試験研究報告書・平成24年度版
Contents
1.2. 2 WIN LASER M300 30 0
3. CAE CAE
4. 2 2 1 2 1 1 0 71mm Smm 2 0 71mm gt Smm S 10mm 10mm
5. 2 2 1 2
6. 75 LPS Development of microfluidic chips and electrochemncal cells for measurement of LPS
7. 2 2 1 1 052 0 1mm 0 05 0 1mm o3mm 60mm 1 6umRa B
8. 24 2 pH 2 1
9. W W
10. CAB CAE CAE
11. J
12. 3 XYZ 3 XYZ 2 3mm
13. 6 6 98 3 1 7 2 3 3
14. Key words 1
15. 7C Nk 3001056
16. 31 Cs Bq kg O 1cmzmol 1 4 2
17. 5 CAE
18. 1km Us 2013 24 SCOPE ICT 1
19. 10 CFU g 11 10 CFU g 3 2 2 400G MVC Brix
20. 130 1 8 30 22
21. 122 2 Bluetooth 2 45GHz I EEE802 15 1 1 2 3 10 0m 10m 1m Bluetooth 1 10m
22. 5 1 1 4 2
23. 5 24
24. 5 60Hz 800mm 15 0 1 3 10 6 e 0mm 600mm 1 10 1 100 6 22 16 10
25. 2 4 CAE 3 3 1 2 e20 I 3 Smm 2 3 Smm
26. PTC PTC Positive Temperature Coefficient 130C P PC PTC BaTi0
27. 2 7 2 2 1 2 1 10 FRP
28. B 50 6 6 B 270 B B 270 2 7 B
29. 3 2 6 JIS 77 3 6 10mm
30. 3 17 4 18 5 19 6 20 7 21 8 22 9 23 23 No 9 24 3 5
31. 1 100 1 1 000 8 30 10 g 30 10 g Brix60 Aw0 83 Brix50 5S8 Aw0 81 Brix
32. 2 2 1 y he 7 y Sv h 7 yy Svh cm 9 cm 0 08uSvyh 1 7mm p 11 35Sgcm 0 6MeV y 0 1178cm7g 11
33. Me 5 102 type 1 6
34. 2 125
35. 2 FCD FCD600 130HV 230HV HV 400 750MPa 10GPa 20MPa 1 2 2 Vo NZ lt 34 Ei ls
36. CAE 123 g L AL AL L 10 6 1
37. 1 CERP pp 1 4 2011 2 CFRP 24 CFRP 3 16 FPGA Development of the industrial machine control system using FPGA
38. 8 209 2 12V 8 LED 4 nl
39. NoC OM 1 C 1 8 1 pp 19 520 2009 2 Network on Chip http casfukuoka is env kitakyu u ac jp files matsutan1 kyushu2008 pdf
40. BaTiO0 Cz0 4HO AM IO Ba OH 2 Ti0 gt BaTi0 H20 1 K Iwase et al 5o7 6e7 Sci Technol 2012 64 1 p 170 177 LNG LNG 162C 1 600 LNG ya
41. CCT 3 5 CAE CAE CAE IVR Scheil Guliver mt CCT JMat Pro 3 CCT SCM43 SNCM439 SNCM630
42. Z Z Z 2 1 ZEISS CNC UPMCSS0CARAT 1 1 U1 0 5 L 900 U3 0 8 L 600 L mm 81 1 20 1C 55 10
43. Key words 1 23 3 2
44. 100 pH6 0 60 80 vy 80 30 50 vV y 50 3 4 1 3 4 2 70 Vy 0 3 5 70 vVV 2
45. eo 4 X BsD 1 OM 7 FEM 5 3 2 6
46. Key words 1 1 1 UV JIS K 5600 ABS
47. 2 3 4
48. 6 type1 type 2 7 1
49. 3 P 6 a P HBRE NEY A T LE 39 1 00 sy 1 6 0 98 o96 4 1 4 KK 1 3 0 94 1 2 0 92 1 1 0 90 1 0 0 6 0 7 0 8 0 9 1 k b 100 1 0 0 98 0 9 0 96 0 8 0 94 0 7 0 92 0 5 4 9 90 0 5 0 88 oa L 0 86 0 3 0 84 0 2 0 82 0 1 0 80 0 0 4 6 8 10 12 14 16 18 n 6 a
50. e100um 150nm 40um p Key words PDMS 1 1 Lipopolysaccharide LPS LPS
51. 0 06mmyrev 0 12mm rev 2 0 03mm rev 17 CV 96 0 gm CY 7 9 gm Mo 9 8 7 6 5 4 3 2 1 Mo 9 8 7 6 5 4 3 2 1 1 pm rm 5ll 5I V50m min f0 03mm rev V100m min f0 03mm rev pn V150m min f0 03mm rev x5OD 17 50m min 100m min 150m min
52. 23 2 2 1 Ni i a
53. 114 lt gt LC 2 2 lt gt 2 3
54. 2 Skm h 2 3 1
55. Key words 1 5 24
56. 750 2 BaTiO 2 2 PTC 2 1 BaTiO Sr Pb Ca La Si Mn Smme 1 320 1 2 3 2 1 BaTiO SEM BET 2 2 BaTiO BaTi
57. 1 1 880mm 2 7m 2mm 400kg
58. 350 3 10 ET TT TD mii NK NN SN WI SN TI NHI nti N AustenitiSation teimperature C 860 0 6 S 500 400 3 Grain Size 9 0 ASTM a SCM435 es Time s WN ll Ii NR I SS Nl 3 S00 Nl NM O 600 WI Ss 400 Nl 300 Austenitisation temperature C 860 0 Grain Size 9 0 ASTM b SNCM439 1000 10000 100000 Tirme 5 a ll 8 TT N NN I NN
59. Pe I Cockcroft amp Latham cmax s 4 Onax C2 49 CAE 5 p35 3mm A C A R C B 0 0 001 0 002 0 003 6
60. 2 4 SCM435 CCT 0 33 C 0 38 C 60 C sec 80 C sec 850 6OO 8OC s 450 400 350 300 gt g 6OC s 033 C 100 4 SCM435 5 CAE CAE
61. 2 a gt TF 4 MTT Sou 1 LEH3 2 115 2 5 i 5 3
62. 2 2 1 1
63. 200 10 1 2 2 1
64. 24 10 27 28 2 012 2 2 1 3
65. TMCP 4 1 1 MPa 9 TMCP 400 600 20 25 _ 600 800 1200 1500 a 1000 1500 _15 20
66. 1 2mm 40um Curren e 6A 9 2 0 0 2 0 4 0 6 0 8 1 1 2 Potential V vs Ag AgCl 11 40m 78 9 Mn PBS Wn PAP Current e 6A 0 0 2 0 4 0 6 0 8 1 Potential V vs Ag AgCl 12 20um 3 LPS gq100um 150um 40um e100um LPS PAP
67. 65 35 W W 3 W 140g W 4 7 a lt ve lt rd v rs ca 4 W
68. 6 2 TTPTTTETTTT um mR RE Er 3 10mm 3 4 4 3 4 2 3
69. 2 2 1 2 2 3 20 14 4 5 S55 C 6 7 2 3 Brix Aw 25 novasina TH S00
70. pH Brix Key words 1
71. JST 24 2 2 5m 2 1 CAE m mm CAE CAE CAE
72. Ni Cr Mo e40mm JIS nl CAE
73. 8 LPS 7 6 1 7 9 2 8 1 1
74. 330usg 1Hz 10 2 i 1 No 1 1 0E6 10 98 10 95 No 2 gg 1 0E6 10 98 10 98 No 3 350 8 0E5 28 22 27 42 No 4 150 8 0E5 28 20 28 14 i Sa II 000 E10 sh hs i y 22 0 lt HH Te TI EIN EIN TAI IN 100 lh e 1E
75. 116 Production of the back panel for news releases that the slogan future from Fukushima is written 300106 3833202 7
76. 10 20 2 1 4 ABS 1 1 2 2 2 2 1
77. 2 2 2 28 35 35 40 C 10 13 1kW ABS 104 3 3 2 3
78. CAE 53 CAE 3 4 CAE CAE 2 CAE CAE CAB CAE CAE 2 CAE CAE
79. 2 2 2 2 1 a 2 2 2 pH 30 BB Di ppm ppm j ppm 0 1 000mgL
80. CAE 24 25 2 2 1 CAE 2 2 3
81. 10 11 3 4 FCD FCD 10 12 13 13 10 19 12 y 1S0HV 330HV 25 15 CAE 13
82. 10m 1 mio 10m mee OO i
83. 4 5 4 1 125g 69 0Lm 5 1 913g 3 1 2 3A dm 1 3 3
84. a A op ote bh a 8 4 103 Japanese lacquerware Droduct development that can be proposed to young age
85. ED T gt ht w ET 7 type2 8 2 1
86. 5 5 1 CA 0 0 0 0
87. nm nm R 1
88. 25 nl 1 2 3 CAE 3 FEM FCD 10 19 7 CFRP 2 Investigatlons on Tools and Processing condition for CFRP by Drilhng 2nd Report
89. 400Bqkg 25 4 3 Cs 137Cs Bq kg 109 6 400 200 Cs Bq kg 0 5 10 15 20 g 2 3 2 3 2 1 3 100 30 90 3 CE27G 3 2 2 pH pH
90. 25 26 3 4 25 26 2 3 25 1 4 26 2 4 2 74
91. a b 2 1 8m 2 No 2 9 035ml WN a 3 100 3 3 1 3 1 1 L 4 a L 1 A emo 0 4 b B nM 2 10 4 cC 4 4 20 12 000rpm
92. 18 B 1 1 A 0 02 0 015 0 01 mm revl EE 0 03 0 0 12 50 100 150 0 005 0 01 m min 1 B 19 270 18 0 02 0 01 EE mm rev 2 m 0 03 rk RH m0 06 gt 0 01 m min 0 12 0 02 0 03 19 270 B
93. 3833202 UV 126 2 4 2 0 1 2 2 5 9 963 0215 1 2 024 959 1741 02 9589 1786 024 959 1741 024 959 1737 024 959 17838 024 959 1739 A X 024 959 1761 NE 960 2154 3 024 593 1121 024 593 1122 F A Xx 024 5983 1125 965 0006 8 8 1
94. Cb 2 2 sw
95. 3 4 2 4 3 NN 0 ae a 7 4 NC 96
96. 30 12 3 5 1 3 7 4 3 3 Im n O D d g 100 100 100 100 100 g 17 25 13 17 25 mD 100 100 100 100 100 8 1 1 6 8 1 1 4 0 mm m 8 0 23 0 85 0 85 0 31 0 54 11 0 15 0 38 0 54 0 54 0 46 6 0 8
97. 6 4 1 JIS 2 FCD AC4CH
98. 7 W W 10 8 3 8 Cs 10KBq Nal TCS 172B 1mm A PN C0 1 1cm 9 10 W 1
99. 7 24 9 3001036 3833202 118 ei C AE 1 5mm
100. 200m 120
101. 3xo 99 7 Q O gr 6 i K 0 i 7 1 x 0 37 1 1 2 3 2 5m
102. 10 10 9 R 11 12 0 01 0 1mm R 0 1mm 25
103. CAE CAE CAE CAE CAE
104. The design adapting the technology of sliced veneer wallpaper Key words 1 2
105. X CT CAD CAE CAE FRP CAE FRP
106. 726mm 736mmx246mm 1 36 2mm 1m m 2 a As Eo 7 10 12 13 3
107. 8 6 7Bq g 62Bq g Key words 1
108. 0 1mm 5 5 25 0 08uSvh SE A OY Cpe en 3 3 1 JIS Z4501 Z4819 K6736 1m y Cs10kBq CU
109. Research for high level synthesis of network on chip structure NoC ITRON4 0 OS TOPPERS JSP 3x3NoC OS PID NoC Key words NoC OS 1 ECU
110. 19 a MN OS i SoC 1 TOPPERSJSP MPU Key words FPGA SoC MPU FPGA SoC System on a Chip SoC 1 MPU
111. W W W 1 pp 51 53 2006 3 Development of a light and easy to use radiation shield Measurement of surface contamination and assessment of shield by dose rate
112. 1mm m m PDMS 240g 1 35 20g 1
113. 24 26 2 2 1 CAE CAE CAE 2 2 CAE CAE CAE CAE CAEB 3 3 1
114. 3 QX Y Z Z 2 2 3 X Y Z 1
115. Key words 1 _ 1 2 1 1 A
116. 1 2 Cs 10kBqJ 3 Key words 1 JIS cpm
117. 1 2 0 3 51 Establishment of the Microstructure Control T
118. CFRP 2 2 2 1 1 2 CFRP A B
119. 1 CAE 1 30 27 51 51 239 266 333 266 3 2 CAE 80ug 7 250us NC UN Eo EE i EH 1 1 EE EE i I EN EN J TI EDL EL MI EE IE II n 142 a 1
120. EBSD CAE CAE 23 25 2 2 1 CAE 0 2 1
121. 2 100 GFT OS a 100 7
122. PT bath4 0 7 2 3 6 8 9 5
123. 0 a 6 47 oz 77 o6447 3 HG es Ww 2 7 5 6 Ar fo Arduino 0 8 N ca F gt ee h a mr 3 a a 0 au a 2 3 2 Smart Project Arduino UNO 3 ADXL345 LPY530AL 3 5 Bluetooth 28
124. 26 CO PVwya JIS 5 9 MO RI 2 OO OO Cs10kBq PR RC RC
125. 9 12 B 1 12 150 0 03mm rev V50m min V100m min V150m min 4 12 13 150 100mm min 0 03mm rev f0 06mm rev f0 12mm rev
126. 5 e30 1mm 2mm 3mm 4mm 4 0 3mm 5 3mm NN PP CAE i 5 1 2 3 4mm 3 3 Archard
127. FPGA 2x2NoC 2 Niosll e Avalon interval NI_ timer Bridge 2 on chip memory 64KB NiosII avalon
128. 9 10 77 Em 1 G WW 9 10 40um LPS p PAP 20uM PBS 11 PBS PAP 0 8V PAP 20um 12 PAP PBS
129. 1 1 2 1 97 2 2 4 NC 3 4 5 3 4 5 3
130. 3 2 2 1 Adobe Illustrator 2 12mm 12 15mm 0 3Smm 0 5mm 2 022
131. 4 33 Development of Shallow Ground Thermal Energy System 10m
132. C CERP 2 CFRP 2
133. START IGOAL OV RI LL NO ML i RE EAA I EA A OCH EONAR AR 1 1 Kas dB RF GS 1 56 3 2 3 120kmh 60km h 80 2 60kmh 75 100
134. gc 24 4 4 1 24 ABS ABS
135. 10 6 2 3 3 1 CAE CAE 2 3 eo180 1 2 3 14 85 23SHz 3 4 1m 100N 100N m 5
136. LPS LPS LPS LPS 2 2 1 LPS LPS 100um LPS LPS LPS
137. 1 2009 2 Cactl http www cacti net 37 Promotion of Recycling Fly Ash 130 22 Key words 1
138. ce CCT 1 ep CCT A i RE M a i i M 1 CCT CCT PE RC CCT
139. NR EFCOS 5 WO SS OS RTOS C FPGA Field Programmable Gate Array TOPPERS JSP TOPPERS ITRON4 0 OS
140. 600 800MPa 1200 1500MPa 2 5 1000MPa
141. 0 1 0 1 50
142. Key words 1 23 3 SC
143. CAE IT CAE SCM43 SCM440 SNCM439 SNCM630 4 CAE CAE 45 CAE 25 24 CAE
144. SNS 12 13 14 8kHz 12SskHz 4kHz 30dB SNS 1 1 DB 1 Z Z 12 2 f 13 SNS 58 8 SNS
145. 4 270 A 4 A V50m minf0 03mm rev V150m min f0 12mm rev 50m min 0 03mmyrev 270 45um 150m min 0 12mm rev 23um 270 2 5 45 40 m 30 mm rev W 25 0 12 20 0 06 150 100 m min 5 270 A CFRP
146. EFA 1 FA 100um 1 FA 3 3 1 FA 2
147. gt FRP FCD 3 4 CAE _ 6 3 3 3 7 8
148. 0 013mm A 4 1 A 2 B A 20 0 12mm rev B 50m min 100m min 150mymin 14 CY 34 2 xm CY 48 5 nm No 9 9 6 5 4 3 1 No
149. a 15 Ra 0 86um 45 20 20 40um Ra 7 533um UD CFRP
150. 30mm 7 0 02uSvh 0 91uSvh 7 4 4 1 5 2 3 0 2uSvyh IAEA y 1cm
151. EBSD CAE CAE
152. 1 1995 2 11 2 pp 26 42 1964 3 2008 4 pH 67 pp S0 1 2001 83 3 pp 210 214 1988 6 9 107 3 pp 191 196 2012 7 3 7 3 pp 89 96 1939 8 53 11 pp 854 859 1938 1 Establishment of painting techniques using Japanese lacquer and gold dust to use a rubbe
153. 1 2mm 20um 40um 2 2 4 4 20um IE 6 7 3 8 2 2 3 40nm 0 036cm
154. CSeL72B 1 mswh 1 Pa 3 4 SD n mm 1 24 Hr 2mm 2 2 NO 2 2 6
155. 2 2 1 Cs 13 700Bqkg 16 200Bqkg 18 2 00Bq kg Cs Cs 124Bq kg 89Bqkg 102Bqkg 30 10 Smm GM 2 2 Cs 2 400 1 300Bq kg lkg 1L 0 8 NaCl
156. 2 SEM FA 3 nl FA10 FA25 8 FA7S rg 1 i yj 0 2 0 0 1 1 100 7 FA Ps0 85 0 7 lt P lt 0 85 mmP lt 0 7 5000 co 43 2 4 4596 4000 40 35 3000 30 hs ee 2S ooo 20 15 Fs 1000 10 A ce 0 0 8 FA P 0 85 P 0 7 P 0 85 1 10um 10 25um 23 75um 3 2
157. W 2 W W 2 W 20 2 3 8um
158. a Key words BB 200m 1 1 2 50 150m
159. 124 LPS LPS L P S PDMS NoC RTOS Real time operating system
160. 4 5 R 0 0460 R 0 0449 6 1 2 DD 4 Y _ l Re IR 0 050 0 050 gt Rr 0 048 OU 048 gt Rr 0 045 4 OU 045 gt Ri 57 RD 6 4
161. 3 0 1 3 4 1 NR ER RN EE NE SR ES 3 8 2 4 1 1 ee ee 4 5 1
162. 93 0 90 8 11 3 3 2 3 3 1
163. 3 70 Study on the durability of the paint for product development using those colored photopolymerizable copolymer purified product that contans the Japanese lacque Key words
164. 75 0 10 0 03 0 06mmrev a 0 12mmyrew MR 550 B 11 mn rev 0 12 270 45 0 0 06 0 03mm rev 0 03 V50m min V100m min V150m min 150 100 m min 7 270 B 50 3 2 A 8 270 100mm min 6 1 0 0 11 V100m minf0 06mm rev 8 V100m minf0 06mm reVv A
165. 2 3mm 4 C AE C AE Computer Aided Engineering
166. 1 ICP 10 2 um um EIC Ei 5 mm dl 2
167. 35 82 H16 H22 1 2 3
168. C 1mm CFRP 3 10 3 2 3 MM 40 15 30 60 90 150 210 270 KH 7700 C SZX12 CFRP UPMC550 3 3 1 A
169. 1 CAE CAE 2 3 CAE CAE JMatPro 55 2 A research and d
170. 4 3 3 1 2 Na 25 2 pH 5 94 2 0 1 0 1 26 9 mg L 3 2 i 3 42 3 0 1 0 1 26 9 0 1 5 3 1 5 0 2 0 5 11 2 2 84 1 0 1 405 0 1 0 1 9 2 13 2 9 76 2 0 1 329 0 1 0 1 11 4 13 5 6 70 3 80 8 63 4 14 7 0 1 0 3 12 4 1 11 4 0 1 417 0 1 0 1 12 7 13 5 9 03 5 0 1 374 0 1 0 1 12 1 11 6 11 39 6 0 1 435 0 1 0 1 8g 9 13 7 8 22 7 0 1 379 0 1 0 1 13 3 10 5 7 52 8
171. Bluetooth 2010 2013 2 70 he
172. 1 pp 17 20 2012 2 59 ITS Japan 11 ITS Proceedings pp 205 210 Dec 2012 3 43 Mar 2013 4 ISO26022 Road vehicles Ergonomic aspects of transport information and control systems Simulated lane change test to assess In vehicle secondary task demand 2010 09 01 S National Highway Traffic Safety Administration Visual Manual NHTSA Driver Distraction Guidelines for In Vehicle Electronic Devices Docket No NHTSA 2010 0053 6 2012
173. 27 28 29 JPA 28 2 29 4 3
174. 7 Cockcroft amp Latham x 8 A B C 1 237 439 611 MPa R C MPa 1000 900 OO 7OO 6OO A R 500 400 300 C 0 05 1 15 2 7 C O
175. ICS 2000 2 2 3 3 3 1 3 1 1 21 000 Bq kg 3 1 2 8 12 000 15 000Bq
176. pH6 0 13 9 4 S 2 2 3 3 1 Brix Aw 30 180 180 14 Brix Brix
177. FPGA 2 9 MPU FPGA SoC PWM OS TOPPERS JSP 1 a 2 1
178. 3 Syh NG 1 25 pp 8 2012 2 22
179. 200um 18mm 1 2mm 1 2 4mm 2 PDMS 4 5 a 5 PDMS 6 2 4mm 2 3 7 outleD 1 2mm 1 5 1 2mm 02
180. 10 10 g 10 10 g 30 80 vy 100CFU g Bacillus 80 v v 20 5 Bacillus 12 3 4 2
181. Key words 1 24 3 CSI UE 1 2 2 1
182. 6 10 6 e 100mm 10 1m 16 lm 30 0 12 5 100 150 200 300 mm a Omin 200 400 600 0 12 5 100 150 200 300 mm b 1min mm c 3min mm d 5min 200 400 600 200 400
183. Cr Mo pH 3 3 4 4 1 2 9 98 5 9 8 2 18 1 90 9 9 0 3 40 4 79 6 7 9 4 69 2 65 1 6 4 90 4 54 3 5 4 6 107 46 0 4 6 7 117 40 9 4 1 8 124 37 4 3 7 9 133 32 8 3 3 10 141 28 8 2 9 TotaL 57 1mg 5 6 8 3 Wa 66 et we i a la 20 10 1 2 3 4 5 6 7 8 9 10 5 10 9 8 7 6 4
184. F G P G 1 00 4 DB 63 84P 20 F G gt 1 0 3 3 pH pH pH pH 4 pH4 3 4 8 5 7 6 2 Brix82 S 20 1 pH4 3 pH48 pH5 7 pHG62 pH4 3 pH4 8 pH5 7 _ 7 gt A 4 i i 8 4 PP i 1 5C 20C
185. 3 pH Brix Brix 2 3 2 2 50mL PP 5 20 C Brix 20 SV 10 HPLO Migtysil NHL 4 6mmID 250mm Sum
186. 7 6x10m7g SEM 1 2x10m7g 1 1 2x10 m 8 3 3 2 BaTiOs BaTiO La 2 BaTi0 BaTi0s 3 4 20 175 3 BaTiO 130 PTC
187. 8 5 1 8 9 NN 2 MNNWNensueee 9 9 3 9 4 1 0 0 5 RR EE Ee i 10 4
188. 70 1 2 3 70 70 9 30 Or 10 kN 29 15 10 0 2 3 4 OO 1 0 20 3 0 4 0 50 mm mm 3 CAE 4 0 14 1 030 1 020 1 010 u 4 3 2
189. FEM FRP FEM FEM 0 1
190. 2 2 3 x 3 9 1 CAE se re 1 1 20mm oc hl 2 3 CAE
191. FPGA HITRON TOPPERS nan DLAI TI FA 4 VV VI ES a i J ny i P W N 4 F VVIVII 1 Pe el FPGA 2 Terasic DEO Nano FPGA FPGA Altera CycloneIV E EP4CE22F17C6N FPGA 2 FPGA LE 22 320 74kB PLL 4 IO 153 FPGA LED 8bit PB
192. 1 8cm 27 0 4cm 12 4 2 8cm 17 6 8cem 41 0 8cm 0 9 2 1 3 5 CL 1
193. 2 3 4 5 6 7 8 SNS 2 23 1 1 4
194. 4 ae BW 2 SW gt SW gt i in ie a EE i i en cw we 3 2 2 726mm 736mmx246mm 36 24 3 gt OC 5 7
195. 3 1 lt gt lt gt lt gt lt gt
196. 11 14 3 1 2 1 2 2 No 3 1 3 2 SUS 30 35 C 4 14 5 No 2 6 No 3 7 No 4 9 No 6 10 No 7 11 No 8 12 No 9 13 No 10 14 No 11 3 3 3 2 No 3 1 SUS 30 35 10 3 2 15 23 1 15 2 16 19 No 5 21 No 7 22 No 8 3 4 3 2 3 3
197. 1 uim um PDMS PDMS 2 2 1
198. 200x200um L 200x100um 200x400um L 100x100um 4 12 3A dm_ 1 200x200 um g 1min 3min mIin 1 895 1 913 737 1 847 2 200x100m g 1min 3 min 5min 822 1 143 550 3 200 x400 um g 1min 3min Hmin 2 347 2 539 2 033 4 100x100 m g Hmin 549 679 317 1 3 3 30um 3 1 4
199. X CT CAD CAE CAE CAE CAE
200. NIMS 1 800 C 50 1 500MPa AFM M22 1 800MPa 2 Co CAE 3 2 CCT
201. 105 C 24 2 1 2 3 5 100cm3 40g 34Cs 137Cs 2 1 3 100cm3 40g 2 1 4 100cm3 10g 70 C 3
202. 0mm 10mm 110mm 210mm 310mm 410mm 3 0mm CNC 3 11 5x10 1 K 3 3 1 10 10 83 11 No 1 6 1 4 H24 9 H23 2 6 H2S 3 2 0 1 6 1 gk 0 8 0 4 0 0 1 2 3 4 5 6 11 6
203. 14 FA 3 1 a FA SEM b c FA qd FA 1 c FA FA FA 2 2 1 FA SEM 10um FA10 10 2Sum FA2 23 75um FA75 3 FA
204. CFRP CFRP UD CFRP UD 0 790 7 62 eG 2 16 22 B 50m min 0 03mm rev 1 gm x2 DO0 00 X50 00 i EE bat NT ek 0
205. H 1 Key words 1 1
206. W a 5 si ha EN A gt W Cg 15cm 100 8O 6O 40 20 0 6 2 5 1 5 3 150 W nm 6 mw 2 5 W W W W 3 W W W g 200 150 100 0 7 W 2 6
207. RDG 2 3 SS 1 20 CC 3 9 WW a 1 2 3 100
208. 3 3x3NoC 9 79 NoC CycloneIII FPGA CycloneIII EP3C120F7800 486kB 2x2NoC 64kB 128kB 2 2 0S NoC OS
209. Applicaton of Fatigue Strength Design and Strength Guarantee Technology to the Gigantic structure in LNG tank LNG m CAE Key words CAE 1 70 90 1970 80
210. Cs 4 Cs 1 7 9 1Bq g Cs 8 Cs Cs H 9 H 9 62Bq g Cs 4 Cs Cs 8
211. 4 2 2 112 CC 2 3 30W O LC 100 30W 100 1 000mm P 5 6 6
212. Brix80 3 4 3 CD eh Eh bh 0 ME 1 lat 1 0 Brix 25 4 26 4 25 6 27 0 HT rix 83 7 83 1 80 2 83 1 Py 100 100 gt 100 100 2 5 72 5 72 5 72 5 72 0 62 0 65 0 67 0 tC 99 3 85 5 89 92 4 2 CDED 72 0 62 0 65 0 67 0 Oo1 05 10 lt 01 05 10 5 C 4 20 C 14 110
213. No 1 5 Glucose 8 000rpm 10 Cs 171Bqkg 300mL 1 30 S3 8 000rpm 10 Ge Cs Cs 1 032Bq kg 2 3 8 Cs 12 9S0Bq kg 30g 200mL Glucose 8
214. W 3 1 W Key words 1 Cs
215. 10 1 11 ORB 60 50 4o 30 0 10 8 9 Match Point 2000 Count 8 10 11 ROI 5 ROI ROI 36 70 ROI ROI 100 00 38 55 100 00 43 85 100 00 33 90 100 00 38 95 7
216. 6 1 0 6 7 1 0 8 8 ee 1 1 2 1 SE EE EE EE 1 1 4 9 1 1 7
217. ITS ISO26022 NHTSA 2010 0053 1 3 N1l oO A 6 a 5 2 1 1 100km h 3 1 1 120km h 1 60km h 60km h 82 9dBml 80 5 3 4
218. Cs Cs Cs Cs Cs Cs Cs Co 2 Cs 87 Cs 8 H 9 Cs Cs 6 7Bq g
219. 0 35mm 100 13 ES 9 10 11 1 WIN LASER M CLASS 11 113 CommemoratiVe medal production of local tradittonal arts Award 24
220. 4 8 2 5 2 3 2 2 8 82ZE SW 2 25 28 80BCSSBE SS 5 6 4 P
221. BaTiO nl 1 2 750 2 3 BaTiO PTC BaTiO 4 3 BarTi 1 MC 2 A STEP PTC 1 K Iwase et al Sol Gel Sci Technol 2012 64 1 pp 170 177 2 H S Gopalakrishnamurthy et al Inorg Nucl Chem 1975 37 pp 891 898 3 H Niimi et al 7 A4m Ceram Soc 2007 80 pp 1817 1821 4 G Liu et al J Mater Sci 1999 34 pp 4439 4435 63 LNG
222. W SEM Cs 2 2 1 1 W KBE 903 W 0 6 150um 8 150mm W PE 1 2 2 W
223. ee 1 6 7 2 6 7 0 SHz 2
224. 2 CTT1 CH i PHT1 kg 3 2 2 3 0 88uSvyyh 0 48uSvh 1m 0 57uSvh 0 46uSvh 20 1m lt 2 3 nSvh 1 88 0 48 1mm ns7 0 46 4 8cm 60
225. P 2 P ABR YT ZN EE P 0 85 SEM 3 1 22 pp 1 4 2011 2 23 pp 30 31 2012 Examination of Reuse Technology for Blectrolyttc Processing Waste Flud
226. 40 45 120 24 JIS K S600 1 1 1 1 A 2 1 B 3 1 C 4 D 5 E ETTT EZ ST sus EE ET 1 19 2 2 2 4 JIS K 5600
227. 62Bqyg Cs Cs 1 TODAY pp 24 2013 01 2 Kuwahara C Fukumoto A Nishina M Sugiyama H Anzal Y Kato F Characteristics of cesium accumulation in the filamentous soil bacterium Streptomyces sp K202 Journal of Environmental Radioactivity 102 2 138 144 2011 3 14 pp 2 Conduct research to Improve the high quality of Japanese lacquerware to avod reputational damage
228. 6 HK L _ 100 100 100 100 100 100 100 100 100 g 13 16 17 22 25 30 15 22 30 m 100 150 100 150 100 150 150 150 150 6 6 6 8 8 11 11 6 8 11 3 v w 1 20 14 3 3 Brix Aw 30 12 10 CEU g 30 6 1 10 1
229. Bq kg es 120 100 a gs0 60 40 20 0 WW uu uu uu i uu wu No 1 Bq kg 1200 1000 soo 7 600 3y bg 400 200 2 3 3 8 Cs Cs 86 Cs Co 3 4
230. lt 100 100 1 2 3 2 2 le 10 1 2 5 2 3 6 4 7 6 9 7 10 Dd kh 8 11 9 12 3 10 13 3
231. W ra SEM 5 W DP w 2 8hm AE 2 4 W Sum W 6 3um Sum
232. 9 CAE CAE 8 a A SN TN Ny N SR y a 7 3 kN 70 1 2 mm ET 0 9 10 11 3 CAE
233. 1mm 10 3 1 121 CAE CAE C AE
234. 3 1 http www preft fukushima jp keienshien ninaite1kusei 22 nouSsagyouannZenn nousagyo 1ko pdft 2 http www pret kagoshima p a
235. 7 8 9 2 3 16 3 4 5 6 e 7 8 9 10 12 14 s 15 16 17 we 18 19 21 23 25 27 28 29 30 92 Production methods of Shio koji that is salt reduced and kept for a long time
236. X Y Z 3 Z Z 2 Development of the radioactive sabstance decontamnation method of farmland The examination from the biological technique
237. 4 5 6 9 8 3 6 1 9 4 3 PR 1 HP 2 UV
238. 5 6 7 7 2 4 2 4 1 P 2 4 2 8 2 OO 3 Fe 8 3 R nl
239. Pt 2 2 Ga 2 3
240. R 1 NoC NoC OS NoC CE C NoC 6 NoC NoC OS 2 NoC 2 1 NoC NoC 0
241. 6 35mm A B 1 50 100 150m min 3 0 03 0 06 0 12mmyrev 3 9 2 2 2 16 CFRP 200x200 x t4 mm F6343B 2ply UD 3252S 25 0 90 x7 14ply 2 M V5B CFRP
242. 25 19 S00HV 1500MPa 4 14 5 16 4 13 14 CAE 4 CAE
243. 24 3 9 20 0 IE 1 6 7 2 3 AIA 7 7 8 Future From Fukushima 8 9 2 4
244. RESTful Web 15 16 1km SNS 0 ICO 9 14 WW SNS HTML aScri HTTP GET Json 4 HTTP POST 15 SNS 4 2013 Google ZENRIN 16 1km SNS 9
245. um d 2 2 76 T a 3 3 2 130um 10um PDMS
246. 75 CHiCN 1 0mL min LRE 30 10uL 70 60 40 SU 140 67 108 3 3 1 HPLC 3 2
247. oe3mmx11 5mm 40mm Z ZEISS 2 46g 3 3 2 2 2 4 4
248. 20 21 JIS B 7440 2
249. 2kmyh 30 2 2 2 20msec 0 SHz Hz
250. 30 Na 1 1 1 10mL 100mL Ni Cr Fe Nb Mo Na 4 2 3 1 1 19 1 TP220 LANXESS H 2 S930 4922 PUROLITE Na 3 S950 PUROLITE Na 4 Ambersep GT74 SUPELCO H 5 DIAION CR1 1 Na 6 DIAION CR20 H 7 TULSION CH 90 THERMAX Na 8 TULSION CH 93 THERMAX Na 200mL 3 50mL 2
251. 600mm 300mm 590mm 3 2mm SN NN NN 1_I NNNNNN 2 2 2 3 Pt100 36 Pt100 2
252. SEM 2 2 a WU m 2 FA SEM a FA10 10 m b FA25 10 25 m c FA75 25 75 m 1 c FA75 FA25 FA10 2 38 2 2 FA FA PITA 3 3 5 3 4r y 1 0 91 0 79 0 60 FA 0 3 1 0 4
253. pHS 8 Brix31 2 pH 10 ER DA EC TINME RS 2 2 200g 400mL 55 7 300U g koji CR21G 9 000rpm 10 No 2 ADVANTEC
254. 3 2 CFRP CFRP Key words CFRP 1 CFRP 3 CFRP
255. UD CF U D FPGA FPGA Field Programmable Gate Array 119 MPU Micro Processing Unit MP U CPU MPU CPU MPU TOPPERS Toyohashi OPen Platform for Embedded Real time Systems
256. 2x2NoC PID OS TOPPERS JSP 7 2kB 1 1 2kB 10ms 30ms 2 3 3x3NoC Fat Tree 2 NoC 2x2NoC 2 2 2
257. 1 3 C 109 10 5 2 a 1
258. 5 pH pH 1 0 5g 1 0g 50 230Bq kg pH 2 6 2 100 1 1 5 94 amp di 88 6 9 Bg BU 9 0 50 100 150 200 min 0 5g Cs 10ppm pH 6 3 HU
259. ECU 1 NoCO NoC NoC NoC ECU NI
260. D 35 24 48H 2 35 24 48H 2 1 4 A D 33 C 24 48H 70 2 D A B C D 3 1 A B 2 C D 80 2 2
261. 2 PTC BaTiO Sr Pb Ca La Si Mn 1 BaTiO BaTiO PTC 2 2 1 BaTi0 PTC Iwase BaTiO 100mmol nm 500 mL 100mL 500mmol ye 100mmol 500mmol 600mL
262. CCT CAE CAE 3 3 CAE CAE CAE CAE CAE
263. 4 pH 1M 1M 90 pH 3 2 3 5g L 5 3 2 4 3 1 1 350Bq kg
264. 9 5 10 5 10 5 10 5 10 Brix 31 2 34 0 37 9 32 2 35 8 33 0 35 6 36 7 37 3 Brix 80 7 79 2 79 8 80 1 78 7 81 7 82 8 81 8 84 8 P 77 5 50 5 41 6 68 0 47 6 gt 100 gt 100 56 0 gt 100 75 0 62 5 56 7 74 2 60 8 80 8 79 2 75 0 66 7 67 0 55 0 51 0 60 0 58 0 70 0 64 0 65 0 59 0 89 3 88 0 89 9 80 9 95 4 86 6 80 8 86 7 88 5 DEy 67 0 55 0 51 0 60 0 58 0 70 0 64 0 65 0 59 0 5 3days Gdays 1Odays 14days A 5C ce i 5 10 5 10 5 10 5 10 gt lt 3days 10days 14days B 20 C 3 2 Uy 6 5 10 5 10 5 10 5 10 86 5 73 2 36 0 812 57 8 758 51 5 71 6 53 6 5 0 5 7 7 6 35 52 7 7 14 0 34 4 3 25 0 10 0 14 7 a e 19 9 33 3 8 5 11 1 16 7 15 3 36 9 16 4 345 50 8 8 63 6 598
265. pp 34 40 2011 1 2 Development of a simplified device to alert the tumble and fall of the tractor Key words Arduino 3 1
266. 70 Vvy 8 100 30 12 103 g 20 Brix60 Aw0 83 Brix50 58 Aw0 81 1
267. Cs 3 3 1 10 107g 10 107g 10 107g GM Cs 5 7 9 21 3 2 21 Cs Cs Cs Cs 171Bq kg 1 032Bq kg 1 2 Cs 30 Cs
268. 4 CFRP 2 CFRP 1 A B 2 A 3 B 4 A B B A 4 1
269. 4 2 y 1cm JETRO 10 y y
270. 8cm 2 2 1 2 1 1 7 15mm 7 15mm 10 16mm 8cm 4cm 8cm 2 1 2 1 Co 60 100kBq TSC 172B
271. 1 2 10 2 4 A D 10 6 3 2 TE NRE WV 2900 DN 1 2 3
272. 4 4 on 3 i i 01 05 1 0W 79 1 72 2 71 6 84 0 14 0 18 8 19 6 10 1 5 5 5B 0 5 B2 3 71 6 84 0 3 5 3 5 3 6 86 5 79 1 3 EC
273. Cact 1 LAN PC csv 4 NN 3 Temperature YOKOGAMA 26 24 TNI i 22 20 18 cH1 12 CH2 a CH3 200mm CH4 400mm 4 CH5 200mm 2 CH6 400mm The 06 00 Thu 12 00 Thu 18 00 Fri 00 00 Fri 06 00 CHl Current 18 36 CH2 Current 21 36 CH3 Current 22 37 cH4 Current 24 00 CHS Current 21 93 CH6 Current 22 83 Averade 17 80 Averade 20 41 Averade 22 31 Averade 23 97 Averaqe 21 74 Averade 22 56 Maximum 21 17 Maximum 21 50 Minimum 12 73 Hinimum 14 06 Maximum 22 90 Maximum 24 50 MaXimum 23 23 Maximum 24 57 Hinimum 21 90 Hinimum 23 60 Hinimum 20 37 Minimum 20 54 4 Cacti 3
274. 2 2 1 2 1 1 2 1 2 2 1 3 4 IPA 20 w0
275. 2 gi jl1 gi 7 1 a b C d e f g h k g 100 100 100 100 100 100 100 100 100 100 100 100 g 0 0 0 17 22 26 25 30 38 25 30 38 ml 100 150 200 100 150 200 100 150 200 100 150 200 0 0 0 8 8 8 11 11 11 11 11 11 5 30 J T 90 10 a OO 1 Brix NaCI 15096 2Z0096 2 g 11 100 0 15 0 38
276. 20mm 2 3 2 7 YZ XY 40 7 eS5mmxS0mm Z 60mm X 150mm 210mm 8 X 210mm 2 X X 9 SmmxS0mm Y 40 8 9
277. 70 4 300mL h 1L 1 5 137mg 1L i a 4 1 2 200mL 57 1mg 3 70 1
278. X Y gxgy z gz 1 3 180 tan Y x gz 1 Sd 9 gx gy gz 3 2 2 IIR 29 272 22 7 7 2 7 2Z i a ic 1 b212 b22z lt T b 7 Z 45
279. 0 9uSvh 1 2 1 3 4 30 5 A B C D wuSvh A B C D B A C D BA U00 2 1 4 1 8cm 2 2 28 8cm nSvh 3m 1m 3 3 1
280. 25 BaTiO 2 5 BaTiO 1532 3 3 BaTiO PTC BaTiO Ba Ti Ba T 1 00 BaTiO Ba Ti 1 100 000 10 000 Ga 3 1 000 2 100 10 20 40 60 SO 100 120 140 160 180 Temp C 3 4 BaTiO PTC
281. 4 16 2 2 2 2 1 22 2 4mm 2 360 45 3 X Y Z 240mm 151mm
282. NoC 2x2NoC 3x3NoC FPGA 32kB 3 OS 3x3NoC OS NiosII IDE 3 3X3NoC 3 NoC OS NoC 2x2NoC 3x3NoC NoC PID
283. 3 0 2 CAE 2 3 FCD CAE 1 um
284. b n 6 0 73 1 0 75 P 0 85 n 6 b z 12 P 0 86 P 0 85 6b 90 8 P lt 0 7 7 8 3 FA P 0 85 0 7 P 0 85
285. 50 CAE 12 R RO 3m 3 5 150 II 0 Ye NE a p Y 50 0 693 2 139 25 CAE 2 MPa _ 90O 0693 134 0693 134 451O O693
286. 24 SUS O 2 2 1 SUS SUS IPA 1000 1 30 35 S 10
287. I HI 2 ICP AES 2 2 2 2 2 1 ICP AES 1 000mg L 2 2 2 ICP AES iCAP6300 Duo Ni 231 604nm Cr 267 716nm Fe 239 940nm Nb 309 418nm Mo 202 030nm Na 3S89 592nm pH HM 16S 2 2 3 ICP AES
288. 4 3 Wpe 1 type 2 2 4 3 101 nn 5
289. EN CN I EC RS 119 CAE Establishment of the Product Development Technique by Multi Scale Simulation CAE Key words CAE 1 Ze 3 CAD CAM CAE
290. Development of micro patterned molds used in mcrofluidic chips for measurement of biomolecules Key words
291. Study on Mantenance of the Traceability of the Coordinate Measuring Machine 3 Keywords 1 6 3 23 3
292. X Y Z 10 XY 0 45 45 3 4S 8 24 0 8 43 8 45 8 3 72 CNC 5 Ne 145 8 5 72 82
293. 1 19 1 SoC CQ Interface 20053 6 2 19 pp 13 16 2008 3 TOPPERS http www toppers jp 19 Development of a light and easy to use radiation shield Development of a flexible radiation shield using tungsten particles on mcrofiber cloth W W W W W
294. 1 3 J O 2 A L 1 2 2 2 2 L 2 b 1 2 No 1 33 No 2
295. 5 PWM MPU NiosII TOPPBRS JSP 6 rpm s TO rpm s rpm 5 CW CCW 18 6 4 SoC 7
296. o oc 4spergillus oryzae 4spergillus usami mut shiro usami oe
297. 105 Development of Deburrmg Technology for Thin and Deep Holes Key words 1
298. 1995 2 60 2 p18 22 1965 3 55 9 pp 61 65 2012 Interior design using the material of the region Key words 23
299. 24 9 11 7 2012 A 17 4 Sep 2012 PTC Development of raw powder for high performance PTC thermistor by utilizing the water soluble barium titanate precursor PTC PTC PTC Ba Ti
300. SoC 1 ke NT EN ii lt 4 7 SoC PWM FPGA 150 rpm s 150 rpm s 300rpm 150 CW SoC FPGA
301. 10 6 5 3 2 66 0 11umRa MM 1 6umRa 3 490mm 3 491mm pe _ 05 3 496 04 _ 3494 03 23 492 5 MH 349 i a 9 488 0 0 10 20 30 40 50 60 SD 0 10 _ 20 30 40 50 60 7 6 1 2 L 20 NO a 3 107 Crystallization control of natural sweetener made of koji
302. 100 Brix Brix 4 nl
303. 72 1 1 3 1 1 20 CV 20mm 0 TRH DM3L 2 3 2 3 1 66 6 632 5mm
304. ls 30 7 Blank Cs Cs B 2 4 Cs Cs Cs 5 Glucose Cs 229Bqkg 8 Pepton Yeast extract 2 1g Cs 800ml 30 5 8000rpm 10 Ge Cs 105 2
305. 100mL 35 Re 2 000 1 BG 2 6 PG 3 40 60Hz 1 5 2 1 60Hz 2 5
306. 0242 39 2100 0242 39 2976 0242 83839 2978 F A Xx 0242 39 0335 T972 8312 23 32 0246 44 1475 F A Xx 0246 43 6958 URL http www4 pref fukushima jp hightech E mail hightech info pref fukushima lg jp
307. 3 2 mw 3 6 1 98 2 10 28 8 200mL 57 1mg 3 4 5 7 a 5 198 1 153 22 6 2 101 49 0 3 79 9 59 6 4 64 5 67 4 5 60 8 69 3 6 62 4 68 5 7 64 1 67 7 8 65 9 66 7 5 Ni 137mg 43 h 7
308. DRE 0 0 0 2 3 8 9 6 7 10 8 9 10 CU 7 8 9 10 4
309. 3 1 PG PG BG 3 6 U Re 2 000 40wt Re B 5 C
310. 4 nl 1 1 10 2 Pt100 Cacti 2 3 PG EG 3 PG EG KIMNO 00 4 16 lm
311. 1 pH pH4 8 5 7 6 14 5 20 3 pH6 2 14 pH4 3 14 pH4 3 pH4 3 3 4 Brix Brix 6 BrixS2 76 2 ya Brix Brix Brix Brix Brix Brix 6O0O 67O 7OO 730 _76O 0
312. 1 00 Key words PTC 1 PTC PTC PTC BaTiO PTC 1 500 BaTiO BaTiO PTC
313. 27 0 0 9 3m nl 1 11 2 pp 111 117 2012 2 11 1 pp 78 85 2012 29 Development of a method for decontamination of radioactive cesium separation and concentration by physical and chemical methods
314. 2 Key words CAE 1 2 8mm CAE CAE
315. Cs Cs 229Bqkg Cs 3 Cs 3 7 13 4 Cs Cs Bq kg e 100 80 60 3 Bq g Bq g g 70 10 60 8 50 40 30 4 _ 8 20 0Q 2 10 0 0 No 4 5 8 H 9 62 Bq g Cs
316. E 0 8 MH 0 FA10 FA25 FA75 0 2 10 um 100 400 3 FA 10 FA10 A23 FA7S 5 LL 1l Ea 4 FA 0 7 FAIO FEA25 FA75 0 5 9 gm WW 5 FA FA 1 0 2 0 5 1 0 81 0 87 FA 1 2 3 FA
317. X J PARC EBSD SEM PHP SS NC 0 1nm 10 9 1 1m 10 6 1
318. 0 5 1 1um 1um 6 1 5Sum 1 30 10 3 CX Y Z 6 20 7 20 1 1 0 1 0 2 3 2 12 13 X D L X D L Z 1 000mm Z D
319. 30MHz PWM 3 84MHz 1SkHz PWM 3 OS uITRON TOPPSER JSP PWM 69 1 pmys 2 rpm s 3 rpm 4 5 CW CCW
320. BEPCS 8MB SDRAM 32MB JTAG SoC MPU PWM 3 4 MPU MPU Altera NiosIe IP 32 MPU SoC FPGA LED PB EPCS JTAG MPU OS ee TIMER W interface Pi Niosll e MPu 4 PMM PWM PWM PWM PWM PWM
321. I TR ON OS OS TOPPERS RTOS OS RTOS 2 134 30 137
322. lg g ACES 1 10 7 S N
323. 600 200 400 600 C 0Imm 15 50 16 00 15 00 15 50 14 50 15 00 14 00 14 50 13 50 14 00 13 00 13 50 12 50 13 00 mW 12 00 12 50 11 50 12 00 11 00 11 50 10 50 11 00 10 00 10 50 C 0 mm 15 50 16 00 15 00 15 50 RR 14 50 15 00 14 00 14 50 R13 50 14 00 13 00 13 50 mW 12 50 13 00 12 00 12 50 11 50 12 00 11 00 11 50 10 50 11 00 10 00 10 50 C 0 mm 15 50 16 00 15 00 15 50 14 50 15 00 14 00 14 50 13 50 14 00 13 00 13 50 12 50 13 00 12 00 12 50 11 50 12 00 11 00 11 50 10 50 11 00 0 mm 15 50 16 00 15 00 15 50 14 50 15 00 14 00 14 50 13 50 14 00 13 00 13 50 12 50 13 00 12 00 12 50 11 50 12 00 11 00 11 50 10 50 11 00 10 00 10 50 C 0 mm 15 50 16 00 mW 15 00 15 50 NW 14 50 15 00 200 14 00 14 50 7 13 50 14 00 13 00 13 50 12 50 13 00 400 12 00 12 50 WN 11 50 12 00 mw 11 00 11 50 600 10 50 11 00 10 00 10 50 mm e 10min 6
324. Cs Cs Cs Cs Cs Cs Cs 20 21 8 S 2 E 3 E 6 H 4 H H 7 H 8 H 9 8 16S rDNA D2 LSU rDNA DNA
325. LPS LPS 100um 1 LPS C PDMS 1 M2 E N ms my fm 2 PDMS 2
326. 55 14 D 15 A 16 D 5 0 OC ND 2 DD 0 25 D 26 DD _ 2 A 28 mm m 528 30 D TO 1 _ _ 2 3 6 206 4 A D 5 6 2 SBE 77C1 1 6 2 C H 5 1 C H 4 2 4 HORIBA 1G 310 3 3 7 1 i 1 2 3 9 5 9 el 955 9 3 9 5 945 eo e 94 91 9 3 ET 7 30 9e 9 2 94 9 dl 9sl 9ss 3 3 1
327. W 2 wW 1 0 5mmPb Cs137 W 1 W 10 W 2 W 1 3 W 1 W 4
328. a L 5days i A 2 Brix D 3 Bax pHS5 8 3 2 pH Brix67 0 Brix52 0 60 0 Brix70 3 5 2
329. 4 pH 4 3 pH 2
330. 8 FPGA 49mmx75 2mm FPGA FPGA 240mmx300mm 19 1 SoC SoC FPGA 23 FPGA NF 31 313 6 NN 8 hie ve We 5 FPGA MPU PWM SoC
331. 9 8 6 5 4 3 gum x500 er V50m min f0 12mm rev V100m min f0 12mm rev V150m min f0 12mm rev a 20 gm x500 20 20 1 45 90 225 270 UD CFRP 45 21 21 B V50m min f0 03mm rev V50m min f0 12mm rev 50m min 0 03mm rev 270 0 12mm rev
332. C 6 1 A STEP 5 LNG 6 4 6 6 8 7
333. ICP AES et i 3 2 4 200mL 30mL odin eo ee 10 2 5 1L 1m 1L 1 L PSM150AA JADVANTEC 300mL h 1 8 ICP AES
334. MI 9 1 30 mALALAALA_AA_A AA_AAA_A ED 9 7 70 125 150 330ue 4 10 6 2 KON
335. Time S O 500 a 5 3 400 5 amn c SNCM630 3 CCT 10000 100000 Austenitisation temperature C 860 0 Grain Size 9 0 ASTM JIS SCM435 830 880 0 2 2 JIS TZ ONE 0 32 Dp 15 D 55 O 25 p 85 D 15 0 39 35 0 95 1 25 0 35 Ea 0 37 p 15 Dp 55 O 25 p 85 p 15 0 44 0 35 0 95 1 2 5 0 35 NCM439 dab Bi Bb L160 B60 iS 0 43 35 0 90 2 00 1 00 0 35 NEM630 Zo Lis E35 ZS Bod DU30 0 35 0 35 0 60 3 50 0 0 70 CAE JMatPro CCT
336. 132mmin 1 mm L c 2 4 3 1 2 a 1 B 1 10 Pe 3 MM 30 40 5 c Pe 10 5 3 e 30 L p3 3mm a b
337. 3 10 SU 8 um 2 2 MO STR 1100
338. Svyh JIS Bqcm 0 1uSvh 0 08uSvh
339. 04 1E 05 1E 06 7 N20 LBET03 10 4 CAE ij 1 CAE ye 2 80p 230ug 3 10 6 9 26 1 67
340. 1 4 FCD 3 FCD 3 3 1 5 3 6 FEM
341. 150 x100 6 18 Brix Brix Brix Brix NaCl Brix NaCl 18 6 80 3 3 2 1 a i 6 j 1 6 a 1 12 11 100 150 200 g D 4 16 Brix NaCl 1 Brix NaCl 6
342. 3 1 16 29 30 17 28 SR 3 LAT 2 40 4 4 2 4 2 4 40 4 4 A AT A SA LAT 1 AE 1 MAME 4 MA 7 MAME 1 A 7 A 17 MA 7 MA 1 2 A 7 2 A N 1 IM 1 h N N N NM 3 N 4 h h h NE vv N M I I 1 6C h NM N N 3 N h 7 Nn 1 6 8 N Il 7 N 9 N I M N 8 N 10 I i 2 N 10 M 4 A B C D C A A C C C C A No 1 D DD 4 B CD ee 8 DD 9 BB 10 D 11 D 12 4A
343. 9 5 3 9 amp 5 9 7 5 1 Am 97 0 9 5 9 FH 0 5g Cs 10ppm 180min 4 pH 40 4 Ei pH 0 5g Cs 10ppm 180min 5g 5 5 ale 6 a 134Cs 137Cs Bq kg 4 nl 1 2 3
344. DC L L um m orion ae diO 13 14 Z 200mm U3 200mm 1 10 2 0 1 5 E 1 0 u m 200mm ee 05 0 0 0 200 400 0 5 mm 14 4 2 6
345. PG 1 4 Re 2000 4 1 Re 2 000 Pa s 4 50x10 1510x10 1 67x10 kg m 1025 9 1046 9 999 97 Re 2 000 Im s 1 35x10 1 56x10 5 24x10 2 10 6 m3 s EG PG 2500 2000 PG 1500 Ee KK 3 1000 0 30 40 50 60 70 Hz 5 3 2
346. i 13 3 3 14 A 1 0 09 0 07 0 05 EE mm rev 0 03 0 03 0 06 lt 0 01 0 12 0 01 m min 14 1 A 150m min 0 03mm rev 0 08mm 15 A 270 0 06 0 05 0 04 EE 0 03 mm revl
347. 1mm 6 amp KM mi 4 6 65 1 100N m 0 5mm
348. 47 3 58 9 43 6 57 7 44 5 80 1 86 8 5 14 71 6 86 5 36 0 57 8 3 6 3 5
349. pp 7 2010 3 24 pp 2 2012 4 HP 2012 HP 2012 6 2 pp 3 6 2011 Development of a light and easy to use radiation shield Decrease of environmental radioactivity level by shielding of crashed ceramic roof tles 8cm
350. 0 03 0 02 0 06 MH 0 01 0 12 0 0 01 0 02 m min 15 270 A 150m min 0 03mm rev 1 0 03mm 0 05mm 7 RONDCOM60A 16 150mymin 3 CY 92 5 um MWo 9 8 6 CY 68 2 gm No 9 8 7 6 5 4 a 20 wm X500 V150m min f0 03mm rev V150m min f0 06mm rev V150m min f0 12mm rev CY 42 7 um Mo 9 8 7 6 5 4 3 2 1 geum 5hl 16 0 03mmrev
351. 0 54 0 54 0 46 h 11 150 0 31 0 38 0 54 0 54 0 69 i 11 200 0 38 0 38 0 46 0 38 0 38 2 11 100 0 31 0 31 0 08 008 0 15 k 11 150 0 00 0 23 0 00 0 38 0 23 11 200 0 08 0 08 0 00 0 08 0 08 2 1 0 1 2 3 4 3 4 1 70 80 v y 30 80 v y 1 5 16 40
352. 003 sec 000 0 002 8 1 0 1 0 1 0 9 1 2 3 SGS AA _ A 3 4 2 9 um
353. 1 03 10 CFU g 95 20 14 11 Me 2 5 G L 55 7 3 Brix Aw 30 12
354. 5 0 69 1 15 0 62 1 08 Alc D 8 0 85 0 62 1 08 0 54 1 08 11 0 62 0 54 0 69 0 38 0 62 2 1 0 1 2 3 5 2 30 12 0 Fa 5
355. ISSN 0919 6676 CODEN SFHPFEFE FUKUSHMA TECHNOLOGY 2 4 SS22 CO NM mm 6 2 CERP 2 1 0 3 FPGA NY 1 1 A SE ee 2 0 2 Me ON NR CE 294 3 2 8 2
356. O 750 2 BaTiO BaT 1 00 2 2 3 3 1 SEM SEM 1 1 750 10 nm 1 3 2 BET 1 1 9x10m7g SEM
357. _ 1L000 HH HH Tl OG NII LL LI IIIHH 1E 03 1 E 1 E 15 ETT 1E N20 7 1 3 3 8 11Hz 30 CAE 13 8SHz CAE i00000 8 9 0 2 1m s 200 1 000ug
358. echnolody of Large Bolt Parts e40mm CAE Key words 1 Ni Cr Mo
359. evelopment of inter vehicle communications which exchanges road condition sensing and local information with Smartphone 2nd Report Bluetooth Key words Bluetooth SNS 1
360. g 2 0 3molL 2 13 Cs 137Cs Bq kg 3 0 3molL 3 4Cs 7Cs Bq kg EE 140 140 1
361. g05 sangyo rodo nogyo g 1Zyutu anzen 1ko2 html 3 http www naro affrc go jp org brain anzenweb index html 4 Christopher J Fisher AN 1057 pp 5 2010 http momnjl 1 1sShikawa nct ac jp dtdesign inr71 lpt shtml 47 Establishment of the Advanced Simulation Technolody of Plate Forging by Material Science Aproach
362. kg 3 1 3 15 000Bqkg 1 1 12 000 13 000Bq kg ha 3 1 4 16 000Bq k
363. r stamp that was created by the laser machine Key words 1 1
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