamps Deposit Condition Source Sensor Errors On Error C ignore a Stop Layer C Timed Power Control Error Crystal Fail Crystal Quality Crystal Stability Enabled Enabled Enabled Enabled Counts E single Hz Counts Total Hz IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Control Error If the control loop cannot maintain the desired deposition rate due to loss of source material excessively high rate ramps or
224. lose the process chamber turbo backing valve Open the roughing valve System roughs through load lock turbo pump Open the load lock gate valve if applicable Rough the system to approximately 500 Torr as read by the process chamber convection gauge Refer to gauge controller manual for convection gauge operating instructions Turn on the load lock turbo pump When the convection gauge in the process chamber is below 100 mTorr close the isolation valve wait for it to close completely and close the roughing valve Verify that the foreline pressure is below 50 mTorr and then open the process chamber turbo backing valve Verify that the process chamber pressure does not go above 200 mTorr and then open the hivac valve to the process chamber turbo Wait for 10 seconds and when the pressure on the process chamber convection gauge is lt 1 0e 3 Torr turn on the on gauge Refer to gauge controller manual for operating instructions Open the roughing valve to the load lock turbo At this point the vacuum system is under vacuum and ready for use Refer to individual component manuals for operation of gas flow equipment and gauging equipment 38 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 TURBO PUMP WITHOUT LOAD LOCK CHAMBER 1 2 3 4 5 6 7 Verify that all connections to the system are made Power water process gas vent gas and vacuum connection to mechanical pump should be checked If operating
225. losed Closing Shutter Source Shutter 1 urn Off Closed Closing T T Platen Motor On Turn On Open Opening T D C AJ N Platen Motor Go Home Turn On Open Opening Check On Open Opening Motors SP Set Value n nn urn On Open Opening C Platen Motor Position heck Value lt n nn Planet Motor On Turn On Open Opening BS D NONE a ae eee ee BN e M BEN ESE s MN EE NE pT ea MESE ao a EA E EN NE of m MN 11 Motors velocity SP Set Value n nn_ 10 12 Motors Continuous Tum On OpeyOpenng 13 Motors Planet Motor Moving Check On Open Opening lee 14 Supply CruPos2 Turn Off Closed Closing 15 Supply CruPos3 Turn Off Closed Closing IL 16 Supply CruPos4 Turn Off Closed Closing IL 17 Supply CruPos5 Tun off Closed Closing IL 18 Supply CruPos6 Turn Off Closed Closing IL 19 Supply CruPos1 Turn On Open Opening IL 20 Supply Crucible In Position 1 Check On Open Opening Iw oH 21 Supply Setpoint Set Value n mn a 22 Supply _ EB HV Off turn Off Closed Closing 23 Supply EBHVOn Turn On Open Opening 24 Supply EBOff Turn off Closed Closing 25 Supply EBOn Tum OOpeyOpenng 26 Sigma Mappngl jSetValue nm 16 27 Sigma Mapping 1 Set Value snnm A 28 Sigma Sigma Control Request Set Value n nn Titanium test 29 Sigma Sigma Process Name Check Value
226. low of gas from chamber to pump inlet It is the combination of the conductances of these passive devices and the pumping speed of the pump that determines the overall pumping speed from the chamber called the effective pumping speed EPS or sometimes the delivered pumping speed We will use the former The EPS s value is critical since it determines the chamber s pump down characteristics and base pressure Since EPS is a combination of conductance and pumping speed it retains the units of volume per unit time such as liters per second L s cubic feet per minute cfm cubic meters per hour m h or liters per minute L m CALCULATING EPS Consider a 500 L s high vacuum pump connected to a chamber by a pumping Measuring EPS One method of measuring EPS uses the fact that in molecular flow the system follows first order reaction kinetics Pa Porgina X e t Integrating with respect to time EPS Vit x log P P Where V is chamber volume t is time and Po and P are the start and final pressures Example a 150 L chamber has a base pressure of 1 x 10 Torr Gas is injected through a valve at a rate that keeps the pressure at 4 x 10 Torr with the pumps operating The valve is shut at time zero 0 s and 16 s later the chamber has reached 6 x 10 Torr EPS 150 16 x loge 4 x 10 6 x 10 EPS 9 38 x log 66 67 EPS 9 38 x 4 2 EPS 39 L sec Limitations to measuring the EPS this way 1 PS 1 C Formula on
227. lues of 9XX indicate a card installation error Front Panel Enabled When used with the SRC series computer enables disables the SQS 242 software to read the SoftKeys Period Sets the measurement period between 0 2 seconds 5 readings per second and 2 seconds A longer period gives higher reading accuracy especially at low rates IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Max Init Min Frequency The frequency values for the quartz crystal sensors used as inputs to the SQM 242 Typical values are Max 6 1 Init 6 0 Min 5 0 Sensor readings outside the min max values cause a Sensor Fail error Filter Sets the number of readings used in the reading filter A low setting gives rapid response to process changes high settings give smoother graphs Last Output Limits the maximum number of outputs shown on the main dialog Dox Continuous Check this box to have the graph continuously display data for each phase of the deposition cycle Uncheck this box to clear the graph at the end of the preconditioning deposition and post conditioning phases Graph X Axis Sets the width of the X axis during deposition normally 100 seconds Whatever width is selected the graph automatically scrolls the X axis as required Due to screen resolution setting a width of more than 10 minutes 600 seconds may cause some data points to not be plotted Graph Y Axis Sets the Y axis Rate graph maximum value during dep
228. ly works for molecular flow conditions Results are invalid if Ps edges into transitional flow If Pris 50x the chamber s base pressure wall outgassing will affect the time measurement Other measurement methods are under Tech Info at www lesker com an EPS of 10 5 L s There is no clearer illustration of the maxim the smallest conductance rules KURT J LESKER COMPANY 223 PVD 75 OPERATION MANUAL GAS LOAD WHAT IS GAS LOAD When discussing pressures and pumping we are really speaking about molecules in the gas phase which are the only ones we can measure or pump However if we could remove all gas phase molecules instantaneously from a vacuum vessel the result would not be zero pressure Molecules are continuously entering the gas phase from various sources which can be summarized as e Real leaks at welds gaskets flanges or porous construction materials e Virtual leaks such as trapped volumes at welds screw threads or mating surfaces e Outgassing which includes gas vapor Desorbing from the wall surfaces which is important enough to warrant its own section Diffusing from the wall matrix e Evaporation of materials with high vapor pressure e Permeation through elastomeric gaskets e Permeation through the glass or walls e Backstreaming gases from the pump e Backstreaming oil vapor from an oil sealed pump e Backstreaming condensable vapors e g solvents coming out of the pump oil
229. m 306 00034 Ceramic Spacer 14 x 6 4 x 1 5 mm CC 005 Ceramic Spacer 7 x 5 x 20 mm CC 006 Ceramic Washer 8 x 5 x 5b mm E329 Ceramic Top Hat S 002 Haynes Spring Washer M4 KURT J LESKER COMPANY CATEGORY d AD QUANTITY STOCK TIME 1 15 Days 15 Days 15 Days 6 inches 15 Days 2 15 Days SC som a CE asp s Dee 6 sce 6 EM ERI EM ES x EET A EA E Euer EM 205 PVD 75 OPERATION MANUAL PROCESS CONTROL NOTE All crystal sensors come in a package of 10 IN LEAD PART NUMBER DESCRIPTION CATEGORY QUANTITY STOCK TIME 008 009 G10 6Mhz Crystal Sensor Silver clean room pkg NOTE Quantities for deposition sources listed below are for one source For systems with multiple sources quantities should be adjusted TORUS HV SPUTTER SOURCE 2 INCH PART NUMBER DESCRIPTION QUANTITY Magnet Assembly 2 Standard Strength Magnet Assembly 2 High Strength TORUS HV SPUTTER SOURCE 3 INCH PART NUMBER DESCRIPTION QUANTITY Magnet Assembly 3 Standard E Magnet Assembly 3 High Strength EUN LI008010G10 6Mhz Crystal Sensor Gold TMO3CC KHDW3 Hardware Only Kit TRS3 TMO3CC RBKIT Rebuild Kit All hardware o rings amp tubing TORUS HV SPUTTER SOURCE 4 INCH PART NUMBER DESCRIPTION CATEGORY TMOACC 00300 Magnet Assembly 4 Standard TMO3CC HS400 Magnet Assembly 4 High Strength 206 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 TORUS LINEAR SOURCE PART NUMB
230. me 3 5 1 4 Condition Tab Before the deposition begins it is often necessary to PreCondition the source material This places the system at the proper power level to achieve rapid PID control when deposition begins See Figure 3 12 Figure 3 12 Condition tab Process Edit Sample SEVE Rename Delete Copi Layer Out Film cetFt Thickness Time Gold Sample Cut Layer Silver Sample Gold Sample Copy Layer Paste Layer Paste Collep Layer RateRamps Deposit Condition Source Sensor Errors Pre Condition Post Condition Rampi Per ST Fawr Feed Power Idle Power 15 00 50 00 oo Er p Auto Rampl Time Rampe Time Ramp Time Ramp Time SEC Sec Sec Soak Time Soake Time Feed Time Sec Sec IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Ramp 1 Ramp power sets the power level that is desired at the end of the ramp phase in of full scale Ramp time sets the time to ramp with a linear rate from the initial power to the Ramp power Soak time sets the time the output remains at the ramp power level Ramp 2 Ramp 2 functions are the same as Ramp 1 Typically Ramp 2 power is set near the power level required to match the desired initial deposition rate Selecting the Ramp2 Power Auto checkbox stores the power over the last few seconds of the deposit phase for this film That value is used as the Ramp2 power for the next run of the selected film Feed The feed ph
231. me 0 01 38 7 z a E H Ed r1 3 E D o E o E c E j e S Eo 2 NEXT ate A s ev Thick kA Power SETTING 2 0 950 52 6 Gold Sample 2 L Silver Sample H H 0 565 46 1 At 0 400 kA thickness the Silver Sample deposition rate ramps down from 15 A s to 0 Similarly at 0 400 kA thickness the Gold Sample film ramps to a higher deposition rate of 15 A s Because the initial rate for Gold was set lower than the initial rate for Silver Gold reached its 0 400 kA thickness rate ramp trigger later in the deposition cycle IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Try a P Term in the 25 30 range less gain for both Gold and Silver to decrease the loop susceptibility to noise Increasing the Term a little say toward 1 0 will lessen overshoot during rate changes The D term can be thought of as a dead band term Most systems require little or no D term 2 6 Conclusion Spend some time with this process to become familiar with its setup and the effect of changes on deposition performance Because we selected Simulate Mode at the beginning of this Quick Start session the SQM 242 card is faking an actual process You can use the Simulate feature at any time to become familiar with SQS 242 operation and the effect of various settings on process performance It is also a very useful feature for pre testing your process setups Return to the Edit menu then select S
232. meters listed below A CAUTION Always make a backup of the INI file before editing MDISize Left Top Width Height Screen size and location in pixels Debug True or False Show SQM 242 card error messages Show True or False True loops continuously through a process KillErrLog True or False True clears error log each time application NumberFormat 0 or 1 0 uses Windows setting for number format 1 uses the U S format e 1 000 00 BackColor Color Default is BLACK ForeColor Color Default is LIGHTGRAY HighLightColor Color Default is WHITE The next four parameters control setup of the 4 indexer values where Name is the Indexer label on the Process form Start is the first index number typically O or 1 End is the last index number typically 15 or 16 First is the text displayed for the Start index number Sourcelndex Name Start End First Layerlndex1 Name Start End First Layerlndex2 Name Start End First Layerlndex3 Name Start End First INFICON SQS 242 Operating Manual This page is intentionally blank IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Chapter 4 Digital I O 4 1 Introduction Digital I O for the SQS 242 software can be handled by an inexpensive PLC This section will cover interfacing a Omron CPM2 series PLC to the SQS 242 card and PC It is not necessary however to use external I O with the SQS 242 software
233. mm ss Active Layer Layer Time mm ss Phase where phase numbers returned are 00 Application Startup 09 ShutterDelay Phase 01 Program Initialize 10 Deposit Phase 02 Not Used LI Layer Stopped 03 Not Used 12 Layer Starting 04 Process Stopped l3 Not Used 05 Rampl Phase 14 Feed Ramp Phase 06 Soakl Phase LS Feed Hold Phase 07 Ramp2 Phase 16 Idle Ramp Phase 08 Soak2 Phase 17 Idle Phase Phase Time mm ss Run All Process Names comma delimited list Source Shutter Status n 1 to 6 0 Open 1 Close Sensor Shutter Status n 1 to 8 0 Open 1 Close All Crystal Good Status 0 False 1 True Crystal n Good n 1 to 8 0 False 1 True All Crystal Fail 0 False 1 True Sensor to Output Map n 1 to 8 DataLog Filename DataLog Type 0 None 1 Overwrite 2 Append 3 Run DataLog Interval in seconds 5 8 2 Update Process UP lt paraml gt lt data gt where lt paraml gt is 01 02 03 04 05 06 07 08 09 10 Set Process Example Update UP 01 MyProc Select MyProc Example Response UP 06 Start Process Stop Process otart Layer Stop Layer Start Next Layer Auto Mode all films in layer Manual Mode all films in layer Zero Thickness all films in layer Set Run INFICON SQS 242 Operating Manual del Set Active Layer 20 Output n 1 to 6 Power Manual Mode Only 4n Map Sensor n to Output 50 Set DataLog filename without extension Stop mode only 51 DataLog type 0 None 1 Overwrit
234. motion only In this case the Jog Rev button is not visible E Velocity Set the jog and continuous velocity for the kr Eer Click to enter value motor in RPM or IPS Jog and Continuous V elacil l l Text motion share the same velocity setpoint Moving Indicator Indicates when the motor is moving Moving Display only Green 1 Moving a Gray 0 Not moving Sends the motor to the position indicated in Go To Position the position setpoint box at the velocity Go To Click to activate shown in the position velocity setpoint box EN This button stays pressed until the motor reaches the position setpoint Position Velocity Velocity Click to enter value MN Currrent Position SS Display only Indicates the current position of the motor Motor Position Setpoint set Point Click to enter value Set the velocity at which the motor should move to the desired position Enter the setpoint for the motor to move to when the Go To Position button is activated 136 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ICON OR DATA FIELD ACTION RESULT Initiates the motor to move in a forward Motor Forward motion at the Jog Cont velocity The motor Click to activate l i l Fwd will move continuously until the button is clicked again Initiates the motor to move in a reverse Motor Reverse l motion at the Jog Cont velocity The motor Click to activate Rev will move continuously until the button is clicked again Mo
235. mp Long Bent Filament 1 700315 Filament Clamp Short Bent Filament EBKL1 700321 Filament Block Assembly Straight Filament 1 703008 Filament Set 5 pcs Straight Filament 1 931100 KL 6 O Ring Set 15 Days 1 931103 KL 8 O Ring Set 1 610800 KL 6 Magnet Current Deflection System 1 611800 KL 8 Magnet Current Deflection System 15 Days 0 601786 2 Rotary F T Upper and Middle O Ring 1 1 1 1 1 1 1 1 1 1 1 1 0 601077 Rotary F T Lower O Ring NN Le BN E E A E EE H 208 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 COMPRESSED GAS PART NUMBER DESCRIPTION QUANTITY ARG20 NO1G1H Z Compressed Air Regulator 7 125 PSI ARG20 DUNO2815 Compressed Nitrogen Regulator 0 60 PSI Poly tubing 1 8 Clear Pneumatics As Required Poly tubing 4 Clear Pneumatics Teflon 4 OD Clear Vent Gas Solenoid Plug 1 8 INSTRUMENT COOLING WATER FLOW PART NUMBER DESCRIPTION QUANTITY 1 1 1 Flow Switch Brass 0 15 GPM a Flow Switch Brass 0 5 GPM pv ax Flow Switch Brass 2 0 GPM Low Tube Press Fitting DENM 3 8 Tube Press Fitting e Water Filter 25 GPM Max DEM Ball Valve X MNT x FNPT Poly tubing 4 BLUE Cooling Poly tubing Y RED Cooling Poly tubing 3 8 BLUE Cooling Poly tubing 3 8 RED Cooling Loap Lock LRP IN LEAD PART NUMBER DESCRIPTION CATEGORY QUANTITY STOCK TIME ELECTRICAL CONTROLS IN LEAD PART NUMBER DESCRIPTION CATEGORY QUANTITY STOCK TI
236. n supply for chamber venting and cryo pump regeneration if applicable Make the required connection to the bulkhead fitting or the backside of the pressure regulator located in the rear of the system The General Assembly Schematic and utility document should be referenced Before installation purge all newly constructed utility lines to remove all loose materials such as thread compound PTFE and tapes Also be sure to remove any remaining burrs from the tube edges before connecting to the system BULKHEAD CONNECTION VENT REGULATOR REGEN REGULATOR Teflon or stainless steel tubing can be used to supply Nitrogen with the following characteristics e Vent 10 psi 69 kPa e Cryo Pump Regeneration 40 psi 69 kPa e q lt 5um particle filtration Typical nitrogen connections DESCRIPTION KJLC SYSTEM CONNECTION CUSTOMER SUPPLIED NITROGEN 1 4 SWAGELOK Tube Fitting 1 4 O D TUBE Nitrogen gas supplies TTO25 TUBING TEFLON 5 32 ID 1 4 OD SST 0025 TUBING 304L SST RIGID 1 4 OD 028 WALL SST 0025CI TUBING 316L SST RIGID 1 4 OD 035 WALL ELECTROPOLISHED d Copper tubing is not recommended for use due to potential internal oxidation and residue that may contaminate the chamber and disrupt sensitive processes KURT J LESKER COMPANY 29 PVD 75 OPERATION MANUAL PROCESS GAS Most tools require a clean process gas supply for depending on the processed be performed Connect the required process gas
237. nd are intended as supplemental information and are to be used as reference ONLY Where applicable the individual component manuals should be reviewed for vendor recommended service intervals and procedures Not all components listed in this schedule may be included on your system A DANGER Many of the referenced maintenance procedures have safety dangers warnings cautions and notes associated with them Read all procedure references and observe all safety measures A CAUTION Any interlocks that may have been overridden must be set back to their operational state Failure to do so may result in component failure or personnel injury KURT J LESKER COMPANY 183 PVD 75 OPERATION MANUAL D any personnel performing preventative maintenance functions must be properly trained on all aspects of the tools operation and safety requirements Engineering schematics should be referenced for proper assembly The manufacturer reserves the right however to discontinue or change specifications or design at any time without notice and without incurring any obligation whatsoever The information and specifications included in this publication were in affect at the time of approval for printing 184 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 SOFTWARE MAINTENANCE ITEM DESCRIPTION PROCEDURE 1 Open the recipe database and locate recorded data via the top tabs 2 Select the data that you wish to remove from the database and pla
238. nd lint free wipes prior to reinsertion in vacuum chamber Use vented hardware on thermal feed thru posts if replacements are needed KURT J LESKER COMPANY 99 PVD 75 OPERATION MANUAL KAUFMAN amp ROBINSON ION BEAM SOURCE OPERATION This procedure details the operation of Kaufman amp Robinson lon Beam KRI sources in conjunction with KJLC CWare software The following are examples of operating modes and are for reference only The KRI manual should be used as a reference for specific process details There are two modes of operation for the discharge e Constant Current Mode Allows for small variations in the discharge voltage while maintaining a constant current and is recommended when operating at 120V and below e Constant Voltage Mode Will allow for small variations in discharge current while maintaining a constant voltage and is recommended when operating at 120V and above E T ie 7 5 Kg NER CONTROL s MAIN POV CON Bi om Tums TO MESE C rr Locas E KRI A fl gee At Ss ANE NN a E Controller cdi oa M S aab LLLI rr Lan m ER P en A eege Y met X we ION GUN POWER SUPPLY 100 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 CONSTANT CURRENT MODE The operating condition selected for this demonstration is with a 2 5A 120 V discharge which is Constant Current Mode operation These conditions are based on a vacuum pump speed of 800 liters per second Operating parameter
239. ndards of practice generally accepted in the profession and or industry for services of a similar nature If the services provided by COMPANY materially fail to conform to the warranty set forth in the preceding sentence CUSTOMER s remedy shall be limited to revision replacement or reperformance at COMPANY s expense of those services which COMPANY reasonably determines fails to so conform SOFTWARE WARRANTY AND REMEDY COMPANY warrants that any Equipment furnished hereunder which is comprised of software when used with COMPANY specified hardware shall conform to the specifications set forth in COMPANY s proposal or quotation or in the case of standard software with published specifications prepared approved and issued by COMPANY s headquarters in Clairton Pennsylvania If any software furnished by COMPANY hereunder materially fails to conform to the warranty set forth in section 3 CUSTOMER s remedy shall be limited to correction of the non conformance by COMPANY without charge to CUSTOMER COMPANY makes no representation or warranty express or implied that the operation of the software will be uninterrupted or error free or that the functions contained therein will meet or satisfy CUSTOMER s intended use or requirements WARRANTY PERIOD The warranties set forth in sections 1 and 3 above shall be effective for a period of twelve 12 months from the date of shipment of the Equipment from COMPANY s plant The warranty set forth in section
240. nect gas to the system Purge gas lines while connecting Pump down the system Pump out gas supply lines Close the tank or wall supply valve throttle the gate valve open system gas valve s and fully open flow valves Refer to 647 manual for proper operation When finished close all system gas valves open the tank or wall supply valve and adjust line pressure to gt 5psig and lt 15psig Verify the system is under high vacuum Turn off the ion gauge Verify that proper gas is hooked to system Throttle the hivac valve Open the capacitance manometer isolation valve if applicable Check that the capacitance manometer reads zero Open the gas inlet valve and the appropriate gas channel valve s and set gas flow chamber pressure to the desired setting This setting usually lies between 1 5 and 15 mTorr for deposition or 100 and 400 mTorr for glow discharge Refer to 647 manual for proper operation When finished close the gas inlet valve and the gas channel valve s and set gas flow chamber pressure to zero Unthrottle the hivac valve Turn on the ion gauge A CAUTION Do not unthrottle or open the hivac valve while the system pressure is above 200 mTorr to prevent equipment damage A DANGER Use appropriate safety measures for gas type s selected to prevent personal injury or equipment damage KURT J LESKER COMPANY OPERATION MANUAL PVD 75 SPUTTER SOURCE SETUP AND OPERATION All TORUS source designs are
241. nel Magidrive MagiGear DX Micromaze OFHC PBR260 Pinnacle Pyrex Radak FX SmartMotor Teflon TMH261 TORUS co c Viton gt A JJ lt KURT J LESKER COMPANY 3 OPERATION MANUAL PVD 75 SERVICE INFORMATION Prior to contacting KJLC Systems Support for assistance utilize the Troubleshooting procedures provided in the individual system component manuals and this Operator s Manual For Service and support within and after the warranty period contact KJLC System Support North America Phone 800 245 1656 ext 7311 or 7557 Fax 412 384 2745 E mail systemscustomerservice lesker com Europe Phone 44 1424 458100 Fax 44 1424 458103 E mail systemcustomerserviceeu lesker com Asia Phone 01186 21 50115900 Fax 01186 21 50115863 Email systemscustomerservicecn lesker com For all other regions contact North America customer service KURT J LESKER COMPANY 5 OPERATION MANUAL PVD 75 OVERVIEW The PVD 75 System is a versatile value engineered vacuum system which can be configured to suit a variety of thin film deposition applications Standard features include a front loading box chamber turbomolecular pump package and an integrated touch screen control Source flange options include magnetron sputtering electron beam evaporation thermal evaporation and low temperature evaporation furnaces To ensure product reliability the system is built using proven process modules from other st
242. ng speed discussed later These terms seem to describe similar concepts and use identical flow units of volume per unit time But they should not be confused The formal definition of conductance is The ratio of throughput under steady state conservation conditions to the pressure differential between two specified isobaric sections inside the pumping system PRACTICAL INTERPRETATION The conductance of a passive vacuum component e g tube nipple elbow tee valve non cooled baffle etc is a measure of that component s ability to transmit gas molecules from end to end in some given time High conductance is of paramount importance in achieving rapid chamber pump down times and low base pressures One characteristic that determines conductance is the clear diameter of the opening through the component A wide opening offers a bigger target for molecules to enter during their random flights around the chamber and obviously until a molecule enters the component it cannot be transmitted Another characteristic is the number of wall collisions molecules make during their transmission through the component When GAS CONDUCTANCE OF A PASSIVE COMPONENT molecules hit surfaces they are not reflected like light from mirror Rather they stick often for a very short time lose all information about their arrival direction and desorbs following a cosine distribution This distribution gives the molecules an equal chance of heading in
243. nput controls to its programmed Layer Setpoint through all of the Ramp Soak Feed phases This allows temperature or pressure control for example to be maintained through all phases of the layer If Stop Layer is selected control is still maintained at setpoint Pressing Abort Process will set the output to zero Rate Ramps Tab Setpoint ramps can also be programmed for an analog signal Deposition Tab The PID and Shutter Delay controls operate the same as a Sensor input Rate sampling is not possible for analog inputs Condition Tab Conditioning is identical to that of a Sensor input Source Sensor Tab Only Max Power and Slew Rate are functional Errors Only Control Error applies The Analog Input s measured value converted to the defined units and deviation from setpoint are shown below the graph The analog input values are NOT shown on the normal Rate graph the values could lead to poor rate resolution on the graph Instead the analog input voltages are shown on the View Analog graph Volts are displayed on this graph rather than the scaled units again to maintain adequate graph resolution 3 5 2 Edit Films The Edit Films dialog see Figure 3 15 allows you to rename delete and copy films The functions in the tabbed control are identical to those for this film on the Edit Processes dialog NOTE Edits to a Film will affect all processes and layers that use that film Figure 3 15 Film Edit dialog ef Film Edit
244. ns Chart Check with your facilities manager for code specific regulations on power installation and service disconnects and power connection wiring Standard System Power Configurations e Worldwide 200 240 VAC 1 phase 50 60Hz 30 amps e North America 208 VAC 10 line to line and line to neutral 3 phase 60Hz 60 amps e Europe Asia 380 415 VAC 3 phase 50Hz 30 amps d Voltage variations outside this range may cause system alarms or erratic operation KURT J LESKER COMPANY 23 PVD 75 OPERATION MANUAL SYSTEM POWER CONNECTIONS SUPPLIED CUSTOMER MATING SUPPLIED COMPONENTS FLYING HARTING LEADS SYSTEM INSERT DEVICE HOUSING HARTING istributi 09310062701 09300160521 09300160301 30 09000005095 Distribution 09380062711 09300160521 09000005097 208 Distribution 10 09380062611 09300160301 OPTIONAL EQUIPMENT POWER CONNECTIONS Depending on the optional equipment purchased some components may require a separate power drop These items could include cryo pump compressors water chillers and deposition power supplies In these cases the system power distribution schematic and specific component manual should be referenced for requirement details COMMUNICATION Analog Modem Port and or 10 100 Ethernet Port for computer controlled systems RJ type connector is available This connection is required for tool remote support and service COOLING WATER Cooling water is requir
245. ny Click to activate recipe even if the user does not own it Operator The user can only run recipes Iv Operator assigned to Operators IV Process Engineer Process Engineer The user can only run v e M Super User recipes assigned to Process Engineers Super User The user can run amend any recipe KURT J LESKER COMPANY 165 PVD 75 OPERATION MANUAL CWARE STARTUP d Please review the General Information amp Definitions Sections thoroughly prior to operating the system via CWare This section provides general information on how to operate the system using the computer interface Please modify these procedures as necessary to conform to your specific needs The system computer is configured to automatically start KJLC software every time it boots up Additionally if the Runtime software has been stopped for sere maintenance purposes it can be restarted by double clicking the software icon on SEGA the Windows desktop Before starting the software or booting the computer it is generally a good idea to verify the appropriate system components are on and in the correct state i e power supplies on cryo compressors turbo controllers on gauge controller on etc Additionally all gauges should be turned off manually on the system s vacuum gauge controller if applicable prior to starting system software this is to prevent priority conflicts and communication errors between the gauge controller and the system con
246. oe in a S Dc Nobum Nb 248 857 1728 197 2287 Ex W DC Attacks W n 180 thodum Bonde 20 69 eg At e RF Monum Cade 3830 16 F S m RF Nobum inde 3508 Mb ga n a RERFR R evap Nb in 10 T No 238 KURT J LESKER COMPANY OPERATION MANUAL Material silicon 11 Charte CA 217 Silicon IV Orie 307 150 Silicon Selenide Se Silicon Sulide SiS 940 8 KURT J LESKER COMPANY Symbol MP C SD gem PVD 75 emp C for Given Evaporation Techniques Vap Press Torr Thermal Sources LM E Beam Boat Coll Basket Crucible a es Si Eu RF R geng Ss Se Se W e HI 10 244 a 23 60 125 M Q Film mads in air Preheat ganfy to cuyas 6 Ta Mo Q RF Preheat gently lo outgas n 1 559 pl T TY E RF RFR Lise bafle box and bw wap rate n 16 RF Quartz excelientin E beam n 1 544 1 553 RF RF n 1853 239 PVD 75 OPERATION MANUAL RE emp C for Given Evaporation Techniques Wap Press Torr Thermal Sources wi 10 10 E Beam Bost Coll Basket TE Q Silicon Talu de Ses 438 550 Siker Ag 962 5 55 UO Ex W Mo TaMo ADW DC Adhesion poor Use Cr iniedayer Silver B i d 4x l 2 i R Silver Chicride 455 555 o0 Mo Pt Mo Q RF n207 Silver lide 568 4601 wl la RF n221 Sodum Na 98 057 74 14 192
247. oes not matter if the gas is pure N co Ar H or a mixture of all four Later Loschmidt determined that 22 4 liters of gas at 760 Torr and 02 C contain 6 022 x 10 molecules the present day value often called Avogadro s number Since gas fills any volume that contains it its density in g cc units depends on that volume the gas composition and molecular weights of the components If instead of density mass per unit volume we use number density number of molecules in 1 cc we can describe a quantity of gas without knowing anything about composition or molecular weights From Avogadro s number which refers to 22 4 liters we know the number density which refers to 1 cc of any gas at 760 Torr and O C is 2 69 x 10 cm IVIEAN FREE PATH The huge number density at atmospheric pressure and the high velocities of the gas molecules mean that in each cc there are many many gas phase collisions every second Expressed another way even though a molecule travels at high speed on average it travels a very short distance before hitting another gas phase molecule This average distance is called the mean free path mfp For air at 760 Torr the mfp is 6 5 x 10 cm PARTICLE FLUX In addition to colliding with each other in the gas phase gas molecules hit the containing vessel walls and every other surface inside the enclosure The rate at which they hit these surfaces called particle flux depends on the gas s number dens
248. old by it and described on the reverse hereof to be for the period of warranty coverage specified below free from defects of materials or workmanship under normal proper use and service The period of warranty coverage is specified for the respective products in the respective Seller instruction manuals for those products but shall not be less than one 1 year from the date of shipment thereof by Seller Seller s liability under this warranty is limited to such of the above products or parts thereof as are returned transportation prepaid to Seller s plant not later than thirty 30 days after the expiration of the period of warranty coverage in respect thereof and are found by Seller s examination to have failed to function properly because of defective workmanship or materials and not because of improper installation or misuse and is limited to at Seller s election either a repairing and returning the product or part thereof or b furnishing a replacement product or part thereof transportation prepaid by Seller in either case In the event Buyer discovers or learns that a product does not conform to warranty Buyer shall immediately notify Seller in writing of such non conformity specifying in reasonable detail the nature of such non conformity If Seller is not provided with such written notification Seller shall not be liable for any further damages which could have been avoided if Seller had been provided with immediate written notificat
249. on for help amp X Find Existing System User To set a new user just type in the user details The password will be created the next time they log on To reset a password just clear the current one New User Recipe Database Access VB Mainform Access VB Other Access User Log in Name IKJLC v Recipes Iv Operation Iv Operate if Running Recipe SurName KJLC M Recorded Data M System M Can change ANY recipe First Name KJLC Iv Action Log Initials max 3 KIL Iv Interlocks IV Sigma Data Sets Start Form Recipes IV Configuration M Operator Password Iv Process Engineer Clear Password V System Users Iv Super User Delete User This chart defines icons and buttons found on the System Users Screen ICON OR DATA FIELD ACTION RESULT Find This field displays a list of all users with Find Existing System User Click to activate access to the system software in drop E down menu format pt Click this button to create a new software Click to activate New User user using the appropriate boxes below Log in User Log in Name TuS SurName Last Name Click to activate Enter the user s last name in this field SurName JKJLC First Name x p Click to activate Enter the user s first name in this field First Name KJLC Click to activate Enter a user s log in name to log in Initials Initials max 3 KIL Click to activate Enter the user s initials in this
250. or n Thickness Imn Sensor n Frequency on Sensor n Life 2n Analog Input n Voltage 5 8 8 Query Register OR lt paraml gt returns register value in HEX 0 Layer Phase Register 1 Sensor Output Register 2 Analog Output Register 20 Source Index Register 21 Source Index Done Register 22 Relay Register 24 Input Register 25 Layer Index Register 20 Layer Index Done Register 5 8 9 Update Register UR lt paraml gt lt value gt value in HEX 0 Layer Phase Register 1 Sensor Output Register 2 Analog Output Register 20 Source Index Register 24 Source Index Done Register 22 Relay Register 24 Input Register 29 Layer Index Register 26 Layer Index Done Register XXX Any Register IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Chapter 6 Loop Tuning This section will help you adjust your control loop PID parameters to achieve a stable deposition process Keep in mind that there is no best way to determine PID parameters and no one set of settings that are best 1 Setup System Parameters Be sure that the output Full Scale voltage and crystal Min Max Frequency parameters are accurate for your system All Tooling parameters are best set to 100 for now A Period of 25 seconds is also a good starting point Simulate should be OFF Create a One Layer Test Process Create a new process that has a single film as its only layer and select it as the current process Set the
251. ore information on programming your PLC The functions of the internal PLC registers used by the standard SQS 242 program are shown below PLC Register SQS 242 Function 200 Layer Phase Register Bits 0 9 are BCD layer number running Bits 10 15 are BCD Phase as shown below 00 Application Startup 09 ShutterDelay Phase 01 Program Initializing 10 Deposit Phase 02 Not Used 11 Layer Stopped 03 Not Used 12 Layer Starting 04 Process Stopped 13 Not Used 05 Ramp Phase 14 Feed Ramp Phase 06 Soak1 Phase 15 Feed Hold Phase 0 7 Ramp2 Phase 16 Idle Ramp Phase 08 Soak2 Phase 17 Idle Phase 18 Continuous Phase 201 Sensors Outputs 1 4 Register updated each layer Bits 0 7 are sensors used 1 used 0 unused Bits 12 15 are outputs used 12 is Out1 13 is Out2 etc IPN 074 551 P1A IPN 074 551 P1A 202 220 221 222 224 225 226 INFICON SQS 242 Operating Manual Analog Outputs 5 6 Register updated each layer Bits 0 3 are analog inputs used 1 used 0 unused Bits 4 5 outputs used 4 is Out5 5 is Out6 Bits 8 11 are BCD of Output source index Bits 12 15 are BCD of Output 6 source index Source Index Register updated each layer Bits 0 3 are BCD of Output 1 source index Bits 4 7 are BCD of Output 2 source index Bits 8 11 are BCD of Output 3 source index Bits 12 15 are BCD of Output 4 source index Source Indexer Done Flag Bit 0 is Source Indexer 1 12 Indexer Done 0 Not Done Bit 1 is Source Index
252. osition Setting the value to O causes the Y axis to automatically scale to the highest rate displayed 3 5 4 7 Comm Tab The SQS 242 software can be controlled by another computer through an RS 232 or Ethernet connection See section 5 2 on page 5 1 for more details Figure 3 24 Comm tab M System Setup E Chamber Rename New Delete Copy Outputs Sensors Analog Indexers vol Cards Comm Ethernet Local Port Remote Port Mame Mame Baud Rate GARY fason IF Address IP Address 0 0 0128 Receive Data En Transmit Data ee o ooo RS 232 Port Selects the comm port used for serial communications with another computer The Comm Port dropdown box lists available ports INFICON SQS 242 Operating Manual Baud Rate Sets the baud rate used for serial communications Ethernet Ports Local Port sets the TCP IP port used by the SQS 242 software for Ethernet communications 1001 is a typical value 1 for no Ethernet When communications is established Remote Port displays the TCP IP port of the remote computer communicating with the SQS 242 software Ethernet Name Displays the name of the local and remote computers as set in their Windows My Computer dialog box Ethernet IP Address Displays the IP address xxx xxx xxx xxx of the local and remote computers Receive Data Displays the Query and Update requests received from the Comm and Ethernet port See section 5 6 on
253. ot be active unless power setpoint is 0 Figure 2 74 KURT J LESKER COMPANY PVD 75 OPERATION MANUAL Shutters z Platen Control PC Pressure Gas Flow Sigma Substrate Shutter Velocity l Open Setpoint EETA Pioc State mu c3 uz Velocity Fei T S epos utter Dual XTL 1 Shutter RPM o Shas OK OK a ER Thick EE PE Make sure the initial tall tal Power Shutter Shutter i Closed Dee E Power Set point is zero j Latz Volts Amps Ebeam Shutter Crucible Indexer Cru Pos 4n Eer poem ES OFF OFF OFF ERAT OER rPos3 CruPos4 Cru Pos L E r2 EB HV will appear after EB On button has been turned on FIGURE 2 d EB Power Setpoint is in percentage The max amperage for the KL 6 is generally set to 500mA therefore 10 setpoint power is 50mA 4 Increment the power setpoint Emission Current slowly making sure the beam is centered in the pocket Once the material has started its melt open the E Beam shutter by turning the E beam shutter button on Once the material has started to Melt adjust the Setpoint to obtain the required rate of evaporation 5 Once user has finished deposition begin ramp down of power Ramp down KURT J power setpoint by inputting a ramp value as seen in Figure 3 Next the user will input O in the setpoint box LESKER COMPANY 75 PVD 75 OPERATION MANUAL NN E E E Ramp Rate of 1 sec When Power setpoint has reached zero the ramp
254. oves the selected layer from the process and places the layer on the clipboard Copy Layer Places the layer selected in the Layers list box on the clipboard without removing it from the process Paste Layer Inserts the clipboard layer above the currently selected layer in the Layers list box Existing layers are shifted down Paste CoDep Pastes the clipboard layer as a CoDeposition layer at the currently selected layer number Attempting to paste a layer that uses an output already assigned to the selected layer generates an error message HINT To add layers to a process it is easiest to select an existing layer in the layers list then click Copy Click Paste repeatedly to insert several temporary layers Next assign the proper film and layers parameters to each of these temporary layers To change one of the temporary layers to a CoDep layer highlight the temporary layer and click Cut Layer Next click the layer desired for CoDep and click Paste CoDep to assign the selected layer Controls in the tabbed control apply to the layer selected above in the Layers list The Layer and Rate Ramp tabs assign layer specific parameters to the selected layer Note that captions on the Layer tab may change depending on the input and output selections The remaining tabs provide access to the film assigned to the selected layer NOTE Edits to the Deposition Condition Source Sensor and Error tabs will affect all processes and layers that u
255. p AG value CAUTION Disable Auto Mode while adjusting PID parameters Heater On Manual Button T Green Heater On lick Click to activate Gray Heater Off Green Auto Mode Enabled Gray Auto Mode Disabled Heater On Auto Button DEE When Auto Mode is enabled the heater is controlled by the temperature setpoint rather than power Refer to the Operation Heating section for descriptions of heater control icons included on the Heating screen 142 KURT J LESKER COMPANY OPERATION MANUAL dd hh mm c Version 3 30 PC MKS373 Control LL MKS979 OFF iss TST or MKS979 Active Filament Power On or MKS979 Degas On FF MKS979 Enable Set Pont or MKS979 Enable Set Point2 or MKS979 Enable Set Port or MKS979 Protect Set Point or MKS979 Atmosphere Cal or MKS979 Vacuum Cal or MKS979 Enable Control SP OFF bass RS Delay SP Operation System Closed Off ir Set Points MKS979 AF SP K5373 Hist 2 SP MKS979 DAC SP MKS979 Hist 3 SP MKS3783 Emission Curent MKS979 Cal Gas Type M K5373 Unit SP 7 in co L o a v K5979 Set Point 1 M M K5979 Set Point 2 M K5979 Set Point 3 M K5373 Scan Rate K5373 Hist 1 SP Emission Current Set Points 1 Auto 2 100UA DAC Set Paint 1 DAC 2 2 PASCAL m Direction Set Points BELOW 1
256. page 5 2 for a description of the serial communications protocol Transmit Data Displays the response to Query and Update requests received from the Comm and Ethernet port NOTE The Comm tab does not monitor communications with the PLC 3 5 5 Edit Security The Security menu assigns Users their Password and their Access Level It also provides a flexible way to assign program functions to different Access Levels NOTE The Security dialog box is available only to users with Supervisor Access 3 5 5 1 Users Tab Figure 3 25 Users tab M Security Users Access user META Access Supervisor Password IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual User Dropdown box used to select an existing user to edit their Access or Password It is not possible to edit or add a user name in the User dropdown Use the New SoftKey to create a new User Use the Delete SoftKey to delete the selected user Access Assigns a program access level to the selected user Generally speaking Supervisor SUPV provides access to all program functions Technicians TECH have access to a subset of functions While User level access USER has access to only those functions needed to run deposition processes See the Access Tab section to assign SUPV TECH and USER program capabilities Password Each user will typically have their own password When a password is entered a second box will appear
257. pen flow valves Refer to 247 250 manual for proper operation When finished close all system gas valves open the tank or wall supply valve and adjust line pressure to gt 5psig and lt 15psig Verify the system is under high vacuum Turn off the ion gauge Verify proper gas is hooked to system Throttle the hivac valve Open the capacitance manometer isolation valve if applicable Check that the Capacitance manometer reads zero Open the gas inlet valve and the appropriate gas channel valve s and set gas flow chamber pressure to the desired setting This setting usually lies between 1 5 and 15 mTorr for deposition or 100 and 400 mTorr for glow discharge Refer to 247 250 manual for proper operation When finished close the gas inlet valve and the gas channel valve s and set gas flow chamber pressure to zero Unthrottle the hivac valve Turn on the ion gauge A CAUTION Do not unthrottle or open the hivac valve while the system pressure is above 200 mTorr to prevent equipment damage A DANGER Use appropriate safety measures for gas type s selected to prevent personal injury or equipment damage KURT J LESKER COMPANY 49 PVD 75 OPERATION MANUAL AUTO PRESSURE CONTROL 647 1 2 3 4 5 6 7 8 9 10 11 12 13 14 If hooking up the system for the first time or changing to a new tank proceed to step 2 If using a previously used set up go to step 6 Use only clean lines to con
258. peration for further instructions A CAUTION Changes to this screen can damage equipment or cause injury to system users ICON OR DATA FIELD ACTION RESULT Show All Show ALL Hide Skips Click to activate Shows all interlocks Reserved for future use Hide Skips Drop Down List M Export Export Interlocks to XL Click to activate Choose a piece of equipment to see only the Click to activate l interlocks associated with that equipment Exports the interlock data to an Excel spreadsheet KURT J LESKER COMPANY 159 PVD 75 OPERATION MANUAL ICON OR DATA FIELD ACTION RESULT dl SES TER Updates Visual Basic with any changes that Update VB have been made Reorder Items l Renumbers the steps after changes have been Click to activate Reorder Items made 160 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 SIGMA DATA SETS Recipes Sigma Data Sets E l l y X 9 Help Recipes Recorded Data Action Log 34 Interlocks Sigma Data Sets Ow Configuration amp System Users Type a question for help amp x Delete 4 D Export All DataSets to XL Copy DataSet Update VB View Material List Number 3 _ Ceserietion Thermal Al substrate mieten Main Material Al Full Time values marked can be entered in Seconds e g 120 or as hh mm ss e g 1 23 40 Rise Time 1 i Card Output No 3 P 0 9999 3 Soak Power 1 0 Tooling Factor 1 50 0 99 9
259. proximation of the real pumping speed 222 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 EFFECTIVE PUMPING SPEED EPS WHAT Is EPS LOW CONDUCTANCE HIGH CONDUCTANCE port of 4 10 cm internal diameter x 4 10 cm long Calculating the port s conductance from Dushman s table gives 500 L s Pumping speed and conductance are combined to give the EPS in exactly the same way two series conductances are combined 1 EPS So a 500 L s pump and a 500 L s port combine as 1 500 1 500 That is the EPS from the chamber is 250 L s The simplest connection between pump and chamber halved the pump s quoted pumping speed Obviously this is a serious issue and adding a trap or valve to the connection can only further reduce the pumping speed from the chamber Unfortunately all too often we see connections between pump and chamber that are just plain silly For example a 500 L s diffusion pump connected to a chamber by a 0 7 1 8 cm 1 D x 1 42 3 6 cm long tube Dushman s table gives the tube s conductance as 10 7 L s Combining this with the pump 1 500 1 10 7 gives As pointed out above a pump s quoted pumping speed is the maximum value measured under ideal conditions In practical situations a pump is connected to a chamber via a series of passive components such as a tube valve and perhaps a trap Each passive device has its own ability to transfer gas and clearly that ability will affect the f
260. purpose of this section is to provide new tool owners with the information necessary to prepare their facility for their new tool and to ensure the tool start up can go as efficiently as possible Typical required utilities will include electrical power compressed air Nitrogen cooling water and applicable process gases to be used in the system In addition hazardous gas exhaust or other customer specific safety regulations may be required which may not be covered in this manual d It is the customer s responsibility to install this equipment in accordance with current local electrical and mechanical codes in addition to any national regulations KJLC engineers are responsible for the start up of the tool only Equipment unpacking locating and site preparation is the customer s responsibility The customer is also required to prepare all required utilities and make those connections to the equipment Failure to have this work completed will delay the scheduling of start up and training if purchased by KJLC Verification from the customer that all utilities are completed is required before KJLC will schedule the tool start up or service If system start up is purchased connect all utilities but DO NOT turn power on Water and gas may be turned on to the system to check for leaks but do not turn ON any gas or water valves on the system If you did not purchase a start up after all utilities are installed and verified you may initiate startup
261. quence if the system is not already under vacuum as described in the appropriate pumpdown procedure b Close the high vacuum valve c Turn off the turbo pump controller d When the turbo stops close the roughing valve e Turn the mechanical pump off if it is on 4 Ifleaving the system vented a Close the hivac valve b Turn off the high vacuum pump this initiates the AutoVent c Turn off the mechanical pump 5 Turn off the individual branch circuit breakers on the main power distribution box branch breakers are located behind the hinged access panel on the power distribution box 6 Turn off the individual component power switches as required power supplies turbo controllers etc At this point the system is at shut down Power can now be removed from the whole system or any of the system components Refer to the manufacturers manuals to make sure that all equipment is in a safe mode KURT J LESKER COMPANY 113 OPERATION MANUAL PVD 75 SOFTWARE OPERATION CWARE OVERVIEW The Kurt J Lesker Company CWare HMI Human Machine Interface consists of two components e System Database e Runtime Software Together these two components give the system operator an interface that provides capabilities such as e Process automation e Process recipe creation e System status e Manual control of the system e Datalogging e Alarms e Password protection e Interlocks e Offline process editing Th
262. quoted this way in some literature collections To transform rates in W m into Torr L cm s divide the former value by 1 333 2 OUTGASSING SOURCES Surfaces are active places that absorb gases and vapors to reduce the unfulfilled bonding forces of the surface atoms This means that all surfaces no matter what material is under consideration outgas under vacuum Some of the worst materials are plastics elastomers and glues porous ceramics and porous metals lubricating sealing or heat transfer greases and us fingerprints hair skin cells dust mites spittle droplets when talking and food The most common gases vapors outgassing from surfaces are water vapor oil and grease vapors solvents and volatile organic materials and when approaching ultrahigh vacuum pressures hydrogen and carbon monoxide from stainless steel used in the chamber s construction REDUCING OUTGASSING As stated above nothing can be pumped from the chamber until it is in the gaseous phase The outgassing rate is reduced by methods that cause adsorbed gas vapor to enter the gaseous phase e Heat baking the chamber increases the desorption rate of the gas vapor e Light intense short wavelength UV breaks bonds between surface and adsorbed gas vapor e Plasma active plasma products break bonds and react with adsorbed gas vapor forming more volatile compounds e Chemistry reactive chemical vapors convert adsorbed water into HCI very limited util
263. r turn the Setpoint Adjust Knob until the discharge current is at its maximum reading as indicated on the Discharge Amps display From the KRI Auto Controller press the white Enable Standby Button to Enable From the KRI Filament Controller press the white Enable Standby Button to Enable From the KRI Discharge Controller press the white Enable Standby Button to Enable From the KRI Auto Controller adjust the gas flow using the Gas Adjust Knob until the discharge voltage is approximately 2 5 amps as read from the KRI Discharge Controller Operate the on source for at least 10 minutes to clean any contaminates from the ion source that may have been introduced while at atmosphere KURT J LESKER COMPANY 103 PVD 75 21 OPERATION MANUAL The discharge voltage as read from the KRI Discharge Controller will vary slightly during this time Adjust the gas flow from the KRI Auto Controller after the 10 minutes to obtain a discharge voltage of approximately 2 5 amps as read from the KRI Discharge Controller d At this point the operating conditions can be saved as a program on the KRI Auto Controller to be used later in the Manual Gas mode 22 23 To save this program first press the white Program Select Button located on the KRI Auto Controller repeatedly until the desired program number is selected as indicated by the numbered red LED s From the KRI A
264. r brittle wire Wedge Tool on internal wires sleeving must be replaced mE Verify wire connections and Retracted limit switch The interlock must be y a WM replace wiring or the switch if triggered when the wedge tool is retracted required Verify wire connections and Substrate mask touching wedge interlock d M wor replace wiring or the switch if switch required Cleanliness of Teflon guides Clean all motion surfaces Wide Range B Atmosphere reading Refer to manufacturer s manual Gauge Atmosphere reading When the chamber is vented to atmosphere the vacuum switch E Vacuum wn Verify wire connections and should not indicate a vacuum level Once the MD Switch replace switch if required chamber is pumped down the vacuum switch should then indicate a vacuum level KURT J LESKER COMPANY 189 PVD 75 OPERATION MANUAL ORGANIC MODULES COMPONENT INSPECT FOR COMMENTS Deposition build up or flaking on shutters Bead blast to remove build up source covers and chimneys vacuum wash and dry thoroughly Check for a short to ground or l contact between thermocouple Thermocouple operation Assure the l E D E BOOM wires throughout the internal pray B B routing of the wires Check for an temperature e Sources open circuit on the source base and feed through Check for a short to ground Check Heater operation for an open circuit on the source base and chamber Check for cracks and replenish Crucible condition materi
265. r slightly less is a good value for Ramp 2 Power This will eliminate a large step change when entering the deposition phase Once PID terms are established for a material they will typically be similar for other materials Only the P Term and preconditioning power levels may need adjustment IPN 074 551 P1A
266. ran is particularly valuable during system re design The existing system s measured pump down characteristics determine the real gas load which is used for the model The designer then makes the proposed design changes on the model and re runs pump down iterations Since the model s gas load reflects reality the calculated results closely parallel real world experience when the re design changes are made If you have a one time question to which VacTran can be applied try our Tech Info service at techinfo lesker com and we may be able to help If you are facing vacuum design issues that involve a number of what if conditions we urge you to buy this program But note successful computer modeling depends on the nature of the problem and the operator s understanding of vacuum technology SLOW PUMPDOWN At techinfo lesker com a frequently asked question runs along these lines Pumping from atmosphere to 1 x 10 Torr is taking over five hours What s the problem Obviously there is no hope of answering without a long assessment that could easily be made by the questioner e Given the chamber s volume cleanliness pumps used conductance from chamber to pumps is a pump down time of lt 5 hours reasonable e ls this the first time the chamber has been pumped down e Does it take five hours for every pump down e Has the time slowly increased e Has the time suddenly increased Let s examine each of these questions 228 KURT
267. rn off the ion gauge Throttle the hivac valve Open the gas ring valve Initiate gas flow and set gas flow chamber pressure to desired setting This value usually falls between 1 5 and 15 mTorr Refer to Gas Flow Setup and Operation procedure for further details Turn on the bias power supply Refer to power supply manual Turn on the bias power supply output Set bias output power level When finished turn off the supply and reset the output to zero Shut off gas flow Close the gas ring valve Unthrottle the hivac valve Once chamber has achieved proper crossover turn the ion gauge on A CAUTION If running RF verify plasma on platen by noting a bias voltage on the matching network to avoid injury or equipment damage Use caution when removing substrate from chamber it may be extremely hot Do not touch any connections while power supply is on KURT J LESKER COMPANY 47 PVD 75 OPERATION MANUAL GAS FLOW SETUP AND OPERATION The following section describes system pressure control options Refer to applicable procedure for operating instructions MANUAL PRESSURE CONTROL NEEDLE VALVE 1 2 3 4 5 6 7 8 9 10 11 If hooking up the system for the first time or changing to a new tank proceed to step 2 If using a previously used set up go to step 6 Use only clean lines to connect gas to the system Purge the gas lines while connecting Pump down the system Pump out the gas supply lines
268. rocess that take place while the ion source is running 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 From the GUI Gas screen turn the lon Source Gas Valve on Turn the KRI Auto Controller on via rocker switch manually Turn the KRI Filament Controller on via rocker switch manually Turn the KRI Discharge Controller on via rocker switch manually Place the KRI Auto Controller in Local Mode Place the KRI Filament Controller in Local Mode Place the KRI Discharge Controller in Local Mode From the KRI Auto Controller change the Operating mode to Gas Only From the KRI Auto Controller select Gas 1 using the white Gas Channel Select Button From the KRI Auto Controller turn the Gas Adjust Knob until 15 sccm is displayed on the SCCM display From the KRI Filament Controller turn the Emission Adjust Knob until 2 7 amps is indicated in the Emission Amps display Note that the filament emission is usually set equal to or up to 10 greater than the discharge current From the KRI Discharge Controller use the white Select button to select Volts From the KRI Discharge Controller turn the Setpoint Adjust Knob until the discharge voltage is set to 150 volts as indicated on the Discharge Volts display From the KRI Discharge Controller use the white Select button to select Amps From the KRI Discharge Controlle
269. rottle Turn_Off Closed Closing 34 l Valve PC High Vac Valve Check_On Open AT LI E oe T Step 1 Always the first step in a recipe sets which Abort Recipe should be run in the event a check step that has an AT Abort on Time fails Step 2 Waiting for a desired base pressure before deposition will begin In this case 5x10 6 Torr Steps 3 4 Sets high vacuum valve to throttle position Steps 5 8 Set up process gas to a pressure required to strike a plasma Steps 9 11 Start up substrate rotation Steps 12 15 Start running sputter source Steps 16 17 Reduce gas pressure to required process setting if necessary Steps 18 23 Pre sputter and film deposition Steps 24 27 Shut down sputter source power supply Steps 28 32 Stop substrate rotation and turn off process gas Steps 33 34 Set High vacuum valve throttle off 58 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 RF SPUTTERING 1 2 3 4 5 6 7 8 9 10 Pump down the vacuum chamber to high vacuum The choice of base pressures is the decision of the user and determined by acceptable impurity levels Select the Vacuum screen Set high vacuum valve to throttle position see Figure 4 Select the Gas screen Open source gas valve or gas injection valve depending on system configuration see Figure 6 Set MFC1 mode to 4 Set Capman pressure set point to 10 mTorr Wait for chamber pressure to stabilize Select the Deposition screen Turn on
270. rrent action of the running recipe Running Recipe VYAITINGS FOR Counterl Check Value gt 90 2 RECIPE DIALOG BOX 5 The recipe can be aborted at any time by right clicking the top half dark red and selecting abort This will run the Abort Default recipe or the Abort recipe assigned to the recipe See Standard Recipes KURT J LESKER COMPANY 169 PVD 75 OPERATION MANUAL WRITING RECIPES 1 On the Recipe screen click New in the upper left corner 2 Type a name in the white box next to Name 3 Check the Include in VB List box so that the recipe will be available from the Runtime Software 4 Click on row O in the Equipment column and then select an equipment option from the drop down menu 5 Tab to or click on the Equipmentitem column and select an option from the drop down menu The contents of this drop down menu are dependent upon the chosen equipment from step 4 above 6 Tab to or click on the EquipmentltemOperation column and choose the desired action 7 Inthe last column Equipment Test Value enter the time or pressure relevant to the chosen action 8 The column labeled GRST allows for Goto sequence number Ramp rate Skip or Timeout steps 9 Repeat steps 1 through 8 for each recipe step You cannot move to the next recipe step until the current one is complete 10 When all steps of the recipe are complete click on the Update VB button to save the recipe This will make the recipe appear on t
271. s Relay 9 Input 1 Input 7 Relay 10 Input 2 Input a Relay 11 Input 3 Input 8 Relay 12 Input 4 Input 10 Relay 13 Input E Input 11 Relay 14 Input B5 Input 12 Relay 15 Relay 16 Relay a P a a a A a Comm Pon Address Jee Comm e O Set Clear Clear All gb E 7 2 CPHIT 2 Relay Events The relay events dropdown box lists the deposition events that can cause a relay output to be activated To assign a deposition event to a relay click the Relay then select the desired event from the dropdown box As you click each Relay the dropdown will change to show its currently assigned event A description of each relay output event follows Source Shutter 1 to 6 Relay 8 These relays control the Shutter that covers your deposition source At the beginning of the deposit phase the relay will close its contacts When the deposit phase finishes the shutter relay contacts open Sensor Relays 1 to 8 These relays control sensor shutters Their function depends on whether you have single or dual sensors If Dual Sensor is not selected i e a single sensor the relay contacts close when Shutter Delay phase is entered on a layer with the sensor enabled As an example let s say you have sensors 1 and 3 enabled for Film 1 and sensors 2 and 4 enabled for Film 2 When you start Film 1 Shutter Delay phase the contacts for Sensor Relays 1 and 3 will close When you start Film 2 these contacts open and the contacts for
272. s reached deposition is stopped for that layer and the feed hold phase is entered Time EndPoint Sets an arbitrary time after deposition begins when the time setpoint relay is activated During 9o Power and Analog Input deposition it also sets the length of the deposition cycle Thickness EndPoint Sets an arbitrary thickness that activates the thickness limit relay Auto Manual Continuous Start Auto Start begins the next layer automatically upon completion of the previous layer Continuous ignores Conditioning phases and controls continuously at rate setpoint see Analog Inputs If Manual Start is selected the previous layer ends at its idle power and waits for the user to push the Start Layer switch An optional User prompt can be entered for Manual Start layers This feature can be disabled by editing ShowPrompts in the SQS242 INI file NOTE The following parameters are common to all of the films in a layer In the previous dialog box shot for this section both layer 1 1 and 1 2 would share common values for the following parameters Layer 2 1 could have different values System Setup System setup assigns outputs to their controlling sensors called sensor mapping It also determines which physical sensor and output connections are displayed on the main dialog box See section 3 5 4 Edit System for detailed system setup information Source Index Assigns each film to a specific source indexer pocket one of 16 values E
273. s a null modem cable In the SQS 242 program select the Edit System menu then the Comm tab Set the Comm Port to match the serial port the cable is connected to on the other computer Set the baud rate to match between the host computer and the remote computer Communications format is No Parity 8 bits 1 stop bit 5 3 Ethernet Interface Connect a cable from the Ethernet card to your Ethernet network In the SQS 242 program select the Edit System menu then the Comm tab Set the Ethernet Port to 1001 and the Ethernet name to the Network name or IP Address of the computer you wish to communicate with Enter a 1 for the Ethernet Port to disable the Ethernet functions 5 4 ActiveX COM Interface Any program that supports Microsoft s COM ActiveX interface i e Lab VIEW etc can communicate with the SQS 242 program A small ActiveX interface program SQS242X EXE provides receive data and transmit data entry points to the global cComm242 class Contact INFICON for examples in other languages and detailed technical information INFICON SQS 242 Operating Manual 5 5 SQS 242 Comm Program SQS 242 Comm found on the SQS 242 CD ROM is a simple Windows program to demonstrate SQS 242 communications concepts With SQS 242 Comm you can easily send commands to and read the responses returned by the SQS 242 program 5 5 1 Setup for RS 232 or Ethernet In the SQS 242 program select Edit System and set the RS 232 or E
274. s can be viewed in Notepad by clicking the View button NOTE To avoid delays in data acquisition DO NOT log data to a floppy disk file Instead save to the hard disk and transfer the files to a floppy disk later Events to Log A number of events can trigger a data entry in the log file End Deposit Phase records process data rate thickness time etc at the end of each layer s deposit phase Similarly End Each Phase logs data at the end of each phase conditioning depositing etc l O Events logs data each time an external digital input or output changes Timed logging records data at the selected time intervals throughout the process Click the Sensors box to include individual sensor data in addition to the normal film based data Click Analog Inputs to also log that data Finally click Readings to log every reading from the SQM 242 card s The file will be saved in the application directory with a name in yymmdd log format That is readings logged on January 15 2011 will be saved as 110115 log NOTE This file can grow quite large and cause Windows to slow significantly Typically the Timed option is a better choice unless you must record every reading When Readings is selected a reminder dialog box appears each time the SQS 242 program is started IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Format There are two formats for writing data If Spreadsheet is selected each entry
275. s for other pump speeds and gases can be found in the lon Source Manual Note that the operating range of the ion source may be limited by the vacuum facility pump speed or other process that take place while the on source is running 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 From the GUI Gas screen turn on the lon Source Gas Valve Turn On the KRI Auto Controller via rocker switch manually Turn On the KRI Filament Controller via rocker switch manually Turn On the KRI Discharge Controller via rocker switch manually Place the KRI Auto Controller in Local Mode Place the KRI Filament Controller in Local Mode Place the KRI Discharge Controller in Local Mode From the KRI Auto Controller change the Operating mode to Gas Only From the KRI Auto Controller select Gas 1 using the white Gas Channel Select Button From the KRI Auto Controller turn the Gas Adjust Knob until 10 sccm is displayed on the SCCM display From the KRI Filament Controller turn the Emission Adjust Knob until 2 7 amps is indicated in the Emission Amps display Note that the filament emission is usually set equal to or up to 10 greater than the discharge current From the KRI Discharge Controller use the white Select button to select Volts From the KRI Discharge Controller turn the Setpoint Adjust Knob until the discharge
276. s in vacuum gauge calibration room temperature pumping speed backstreaming from the pump etc mask or counter any real pressure reduction and the chamber appears to have reached a steady state Often what happens is the operator pumps the chamber for a few hours grows tired of waiting and claims the chamber is at base pressure This is not necessarily wrong After all if the pressure falls from 5x10 Torr to 4x10 Torr by waiting another ten hours is all that much gained Perhaps it doesn t conform to formal definition but in a sense the base pressure is reached whenever the operator says it is and starts using the chamber WORKING PRESSURE The term base pressure defines conditions where no gas is deliberately flowing into the system But sometimes the chamber is first pumped to its base pressure to check for leaks or remove contamination and then back filled with a gas to an intermediate pressure This is how processes such as sputter deposition plasma etching and CVD are done This intermediate pressure is called the working pressure To establish and maintain a working pressure it is rarely sufficient to just close the pumping port back fill with gas and walk away Most back fill applications require a flow of fresh gas to sweep away contaminants desorbing from the chamber walls Often the back fill pressure is stabilized with a feedback control system KURT J LESKER COMPANY 215 PVD 75 OPERATION MANUAL Pressure Fract
277. s to functions for building deposition processes configuring the hardware for your vacuum system and data display SoftKeys The six switches to the left of the display are used for the normal operation of the instrument and to navigate the setup programs see below for the individual switch functions Just move the cursor over the key label on dialog box and single click the mouse You can also use the keyboard F1 to F6 function keys to simulate the front panel function switches The SoftKeys change during operation to address different user input requirements NOTE The current process must be stopped for the File menu to be available 3 4 1 File Process Used to select a process from a list of all processes in the current database If the process selected is different than the current process you are prompted to confirm the change IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual 3 4 2 File Open and Save Database Open Database Selects a process database to be used for deposition Remember a single process database may contain an unlimited number of processes films and materials See Figure 3 6 Figure 3 6 Open Database File dialog Open Database File Look jn Cx vb Al el ez e SID 142 mdb 2210 mdb File name 510142 mdb Files of type Database files mdb sl Cancel Z Save Database As Saves the current process database to disk under a different name This is useful
278. se the selected film INFICON SQS 242 Operating Manual 3 5 1 1 Layer Tab Figure 3 9 Layer Tab al Process Edit Sample SES Rename Delete Copy Layer Out Film c etFt Thickness Time Gold Sample 10 Cut Layer oilver Sample 15 Gold Sample Copy Layer Paste Layer Paste Collep Layer RateRamps Deposit Condition Source Sensor Errors Film Output Input Gold sample Output 1 Sensor s c etPt Final Thick o EndFt EndFt c stem Setup kA s Auto Start Indexers Continuous cnurce Substrate Iser Iserz amp Manual None None None None Index Index Index Index Film DropDown Box Assigns a film to the selected layer A film is basically a Material plus the other settings shown on the Deposit Condition Source Sensor and Error tabs Output DropDown Box Selects the output that is used for deposition of the selected layer s film A particular film often uses the same output i e a thermal boat or E Beam pocket NOTE Due to the way outputs are stored in the process database the physical output number not its name is listed in the layers listing Outputs 1 and 2 refer to the first SQM 242 card outputs Outputs 3 and 4 refer to the second SQM 242 card outputs if installed Outputs 13 and 14 are the SAM 242 card outputs if installed Input DropDown Box Selects the input used to measure and control deposition of the selected
279. sembly i Assure proper alignment and Loose cassette clamping bolts RSR 8 tighten Remove all particulate and wipe internals with isopropyl alcohol and lint free wipes If any Chamber Cleanliness debris or particulate internals require additional Internals bead blasting or mechanical cleaning those parts must be properly vacuum washed and dried prior to re installation Deposition build up or flaking on substrate and Platen mask shelves Replace cracked or damaged O rings Remove contaminated O rings and clean with isopropyl alcohol and grease with Payson Scratches particulate or wear L vacuum grease Marred sealing surfaces must be corrected via the appropriate mechanical means such as hand polishing or machine resurfacing Broken or coated bulbs Replace bulb Bake out and Illumination Conductive coatings on the ceramic insulators Lamps If coated with a conductive film the bulbs can Replace ceramic insulators short out O rings Sealing Surfaces 186 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ALL MODULES COMPONENT INSPECT FOR COMMENTS Manufacturer s recommended maintenance Refer to manufacturer s manual Securely inserted crystals and proper crystal If no signal is being displayed sensing It is recommended to then check continuity of the replace the crystal when lt 30 of its life is cable and the oscillator Replace Film reached crystal Thickness Bead blast to remove build up Monitors
280. stalled in multistory buildings other types of grounding electrodes permitted by applicable regulatory codes can be used i e building structural steel or designated electrical ground points provided the resistance specification is still met A DANGER Braided wire has high impedance to radio frequency Do not use braided wire for grounding connection Use the copper conductors indicated below DISTANCE CONDUCTOR O 20 feet 0 6 meters 4 AWG 5 19 mm wire 20 60 feet 6 28 meters Copper strap as described below over 60 feet over 28 meters Consult KJLC personnel Recommended copper strap for Earth Ground KJLC PART NUMBER DESCRIPTION RSHUCO1324 0 032 X 2 5 INCH 1 MM X 6 5 CM COPPER STRAP 8 FT 2 5 METERS KURT J LESKER COMPANY 21 PVD 75 OPERATION MANUAL EARTH GROUND INSTALLATION If possible dedicated grounding electrode s should be installed The electrodes should be 4 inch 2 cm diameter copper rod or pipe driven 8 ft 2 5 meters into the ground no less than 6 ft 2 meters apart located as close to system as possible Bonding jumpers between the electrodes should be copper strap as listed above Measure the resistance between the two ground rods using an accurate resistance bridge Add salt water or copper sulfate to the earth to lower the resistance to one ohm See Figure 3 for illustration of grounding electrodes Grounding connection to the deposition system should follow KJLC wiring diagrams and shou
281. stem Database and is used to navigate throughout the database Each button opens a new screen with a different set of information or data COMMAND BUTTONS Recipe Database Hun Recipe Start PC Pump Start PL Vent Start LL Pump Start LL Vent Start Transfer ne ien Recording Stark Command Buttons appear on all Runtime Software screens and are used to run pre programmed processes as well as user selected processes In addition to standard Command Buttons additional custom buttons are available to be configured by KJLC upon customer request The number of custom buttons available depends upon system configuration KURT J LESKER COMPANY 125 PVD 75 OPERATION MANUAL OPERATION VACUUM SCREEN 1 8E 4 10 07 40 AM 2 12 2007 Operation Vacuum Cop ght 2 x Kurt J Lesker j Logout KJLC tJ Company 0 00 02 Closed Off E Super User ABORT Version 3 04 Deposition Gas Heating Cooling Motion MKS979 OFF PC Door Lock LOCKED PC Pfeiffer Turbo Pump Speed SP PC Vent Valve ma a Ge Turbo Pump PC AT SPEED PC High Vac Valve Start PC Pump Bec PC High Vac Throttle Start PC Vent Xn ae Start Turbo Pump Valve Vent y rar im PC Roughing Valve Recording Start Roughing Pump Operation System Help d The chamber representations appear white while at atmosphere and get darker as the Ji pressure in the chamber decreases The Process Chamber above is at high
282. system setup It is a graphical display of the Rate column of the Sensor Readings dialog box Analog Graph If an SAM 242 analog input card is installed this graph shows the voltage readings from each analog input assigned to a system setup Automatic Changes the main graph to display the most pertinent information for each deposition phase During preconditioning output power is displayed During shutter delay rate ramps and deposition the main graph displays deposition rate During feed and hold phases the graph reverts to output power NOTE To alter the appearance of a graph right click anywhere on the graph Use the Graph Property Page dialog box to alter the graph to your preferences To permanently save the changes click the Control tab the General tab then the Save button Save the graph setup to the appropriate OC2 file for the graph you are modifying High Resolution When this option is checked rate is displayed to 0 01 A s and thickness to 0 1kA This can be useful for low rate applications but annoying for moderate rates The SQM 242 card resolution for PID control is unchanged 3 Software Specifications Display GraphS tan oe radial bas ee ed Rate Deviation Power Readouts Rate Dev Thick Power Name 12 characters INFICON SQS 242 Operating Manual ProceSS S 00000 eee Unlimited LAYEIS 1 eee Unlimited FilMS end on Wee Be ae ae Unlimited Rate Ramps
283. t Events The input events dropdown box lists the deposition events that can be caused by an external digital input To assign a deposition event to an input click the Input then select the desired event from the dropdown box As you click each Input the dropdown will change to show its currently assigned event A brief description of each input event follows Start Process Input Triggering this input is the same as pushing the Start Process button Abort Process Input Triggering this input will abort the process Start Layer Input Triggering this input will start or restart the current layer Stop Layer Input Triggering this input will stop the current layer Start Next Layer Input Triggering this input will skip the current layer and start the next layer Zero Thickness Input This will zero the thickness It is identical to pressing the Zero button Force Final Thickness Input Triggering this input has the same effect as reaching Final Thickness setpoint Comm Port Selects the serial port used to communicate with the PLC The Comm Port dropdown lists available ports However some ports may be used by other devices modem mouse etc Select Disabled to prevent I O from using the PLC INFICON SQS 242 Operating Manual The communications parameters baud parity bits stop are shown below the Comm Port dropdown The baud rate can be changed in the SQS242 INI file see section 3 8 Address Severa
284. t rato da 11 Sae Guidelines pd cis 12 Site Prepara ION iii 15 Receipt Te e d Le aii Lin GOV Roa EAR ANN EE E RR RA 16 UNC UNS ROTE ENTE 17 Installation e E ECH LCE 19 Environmental Conditiahis isa oi 19 Grouname uste Misas 21 Electrical GrOUN G E 21 Bug ee o TE E A OOO 21 Earth Ground Instala cerei lld 22 Grouncsing Manten le EE 22 Utility eet el CH 22 leede 23 Standard EELER 23 SEET 24 Optional Equipment Power Connections eene 24 COMMUNICATION siria 24 Cooling Waters ande 24 REC Caller COMPONENTS scada a ad tt 27 Compressed Air pneumatics eoe di 27 Pheurnatic CONTO ti a iS 27 AER 29 POCOS Ga CT 30 Exhaust CONMCCLION Si is 31 Cl UD WE 33 EISES HEIEREN 35 Manual ODeratioD zc nnde eie e Uie adas 35 Pulnpdown Procedure EE 36 Cryopump with Load Lock Chamber 36 Cryopump without Load Lock Chamber 37 Turbo Pump with Load Lock Chamber 38 Turbo Pump without Load Lock Chamber 39 Vent Procede 39 TurDo Pub Vell EE 39 Edad Lock Ventanas pera beber pcr e aaa 40 T rbo without Load Lock Ventana tidad Eh deus 40 Turbo and Cryo Pump with Load Lock Cryo Pump without Load Lock Vent 40 Process chamber EE 41 Load Lock Chamber EE 41 Cryopump Regeneration Procedure eene nnns 42 Pneumatic valve Panel e e E 43 Sample Transter Procedures cs 43 Sana SOSA Proa 43 Sample ele allt St 44 Zot Setup and ODSEFdlOb EE 45 Sample Heating Setup ANd Operation 46 Substrate Shutter Setup and Operation 46 Manual Substra
285. te Shutter Procedure enne 46 Manual Pneumatic Shutter Procedure scccsssscssssressssseccsesscncussescscssenensrens 46 Sample Bias Setup and Operation 47 Gas FOW Setupand Operation ari iaa 48 Manual Pressure Control Needle Valhvel 48 Auto Pressure Control 247 2500 49 Auto Pressure Control 647 liinda EE ee ei 50 Sputter Source Setup and Operation sccccsccccscscccceccccsccccscecceccccsceccececcsceccccscecees 51 EE 51 Se E SE System Equipment Reouirements NENNEN SE Manual Operation through Cware ccoocccccnccnnonocononaconcnnncononarononaronnnnnnnnonaronenaronenanonos 54 DESPUES 54 3 Position High Vacuum Valve System 54 Variable Speed Turbo Pump System No High Vacuum Valve 55 sc elen LE 59 KT EE E TT 63 Cleaning and Manege 65 E Beam Source Setup and Operation eee RENE esee eee nennen RER E RE 65 SE 66 GEET 67 Shutter speed AdIUstmellt eege 67 Shutter Be lee EE dE EE 68 System Equipment REQUIFEMENKS cccccscccsscesccesccesccsccsecesecesecesecesecasetseeeseeesees 68 Water FIoW SensOFS succedit aunt ulti du coi addon aue eq abn ote ta cto UD D a LEE 69 eis glo We Tu e EE 71 External COVEN SWECO S vest ee tees AS AA AAA 71 Opera 73 KEG e le NE NC E 74 265 MOdeL EX3tmiple ensis poesie tese tack E 79 Abort if Timeout and GOTO Setup 83 Material e E EE 85 Cleaning ana Mamtenance EE 85 Ella ETE T DU T UU IUE 85 LTE HTE Furnace Operation
286. ter channel is set such that the desired gas composition is maintained PRESSURE CONTROL The software uses closed loop PID control to accomplish upstream pressure control When a given MFC is assigned to pressure control mode the software adjusts that MFC s flow rate setpoint accordingly based on the desired pressure setpoint and the actual pressure reading supplied by the capacitance manometer If any additional channels are slaved to the pressure control channel then their flows will also be adjusted respectively 134 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 MOTION SCREEN 4 2E 8 11 58 00 AM 12 15 2005 x rt Lesker Logout KJLC Kurt J Le company 0 00 01 Closed Off Es Super User ABORT Vacuum Deposition Gas Motion Cooling Heating Platen Motor Velocity Errors On D RPM lo Acc Texti 1 Recipe Database Max Text H Offset Velocity SP Referenced F E Run Recipe ome Tet Tei n Je p JText Drive Motor Continuous Jog Cont z A mms Velocit Moving EN Text2 o Fwd Reset Start PC Pump Start PC Vent GoTo Velocity Du Pos Set Point SE Text3 190 0 Texts Start LL Pump Start LL Vent Start Transfer afer AERE TEE EET Recording Start Operation System Help d Additional icons appear on the Operation Motion screens for systems equipped with oi automatic transfer Please disregard descriptions for icons not included with
287. the lifted system or serious injuries could occur 8 Before placing the system on the ground insert the all thread removed in Step 5 into the mounting pads on the underside of the system frame Once the all thread is fully inserted install the leveling feet onto the all thread 9 Gently place the system on the ground Any damage to the system or its components incurred during un crating should be reported to KJLC immediately d Shipping bolts may be installed on the chamber door or chamber top plate These bolts must be removed prior to opening the door 18 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 INSTALLATION CONSIDERATIONS When moving the tool to its new location it is important to consider passageways doorways and floor loadings to allow easy and safe handling of the equipment The height and width of the system varies depending on the platform and configuration purchased Therefore the tool General Assembly schematic should be referenced for approximate dimensions It is highly recommended that the path intended to be used when moving the equipment from the uncrating area to the final location is checked for height and width limitations specifically dimensions of doors elevators and corners d The General Assembly schematics only show major components and may not indicate items such as cables plumbing connectors or brackets that may extend outside of the referenced dimensions Therefore contact KJLC if the
288. the process chamber convection gauge Refer to gauge controller manual for convection gauge operating instructions Turn on the load lock turbo pump When the convection gauge in the process chamber is below 200 mTorr close the load lock isolation valve wait for it to close completely and open the hivac gate valve to the cryo pump Wait for 10 seconds and when the pressure on the convection gauge is lt 1 0e 3 Torr turn on the on gauge Refer to gauge controller manual for operating instructions At this point the vacuum system is under vacuum and ready for use Refer to individual component manuals for operation of gas flow equipment and gauging equipment 36 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 CRYOPUMP WITHOUT LOAD LOCK CHAMBER 1 2 3 4 5 6 7 8 9 10 Verify all connections to system are made Power water process gas vent gas and vacuum connections to mechanical pump should be checked Verify that the cryo pump is cold and ready for use lt 20K If not refer to the Cryo pump Regeneration procedure Refer to the On Board manual for On Board cryo pump regeneration procedure If operating the system for the first time open the capacitance manometer isolation valve if installed and any gas isolation valves Start the system roughing pump and verify that the foreline pressure is less than 1 Torr Open the roughing valve Rough the system to approximately 200 mTorr as
289. thernet settings as detailed in the previous sections Load the Comm program on a computer the host and connect an Ethernet or RS 232 cable between the host and the computer running the SQS 242 program Start the Comm program on the host computer then select the Utility tab Set the Comm Port and Baud Rate for the host computer or select Ethernet and set the Ethernet Port typically 1001 5 5 2 Setup for Active X Control Load the Comm program on the same computer that is running the SQS 242 program Start the Comm program then select Active X on the Utility tab Start the SQS 242 program but minimize it or bring the Comm program to the foreground 5 5 3 Communicating with the SQS 242 Program In the Comm program Utility tab click the Version button under the SID 242 Controller heading Click Send to send the query to the computer running the SQS 242 program The response from the SQS 242 program should show in the Comm program Response window A typical response is QU ACK 3 2 9 32 which indicates software version 3 29 The next section describes the Query Update and Response strings in detail The transmissions to and from the Comm program will also show in the SQS 242 Edit System Comm Receive Data and Transmit Data windows 5 6 Protocol SQS 242 commands fall into two categories Query commands request data from the SQS 242 program Update commands update a setting or instruct the program to take an action The
290. ticulate and engaged with rotating surfaces through the replace all worn components full range of motion Components should be properly cleaned or replaced If any l E internal power connections Electrical shorting to ground or signs of arcing Ge require additional bead blasting Deposition of conductive coatings can cause l Internal l or mechanical cleaning those shorting of internal connections Power parts must be properly vacuum Connections washed and dried prior to re installation Damaged insulators Ceramics or wire insulation must remain intact to ensure proper system operation Coated insulators Debris in F T s Particulate and debris can cause shorting across electrical posts in F T ports Broken ceramics or brittle wire sleeving must be replaced All coated ceramics must be cleaned or replaced All particulate and debris must be removed Bead blast to remove build up vacuum wash and dry Gas Ring Deposition build up or flaking thoroughly All gas inlet holes must be free from particulate such as bead blasting media 188 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ALL MODULES COMPONENT INSPECT FOR COMMENTS Bead blast to remove build up Deposition build up or flaking vacuum wash and dry thoroughly Installation of the blade The blade must be parallel to the substrate through its range of Adjust blade motion Signs of damage arcing or broken insulators Broken ceramics o
291. tion and system configuration details SYSTEM I O system nputs Outputs I O refers to the electronic hardware controls for a system Inputs are typically device signals that provide system status or feedback Examples of Inputs include flow switches vacuum switches valve positions pressures and motor speeds Outputs are typically device signals that provide system control or manipulation Examples of Outputs include pumps valves flow setpoints and power supply setpoints UPSTREAM PRESSURE CONTROL MODE method of pressure control whereby effective pumping speed is held constant i e fixed position throttle valve and gas flow is varied to achieve a desired pressure The point of gas introduction is referred to as being Upstream relative to the means of pumping 118 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 SECURITY KJLC CWare security is managed with a user name and password approach Ideally one or two people should be assigned to manage the system security The System Administrator s will need to assign a login name for each person that will operate the system using the computer interface Each login name will be assigned parameters that dictate that user s access to the software The System Users Screen is used to administer this information and is accessed through the System Database 1 On the Operation Vacuum Screen click the Recipe Database button 2 Click the Systems Users button on the topmost too
292. tion Equipment Test Value GRST fault Goto Sequence No if 999 999 Abort if Timeout alue lt n nn 00005 AT Timeout Closed Closing SkipRecipeltem a Close Open Opening Ramp Units sec Closed Closing Motes not for Ts Open Opening e n nn 0 Closed Closing 11 Power Supply Power Supply1 Output Setpoint Set Value n nn 0 Include in Seq e n nn 20 Open Opening 12 Power Supply Power Supply 1 Tum On Open Opening 13 Sigma Sigma Launch 242 Turn_On Open Opening 14 Sigma Sigma Shutter Delay Mapping 1 Set Value n nn 17 15 Sigma Sigma Shutter Deposit Mapping 1 Set Value n nn 14 16 Sigma Sigma Control Request Set Value n nn Ag EVAP AKW 17 Sigma Sigma Stop Process Tum Off Closed Closing 18 Recipe Dwell 3 Seconds 18 Sigma Sigma Load Process Turn_On Open Opening 20 Sigma Sigma Start Process Tum On Open Opening kl 21 Sigma Sigma In Process Check_On Open Opening 22 Sigma Sigma In Process Check Off Closed Closing AT 23 Power Supply Power Supply1 Ramp Rate Set Value n nn O 24 Power Supply Power Supply1 Output Setpoint Get Yalue n nn O 25 Power Supply Power Supply 1 Tum Off Closed Closing 26 Motors Platen Motor Go Continuous Tum Off Closed Closing ABORT IF TIMEOUT e Recipe Step 21 is used for this example The Recipe Items Detail box is explained below e This Abort step allows 15 seconds to elapse before aborting TimeOut for Wait e Ift
293. tion Only PC Cryo Regen Valve MO Cannes Perros Nuls 27 Interlocks Sigma Data Sets Ow Configuration 2 System Users Type a question for help Export Interlocks to XL Update VB Reorder ltems EquipmentltemOperation 000000000000000000000000000 Tum On Open Opening Check On Open Opening 000000000000000000000000000 Turn On Open Opening Check On Open Opening 000000000000000000000000000 Turn On Open Opening Check On Open Opening 000000000000000000000000000 Tum On Open Opening Check Off Closed Closing 000000000000000000000000000 Turn On Open Opening Check Off Closed Closing 000000000000000000000000000 Tum On Open Opening Check On Open Opening 000000000000000000000000000 Tum On Open Opening Check On Open Opening 000000000000000000000000000 Tum Off Closed Closing Check On Open Opening 000000000000000000000000000 Turn On Open Opening Check On Open Opening 000000000000000000000000000 Turn On Open Opening CL ele Dti Tel Equipment Test Value LL iso valve closed is active LL iso valve open is active LL turbo vent valve is open LL turbo backing valve is closed Roughing pump is off Turbo backing valve is open Turbo pump is on Turbo pump is on LL turbo vent is open Purge valve is open xX This screen provides detailed information regarding interlocks Only KJLC Engineers or System Administrators under the direction of a KJLC Engineer should change these interlocks See CWare O
294. tion cycle removes trapped gasses through a process similar to defrosting a refrigerator freezer If the cryo pump becomes incapable of maintaining high vacuum typically an increase in your vacuum chamber base pressure by a factor of 10 even though the cold head and the compressor unit are operating satisfactorily the cryo pump requires regeneration It is recommended that your cryo pump be regenerated on a regular schedule that coincides with system maintenance weekend system shutdown etc A suitable time interval between regeneration cycles can be determined from experience 1 Close the hivac isolation valve 2 Shut off the cryo pump by setting the power switch on the compressor to the OFF position 3 Ifthe system has a cryo purge heater immediately introduce heated dry purge gas through the vessel purge fittings at approximately 150 F 66 C and at a flow rate of 1 2 cfm Allow the purge gas to vent through the relief valve 4 Halt the gas purge when the condensing arrays reach 80 F 26 C 300K 5 When the condensing arrays reach ambient temperature rough the cryo pump to an initial starting pressure between 50 and 100 mTorr 6 Perform the rate of rise test as follows 7 Once the roughing cycle has roughed the cryo pump starting pressure between 50 100 mTorr close the roughing valve 8 Observe the rate of rise ROR over a five minute period d The ROR should be less than 10 mTorr minute over a five minute
295. tions The first is Scientific Foundations of Vacuum Technique by Saul Dushman 2nd ed J M Lafferty editor from which we have reprinted a table from p 99 with permission from John Wiley amp Sons 1962 The second is Scientific Foundations of Vacuum Science and Technology J M Lafferty editor John Wiley amp Sons 1998 which has a chapter by R Gordon Livesey with a wealth of information and equations for calculating conductances in molecular transitional and continuum flow regimes Examples of conductance calculations for straight cylindrical components using Dushman s table are given in the sidebar To calculate conductances of non cylindrical components find the appropriate equation in Lafferty s 2nd book or for less accurate estimates use Dushman s table and some rules of thumb e Right Angle Bends Measure the tube length L as the shortest distance along the inside of the bend Calculate the conductance from the table as if the tube were straight and then divide by 2 for every right angle bend e Non Cylindrical Cross Section Calculate the open area of the tube or annulus and find the radius of a cylindrical tube with an equal area Calculate the conductance of this equivalent tube e Diameter Changes If a tube changes diameter along its length the safest way to calculate conductance is to use the smaller diameter to calculate a the radius But if the smaller diameter portion is short compared to
296. tive pumping speed by dividing 1 27 T L s by 0 013 T 1 27 0 013 100 L s Minimum effective pumping speed 100 L s Clearly the pump s quoted pumping speed must be higher than this since the pumping port s conductance will reduce it However it can be much higher and simply trimmed to 100 L s using a throttle valve between chamber and pump KURT J LESKER COMPANY 22 PVD 75 OPERATION MANUAL PUMP DOWN TIMES MANUAL CALCULATIONS Can pump down time be calculated The short answer is yes But the longer answer is this is an iterative process involving exponential decay and manual calculation can be involved and tedious even using a spreadsheet program COMPUTER CALCULATIONS Over the years computer algorithms have been developed for iterative techniques needed to calculate conductances throughputs gas loads effective pumping speeds and pump down times across continuum transitional and molecular flow regimes using the available formulas from vacuum technology Typically the user keys in the pump s pumping speed curve chamber dimensions surface outgassing rates start finish pressure etc and the calculations are done automatically with the program choosing the appropriate formula at each iteration We have used successive updates of the VacTran program from Professional Engineering Computations for over 17 years We find it invaluable and of the programs we have examined the easiest to use and most versatile VacT
297. to identify A few of the more commonly used pressure units in vacuum applications are noted here with approximate conversion factors to 1 atmosphere pressure 1 atm to show their relative magnitude millimeter of mercury 760 mmHg 1 atm Torr 760 Torr 1 atm millitorr 760000 mTorr 1 atm micron of mercury 760000 uHg 1 atm bar 1 013 bar 1 atm millibar 1013 mbar 1 atm pascal 101325 Pa 1 atm Preferred unit in the USA and used throughout these notes Sl units 1 Pa 1 newton m KURT J LESKER COMPANY 213 PVD 75 OPERATION MANUAL BASIC VACUUM CONCEPTS Our concept of solids and liquids depends largely on our ability to see touch them If we have two lumps of solid roughly the same volume and one lump is light while the other is heavy we say the heavy lump has a higher density mass per unit volume Ib in g cc kg m etc Gases present a challenge to our ability to see touch and new terms have been introduced to describe the gaseous state The gas laws used to derive the values quoted below are correct only for ideal gases However in room temperature chambers as pressure decreases all gases approach ideal behavior For vacuum applications the appropriately scaled value to allow for pressure change will be sufficiently accurate for precise calculations NUMBER DENSITY Avogradro determined that equal volumes of gas at the same temperature and pressure contained equal numbers of molecules It d
298. tool location has severe space constraints to ensure there will not be any interference The weight of the system varies depending on the platform and configuration purchased Standard platforms typically range between 1500 to 4500 Ibs 680 to 2100 Kg Custom and cluster tools may weigh more If there are weight limitations within the travel path or final location of the tool KJLC should be contacted for more detailed weight information ENVIRONMENTAL CONDITIONS d Facility and local safety codes may also have more stringent requirements that must be met for equipment placement It is the responsibility of the customer to ensure these requirements are met The location of the tool should be given careful consideration The tool is designed for indoor use only and is not protected against harmful ingress of moisture It is designed to operate in a laboratory environment that contains minimal shock and vibration The following are recommended conditions and are applicable to all KJLC platforms There should be adequate space around the tool to easily gain access to all required components for routine services and preventative maintenance It is recommended that the minimum distances listed below be maintained FRONT 36 INCHES 0 9 M SIDES 24 INCHES 0 6 M REAR 24 INCHES 0 6 M KURT J LESKER COMPANY 19 PVD 75 OPERATION MANUAL Custom systems may require increased distances and should be considered when installing the tool T
299. tor as well as a desiccant filter be installed prior to the air entering the system to help assure reliable and long lasting operation of the system pneumatic valves Polyethylene or Teflon tubing can be used for to supply compressed air with the following characteristics e 80 90 psi 552 621 kPa e lt 5um particle filtration e Dry non lubricated KJLC does not recommend the use of Nitrogen in place of compressed air Effects of dry Nitrogen observed over time included gradual changes in some lubricants and the seals commonly used in pneumatic products Seals have been observed to dry out and some lubricant will thicken as the dry N2 accelerates evaporation This process may take some time but can shorten the life of the product The effect is more pronounced in dynamic seals then in static seals so is more of an issue in pneumatic valve and cylinders then in fittings and flow controls Typical compressed air connections DESCRIPTION KJLC SYSTEM CONNECTION CUSTOMER SUPPLIED 1 4 SWAGELOK TUBING 1 4 O D TUBE Compressed air supplies KJLC PART NUMBER DESCRIPTION PETO25 TUBING POLYETHYLENE 1 4 OD NATURAL COLOR TT025 TUBING TEFLON 5 32 ID 1 4 OD SST 0025l TUBING 304L SST RIGID 1 4 OD 028 WALL SS 6MO R 4 REDUCER SS 6MM TUBE X 1 4 TUBE STUB SS 401 PC FITTING SWAGELOK SS 1 4 TUBE PORT CONNECTOR 28 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 NITROGEN GAS All tools require a clean Nitroge
300. tor Error Reset Sec Click to activate Resets motor error conditions Stop Motion Button Click to activate Click to stop all motor motion Station Setpoints E E M Click to enter Value Enter the desired setpoint in inches Go To Station Causes the shutter motor to go to the location GoTo Click to activate ETE DER specified for the given station NOTE The following icons and fields are available for adjustment however it is highly recommended that the SMI User s Guide be read prior to adjusting these parameters Changing motor tuning parameters can seriously degrade the performance of your motors Motor Acceleration belegt Set or change the motor acceleration Refer to m the SMI User s Manual Maximum Motor Current DEE Set the maximum motor current Refer to the Mas SMI User s Manual Motor PID Filter P Term gt PT Click to enter value Refer to the SMI User s Manual EX Motor PID Filter Term Click to enter value Refer to the SMI User s Manual Motor PID Filter D Term Click to enter value Refer to the SMI User s Manual O UEM Substrate X Source Y i Click text to enter the The platen will to the desired positi Substrate Position Key ICK Text Lo enter the e platen Will move to the desired position desired station when the station setpoint is used in setpointin degrees conjunction with the enable position button See example below KURT J LESKER COMPANY 137 PVD 75 OPERATION MANUAL SUBSTRA
301. trol software The Operation Vacuum Screen is typically the first screen to appear 4 2E 8 12 00 05 PM 12 15 2005 Logout KJLC 0 00 03 Closed Off Exit Super User ABORT Vacuum Deposition Gas Motion Cooling Heating VAC RG Torr 4 2E 8 CAP mT orr Kurt J Lesker Recipe Database PC Vent Valve Cryo Temperature Regen Pressure TempK PRNI mT orr OFF 011 2 4E 3 Run Recipe Start PC Pump LL Iso Valve Open WAG T orr Se sky 000 20 PC High Vac Throttle 7 5E 2 LL Iso Valve Close eg PC ri Purge Valve 231 OPEN sk Start LL Pump LRP EOT sk Start LL Vent Start PC Vent T PC Cryo Regen Valve Gas Injection Start Transfer Wafer ALE LL Turbo Vent EI LL Turbo Back Roughing Pump is peed 000 LL Turbo Pump ES 1 1E 2 Recording Start Operation System Help oi 166 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 At system startup the Login Logout Button is in a Login Here state Clicking on this button will display the dialog box shown here 1 2 3 Login Logout x Please key in Login Name and press Enter KJLL Please key in Password and press Enter Cancel LociN Locour DIALOG Box Type your user name in the upper window Then use the mouse to set the cursor in the password window Type your password and press the enter key on the keyboard
302. trom atmospheric pressure to high vacuum requires iterative processes ideally suited to computer calculation PEC s VacTran described on page 17 21 is an exceptionally powerful program for vacuum The conductance of a straight cylindrical tube technology calculations including the is Calculated as follows calculation of series and parallel Measure the overall length of the tube conductances for any pressure range and In any convenient units many different cross sectional shapes Measure the tube s I D in the same units cones slots ovals annuli and triangles Divide the 1 D by 2 to give the radius Enter the table at the appropriate a radius row Go right to the Fg column and read the conductance in L s Divide the length by the radius this gives the L a ratio used in the table Convert the radius to centimeters this gives a cm to use in the table Enter the table at the appropriate a row Go right until under the value of the calculated L a ratio If the exact match is not available use the next larger L a value or interpolate 220 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 PUMPING The formal definition of pumping speed is The ratio of the throughput of a given gas to the partial pressure of that gas at a specific point near the inlet port of the pump PUMPING INTERPRETATION With less formality but perhaps more clarity pumping speed is a measure of
303. try can be customized by editing entries in the SQS242 INI file see section 3 8 Complete Signal Check this box if your indexer sends a signal indicating that the move is complete Timeout If Complete Signal is checked the process will halt if a move complete signal is not received within this timeout period If Complete Signal is not checked the process waits for this fixed time period before starting a layer Move Useful for testing indexer functions manually Select an indexer then an index pocket Click Move to move to the selected index Layer indexers are typically named Substrate User 1 and User 2 Layer indexer names can be edited in the SQS242 INI file see section 3 8 3 5 4 5 I O Tab A PLC must be used to provide digital I O capabilities The I O tab assigns deposition events i e open shutter start deposit final thickness etc to the physical relays and inputs on the PLC IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual NOTE Omron CPM series PLCs number relays from 10 00 to 10 07 then 11 00 to 11 07 These correspond to Relays 1 to 16 on the I O tab Similarly inputs 0 00 to 0 11 on the Omron PLC correspond to inputs 1 to 12 on this dialog box See Figure 3 22 Figure 3 22 I O tab M System Setup Ej Chamber Rename New Delete Copy Outputs Sensors Analog Indexers MO Cards Comm Relay Ewents Input Ewents Process Running Start Proces
304. ubstrate rotation Zeroes the Ramp Rate text box and the Setpoint text box turns On Power Supply Launches turns on Sigma control via KJLC software and sets both the shutter delay and shutter deposit mapping to the correct values This ensures that the correct shutters are actuated via Sigma control Sets the value Sigma Control request to the appropriate program from Sigma for which to would like to run NOTE This name Ag EVAP 4KW for example must match the process in Sigma exactly Turns the Stop Process signal Off and then dwells for 3 seconds Loads the Sigma Control request for which to run and Starts the Sigma Process Checks that the Sigma Process is running or In Process Checks that the Sigma Process has Stopped Sets Ramp Rate text box to O U s and enters a value of 0 in the Setpoint text box Turns Off the Power Supply Turn Off motor Go Continuous KURT J LESKER COMPANY 97 PVD 75 OPERATION MANUAL ABORT IF TIMEOUT AND GOTO SETUP When creating a recipe the Abort if Timeout or Goto from the GRST column can be set Click inside the cell on the GRST column of the step you want to add the Abort if TimeOut AT or Goto GT The following box will appear New 4l 4 Ils v p nl Sho Sub Recipe Delete Export All Recipes to XL E Recipe Items Detail Bisi TimeOut for Wet E Update VB Reorder Items Copy Recipe TimeOutMessage pesce quipmentitemOpera
305. ughput is the total amount of gas leaving the system Both have units of volume x pressure per unit time The critical point here is to recognize that when the chamber s pressure is constant gas load must equal throughput To express the concept fully the mass of gas entering the system in a given time must equal the mass of gas leaving the system in the same time or the pressure will change To use a less rigorous but more memorable expression at constant pressure Gas In Gas Out This identity is used when sizing pumps for applications that have known mass flow of gas injected The common unit for measuring mass flows of gas is standard cubic centimeters per minute or sccm popularly called skims Note the units standard refers to 760 Torr or 1013 2 mbar at 0 C cubic centimeters is a volume and minute is obviously time As an example let us calculate the pumping speed needed to maintain a working pressure of 13 mTorr when injecting 100 sccm of argon First we convert the gas flow units sccm into pump flow units say L s if we are dealing with a high vacuum pump situation or cfm L m etc for a roughing pump Here we will consider just a high vacuum pump 100 sccm 100 x 760 Torr ccm 100 x 760 1000 Torr liter min 100 x 760 1000 x 60 Torr liter sec Gas In 1 27 T L s Since Gas Out must also equal 1 27 T L s and we know the chamber pressure must be 13 mTorr with the gas flowing we calculate the minimum effec
306. uid and 14 7 psi applies to all surfaces no matter what their orientation If we evacuate a 1 cubic box at sea level then the top horizontal surface will experience 14 7 psi pushing down and the bottom horizontal surface will experience 14 7 psi pushing up Equally opposite sides of the cube experience forces of 14 7 psi pushing left and right So the cube experiences no net force pushing it in any direction other than gravity of course NANO SCALE Airis a mixture of molecules nitrogen oxygen carbon dioxide etc and atoms argon helium etc which at normal temperatures are all moving at high speed making a huge number of elastic collisions with each other in a gas phase and non elastic collisions with surfaces At room temperature the average nitrogen molecule is traveling at 900 mph 474 m s At any moment 90 of the N molecules have velocities between 100 mph and 1 800 mph But N has the mass of only 4 8 x 107 gm so despite its high velocity its kinetic energy is unnoticeably small However as noted in Number Density below 1 cubic centimeter cc of air contains a gigantic number of atoms molecules It is the force generated by the high speed surface bombardment of those myriad tiny particles that we experience as pressure 212 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 PRESSURE UNIT All pressure measurement units are of the form force per unit area However for many units this relationship is hard
307. ulfide gt gt 8 44 MW G Wb Mola ALO No dacampasiion n 3 19 4 06 43 Arsene j 5 j A308 Q 4 281 3 0 Arsene Talluride A n bn 3 zm Flash See JVST 1973 10 748 EA Gives Ba Co evap OK Soutiar OK n 240 1 278 16 TiO 88 100 Ex Wb W W BeD C VC DC Wetz W Ta Mo E zz A Telusde Gi at ap OK Spir OK Bank Ebi D RF Sputer OK R co evap ih 10 T Op Boron B 209 23 128 158 IN Ex C de RF Forms cartide with cortaner 25 Ex RF 234 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 Temp CH for Given Evaporation Techniques Vap Press Torr Thermal Sources Mater ial Symbol MPC Sp gem 10 10 10 Boat Coll Basket Crucible Sputter Cadmium Talude CdTe 181 55 450 W MeTa W WD Mo RF Substrate tamp aflects composition m 2 6 Cakium Ca CX S 154 272 MX 459 P W WW wW Ada Q Film reacts in air CabiumFluxke Cao 143 318 AW Wh WMoTa X Q RF Rate contol important Peheat gently bogs nid Calcium Oxide Cad 20144 313 umo W Mo Zr RFR Forms volatile oxides with W Mo n 18 Cakium Sikais Cai 150 29 G Q RF n 1 61 1 66 Mo RF RE RF POC KURT J LESKER COMPANY 235 PVD 75 OPERATION MANUAL emp C for Given Evaporation Techniques Vap Press Torr Thermal Sources Material Symbol MP C CENE 0 10 107 E Beam Boat Coll Basket
308. ures KURT J LESKER COMPANY 13 PVD 75 OPERATION MANUAL P some cleaning fluids may leave a flammable or toxic residue Observe all instructions provided with cleaning fluids 5 Mechanical hazards exist because moving parts can cause personal injury or instrument damage A DANGER Before actuating the hoists or slit valves all personnel must be clear of moving parts Use extreme caution when working around moving parts 6 Compressed gas used for processes can create high pressure hazards throughout the gas plumbing lines and process chamber A DANGER 8 High pressure can cause personal injury and property damage The compressor unit and associated hoses contain compressed helium and must not be mechanically or thermally stressed Before accessing a cryogenic pump read the operator s manual and follow all safety guidelines Process gas tanks must be kept according to manufacturers specifications and local codes 7 Heating elements quartz lamps composite etc used for sample heating can create high temperature hazards on chamber walls viewport surfaces and chamber internals DANGER M High temperatures can cause harm to personnel and equipment Do not vent chamber until temperature is low enough to facilitate safe handling of parts High temperatures can also cause damage to materials if the system is vented prematurely 14 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 SITE PREPARATION The
309. urge Start PC Pump Heater LRP EOT EL CLOSED OFF Start PC Vent PC High Vac Throttle PC Cryo Xn Purge LL Iso Valve Close ei pj mm OFF OPEN Valve Start LL Pump OPEN HE pa PCC Start LL Vent CX LL High Vac Valve Eeer CLOSED Gas Ring Valve Start Sample oa LL Turbo Reset OFF PC Roughing Valve LL Rough Valve Xn Start Sample LL Turbo Vent MEE ss eg eg LL Turbo Pump AT SPEED PRNI Torr Start Cryo Regen LL Turbo Back 3 Recording Start Roughing Pump AHB DDR NA A AC utility power restored to APC battery backup Your equipment is now running on AC utility power 1 User press exit button in CWare Wait for CWare software to exit 2 Shut down Windows software 3 Turn UPS off KURT J LESKER COMPANY 111 PVD 75 OPERATION MANUAL UPS Location on PVD system PVD SYSTEM Turn breaker OFF at System Power Distribution Unit Location of breaker depends on type of Power Distribution Unit installed Main breaker ETIN 208 VOLTS THREEPHASE 3 PHASE POWER DISTRIBUTION UNIT Fis zb S A 1 A A SINGLE PHASE POWER DISTRIBUTION UNIT 112 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 SHUT DOWN 1 Verify that all gas valves are closed the source and heater supplies are turned off and that the temperature is below 80 C 2 Turn off the ion gauge filament 3 If leaving the system under vacuum a Complete the pumpdown se
310. ut Current 0 002 Amps Capman Range 100 100 mTorr Power Supply Output Power 0005 Watts MFC1 Correction Factor 1 39 1 39 Power Supplyl Output Voltage 0000 Volts MFC Gas Ar Ar Substrate Heater Current 0 000 4 MFC1 Mode 0 0 Substrate Heater Over Temp 23 0 degC MFC1 Range 100 100 Substrate Heater Temperature 23 2 degC MFC1 Ratio 50 50 Wide Range Gauge PC 0 0E 0 Torr Rotation Start MFC1 SP 0 0 SCCM y Recording Start Operation System Help d This screen is primarily used for troubleshooting datalogging It is recommended that e o T gt T o gt a o 1 operators other than the system administrator do not have access to this screen Users can be denied access to this screen based upon their login parameters see the System Users Screen and the Security section of this manual A CAUTION Forcing analog inputs can override interlocks When system troubleshooting is complete you must remember to reset un force signals 148 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 CON OR DATA FIELD ACTION RESULT Signal Click to select or Sere deselect Outputs Initial Value Initial Value Display only Outputs Signal Value zent Units z Display only Inputs Value o Inputs Status Status Generate Data Log Generate Data Lag Suspend Screen Updates Click to activate Suspend Screen Updates Click to activate Click to activate Display only Cli
311. uto Controller press and hold the white Acquire Setpoints Button until the red numbered LED that was selected stops flashing To Turn the lon Source Off 1 2 3 4 104 From the KRI Discharge Controller press the white Enable Standby Button to Standby From the KRI Filament Controller press the white Enable Standby Button to Standby From the KRI Auto Controller press the white Enable Standby Button to Standby Restarting the ion source in the Gas only mode consists of enabling the KRI Auto Controller KRI Filament Controller and KRI Discharge Controller in that order Slight variations in discharge voltages may be seen while the source is reaching operating temperature The variations should be acceptable for most cleaning or ion assist applications KURT J LESKER COMPANY OPERATION MANUAL PVD 75 d The following steps must be performed prior to running in Remote Mode Determine what mode of operation is compatible with system and perform these operational steps Constant Current Mode Operation OR Constant Voltage Mode Operation prior to running in remote mode MANUAL GAS MODE 1 Manual Gas mode sequentially enables the gas filament and discharge in the Same manner that these would be enabled manually if the Gas Only mode were used There is no feedback to adjust the gas flow to maintain the constant discharge parameters 2 From the KRI Auto Controller sel
312. vacuum black while the Load Lock chamber above is at atmosphere white ICON OR DATA FIELD ACTION RESULT Clicking the on off button will lock or unlock the process chamber door while the Click to activate W OFF E locked unlocked icon indicates the current status Door Lock Valve Icons 7 Green Pressed open or active Click to activate l Gray Unpressed closed or inactive Indicates position of valves with real Valve Indicators Display only feedback such as the isolation and high Porem CLOSED vacuum valves This icon will only appear during a fault Display only condition 126 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 ICON OR DATA FIELD ACTION RESULT Speed l Indicates the current speed of the LL turbo Speed Display only Sum Pirani Gauge IPRNI Tom Display only Indicates Pirani gauge pressure in Torr Cryo T t A Indicates the temperature of the Cryo Display only pump in Kelvin Regeneration Pressure l l Indicates pressure in mTorr of the Cryo FANIT or Display only ELE pump during regeneration Pump Icons NEN x On green animated motion and appear e pressed down ALI ND Display only Off gray no animation and appear un E pressed up Turbo Speed Setpoint PC Heller Turba Pump Speed SP Click to enter value Enter the desired turbo speed in percent valid range is 20 100 Process Chamber Vacuum Indicator Display only Gray atmosp
313. ve maintenance schedules should be reviewed and followed A CAUTION Failure to follow the proper preventative maintenance procedures could result in premature failure of the system or components A DANGER Many of the referenced maintenance procedures have safety dangers warnings cautions and notes associated with them Read all procedure references and observe all safety measures COMPONENT REPAIR REPLACEMENT For repair or replacement of specific components see appropriate schematics and operation manuals These procedures are associated with features critical to proper system function In house performance of component repair or replacement during the warranty period without direction or approval from KJLC Systems Support can result in termination of the warranty If an authorized KJLC service representative suggests that a system component be returned to KJLC a Return Material Authorization RMA number must be issued The RMA number expedites handling and ensures proper service of the equipment PROCESS CHAMBER CLEANING The chamber and internal shielding should be cleaned regularly to remove contaminants and particulates which can affect vacuum integrity and process performance The user should review the system periodically and perform duties as required to set up a scheduled preventative maintenance procedure If required a recommended cleaning procedure can be supplied by an authorized KJLC representative A CAUTION
314. view this example until you are comfortable with these concepts 4 Edit Layer 1 Rate amp Thickness Click Silver Sample in the list of layers Set Initial Rate to 15 A s Final Thickness to 1 500 kA Click the Rate Ramps tab and set Start Thickness to 0 400 kA Ramp Time to 15 seconds and New Rate to 0 A s 5 Edit Layer 2 Rate amp Thickness Click the Layer tab then click Layer 2 Gold Sample Set Final Thickness to 0 5000 kA 6 Set Layers to Auto Start At the end of deposition you may choose to have the next layer wait for a Start Layer command or to start automatically Select each Layer in the layers list then click Auto to set that layer to start automatically Verify that your process matches the one shown in Figure 2 14 IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Figure 2 14 Process Edit Dialog Box Process Edit Sample Save Rename Delete Lopy Lawyer Out Film cetPt Thickness Time Gold Sample 10 Cut Layer iwer Sample 15 Copy Layer Paste Layer Paste Collep Layer RateRamps Deposit Condition Source Sensor Errors Film Output Input Gold sample Output 1 Sensor s cett Final Thick Cen EndFt MET EndFPt oystem Setup ATS k Auto Start Continuous SOUrCEe Substrate Izer Izerz Manual None None none None B Po Indexers Index Index Index Index 7 Edit Silver Conditioning Select the Con
315. wer braces from the instrument rack A CAUTION Due to the weight of the system and mode of travel crate contents may shift Extreme caution should be exercised when removing all internal and external supports 5 Remove the nuts from the pieces of stainless steel all thread that hold the system to the crate See Figure 2 Do NOT discard the pieces of all thread They may be part of the leveling foot assemblies for the system framework KURT J LESKER COMPANY 17 PVD 75 OPERATION MANUAL system Frame Lan KE Tunes a hn EA A RAS O JA AAA All Thread ill Double Nut Both Sides FIGURE 1 FIGURE 2 6 Use a fork truck to separately lift the instrument rack and system off of the shipping base if applicable Approach both pieces from the SIDE and lift from the lower frame members unless otherwise instructed A CAUTION Only a properly trained and licensed fork lift operator should remove the instrument rack and deposition system from the shipping base Improper removal of the components can result in equipment damage Be cautious of electrical cable gas lines etc when placing forks under the system framework and the instrument rack Also be aware of the length of the cables between the instrument rack and the system if applicable 7 Liftthe system up far enough to allow the shipping base to be pulled out from underneath the system A DANGER DO NOT put any part of your body under
316. with the chamber s characteristic dimension s the gas is in continuum flow e Shorter than the chamber s characteristic dimensions but approaches them the gas is in transitional flow e Equal to or longer than the chamber s characteristic dimensions then the gas is in molecular flow The flow regime is used to identify the appropriate equations needed to calculate conductances pump down times and other characteristics 216 KURT J LESKER COMPANY OPERATION MANUAL PVD 75 VACUUM DOESN T Suck There is a common misunderstanding that vacuum pumps suck There is no such force as suction If the gas molecules in one section of a vacuum volume could be instantaneously removed molecules from the remaining section in their normal high speed flight would randomly collide and bounce off walls until they filled the whole volume at a lower pressure For vacuum pumping this means that until a gas molecule in its random flight enters the pumping mechanism that molecule cannot be removed from the volume In effect the pump acts like a one way valve gas molecules may enter but not return But for that to happen molecules must first arrive at the pump it cannot reach out and grab them Understanding that vacuum doesn t suck makes the basic aspects of vacuum technology much easier to grasp KURT J LESKER COMPANY 217 PVD 75 OPERATION MANUAL CONDUCTANCE Vacuum technology novices have difficulty distinguishing conductance from pumpi
317. worn Adjust flow controllers on air lines or open and close limits of operation Refer to manufacturer s manual Date 195 PVD 75 7 DAY MAINTENANCE ALL MODULES COMPONENT INSPECT FOR COMMENTS Limit Switches Proximity Sensors Sample Transfer Z Shifts Cassette and Platen Shafts 196 Proper operation Operate each axis of motion in each direction of movement to its limits The switches should indicate limits of travel in the operation positions Proper operation Check illumination of sensor when at home or in the limit position Sample transfer to all transfer locations Transfer should be inspected at each location for the proper placement and pick up of substrates and masks Smooth motion in both up amp down directions Operation of limit switches Operate the Z shifts in each direction of movement to its limits Operation The recommended maximum operation of the bellows is 10 000 cycles Operation The recommended maximum operation of the lead screws and drive nuts is 10 000 cycles Wear misalignment debris and free rotation of bearings Components should move freely OPERATION MANUAL Verify wire connections and replace wiring or the switch if required Verify wire connections and replace wiring or the switch if required Adjustments should be made at each location Encoder counts or position values should be logged for reference Clean all motion surfaces and
318. your particular system configuration ICON OR DATA FIELD ACTION RESULT Platen Motor On Click to activate Click to turn the Platen motor on platen Morar ey Bebe Indicates the current motor velocity in RPM or FS IPS depending on motor Indicates if an error occurs with the platen Display only MM Click to send the motor home The button will stay pressed while the platen is homing Once Click to activate Home the platen is homed referenced the button changes to un pressed Platen Home KURT J LESKER COMPANY 135 PVD 75 OPERATION MANUAL ICON OR DATA FIELD ACTION RESULT Enter the desired offset from home that you Platen Home Offset want the motor to consider its new home Utfset Click to enter value When you home with an offset the motor will go home then move to the offset and consider this location to be O Home Velocity Setpoint o Velocity SP leger Enter the desired home velocity in RPM or IPS depending on motor Referenced Indicator Indicates when the motor is referenced Referenced Display only Green 1 referenced Gray O 2 not referenced Platen Jog Forward Click and hold to move the motor in the Jog Click to activate forward direction The motor will stop when Fwd the button is released Click and hold to move the motor in the reverse direction The motor will stop when Platen Jog Reverse the button is released m eil Click to activate NOTE Some motors are restricted to forward
319. ystem and set the Mode to Normal to begin running your real process with the SQS 242 software INFICON SQS 242 Operating Manual This page is intentionally blank IPN 074 551 P1A IPN 074 551 P1A INFICON SQS 242 Operating Manual Chapter 3 SQS 242 Software 3 1 Introduction This chapter covers the minimum system connections and initial setup required to run the SQS 242 software Consult the SQM 242 operating manual for more detailed instructions See Figure 3 1 Figure 3 1 SQM 242 Setup Sensor Computer In Vac Cable Source Shutter R User Suppliec Feedthrough Control Cable oN NN lr 10 BNC Cable d Control Input X EE gt Pd Evaporation 6 BNC Cable Power Supply 782 900 011 Chassis Ground Oscillator P s 782 900 010 1 Sensor Input Connections Connect the BNC cables and oscillators from your vacuum chamber feedthrough to the desired SQM 242 Card Input s Refer to Chapter 2 of the SQM 242 manual for detailed instructions on system hookup to the SQM 242 card s 2 Source Output Connections Connect the dual phone plug from the SQM 242 output jack to your evaporation supply control input Refer to Chapter 2 in the SQM 242 manual for detailed instructions on wiring the SQM 242 output phone plug 3 Digital UO Connections Digital I O is not required for initial operation of the SQS 242 software Perform initial setup an

Kurt J. Lesker PVD 75

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