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tm-350/400 operation and service manual

1. 8 4 TABLE 8 2 DENSITY AND ACOUSTIC IMPEDANCE VALUES FOR SELECTED MATERIALS iss 8 5 TABLE 10 1 TROUBLESHOOTING 5 10 4 350 400 55 1 GENERAL DESCRIPTION The Thickness Monitor allows improved manual control of the vacuum film deposition process by providing a direct display of film thickness and deposition rate during deposition Semiautomatic control of film thickness can be accomplished by utilization of the shutter control relay in the Monitor The shutter control relay allows for direct operator control of the systems shutter and will also automatically close the shutter when the deposition thickness equals a preprogrammed value The Monitor requires 4 6 in a TM 400 using crystal switching operator supplied parameters in order to provide direct readout and shutter control Entry modification and display of these parameters are easy and straightforward Parameter storage is not dependent on continuous AC power An internal self charging Lithium battery provides parameter storage for a minimum of five years without external power 1 4 FEATURES 1 1 1 INDEPENDENT FILM DENSITY AND TOOLING FACTOR PARAMETERS The tooling factor parameter allows the Monitor to compensate for deposition geometry effects such as different source to sensor and source to substrate distances which result in proportional but not
2. AND SERVICE MANUAL MODEL TM 350 400 MAXTEK THICKNESS MONITOR 18 THICKNESS E FREQ 1 LI L 2 5 1 285 S3 MODFY H wom cite um mm gt m A m mm m THICKNESS MONITOR C MODEL 400 MAXTEK INC ZA MAXTEK INC http www maxtekinc com 5980 Lakeshore Drive Cvpress CA 90630 3371 Tel 714 828 4200 e Fax 714 828 4443 Email sales maxtekinc com support Omaxtekinc com AND SERVICE MANUAL MODEL TM 350 400 MAXTEK THICKNESS MONITOR E 44 THICKNESS 2 7 Loc 71 S LI Li ZI ASEC 1 see me TEER 8 DISPLAY p FACTOR FACTOR O 19 maxtex inc 178800 S N ZA MAXTEK INC http www maxtekinc com 5980 Lakeshore Drive Cvpress CA 90630 3371 Tel 714 828 4200 e Fax 714 828 4443 Email sales maxtekinc com support Omaxtekinc com 1998 2005 INC rights reserved First Edition February 1998 Second Edition July 1998 Third Edition October 1998 Fourth Edition Januar
3. Figure 2 7 095 DTE RS 232 male connector Pin Signal RS 232 Not used Tx Output Rx Input Not used GND 6 CTS Input Output 9 Table 2 4 D9 Rear Panel RS 232 RS 485 Connector Pin Assignments Figure 2 8 DAC socket connector Thickness 2 ThiknesReum 1 5 Zero Scale Input 6 ull Scale Input Table 2 5 DAC System Interface Connector Pin Assignments UNPACKING amp INSPECTION 2 9 350 400 55 AVIdSIG 28 Wd 11 L vd 910 887 333 qNHVO8 5 5 S3HOLIMS did 123145 AONANOAYS IVLSAHO ANY 553 00 3OVJAM31NI HILAHWOD NOlldO 58754 123135 cen 9934 2019 123135 cer LLN N ii LJ 210 l ra LJ ep is gt TE sid A L 26454 10 DOA SevSM n 9 ZN Figure 2 9 400 Top View Cover Removed 2 10 UNPACKING amp INSPECTION 350 400 55 3 MONITOR INSTALLATION 3 1 MONITOR INSTALLATION PRECAUTIONS 3 1 1 PROPER GROUNDING The Monitor was designed to operate in electrically noisy environments In many cases no special grounding precautions will be required Where noise susceptibility is suspected use a short length of wire wire braid or copper strap is recommen
4. 8 2 SENSOR NUMBER 7M 400 only The Sensor Number parameter defines the primary sensor for the film meaning the sensor that the film will start with This parameter is included because it is desirable to use one sensor crystal for one material and the other sensor crystal for the second material in a multi layer application 8 3 DENSITY The Density parameter provides the Monitor with the density of the material being deposited so that it can calculate and display the physical film thickness If the film density is known it should be used A list of the more commonly used film densities is presented in Table 7 1 As a first approximation bulk material density can be used in programming this parameter Empirical calibration of this parameter is described in Section 8 5 1 8 4 ACOUSTIC IMPEDANCE The shear wave acoustic impedance of the deposited film is required by the monitor in order to accurately establish the sensor scale factor when the sensor crystal is heavily loaded If the acoustic impedance of the film material is known it can be entered directly in units of 100 000 gm sq cm sec In most cases the acoustic impedance of the bulk material can be used and can be obtained from the Handbook of Physics or other source of acoustic data The shear wave acoustic impedance can be calculated from the shear modulus or the shear wave velocity and the density by using the following equation acoustic impedance PC PG where
5. ON The TM 400 can switch to a failed back up sensor and still display an O fail error OFF Disables above feature ON OFF DAC Rate range Select Bit 1 Refer to DAC Table below ON OFF DAC Thickness range Select Bit 1 Refer to DAC Table below ON The TM 350 allows the source shutter to pulse close for second once the thickness endpoint is reached Disables above feature and uses standard operation OFF 8 Not used 3 3 8 DAC RANGE SETTINGS DAC Range Thickness Rate Bit 1 Bit 0 Bit 1 Bit 0 Switch 6 Switch 2 Switch 5 Switch 1 OFF OFF OFF OFF OFF ON OFF ON ON OFF ON OFF ON ON ON ON For more detail information on the DAC refer to Section 6 8 3 6 MONITOR INSTALLATION gt P TM 350 400 THICKNESS MONITOR 3 4 COVER REMOVAL WARNING Under no circumstances should the Monitor cover be removed without first removing the line voltage cord as dangerous voltages are present inside the case CAUTION To prevent damage to internal components by means of electrostatic discharge ESD wear grounded anti static wrist strap Five screws located on the top of the unit and 1 screw on the rear panel secures the cover of the Monitor Remove the 6 screws and slide the top cover toward the rear To reinstall the cover slide it into the groove created by the front and side panels then replace the screws WARNING To avoid electrical shock or personal in
6. INSTRUMENT BAIL IN TOP VIEW FRONT VIEW Figure 1 1 TM 400 Outline GENERAL DESCRIPTION 1 5 350 400 THICKNESS MONITOR 5914 9 1015 Be x sz sum v a a JC E B22 v TEA L Ca i 072 Figure 1 2 400 Outline 1 6 GENERAL DESCRIPTION 350 400 55 1 3 ACCESSORIES Part Number 179217 IEEE 488 Communication Board 179219 RS 232 to RS 485 conversion 123200 5 SH 102 Sensor Head cables and carousel of 10 each 6MHz Gold SC 101 sensor crystals 124201 4 SO 100 Oscillator with 6 and 10 BNC Cables 130200 2 IF 111 Instrument Feedthrough 1 O Ring with 1 electrical connector and dual 3 16 water tubes 130204 2 IF 276 Instrumentation Feedthrough 2 3 4 Conflat amp Flange seal with 1 electrical connector and dual 3 16 water tubes 150902 SF 120 Combination Sensor Head Feedthrough Cables Crystals and Oscillator 123204 1 123204 2 124202 1 124202 2 124204 gold sensor crystals silver sensor crystals Refer to Maxtek s Price List for more accessories and other products GENERAL DESCRIPTION 1 7 350 400 55 2 Carefully inspect your Monitor and its shipping container for evidence of possible shipping damage or loss If such evidence is present a report should be filed with the carrier as soon as possible Keep the shipp
7. 1 NMOHS 1531 2 JOSNIS MOQNIM 31V NI NMOHS 1531 NOSN3S N3HA NMOHS SI 05 35 3ALIOV 3HL 30 AON3nO03H4 1910 8 N3HM N3dO JOSNIS N3dO Y3SLLNHS 328005 2 5 UNPACKING 4 INSPECTION Figure 2 2 TM 400 Front Panel with Descriptions 350 400 THICKNESS MONITOR a si aa 4350 LON 2 MOSN3S 9rd 310H JILSVId WNIWM31 738v 88v 333l IVNOl1dO 3503 123135 39VL10A 1 OV Figure 2 3 TM 400 Rear Panel with descriptions 2 6 UNPACKING amp INSPECTION 350 400 55 E Ss 22 11 Sensor Shutter Normally Closed Source Shutter Normally Closed Sensor Shutter Normally Open Source Shutter Normally Open Not Connected 3 Er Figure 2 5 Input Connector Pin Number 1 Start Film Number Increase 0 7 Decrease Table 2 2 Input Pin Assignments UNPACKING amp INSPECTION 2 7 350 400 55 1 5 24 1 12 Figure 2 6 IEEE 488 Connector Pin Number GND Logic GND Table 2 3 IEEE 488 Pin Assignments 2 8 UNPACKING amp INSPECTION 350 400 55
8. 9 81 13 38 5 70 12 20 14 06 22 07 54 17 58 48 37 10 16 66 781 10 57 17 18 15 88 12 23 8 6 ESTABLISHING THE DEPOSITION PARAMETERS 350 400 55 ESTABLISHING THE DEPOSITION 5 8 7 350 400 55 9 91 GENERAL The various computer interfaces of Maxtek TM 350 400 Deposition Monitors permit complete remote control using a personal computer There are three types of computer interfaces offered The TM 350 400 comes standard with an RS 232 serial interface Both RS 485 and IEEE 488 interfaces are available as options 9 2 RS 232 SERIAL INTERFACE The standard RS 232 serial interface of the TM 350 400 allows one monitor to be connected to any other device with an RS 232 serial interface The RS 232 interface port is the connector on the rear panel of the monitor The pin layout is shown in Figure 2 7 and Table 2 4 lists pin signal assignments including a definition of whether the signal is an input or an output of the TM 350 400 The TM 350 400 acts as DTE and accordingly the 9 pin connector has plug pins It can be used with a DCE or a DTE host cable connection providing the sense of the RxD TxD data lines and the control lines is observed Pin 2 TxD transmits data from the TM 350 400 to the host pin 3 RxD receives data from the host Pin 7 is a control output signal and pi
9. Material Density m 272 0 01 gm cm Acoustic Impedance 50 5999 0 01 gm cm s ec Tooling Factor 1 2 9 1 100 4999 Tooling Factor 2 100 4999 Total 13 bytes ndicates decimal point position is not applicable Format Header Address Instruction 2 Length 1 Film 1 100 Checksum Example To instruct the monitor to send the parameter list for material 15 the computer would send Chr 255 Chr 254 Chr 1 Chr 2 Chr 1 Chr 15 Chr 237 4 Receive film parameters Code 3 Instructs the monitor to enter all the incoming film parameters for film into memory The parameters must be in the same order and format as the above film parameter list Format Header Address Instruction 3 Length 13 1 byte Film 1 100 12 bytes film parameter data Checksum COMPUTER INTERFACE 9 5 350 400 55 5 Send monitor status Code 4 Instructs the monitor to send the status data The description of the status data is as follows Source amp Sensor Shutter 0 Closed 1 Open Display 1 O Rate amp Thk 1 Freq 2 Test Address 0 31 Crystal Type 1 0 2 5 1 3 2 5 0MHz 3 6 0MHz 4 9 0 5 10 0MHz Simulate Mode Bit 4 0 l On Failure Register Ram Fail EPROM Fail Bit2 Film Data Fail Bit3 Sensor Input Fail Bit4 Not Used Bit5 Power Fail Bit6 Sensor Card Fail Total 10
10. P Density gm cm Transverse shear wave velocity cm sec Shear modulus dynes cm A list of the acoustic impedance and density of the more commonly deposited materials is presented in Table 8 2 and a technique for empirically determining this parameter is presented in Section 8 5 3 In many cases and particularly if the sensor crystal is not heavily loaded sufficient accuracy can be achieved by using the acoustic impedance of quartz 8 83 X 100 000 gm sq cm sec 8 5 EMPIRICAL CALIBRATION If the density and acoustic impedance of the film material is known the values should be entered into the monitor and a trial deposition should be made If the displayed thickness does not agree with an independently measured thickness the monitor should be calibrated as described below To calibrate the monitor material density tooling factor and acoustic impedance must be established in that order Approximate values should be used initially Table 8 2 provides density of some materials which should ESTABLISHING THE DEPOSITION PARAMETERS 350 400 55 provide guidance as to the approximate density If the acoustic impedance is unknown use the value for quartz 8 83 851 MATERIAL DENSITY CALIBRATION Use a fresh sensor crystal Place test substrates as close as possible to the sensor crystal Make a trial deposition of sufficient thickness to permit adequate precision of measurement by
11. switches 1 and 2 are provided on the back of the front panel With J2 Rate or J3 Thickness installed default the DAC 15 set for three digit conversion If the jumper is removed the DAC is set for two digit conversion OPERATION 6 5 350 400 55 7 THEORY OPERATION 7 1 BASIC MEASUREMENT The TM 350 400 uses a quartz crystal as the basic transducing element The quartz crystal itself is a flat circular plate approximately 0 55 in 1 40 cm in diameter and 0 011 0 013 in 28 33mm thick for 6 and 5 MHz The crystal thickness is inversely proportional to the crystal frequency The crystal is excited into mechanical motion by means of an external oscillator The unloaded crystal vibrates in the thickness shear mode at approximately the frequency of the specified crystal The frequency at which the quartz crystal oscillates is lowered by the addition of material to its surface 7 2 FILM THICKNESS CALCULATION Early investigators noted that if one assumed that the addition of material to the surface produced the same effect as the addition of an equal mass of quartz the following equation could be used to relate the film thickness to the change in crystal frequency TK Pa f f 1 per where N Frequency constant for an cut quartz crystal vibrating in thickness shear Hz x cm 1 668 x 10 Hz x cm Density of quartz g em fq Resonant frequen
12. unit The O off position cuts off the power to the unit However turning the power switch off does not fully remove the AC power from inside the unit Always disconnect the power cord from the power entry module to fully remove AC power from inside the unit Table of Contents Safety Precaution and Preparation for Use 1V 1 4 GENERAL DESCRIPTION 2 2 snnt 1 1 151 o a EDS 1 1 1 1 1 INDEPENDENT FILM DENSITY AND TOOLING FACTOR PARAMETERS 1 1 1 452 ACOUSTIC IMPEDANCE 1 1 1 1 3 PARAMETER DISPLAY 1 1 1 1 4 HIGH RESOLUTION AUTORANGED DISPLAY 1 1 1 1 5 LONG TERM PARAMETER 5 1 2 1 1 6 MULTIPLE COMPUTER INTERFACES 1 2 1257 COMPACT CASE is 1 2 1 1 8 DACOUTPU T eg pi G Sa uuu ER Pee e p sa qusa 1 2 1 1 9 MULTIPLE CRYSTAL FREQUENCIES 2 1 2 1440 lt BUILTIN TEST ee ertet 1 2 1 1 11 DYNAMIC MEASUREMENT UPDATE 4 1 2 1 1 12 AUTOMATIC CRYSTAL SWITCHING TM 400 1 2 12 SPECIFICATION etre 1 3 1 2 1 MEASUREMENT u dr
13. In order to minimize the chance of discharging body charge into the I C inputs always handle circuit boards by the edge avoiding contact with the connector area When moving a board from one surface or work area to another surface or work area always personally touch the new surface or location before laying down or inserting the board so that you the board and the surface or equipment are all at the same potential It is wise in dry climates to minimize the amount of movement when handling or replacing I C s in circuit boards When handing a circuit board or I C to another person always touch the person first Wood or paper surfaces are the most forgiving surfaces to work on Plastic should be avoided Metal is O K as long as the metal is always touched with the hand prior to laying down the I C s or circuit boards P C boards or I C s should never be placed in plastic bags unless they are of the conductive plastic type intended for this use These bags are typically black or pink and are normally labeled as conductive or anti static If no conductive plastic bags are available boards or I C s can be wrapped in paper and then placed in plastic bags or shipping bags If the above precautions are observed the chance of damage will be minimal and no problems should be encountered 10 2 MAINTENANCE PHILOSOPHY The TM 350 400 was designed around a maintenance philosophy of board replacement Field repair at the component level is
14. TM 400 only output is an isolated SPST normally open relay rated at 120 VA and 2A max Figure 2 4 shows the connector and Table 2 1 shows the signal assignments 3 2 6 LINE VOLTAGE SELECTION AND FUSE REPLACEMENT The TM 350 400 is compatible with AC line voltages of 100 through 120 or 220 through 240VAC at 50 to 60Hz The two line fuses are IEC T Type Slow 4 10 A 250 VAC To select the line voltage or to replace the fuses refer to Figure 3 1 and follow the steps below 4 Voltage selection selection slot wheel Figure 3 1 Power Entry Module cord before opening the cover on the power entry module 1 WARNING To avoid electrical shock or personal injury disconnect the power 1 Disconnect the power cord from the power entry module 2 Using a medium flat tip screwdriver or similar tool open the cover on the 3 2 MONITOR INSTALLATION 350 400 55 power module exposing two fuses voltage selection wheel 3 Insert the tool into the voltage selection slot and remove the wheel from the module 4 Select the desired voltage Replace the wheel back into the module 5 fuse replacement is needed pull out the fuse holders Check and replace fuse s with the correct type Replace the fuse holders back into the module 6 Close the module cover making sure the selected voltage shows through the window 3 3 INTERNAL DIP SWITCHES On the back of the display board as sho
15. an independent measuring device Determine the average thickness on test substrates If the monitor s displayed thickness is lower than the measured thickness push the MATERIAL DENSITY key and then push the Modify down key If the displayed thickness is higher than the actual thickness push the Modify up key The thickness will be displayed three seconds after the Modify key 15 released Check to see if the thickness displayed now equals the measured thickness If it does not repeat the procedure in 5 above until the displayed thickness agrees with the measured thickness The programmed material density will now be correct for that particular material Record this value for future use 8 5 2 TOOLING FACTOR CALIBRATION Use a fresh sensor crystal Place test substrates in a location which is representative of where the production substrate will be located Make a trial deposition with the known material density as determined above Determine the average thickness on the test substrates with an independent thickness measuring device Alternating between the TOOLING FACTOR and the Modify up and Modify down key follow the procedure described in item 5 above except the Modify down key is used to lower the displayed thickness to the actual thickness and the Modify up key is used to raise the display thickness to actual thickness Continue until the displayed thickness agrees with the measured thickness The Tooling factor should now be
16. basic measurement is period which can be thought of as a measurement of equivalent quartz mass The actual film mass on the crystal is then found by applying the acoustic impedance correction factor At the beginning of the deposit or when the thickness indication is zeroed the initial equivalent quartz mass and the initial corrected film mass are stored For each subsequent measurement the new corrected total film mass is calculated and the film mass deposited since the start of deposit is determined by subtracting the initial corrected film mass from the total corrected film mass The film thickness on the crystal is calculated by dividing by the film mass by the film density The film thickness on the substrates is then calculated by multiplying the film thickness on the crystal by a tooling factor If the acoustic impedance parameter is changed following a deposition both the total and the initial film masses are recalculated This allows the effect of the changed parameter value to be immediately displayed and provides a relatively straightforward method of empirically determining the acoustic impedance if it is not available See section 8 5 3 7 3 CRYSTAL HEALTH CALCULATION Crystal Health decreases from a value of 100 for an uncoated crystal blank to 0 at a total deposited aerial mass of 25 mg cm This value corresponds to a crystal frequency shift of approximately 1 5 MHz or an aluminum thickness of 925 KA Very few mater
17. buffer is designed to operate with coaxial cable of 50 impedance Cable lengths up to 100 feet may be installed using RG 58 cable or an equivalent Cable lengths longer than the 10 ft length supplied are available upon request Refer to Section 4 for SENSOR FEEDTHROUGH AND OSCILLATOR installation instructions 3 2 2 IEEE 488 OPTION BOARD optional The optional IEEE 488 interface provides the TM 350 400 with the abilitv to communicate with computers and other devices over a standard IEEE 488 interface bus Figure 2 6 shows the connector and IEEE 488 Connector shows the signal assignments MONITOR INSTALLATION 3 1 350 400 55 3 2 3 DIGITAL ANALOG CONVERTER DAC CONNECTION The Digital to Analog Converters are interfaced via a 7 pin circular mini DIN connector The mating connector is a CINCH MDX 7Pl or equivalent Figure 2 8 shows the DAC connector and Table 2 5 shows the signal assignments 3 2 4 REMOTE TTL INPUTS A short across the input pins activates TTL level inputs The pins must be shorted for a minimum of 200ms or else the monitor will consider it unintentional and ignore it Provides for remote activation of the Start Stop Film Number Increase and Decrease function keys Figure 2 5 shows the connector and Table 2 2 shows the signal assignments 3 2 5 RELAY OUTPUTS The Source Shutter output is an isolated SPST normally open relay rated at 120 VA and 2A max The Sensor Shutter
18. fully grounded to effectively eliminate problems due to free electrons and RF interference The crystal holder is easily removed and installed even in awkward location in the vacuum system Once removed from the housing the crystal is still retained in the crystal holder by a snap on retainer The crystal can be easily replaced without tools at a more convenient place such as a clean bench The housing is provided with four tapped 4 40 holes for convenient mounting 1 8 diameter x 30 long inlet and outlet water cooling tubes and a coaxial connector The electrical connection to an instrumentation feedthrough is made with a 30 coaxial cable Both ends of the cable terminate with standard Microdot 5 50 type connectors Cable lengths up to 60 are available upon request with a factory modified oscillator 4 2 SENSOR HEAD INSTALLATION The sensor head can be installed in any appropriate location in the vacuum chamber preferably more than 10 inches from the evaporation source It can be supported by its integral mounting bracket furnished with two 74 40 tapped holes The internal vacuum cable supplied with the sensor kit connects the sensor head to the dual water electrical feedthrough to which the oscillator is attached The cable length from the sensor head to feedthrough connection should not exceed 60 inches Cable lengths in excess of 30 inches require a factory modified oscillator Shield the sensor cable in the most expedient way
19. little practice this allows parameters to be set to the necessary accuracy while keeping the time to go from one extreme value to another within reasonable limits The Modify up and Modify down keys are only active when a parameter is being displayed The parameters may be changed before during and after a deposition Only during a failure condition will the parameters be viewable but unchangeable 6 4 THICKNESS SET POINT SHUTTER CONTROL The TM 350 and the TM 400 provide a single shutter set point The Thickness Endpoint parameter establishes the film thickness at which the shutter will close As described above depressing the START key zeros the Thickness Display and opens the source shutter The shutter is then automatically closed when the thickness equals or exceeds the Thickness Endpoint parameter If auto control of 6 2 OPERATION 350 400 55 the shutter is not desired the Thickness End Point parameter be programmed at a value much greater than can reasonably be achieved 6 5 CRYSTAL TEST DISPLAY To view the crystal test display press the Display key until the TEST LED is illuminated With the Test display the first digit of the Rate display shows the current frequency setting 222 5 323 0 5 5 0 626 0 929 0 or 1210 0 MHz See Section 3 3 1 CRYSTAL TYPE SELECTION to change the crystal type The next digit is a dash where a blinking dash indicates the active sensor The last two di
20. not recommended and indeed can void the warranty The following sections are intended primarily as an aid in understanding the operation of the TM 350 400 and to help in isolating problems to the board level electronic components with the exception of the power supply transformer are mounted on plug in assemblies for ease of removal and replacement The circuitry is partitioned among plug in modules on a functional basis to make fault isolation to the plug in assembly level as straightforward as possible Most problems can be diagnosed to the board level without external test equipment and verified by simple board replacement 10 3 SELF TEST FAILURE DETECTION The Monitor s self test features detect several system failures The specific failures are described below Upon detection of a failure the appropriate message REPAIR AND MAINTENANCE 10 2 350 400 55 is displayed There are basically two types of system failures failures that may not be reset by the operator and those that may You cannot reset the E FAIL FAIL messages They may be cleared only by the replacement of the defective components These failures are displayed continuously and ALL OTHER SYSTEM OPERATIONS ARE DISABLED For these internal failures it is recommended that the unit be returned to the factory for repair On failures that may be reset the front panel display alternates the particular failure message and the Rat
21. possible to protect it from radiation heat released from the evaporation source or the substrate heater The water cooling tube connects to the feedthrough by brazing or vacuum couplings If necessary both cable and water lines may be wrapped in aluminum foil to extend their useful life The mounting tabs may be used to install a radiation shield to specifically protect the Microdot connector and cable at its attachment point to the head Water cooling of the sensor head should always be provided except during short depositions at low temperatures In all cases head operating temperatures should not exceed 100 C Sufficient cooling for thermal environment to 300 C can be provided by approximately 0 2 gallons per minute water flow SENSOR FEEDTHROUGH AND OSCILLATOR 4 1 350 400 THICKNESS MONITOR Use a shutter to shield the sensor head during initial soak periods to protect the crystal from any sputtering that may occur If a small droplet of molten material hits the crystal the crystal may be damaged and oscillation will cease 4 3 INSTRUMENTATION FEEDTHROUGH INSTALLATION A l inch diameter O Ring sealed feedthrough or a 2 3 4 inch Conflat flange seal are available with 3 10 inch source and return water cooling lines and internal and external coaxial cable connectors Base plate thickness up to one inch can be accommodated RF interference and free electrons are effectively shielded from the signal connector through the use of
22. the surface of the crystal produced the same effect as that of the addition of an equal mass of quartz was of course questionable and indeed work with crystals heavily loaded with certain materials showed significant and predictable deviation between the actual measured film thickness and that predicted by equation 2 Analysis of the loaded crystal as a one dimensional composite resonator of quartz and the deposited film led to the equation below TK 2 N 4 LL 2l 3 Pr AR T where R is referred to as the Acoustic Impedance Ratio and is obtained by dividing the acoustic impedance of quartz by the acoustic impedance of the deposited film This equation introduces another term into the relationship which is the ratio of the acoustic impedance of quartz to the acoustic impedance of the deposited film The acoustic impedance is that associated with the transmission of a shear wave in the material Note that if the acoustic impedance ratio is equal to one quartz on quartz equation 3 reduces to equation 2 7 2 THEORY OF OPERATION 350 400 55 Although the above equation still involves number of simplifying assumptions its ability to accurately predict the film thickness of most commonly deposited materials has been demonstrated The use of microprocessors allows an equation as complex as equation 3 to be solved economically and the above equation is implemented in the TM 350 400 The
23. 0R OUTLINE i nette teet 1 6 FIGURE2 I EM 350 FRONT PANEL e tH oo her e edet 2 4 FIGURE 2 2 TM 400 FRONT PANEL WITH DESCRIPTIONS eee 2 5 FIGURE 2 3 TM 400 REAR PANEL WITH 8 2 2 6 FIGURE2 4 OUTPUT CONNECTOR 2 7 FIGURE 2 5 INPUT CONNECTOR e RH pe 2 7 FIGURE 2 6 IEEE 488 CONNECTOR ed er epe e dp etes 2 8 FIGURE 2 7 095 DTE REAR PANEL RS 232 MALE CONNECTOR 2 9 FIGURE 2 8 DAC SOCKET 22 2404040404404010000 2 9 FIGURE 2 9 400 TOP VIEW COVER REMOVED eene eene 2 10 FIGURE 3 1 POWER ENTRY enne 3 2 FIGURE 3 2 TYPICAL SYSTEM INSTALLATION 3 8 FIGURE 3 3 RECOMMENDED GROUNDING METHOD eee 3 9 vii viii List of Tables TABLE 2 1 OUTPUT CONNECTOR PIN 55 65 2 7 TABLE 2 2 INPUT CONNECTOR PIN 55 6 2 7 TABLE 2 3 IEEE 488 PIN 55 8 2 8 TABLE 2 4 D9 REAR PANEL RS 232 RS 485 CONNECTOR PIN ASSIGNMENTS 2 9 TABLE 2 5 DAC SYSTEM INTERFACE CONNECTOR PIN ASSIGNMENTS 2 9 TABLE 8 1 CALIBRATION 5
24. 488 communications As shipped the Monitor is set up for an interface address of 1 To reconfigure the monitor for any other interface address switches 4 5 6 7 and 8 respectively of S1 need to be set as follows Interface Address S SEL 4 S SEL 5 S SEL 6 S SEL 7 S SEL 8 1 OFF OFF OFF OFF OFF 2 ON OFF OFF OFF OFF 3 OFF ON OFF OFF OFF 4 ON ON OFF OFF OFF 5 OFF OFF ON OFF OFF 6 ON OFF ON OFF OFF 7 ON ON OFF OFF 8 ON ON ON OFF OFF 9 OFF OFF OFF ON OFF 10 ON OFF OFF ON OFF 11 OFF ON OFF ON OFF 12 ON ON OFF ON OFF 13 OFF OFF ON ON OFF 14 ON OFF ON ON OFF 15 OFF ON ON ON OFF 16 ON ON ON ON OFF 3 4 MONITOR INSTALLATION 350 400 THICKNESS MONITOR 17 OFF OFF OFF OFF ON 18 ON OFF OFF OFF ON 19 OFF ON OFF OFF ON 20 ON ON OFF OFF ON 21 OFF OFF ON OFF ON 22 ON OFF ON OFF ON 23 OFF ON ON OFF ON 24 ON ON ON OFF ON 25 OFF OFF OFF ON ON 26 ON OFF OFF ON ON 27 OFF ON OFF ON ON 28 ON ON OFF ON ON 29 OFF OFF ON ON ON 30 ON OFF ON ON ON 31 OFF ON ON ON ON 32 ON ON ON ON ON 3 3 3 DAC The TM 350 400 has two DAC output channels One output is for rate and one is for thickness Each DAC channel has a selectable range which is used to convert the appropriate display to a 0 to 5 volt analog signal for more information see Section 6 8 DAC OPERATION 3 3 4 DISABLE NEGATIVE THICKNESS RATE READ
25. EDANCE a et a 8 3 COMPUTER INTERFACE 9 1 Seta RN Maie EE MU 9 92 232 SERIAL INTERFACE cotta SR 9 1 93 RS4S5SERIALINTEBEACE re deerit adea en 9 1 94 IEEE 488 PARALLEL INTERFACE ettet tet 9 2 a 9 2 BG VAD EXPES d E E E 9 2 97 MESSAGE RECEIVED STATUS ettet 9 3 98 INSTRUCTION SUMMARY db pits etenim 9 4 9 9 INSTRUCTION DESCRIPTIONS ertt ttt 9 4 REPAIR AND MAINTENANCKE 10 1 101 HANDLING PRECAUTIONS eerte 10 1 10 2 MAINTENANCE PHILOSOPHY treten 10 1 10 3 SELF TEST FAILURE DETECTION ttt 10 1 10 3 1 EPROM FAILURE E ute na i 10 2 10 3 2 FAILURE I FAIL Mis ab Galea tinct Ch ki af D S tU 10 2 10 3 3 FILM DATA FAILURE ite os an tette 10 2 10 3 4 POWER FAILURE e oscura LL Ed 10 3 10355 OSCILLATOR FAILURE O FAIL adita 10 3 1036 SENSOR CARD FAILURE S FAIL a 10 3 10 4 TROUBLESHOOTING AIDS ISOLATE INSTALLATION FAULTS 10 3 10 5 RETURNING THE TM 350 400 TO THE FACTORY 10 4 Table of Figures FIGURE 1 1 400 71 eite ttt rt eh ente ep 1 5 FIGURE 1 2 TM 40
26. INGS While 516 switch 3 is on the TM 350 400 will ignore all negative rate or thickness readings and display these values as 0 Once the monitor measures a positive change it will begin displaying the current values in real time Turning 516 switch 3 off disables this feature 3 3 5 ALLOW CRYSTAL SWITCHING TO A FAILED SENSOR 7 400 only By default while in the deposit state the TM 400 will check the state of the backup sensor before an automatic crystal switch If the backup sensor is failed the monitor will keep the primary sensor active and display an O Fail error With 516 switch 4 in the on position the TM 400 can switch to a failed backup sensor and still display an O Fail error This can be helpful if the process requires an output to be active on crystal failure MONITOR INSTALLATION 3 5 350 400 THICKNESS MONITOR 3 3 6 PULSE SWITCH AT THICKNESS ENDPOINT TM 350 Only While 516 Switch 7 is set on the source shutter pulses closed on for 1 second once the thickness endpoint is reached As opposed to the standard operation where the source shutter relay turns on after pressing Start and remains on until the endpoint thickness is reached 3 3 7 16 SWITCH SETTINGS ON OFF DAC Rate Range Select Bit 0 Refer to DAC Table below ON OFF DAC Thickness Range Select Bit 0 Refer to DAC Table below ON Ignores all negative rate or thickness readings and displays these values as 0 Disables above feature
27. LLATOR 5 SENSOR CRYSTAL REPLACEMENT The Sensor Head is especially designed for easy sensor crystal replacement and reliable operation The crystal lies in a drawer that slides into the sensor housing Pull the drawer straight out of the sensor housing by the drawer s edges between thumb and forefinger With the drawer removed pull straight up on the retainer spring clip and shake out the spent crystal Drop a new crystal into the drawer with the full electrode side down and the pattern electrode side up Make sure the crystal 15 properly seated in the bottom of the drawer Install the retainer clip by gently pressing it onto the drawer The retainer clip should snap into the drawer three retaining legs must be fully engaged onto the drawer housing Replace the drawer into the sensor housing The drawer should slide in easily and snap into place Removal and replacement of sensor crystals should be performed in a clean environment An isolated clean workbench is recommended for crystal replacement To prevent crystal contamination use clean lab gloves or plastic tweezers when handling the crystal and keep the new crystals in a closed plastic case When handling the drawer always hold it by the edges to avoid touching the crystal surface SENSOR CRYSTAL REPLACEMENT TM 350 400 THICKNESS MONITOR 5 1 350 400 55 6 OPERATION 6 1 FRONT PANEL DISPLAYS The 350 display consists of
28. NTENANCE 10 3 10 4 350 400 55 Table 10 1 Troubleshooting Aids Unit blows line fuse a Line voltage selector is not set for the line voltage being used See Section 3 2 6 b Incorrect fuse size Front Panel display never illuminates a Blown fuse b Faulty clock generator TM 400 only High Speed Counter board FAIL message can t be cleared a Active sensor number not equal to sensor connected to the good sensor 400 only b Defective cable or cables See Section 4 c Defective or overloaded sensor crystal See Section 5 d Oscillator unit connected in the wrong direction e Bad Oscillator unit f Thickness Monitor not properly grounded to the vacuum system g Wrong crystal selection J5 See Section 3 3 1 functional b Bad Front Panel Logic board Reoccurring C Fail message on power a Power up or Power down up sequencing circuit malfunctioning b RAM Power switching circuit not functioning Aged or defective battery via Input connector b Inputs not properly grounded Faulty DAC outputs Improper DAC wiring b External recording device puts excessive load on the DAC For further assistance call 714 828 4200 10 5 RETURNING THE TM 350 400 TO THE FACTORY If there is a need to return your monitor to the factory please call Maxtek to obtain a Returned Merchandise Authorization Number This number is required prior to returni
29. TAL TO ANALOG CONVERTER DAC 3 2 3 2 4 REMOTE TTL INPUTS rt etr eta HR e pr He eb t 3 2 2 22 RELAY OUTPUTS 5 epe 3 2 3 2 6 LINE VOLTAGE SELECTION AND FUSE 3 2 3 3 INTERNAL DIP SWITCHES eR o he Ep 3 3 3 3 1 CRYSTAL TYPE SELECTION etti 3 4 3 3 2 COMPUTER INTERFACE 85 3 4 3 3 3 M n 3 5 3 3 4 DISABLE NEGATIVE THICKNESS RATE READINGS 3 5 9 3 5 ALLOW CRYSTAL SWITCHING FAILED SENSOR 400 3 5 3 3 6 PULSE SWITCH THICKNESS ENDPOINT TM 350 Only 3 6 3 3 7 516 SWITCH 8 0 4 400 000 i E a iiS 3 6 3 3 8 DAG RANGE SETTINGS 3 6 34 MONITOR COVER na e ae a E E EEKE RESE 3 7 SENSOR FEEDTHROUGH AND OSCILLATOR 4 1 5 6 10 41 SENSOR HEAD DESCRIPTION ion tpe ein E 4 1 42 SENSOR HEAD INSTALLATION i ete 4 1 43 INSTRUMENTATION FEEDTHROUGH INSTALLATION 4 2 44 SENSOR OSCILLATOR INSTALLATION ertt 4 2 SENSOR CRYSTAL REPLACEMENT 5 1 OPERATION ei
30. The Tooling Factor parameter compensates for geometric factors in the deposition system which result in a difference between the deposition rate on the substrates and the rate on the sensing crystal The TM 350 has only one tooling parameter for its one sensor input The TM 400 has two tooling parameters one for each sensor Since they are in different locations they most likely will require different values The tooling 18 entered in percent units and 100 corresponds to equal rates at the substrate and at the sensing crystal For initial approximation the tooling factor can be calculated using the following equation Tooling 100 ds where dc Distance from the source to the crystal ds Distance from the source to the substrate The equation above assumes that the angle from normal between the source and sensor and the source and substrate 15 zero account for the angle of the crystal and the substrate use the following equation 2 Tooling E 48 cos dc where dc Distance from the source to the crystal ds Distance from the source to the substrate The angle of the crystal off of normal from the source s The angle of the substrate off of normal from the source This equation assumes the crystal face is perpendicular to the source Empirical calibration of the tooling factor is described in Section 8 5 2 ESTABLISHING THE DEPOSITION PARAMETERS 8 1 8 2 350 400 55
31. UREMENT 0 5 Hz 06 0 MHz TM 350 Mass Resolution 0 375 ng cm2 TM 400 6 0 ng cm 2 TM 350 0 5 1 count Sensor Crystal Frequenc 1 2 2 DISPLAY Thickness Display Autoranging 0 000 to 999 9 Rate Display Autoranging 000 0 to 999 9 Frequency 0 000 000 0 to 9 999 999 9 MHz 1 2 3 COMPUTER INTERFACES RS 232 serial port standard RS 485 serial port optional IEEE 488 bus interface optional 1 2 4 PROGRAM PARAMETERS Film Number 1002 Primary Sensor TM 400 only 102 1 2 5 1 Discrete Inputs TTL level inputs activated by a short across the input pins min 200ms pulse Start Stop Film Number Increase Decrease 1 2 6 OUTPUT CAPABILITY Source Shutter Relay One Single Pole Single Throw Relay 120 VA 2A Max Sensor Shutter Relay One Single Pole Single Throw Relay 120 TM 400 only VA 2A Max Digital to Analog Converter Rate and Thickness 0 to 5 VDC 11 bit resolution 2 or 3 Decade range GENERAL DESCRIPTION 1 3 350 400 THICKNESS MONITOR 1 2 7 OTHER Input Power Requirements 100 120 200 240 VAC 50 60 Hz 25 watts IEC T Type Slow 4 10 A 250 VAC Operating Temperature Range 0 to 50 C Physical Size Instrument Case 3 47 H x 8 4 W x 9 7 D 19 Rack mount case 3 47 H x 19 W x 9 7 D 1 4 GENERAL DESCRIPTION 350 400 55 SIDE VIEW DOWN POSITION
32. a 4 digit Thickness display a 4 digit Rate display a Source Shutter LED a Frequency LED a Test LED and a Sensor status LED TM 400 also has a Sensor Shutter LED and a second Sensor Status LED When the Source Shutter LED is on the Source Shutter relay is activated The tricolor Sensor Status LED is Green when the sensor is good and is the active sensor yellow when the sensor is good and is the inactive sensor on the TM 400 only and red when the sensor is failed When the Sensor Shutter LED is on the Sensor Shutter relay is activated The rate and thickness displays can display rate and thickness active sensor frequency or sensor 1 amp 2 test values The FREQ and TEST LED s indicate what values are being displayed and the Display key increments to the next display value If the FREQ and the TEST LED s are both off the Rate and Thickness displays show Rate and Thickness respectively If the FREQ LED is on the rate display shows the frequency of the active sensor in MHz and the thickness display shows the remaining digits of frequency in hertz If the Test LED is on the first digit of the Rate display shows the current frequency setting 222 5 323 0 5 5 0 6 6 0 929 0 or 1210 0 MHz The next digit is a dash where a blinking dash indicates the active sensor For the TEST display the last two digits of the rate shows the crystal health for Sensor 1 The TM 400 will show the same information for Sensor 2 in the Thickness d
33. and the voltage selection wheel Power Cord WARNING To avoid electrical shock always connect the power cord to an AC outlet which has a proper protective ground The TM Series Thickness Monitor comes with a detachable three wire power cord for connection to a power source with protective ground The TM chassis is connected to the power ground to protect against electrical shock Always connect to an AC outlet which has a properly connected protective ground If necessary or when in doubt consult a certified electrician Grounding A grounding lug is located on the rear panel near the power entry module Use heavy ground wire wire braid or copper strap of 12 AWG or larger to connect this grounding lug directly to a facility protective earth ground to provide additional protection against electrical shock See Figure 3 3 Line Fuses There are two 5 x 20 mm fuses mounted inside the power entry module They are accessible via the snap in cover Replace with the correct fuse rating IEC T Type Slow 4 10 A 250 VAC Refer to Section 3 2 6 for instruction to replace the fuse Power Switch WARNING Do NOT use the power switch as a disconnecting device disconnect the power cord from the power entry module to fully remove hazardous voltage from inside the TM monitor The power switch is located on the front of the TM monitor The switch is a toggle type marked with and O The on position applies the power to the
34. bytes Example To instruct the monitor to send the status data the computer would send Chr 255 Chr 254 Chr 1 Chr 4 Chr 0 Chr 25 1 9 6 COMPUTER INTERFACE 350 400 55 6 Automatic Data Logging of String Values Code 45 This instruction allows the computer to setup the TM 350 400 to automatically output selected string values to the communication port every 100 milliseconds The values sent are determined by the bit value of the message byte in the data logging instruction message Byte Bit Description Length byt Format Units es 1 0 DisplayedRate 5 6 Sensor 2Rate 5 8 Asec 0 Sensor 2Frequency 1 Herz values format including decimal points commas and negative signs For example to instruct the to output rate thickness and frequency for sensors 1 amp 2 the computer would send the following message Chr 255 Chr 254 Chr 1 Chr 5 Chr 2 Chr 248 Chr 1 Chr 255 Data logging is stopped by sending the following message Chr 255 Chr 254 Chr 1 Chr 5 Chr 2 Chr 0 Chr 0 Chr 248 COMPUTER INTERFACE 9 7 9 8 350 400 55 7 Automatic Data Logging of Binary Values Code 6 This instruction allows the computer to setup the TM 350 400 to automatically output selected binary values to the communication port every 100 milliseconds The
35. correct for the specific application measured 8 5 3 ACOUSTIC IMPEDANCE Use a heavily loaded sensor crystal with a crystal health of about 75 Deposit on the sensor crystal until the crystal health approaches 50 Measure the actual thickness of the deposition Alternating between ACOUSTIC IMPEDANCE and the Modify up and Modify down keys follow the procedure described in item 5 under Tooling Factor until the displayed thickness agrees with the measured thickness See Calibration Adjustment below ESTABLISHING THE DEPOSITION PARAMETERS 8 3 350 400 55 This calibrates the acoustic impedance for the material being deposited Table 8 1 Calibration Adjustment THICKNESS MATERIAL TOOLING ACOUSTIC DENSITY FACTOR IMPEDANCE Display is greater than actual Modify up Modify down Modify down Modify down Modify Modify up 8 4 ESTABLISHING THE DEPOSITION PARAMETERS 350 400 55 Table 8 2 Density Acoustic Impedance Values for Selected Materials om cm 2 10 5gm cm 2sec Baium 3535 40 Bismuth 98 uis Born 24 2270 524 lead 1130 7 44 ESTABLISHING THE DEPOSITION 5 8 5 350 400 55 MONITOR 26 68 17 91 Palladium 1200 2473 36 04 4 31 Rhenum 2104 5887 42 05 9 02 9 70 10 22 12 40 10 15 8 25 16 69 7 48 1 84 5 62 3 86 33 70 29 43
36. cy of uncoated crystal Resonant frequency of loaded crystal Film thickness py Density of film g cm This equation proved to be adequate in most cases however note that the constant of proportionality is not actually constant because the equation contains the crystal frequency which of course changes as the film builds up Because the achievable frequency change was small enough the change in scale factor fell within acceptable limits Improvements in sensor crystals and oscillator circuits resulted in a significant increase in achievable frequency shift Low cost integrated digital circuits THEORY OF OPERATION 7 1 350 400 55 became avallable allowing significant Increase basic instrument accuracy a result of the above two factors the frequency squared term in the scale factor became significant limitation on the measurement accuracy If the period of oscillation is measured rather than the frequency 1 period be substituted for frequency resulting in the following equation TK where T Period of loaded crystal sec Z Period of uncoated crystal sec Note Units of are cm sec Note that the constant of proportionality in this equation is constant This approach was demonstrated to be a significant improvement over frequency measurement and was widely adopted The original assumption that the addition of a foreign material to
37. ded to connect the Monitor to the equipment on which or in which the unit is mounted Use the grounding lug provided on the back of the Monitor for this purpose If trouble still persists make sure that the equipment on which the Monitor is mounted or the equipment rack in which the unit is mounted is adequately grounded to the vacuum frame Use short copper straps or braid It is a good idea to use several grounding straps attached to widely separated points on the vacuum system and equipment frame in order to minimize the inductance of the ground path Refer to Figure 3 3 for recommended grounding method 3 1 2 HEAT DISSIPATION Your Monitor dissipates very little heat Even so the heat that is generated must be allowed to dissipate or the Monitor will overheat Most of the heat generated in the Monitor is routed to the rear panel that is cooled by convection and radiation Make sure that there is adequate clearance around the unit to allow airflow If the unit is mounted in an enclosure make sure that the airflow is enough to maintain a maximum temperature environment of 50 degrees centigrade for the Monitor Overheating of the Monitor will ultimately cause functional failures and may cause permanent failures 3 2 REAR PANEL CONNECTIONS 3 21 OSCILLATOR 5 A BNC connector is provided on the rear panel of the TM 350 and 2 BNC connectors on the TM 400 for connection to the sensor oscillator The Monitor s oscillator input
38. e address will range from 0 to 32 See Section 3 3 2 for instructions on setting the TM s device address A message sent to a device address of zero will be received by all TMs except in the case of the IEEE 488 interface With this interface only the addressed device will receive the message One byte instruction code 0 to 6 Defines the code number of the message One byte message length 0 to 249 Indicates the number of data bytes contained in the message One byte checksum 0 to 255 The checksum byte is used for transmission error detection If the TM receives a message with an incorrect checksum it will disregard the message The checksum is the compliment of the one byte sum of all bytes from and including the instruction code to the end of the message If the one byte sum of all these bytes is added to the checksum the result should equal 255 If the sum of all bytes occupies more than one byte a single byte checksum can be generated using the expression checksumz Sum MOD 256 i e the checksum is the complement of the remainder byte which results from dividing the sum of all bytes by 256 9 6 DATA TYPES There are three data types stored in the TM 350 400 One byte two byte and three byte parameters data types are stored as integers in binary format with the most significant byte first The one byte data types are ASCII characters COMPUTER INTERFACE 350 400 55 n
39. e and Thickness values prior to the failure The display continues to alternate the failure until the fault has been reset The following is a summary of detected failures the displayed messages and the necessary actions to reset them Detected Failure Failure Message Reset by EPROM Failure E FAIL Replacement of defective ROM RAM Failure Film Data Failure Power Failure Oscillator Failure Sensor Card S FAIL Replacement of sensor measurement Failure card Any long term failures can cause serious thickness errors if they occur during a run To save any materials which may be in process the shutter is automatically closed The process can be continued only after the fault has been corrected and the message has been reset as described above If there is more than one failure the other failure will then be displayed When no failures exist only current display values will be displayed A description of the conditions of the individual failures follows 10 3 1 EPROM FAILURE E FAIL In the case of a failure in the TM 350 400 s program memory or EPROM the E FAIL message is displayed If an EPROM failure occurs the monitor should be returned for repair 10 3 2 RAM FAILURE I FAIL In the case of a failure in the Monitor s data memory or RAM the I FAIL message will be displayed The shutter is automatically closed since reliable operation of the Monitor is impossible until it is serviced To confirm the RAM failure cyc
40. e monitor a flashing O FAIL will be displayed indicating that the sensor is failed If an oscillator feedthrough and sensor head are available you may wish to bench check the total system at this time Obviously good vacuum practice should be observed when handling those items that will later be installed in the vacuum system Be careful not to touch the surface of the sensor crystal installed in the Crystal Holder Connect the various components as follows Use the 10 coaxial cable to connect the Monitor to the Output end of the Oscillator Use the 6 coaxial cable to connect the Input end of the Oscillator to the atmosphere side of the Feedthrough Use the 30 miniature coaxial cable to connect the vacuum side of the Feedthrough to the Sensor Head After all the components have been connected press the STOP button to clear the O FAIL message Depressing the START button will set the thickness display to zero Breathe lightly on the sensor crystal surface The displayed thickness should increase due UNPACKING amp INSPECTION 2 1 350 400 55 to condensed water vapor on the crystal The FAIL message may be reactivated if excessive water on the crystal causes it to fail Pressing the Stop key after sufficient water has evaporated from the surface of the crystal should clear the failure The displayed thickness should then decrease as additional water vapor evaporates from the surface If operati
41. equal film thicknesses at the sensor and the substrates By utilizing the tooling factor the Monitor can calculate and display film thickness and rate at the substrate rather than at the sensor 1 1 2 ACOUSTIC IMPEDANCE CORRECTION The Monitor corrects the thickness reading for acoustic impedance mismatch between the crystal and film material by taking into account the operator supplied Acoustic Impedance Parameter for the film If not corrected for errors result as the film thickness builds up on the sensor crystal The sensitivity of quartz crystals to material buildup changes with the amount of material on the crystal if the deposited material s acoustic impedance 15 significantly different than that of quartz With some materials this effect can lead to differences between indicated and actual thickness of up to 20 as material builds up on the sensor crystal 1 1 3 PARAMETER DISPLAY The Film Density Tooling Factor and Acoustic Impedance parameters are instantly viewable on demand for quick reference at any time 1 1 4 HIGH RESOLUTION AUTORANGED DISPLAY parameter displays and Rate and Thickness displays are fully auto ranged Rate measurements are displayed to resolution of 0 1 A sec and thickness to a resolution of 1 A GENERAL DESCRIPTION 1 1 350 400 55 1 1 5 LONG TERM PARAMETER STORAGE Parameters entered into the Monitor are maintained in memory for a period of at least five years with
42. er channel can be configured using the switches shown in Figure 2 9 to convert only the last two digits of the parameter thus the analog output would achieve full scale at 99 The output scale factor in this configuration is 50 mV The above scale factors are based on the assumption that the thickness display is in the 0 9 999 range Because the thickness and rate displays are autoranging the analog output of these variables will also autorange In the above example if the thickness were in the range of 10 to 99 9 the analog scale factor would be 50 mV per 10 also ten times larger UNPACKING amp INSPECTION 2 3 350 400 THICKNESS MONITOR 0350 LON AJTIN333 2 SA3M 2345 SSANMOIHL 0656 41 13GON HOLINOW SSANMOIHL Figure 2 1 TM 350 Front Panel 2 4 UNPACKING amp INSPECTION 350 400 55 OSC NL NI LON NOILONA4 79395 JISWAN WILL SALOV TWO3J OL 3501 3A SMN AJIGOW OL 30 5 HONOYHL 110825 OL 350 Wild 3HL 30 SSNIWA 3313AV Vd OL 350 AON3nO3HJ 1910 8 SUJGWAN 1531 SSINMOIHIL 31V3 AV1dSIQ 123135 OL ISN AV133 YALLNHS 324006 JHL 319901 65533084 JHL 4015 01 35 5533084 JHL 1 15 AV1dSIQ 3HL 0832 OL 350 OSE WL NI LON 1 2345 1 1 JIQI MOTIJA JALLOV NI3IJD SNIVIS 5 35 MOQNIM 553
43. ey clears a crystal failure A crystal that has failed should be replaced For obvious reasons crystals should normally be replaced well before they are likely to fail See Section 5 for the procedure on replacing spent crystals 6 7 POWER FAIL INDICATION The Monitor is designed to tolerate short duration power failures of less than 250 milliseconds During a deposition if the power is disrupted for less than 250 milliseconds then there is no disruption to the deposition However if the power is disrupted for more than 250 milliseconds the deposit is terminated And because the Monitor is designed for possible unattended operation it does not reopen the source shutter if the power returns a process disruption of this duration could seriously affect the deposition Instead the Monitor retains the value of the OPERATION 6 3 350 400 THICKNESS MONITOR film thickness at the time of power failure and flashes the P FAIL message to indicate to the operator that power was down during their absence The operator then has the option of continuing the deposition if desired by restarting the Monitor 6 8 DAC OPERATION The monitor has one rate and one thickness DAC output which are suitable for recording with a strip chart recorder or other recording device Each DAC has a selectable range which is used to convert the appropriate display to a 0 to 5 volt analog signal The four available DAC ranges are selected by setting the 516 dipswitc
44. f the pins It is on the left side along the back of the TM 350 400 s main board 5 Insert the supplied yellow jumper across J22 which is on the left side along the front of the main board See Figure 2 9 6 Replace the chassis top cover 2 3 DIGITAL TO ANALOG CONVERTER DAC CHECKOUT The built in DAC function on the Main board contains two converters allowing simultaneous recording of Rate and Thickness The full scale output of each converter is 5 volts is single ended and is referenced to ground 2 2 UNPACKING amp INSPECTION 350 400 55 In addition to the individual channel output pins there are two control pins that are common to both channels and are intended to simplify the process of setting up analog recorders Connecting the Zero control line to ground will drive both channel outputs to zero allowing the recorder zero reference to be easily set Releasing the Zero line and connecting the Full Scale line to ground will drive both channel outputs to full scale for establishing the recorder full scale calibration Each channel can be set independently to convert either the two or the three least significant digits of the displayed Rate and Thickness to a proportional analog signal corresponding to the DAC setup option chosen With the three digit setting a thickness of 0 500 would result in an analog output of 2 50 volts or a scale factor of 5 mV If more resolution is desired eith
45. fully closed coaxial cable connections A standard coaxial cable with a Microdot 5 50 connector mates the internal feedthrough connector to the sensor head The feedthrough has a standard BNC connector for the coaxial connection the sensor oscillator The feedthrough is installed in the vacuum chamber housing with the smaller Microdot 5 50 connector exposed to the vacuum chamber The sensor head is connected to the Microdot connector by a coaxial cable This coaxial cable should not exceed 60 inches Connect the 6 inch coaxial cable to the feedthrough s external BNC connector and the sensor oscillator s TRANSDUCER BNC connector Brazing or vacuum couplings may accomplish water line connections to the feedthrough 4 4 SENSOR OSCILLATOR INSTALLATION The sensor oscillator was designed to be used with industry standard 6 MHz sensor crystals The oscillator s characteristics enable it to obtain maximum life from the sensor crystal The oscillator is supplied with a 6 coaxial cable and a 10 cable The 6 cable interconnects the oscillator and the feedthrough 10 cable interconnects the oscillator and the TM 350 400 This single coaxial cable provides both power for the oscillator and the signal output for the Monitor Be careful to route the cable away from any high voltage or RF lines and away from hot or moving surfaces Cables of any length are available upon request for replacing the 10 cable 4 2 SENSOR FEEDTHROUGH AND OSCI
46. gits of the rate show the crystal health for Sensor 1 Crystal health is indicated as a percentage of crystal life remaining A new crystal will have a health of 98 to 99 health decreases as material is deposited on the crystal sensing surface TM 400 will show the same information for Sensor 2 in the Thickness display Pressing the Display key again until both the FREQ and the TEST LED s are off will change the display back to rate and thickness Displaying the Test function does not affect the normal operation of the Monitor In particular both Thickness and Rate continue to be calculated and the normal operation of the Thickness Endpoint is not affected 6 6 CRYSTAL FAIL INDICATION As material builds up on the sensor crystal a point will be reached at which the crystal will no longer be able to support oscillation At this point the crystal has failed The TM 400 will automatically switch to the backup sensor crystal upon a crystal failure and continue on from the last valid thickness However with the TM 350 or if the backup sensor is failed the monitor will indicate the crystal failure by alternately flashing an O FAIL message with the normal display The normal display can still be changed using the Display key so that the last valid thickness before the failure can be recorded The source shutter closes and the Source Shutter Indicator LED is turned off Correcting the cause of the failure then pressing the Stop k
47. h array on the TM s front panel PWB default setting 15 99 for both DAC s To select a different range unplug the TM remove the top cover and change the settings The new settings will take affect once the TM is turned on The 516 dipswitch array also controls other features of the TM as listed below Switch Description 1 DAC Rate Range Select Bit 0 2 DAC Thickness Range Select Bit 0 3 Disable negatives Disables negative rate and thickness values 4 Switch to backup crystal even if backup is failed 5 DAC Rate Range Select Bit 1 6 DAC Thickness Range Select Bit 1 y Allows source shutter to pulse close on for 1 sec once thickness endpoint is reached Both of the rate and the thickness DAC range selections work the same The following table shows the settings to select one of the four the available ranges DAC Range Thickness Rate Bit 1 Bit 0 Bit 1 Bit 0 Switchit6 Switch 2 Switch 5 Switch 1 OFF OFF OFF OFF OFF ON OFF ON ON OFF ON OFF ON ON ON ON With the range set to 999 a thickness of 0 999 would correspond to an output 01999 999 5 volts or 5 volts thickness of 0 900 would correspond to an output of 900 999x5 volts or 4 5 volts With the range set to 5000 a thickness of 1 000 would correspond to an output of 1000 5000x5 volts or 1 0 volts 6 4 OPERATION 350 400 55 select between two three digit conversion set of switches 516
48. h film can be individually programmed by setting the film number and programming as described in paragraph 6 3 Note Any failures must be cleared in order to advance to the next film SENSOR SWAP KEY TM 400 only Toggles the active sensor between sensor 1 and sensor 2 The Sensor shutter will also toggle so that it is closed when sensor 2 is the active sensor and open when sensor 1 is the active sensor Use this key with caution because you can switch to a failed sensor during a deposit thereby aborting the run and causing and O FAIL message 6 3 DISPLAY AND MODIFICATION OF PARAMETERS Display of the parameter values stored in the monitor is accomplished by pressing the corresponding parameter s key The value of the parameter is displayed in the Thickness display and the current film number is displayed in the Rate display The parameter is displayed as long as the parameter key or a Modify key is pressed and is held for about 3 seconds once the keys are released When displayed the value of the parameter can be modified by pressing the Modify up and Modify down keys The parameter key needs not be simultaneously pressed with the Modify up or Modify Down keys If a Modify up or down keys is kept depressed the rate at which the parameter changes gradually increases Thus the longer the key is kept depressed the faster the parameter changes When the key is released and then depressed again the rate returns to its initial slow value With a
49. ials can be deposited to this thickness without producing a crystal failure so that a crystal health of zero will not normally be achieved and indeed for some materials the crystal health may never get below 90 In order to establish the point at which the crystal should be changed several trial runs should be made to determine the point at which the crystal fails and subsequent crystals should then be replaced well in advance of this point Because the crystal health is determined from the calculated film mass the Acoustic Impedance parameter will affect the displayed crystal health 7 4 RATE CALCULATION The deposition rate is calculated by dividing the change in thickness between measurements by the time between measurements The rate is then filtered by a three pole digital filter to filter out quantizing and sampling noise introduced by the discrete time digital nature of the measurement process The above filter has THEORY OF OPERATION 7 3 350 400 55 effective time constant of about 2 seconds Following step displayed rate will settle to 95 of the final value in 5 sec 7 4 THEORY OF OPERATION 350 400 55 8 ESTABLISHING THE DEPOSITION PARAMETERS The following is a guide to establishing the deposition parameters Valid reasons may occur to deviate from the recommendations and these reasons of course would take precedence 81 TOOLING FACTOR
50. ing container as evidence if shipping damage is present or for possible future return of the unit Check the material received against the packing list to be certain that all material is accounted for The following items should have been included with your Monitor 350 400 instrument Operator s Manual Power cord Output cable 8 pin mini din 10 Input cable 6 pin mini din 10 optional DAC interface control unit optional m 21 If there is no evidence of damage the Monitor can now be bench checked Make sure that the input power voltage requirement is correct for your installation If not see Section 3 2 6 LINE POWER VOLTAGE RANGE SELECTION to set your Monitor for the correct line voltage When power is first applied to the Monitor all LED displays will light for about two seconds This is followed by an E FAIL message indicating that the EPROM is being tested followed by an I FAIL message indicating that the RAM is being tested The monitor will halt with the failure displayed if a fault is detected and will remain inoperative until the fault is corrected Further details of error messages can be found in Section 10 3 SELF TEST FAILURE DETECTION Assuming both tests pass the P FAIL message will begin flashing indicating that power was interrupted for more than 250 ms Pressing the Stop key will clear the P FAIL message If a working sensor is not connected to th
51. isplay 6 2 FRONT PANEL CONTROLS The front panel controls are made up of fourteen keys which are arranged in three groups The first group of six keys on the left side of the front panel are the operating keys In this group you will find the Start Stop Shutter Display Film Number and Sensor Swap TM 400 only keys The second group of two keys in the center of the front panel are the Modify up and Modify down keys which are used to change parameter values and the active film number The third group of six keys on the right side of the front panel are the parameter keys These keys are used for the display and modification of parameters which is described in the DISPLAY AND MODIFICATION OF PARAMETERS section below The following describes the function of the operating keys START KEY Sets the thickness display to zero opens the source shutter and sets the active crystal equal to the primary crystal for the current film STOP KEY Closes the source shutter Also used to clear failures such as P FAIL O FAIL etc OPERATION 6 1 350 400 THICKNESS MONITOR SHUTTER KEY Toggles the source shutter relay output DISPLAY KEY Switches the rate and thickness displays between Rate and Thickness Frequency and TEST display modes FILM NUMBER KEY Used to display and modify the current film number When pressed current film number is displayed in the rate display and is changed by pressing the Modify up and Modify down keys Eac
52. jury do not operate the monitor without its cover installed in place MONITOR INSTALLATION 3 7 350 400 THICKNESS MONITOR 104100 134 NOSN3S cf 5 35 f uosN3s 100 H31VM SM 1NALNO AVI3Y YALLNHS 329005 ILNAWOD WNWINIW OL JONVISIG 05 35 01 32 05 YITIONLNOD 01 Q3103NNOO 33030039 41415 71138 Figure 3 2 Typical System Installation SYOLVTIIOSO JOSNAS XALLNHS WLSAYD 303 JAWA YILLNHS JILVWNINd 001 54 YALLNHS 1 15 442 0 3105 YOLVNLOY YALLNHS 3024005 10 3105 2 3119 35 8 WALSAS 9 JOYNOS NOILVJOdVA3 M3linHS 328005 YALLNHS 1 15 42 H9603H10334 13094 S QV3H YOSN3S 3 8 MONITOR INSTALLATION 350 400 55 Bolt copper strap to the G ground lug of the TM monitor 1 shown sink two grounding rods into the earth approximately six feet apart Locate these rods as close as possible to the vacuum cabinet 2 Measure the resistance between the rods If the resistance is greater than 3 Ohms consult an Electrician specializing in grounding systems If the resistance is 3 Ohms or less connect a length of copper grounding strap to the system s central grounding point which should be somewhere on the
53. le the AC power to the unit The monitor will recheck its memory and if failed will again display the I FAIL message If the I FAIL message is not displayed on power up the second time the problem may be intermittent and it is recommended that your monitor be returned for repair 10 3 3 FILM DATA FAILURE C FAIL The C FAIL message indicates that an error has been detected in the film data storage area of the RAM and could not be corrected When such an error is detected the parameters of all the films are automatically tested and set to default REPAIR AND MAINTENANCE gt gt N TM 350 400 THICKNESS MONITOR if out of range The monitor should not be started until the user has checked all of the parameters for the desired film In the event of a C Fail the shutter is automaticallv closed since reliable operation of the Monitor is impossible until the bad data is corrected 10 3 4 POWER FAILURE P FAIL Since power interruptions seriouslv effect your run indication of significant AC line disruptions is provided bv the P FAIL message The shutter is automaticallv closed if a run was in process It mav be continued once all other equipment is functioning normallv again bv depressing the STOP kev Note that it is normal for the power failure message to flash when the unit is first turned on Press the STOP to clear this message 10 3 5 OSCILLATOR FAILURE O FAIL An Oscillator Fail message indicates an i
54. mproper or missing signal from the oscillator The problem is most likely with the sensor crystal however failures in the oscillator coaxial cables Feedthrough or sensor head can also generate this failure message Pressing the STOP key once the cause has been corrected clears oscillator failures 10 3 6 SENSOR CARD FAILURE S FAIL The S FAIL message indicates that the sensor measurement card has failed or is not installed If this failure occurs then either the sensor card should be replaced or the monitor should be returned for repair Press the STOP key to clear an S FAIL message 10 4 TROUBLESHOOTING AIDS TO ISOLATE INSTALLATION FAULTS The following table describes possible problems that could occur when interfacing the Monitor with a vacuum system With each symptom 15 a list of probable causes If you should decide to remove the Monitor cover read Sections 3 4 and 10 1 carefully before doing so WARNING To avoid electrical shock or personal injury disconnect the power cord before opening the cover on the power entry module WARNING Do NOT use the power switch as a disconnecting device disconnect the power cord from the power entry module to fully remove hazardous voltage from inside the TM monitor WARNING All standard safety procedures associated with the safe handling of electrical equipment must be observed Only properly trained personnel should attempt to service the instrument REPAIR AND MAI
55. n 8 RTS is a control input signal In this implementation pin 7 CTS means what is says namely this is an output control line and when the TM 350 400 asserts this control line true the host can transmit to the TM 350 400 On the other hand pin 8 RTS is not quite what it may seem because this is a signal input to the TM 350 400 and it is intended that the host should assert this line true only when the TM 350 400 is allowed to transmit data to the host The TM 350 400 does not generate an RTS request to send as such for the host PC so the host should assert pin 8 true whenever the TM 350 400 is allowed to transmit to the host without being asked to do so The TM 350 400 s RS 232 port is automatically set up to operate with the following specifications 9600 Baud 8 Bit data No Parity 1 Stop bit 9 3 RS 485 SERIAL INTERFACE The optional RS 485 serial interface of the TM 350 400 allows connection of up to 32 separate devices equipped with RS 485 RS 485 serial interface is also ideal in electrically noisy environments and in applications where long cables are required The RS 485 port of the TM 350 400 is the same D9P connector on the rear panel used for RS 232 The pin layout is shown in Figure 2 7 and Table 2 4 lists pin signal assignments including a definition of whether the signal is an input or an output of the TM 350 400 The TM 350 400 s RS 485 port is automatically set up to operate with the f
56. ng your monitor to the factory You are required to show this RMA number on your shipping document It will help us track and ensure proper actions will be made to your monitor REPAIR AND MAINTENANCE 350 400 55 REPAIR AND MAINTENANCE 10 5
57. ollowing specifications 9600 Baud 8 Bit data No Parity 1 Stop bit COMPUTER INTERFACE 9 1 9 2 350 400 55 9 4 488 PARALLEL INTERFACE optional 488 interface provides 350 400 with the ability to communicate with computers and other devices over a standard IEEE 488 interface bus The IEEE 488 interface also known as GPIB or HPIB provides an eight bit parallel asynchronous interface between up to 15 individual devices on the same bus This means that one computer equipped with an 488 interface card can communicate with up to 14 monitors or other devices The pin layout of the IEEE 488 port 15 shown in Figure 2 6 and Table 2 3 lists pin signal assignments including a definition of whether the signal is an input or an output of the TM The RS 232 serial port can still be used with IEEE 488 installed However since both interfaces use the same input and output message buffers they should not be used at the same time This will result in communication errors 9 5 PROTOCOL communications between the computer and the 350 400 are in the form of message character strings with the format Two byte header FFh FEh i e Chr 255 Chr 254 The header indicates the beginning of a message One byte device address 0 to 32 The device address byte defines the bus address of the instrument that sent or should receive the message The devic
58. on seems abnormal check to see that the stored parameter values are reasonable The following parameter values are suggested SetPoint Thickness 10 00 Material Density 2 650 gm cubic cm Acoustic Impedance 8 830 Tooling Factor 100 096 If everything responds as described above the total system is OK If not refer to Section 10 REPAIR AND MAINTENANCE 2 2 INSTALLING OPTIONS Options are most easily installed while the TM 350 400 is on the bench Figure 2 9 shows the location of the various options 221 488 OPTION BOARD Remove the chassis top cover 2 Locate IEEE 488 option slot and remove the slot cover 3 Carefully slide the connector of the IEEE 488 board into the slot 4 Plug the 20 pin ribbon connector into the J7 connector on the Main board and then secure the board in place using the screws that came with the board 5 Replace the chassis top cover and apply power to the monitor 2 2 2 RS 485 OPTION Remove the chassis top cover 2 Locate the IC socket labeled 01 It is on the left side along the back of the TM 350 400 s main board Remove the device from this socket This will disable the standard RS 232 interface 3 Carefully insert the supplied IC labeled U2 RS485 into socket U2 being careful no to bend any of the pins It is on the left side along the back of the TM 350 400 s main board 4 Carefully insert the supplied IC labeled 04 RS485 into socket U4 being careful no to bend any o
59. only benefit this command over command 5 18 that the binary values at the maximum resolution of the instrument where the string values are not The values sent are determined by the bit value of the message byte in the data logging instruction message es 0 ActiveSensorRate 3 Byte Description Length byt Format Units 1 Active Sensor Thickness 3 JBina 2 Active Sensor Period 4 Binary 3 Sensor IRae 3 Binary 4 1 Thickness 3 JBina 5 Sensor amp lPeriod 4 6 Sensor 2Rate 3 Binary 7 2 Thickness 3 Binary A AJU 0 Sensor 2 Period 0n Active Sensor 1 1 String None gt area ng cm 2 Sensor 2 Mass per unit area ng cm 2 values are sent in Binary format with the most significant byte first To convert this to decimal use the following formula Decimal Value Sum of Byte n 256 Y 1 where n goes from 1 to Y and Y is the total number of bytes that make up the value example say you receive the four following bytes representing mass per unit area 0 10 250 76 This equals 0 256 3 10 256 2 250 256 76 0 137 ng cm 2 98 562 7 ng cm 2 The rate and thickness values are in the normal units of Ang and Ang sec Sensor period however is in special units Use the following form
60. out power Short term power loss will not require parameters to be re entered 1 1 6 MULTIPLE COMPUTER INTERFACES Supports RS 232 standard RS 485 or IEEE 485 1 1 7 COMPACT CASE Available in either a bench top model or with a standard 19 rack mounting kit 11 8 DAC OUTPUT Dual Digital to Analog converter outputs provide data for recording Rate and Thickness data simultaneously 1 1 9 MULTIPLE CRYSTAL FREQUENCIES The Monitor is designed to accept 2 5 3 5 6 9 amp 10 MHz sensor crystals and nominal AC line voltages of 100 through 120 or 220 through 240VAC at 50 to 60Hz 1 1 10 BUILT IN TEST The Monitor incorporates built in test functions to guarantee its operational integrity and to aid in fault isolation in the event of an internal failure 1 1 11 DYNAMIC MEASUREMENT UPDATE RATE The Monitor utilizes a dynamic updating scheme where the update rate is automatically varied from 0 5 to 10 measurement updates sec depending on the deposition rate The update rate will increase for high deposition rates where fast response is important Conversely the update rate will decrease for slow deposition rates to maximize the measurement resolution 1 1 12 AUTOMATIC CRYSTAL SWITCHING TM 400 ONLY Allows the use of a dual sensor head so that upon crystal failure the unit can switch to a backup sensor to complete the film 1 2 GENERAL DESCRIPTION 350 400 55 1 2 SPECIFICATIONS 1 2 1 MEAS
61. re 6 1 61 FRONT PANEL DISPLAYS aa aa 6 1 62 6 1 63 DISPLAY AND MODIFICATION OF PARAMETERS 6 2 64 THICKNESS SET POINT SHUTTER CONTROL 6 2 65 CRYSTAL TEST DISPLAY dehet n citer ben etre 6 3 66 CRYSTAL FAIL INDICATION 05 6 3 67 ctun tue eee te 6 3 65 tut 6 4 THEORY OF OPERATION 7 1 71 BASIC MEASUREMENT ettet tte ttt nn aa 7 1 72 FILM THICKNESS CALCULATION roseo ren gusti et Gets 7 1 73 CRYSTAL HEALTH CALCULATION 7 3 74 E E 7 3 ESTABLISHING THE DEPOSITION PARAMETERS 8 1 Sa a ha 8 1 82 SENSOR NUMBER TM 400 ONLY 8 2 g3 DENSI ccc nectar A G aa EE 8 2 S4 ACOUSTIC IMPEDANCE dedu eoram EUM 8 2 85 EMPIRICALCALIBRATION a E tai 8 2 8 5 1 MATERIAL DENSITY CALIBRATION tete 8 3 892 TOOLING FACTOR CALIBRATION A tear eh at 8 3 85 3 _ ACOUSTIC IMP
62. rt rnit a 1 3 1 2 2 DISPLAY iie e erum OSEE EE 1 3 1 2 3 COMPUTER INTERFACES ts re eee t RH 1 3 1 2 4 PROGRAM eir ee a o 1 3 1 2 5 INPUT CAPABILITY rU ER re 1 3 1 2 6 OUTPUT CAPABIELITY dc REP RERO RR 1 3 1 2 7 OTHER Saa qa SI rr E a Ru UR 1 4 13 ACCESSORIES citt 1 7 UNPACKING amp INSPECTION eese entente entusiasta tasas tasa tatu 2 1 2 1 BENCHGHEGCK QOUT 5 5 re REO rt ttes eee ttp reae IER 2 1 22 INSFALLING OPTIONS 2 2 2 2 1 IEEE 488 OPTION BOARD nennen nennen renes ens 2 2 222 RS 485 OPTION 2 2 23 DIGITAL TO ANALOG CONVERTER DAC 2 2 MONITOR nonna sins a 3 1 3 1 MONITOR INSTALLATION 3 1 3 1 1 PROPER GROUNDING eee Rena e Reg 3 1 3 1 2 HEAT DISSIPATION reete or REP ea b 3 1 3 22 RBAR PANEL CONNECTIONS niit etr p irr 3 1 3 2 1 OSCILLATOR CONNECTOR S nnne tente teen en 3 1 3 2 2 488 OPTION BOARD optional eese 3 1 3 2 3 DIGI
63. ther than that covered by the applicable specifications Maxtek assumes no liability in any event for consequential damages for anticipated or lost profits incidental damage of loss of time or other losses incurred by the purchaser or third party in connection with products covered by this warranty or otherwise DISCLOSURE The disclosure of this information is to assist owners of Maxtek equipment to properly operate and maintain their equipment and does not constitute the release of rights thereof Reproduction of this information and equipment described herein is prohibited without prior written consent from Maxtek Inc 5980 Lakeshore Drive Cypress California 90630 SAFETY WARNING standard safety procedures associated with the safe handling of electrical equipment must be observed Always disconnect power when working inside the monitor Only properly trained personnel should attempt to service the instrument N Safetv Precaution and Preparation for Use Input Power Requirements The TM Series Thickness Monitor can be set to operate one of the following line voltages 100 120 200 or 240 VAC at line frequency of 50 or 60 Hz Maximum power consumption is 25 watts See Section 3 2 6 for instruction to select line voltage Power Entrv Module The AC alternating current power entrv module located in the rear panel of the TM provides connection to the power source and a protective ground It also holds the fuses
64. tic data logging of string values 6 Intermalcommand 0 02 Intermalcommand 0 02 9 9 INSTRUCTION DESCRIPTIONS The following is a description of the valid instructions along with an example of how they are used All the examples assume the device address 15 1 1 Remote activation of monitor Code 0 This instruction initiates a key press of the TM 350 400 s keyboard The valid key codes are shown in the following table 8 bDisayky 0 0 O Film key Format Header Instruction 1 Length 1 Key Code Checksum Example Example of a remote start message Chr 255 Chr 254 Chr 1 Chr 0 Chr 1 Chr 1 Chr 253 COMPUTER INTERFACE 350 400 55 2 Send monitor hardware configuration Code 1 Instructs the monitor to send monitor configuration data to the host computer The following 18 description of the configuration data Length bytes Maxtek TM 350 Software Version X XX 1 RS232 2 RS 485 3 IEEE488 Total 36 bytes Example To instruct the monitor to send the hardware configuration data the computer would send Chr 255 Chr 254 Chr 1 Chr 1 Chr 0 Chr 254 3 Send film parameters Code 2 Instructs the monitor to send the parameters for film n to the host computer A description of the film parameter list is in the table below Bytes Offset Position D Primary Sensor 1 2
65. ula to convert period to frequency Frequency Hz 3 221E15 Period Where the period value is converted from the four byte binary data as shown in the example above To instruct the TM to output sensor 1 and sensor 2 period the computer would send the following message Chr 255 Chr 254 Chr 1 Chr 6 Chr 2 Chr 128 Chr 1 COMPUTER INTERFACE 350 400 55 Chr 118 The TM will return two four byte values containing sensors 182 period Data logging is stopped by sending the following message Chr 255 Chr 254 Chr 1 Chr 6 Chr 2 Chr 0 Chr 0 Chr 247 8 Internal command Code 7 9 Internal command Code 8 10 Internal command Code 9 11 Set active film Code 10 This instruction allows the computer to set the active film number The message must be in the following format Format Header Address Instruction 10 Length 1 1 byte Film 1 100 Checksum COMPUTER INTERFACE 9 9 350 400 55 10 REPAIR AND MAINTENANCE 10 1 HANDLING PRECAUTIONS Integrated Circuits I C s can be damaged by static discharge into their inputs This static discharge is the same phenomenon that produces the unpleasant shock when one grabs a doorknob after walking across a carpet The likelihood of static buildup is proportional to the dryness of the air and can be particularly troublesome in cold dry climates or hot desert climates
66. umeric values 0 255 8 bit registers Some of the multiple byte data types are decimal values stored as integers To convert these values to their decimal equivalent use the following equation Decimal Value Integer Value 10 DP Where DP the value s decimal point position The decimal point positions for all the parameters are constant and are given in tables along with the parameters range 9 7 MESSAGE RECEIVED STATUS Following the receipt of each message the monitor will send a one byte received status message indicating how the message was received with the following format Header Address Inst 253 Length 2 Instruction Code Receive code Checksum A value of 253 for the instruction byte indicates that this is a received status message The Instruction Code byte indicates the instruction code of the message that was received The following table shows a list of possible receive codes O o O Invalid message length Parameter s out of range Invalid message COMPUTER INTERFACE 9 3 9 4 350 400 THICKNESS MONITOR 9 8 INSTRUCTION SUMMARY The following table is a list of valid instruction codes Instruction Code Description ______0 Remote activation o ooo O 1 Send monitor configuration f Sendafilmsparmeters o O o O pi Receive a film s parameters 0002 224 Send monitor status S SSS O 5 Hitiate automa
67. vacuum system 3 Silver solder the other end of this grounding strap to the rods DO NOT rely on mechanical connections Star Washers are recommended to be use in between the front panel mounting angles and the rack The star washers will cut through the paint providing four additional ground points between the TM and the instrument rack System Grounding Point Bolt copper straps to clean bare metal Copper Straps should be as wide as practical preferably a 1 copper sheet or a 1 braid Building Floor Grounding Rods 6 ft apart Copper clad steel 34 dia x 8 ft minimum Figure 3 3 Recommended Grounding Method MONITOR INSTALLATION 3 9 350 400 55 4 SENSOR FEEDTHROUGH AND OSCILLATOR 4 11 SENSOR HEAD DESCRIPTION The Sensor head is designed for simple installation and easy crystal replacement It consists of two parts a water cooled 304 stainless steel housing which is permanently positioned in the vacuum system and a quickly removable gold plated 304 stainless steel crystal holder which snaps into the housing The crystal holder accommodates an industry standard 550 diameter crystal This design provides several convenient features in performance and use The crystal holder is thermally shielded by the water cooled housing insuring excellent crystal performance in temperature environments up to 300 C The exposed crystal electrode is
68. wn in Figure 2 9 are 2 DIP switch packs 5175 switches control Crystal Frequency selection and Computer Interface Address settings 516 switches control the DAC scale enable disable negative thickness readings in the Rate and Thickness displays allow disallow crystal switching to a failed sensor input and allows the source shutter to pulse close on for 1 second once thickness endpoint is reached WARNING Under no circumstances should the Monitor cover be removed without first removing the line voltage cord as dangerous voltages are present inside the case To make any changes to these settings first remove the cover as described in Section 3 4 Once your changes have been made to replace the cover and restore power to the Monitor Changes will take effect only after the unit has been restarted MONITOR INSTALLATION 3 3 350 400 THICKNESS MONITOR 3 8 4 CRYSTAL SELECTION The Monitor is compatible with 2 5 3 5 6 9 and 10 MHz sensor crystals The DIPswitch pack S1 is used to set the Monitor for the particular sensor crystal frequency to be used As shipped the Monitor is set up for a 6 MHz sensor crystal To reconfigure the monitor for any other frequency the switches 1 2 and 3 respectively on the front panel need to be set as follows S SEL 1 S SEL2 S SEL3 OFF OFF OFF OFF 3 32 COMPUTER INTERFACE ADDRESS The TM 350 400 allows for computer interfaces between 1 and 32 for RS 485 and IEEE
69. y 1999 Fifth Edition May 2000 Sixth Edition October 2000 Seventh Edition June 2002 Eighth Edition February 2003 Ninth Edition December 2003 Tenth Edition October 2004 Revised January 2005 Revised July 2005 Eleventh Edition August 2005 Twelfth Edition October 2005 Maxtek Inc warrants product free of functional defects material workmanship and that it will perform in accordance with its published specification for a period of twenty four 24 months The foregoing warranty is subject to the condition that the product be properly operated in accordance with instructions provided by Maxtek Inc or has not been subjected to improper installation or abuse misuse negligence accident corrosion or damage during shipment Purchaser s sole and exclusive remedy under the above warranty is limited to at Maxtek s option repair or replacement of defective equipment or return to purchaser of the original purchase price Transportation charges must be prepaid and upon examination by Maxtek the equipment must be found not to comply with the above warranty In the event that Maxtek elects to refund the purchase price the equipment shall be the property of Maxtek This warranty is in lieu of all other warranties expressed or implied and constitutes fulfillment of all of Maxtek s liabilities to the purchaser Maxtek does not warrant that the product can be used for any particular purpose o

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