6. MAIN Electrical Parts List
Contents
1. SEC CODE Design LOC Description 2007 002796 R401 R CHIP 2007 003010 R507 R CHIP 2007 007008 R404 R CHIP 2007 007132 R140 R141 R CHIP 2007 007148 R114 R CHIP 2007 007 193 C518 C CERAMIC CHIP 2007 007334 R602 R CHIP 2007 007489 R210 R CHIP 2007 007741 R503 R CHIP 2007 007798 R506 R CHIP 2007 007981 R209 R CHIP 2007 008050 R113 R CHIP 2007 008055 R130 R137 R139 R231 R CHIP 2007 008055 R504 R CHIP 2007 008213 R223 R CHIP 2007 008401 R219 R CHIP 2007 008419 R108 R109 R110 R224 R CHIP 2007 008456 R505 R CHIP 2007 008478 R501 R502 R CHIP 2007 008483 R112 R116 R CHIP 2007 008516 R118 R500 R CHIP 2007 008517 R220 R CHIP 2007 008786 R111 R115 R CHIP 2007 009157 R230 R CHIP 2007 00917 1 R124 R125 R126 R127 R CHIP 2007 00917 1 R128 R CHIP 2007 009323 R103 R CHIP 2203 000233 C1025 C CERAMIC CHIP 2203 000254 C1015 C105 C108 C110 C CERAMIC CHIP 2203 000254 C183 C205 C206 C224 C CERAMIC CHIP 2203 000278 C118 C193 C199 C CERAMIC CHIP 2203 000386 C137 C139 C CERAMIC CHIP 2203 000425 C337 C CERAMIC CHIP 2203 000438 C159 C170 C CERAMIC CHIP 2203 000550 C305 C307 C CERAMIC CHIP 2203 000679 C408 C413 C CERAMIC CHIP 2203 000696 C185 C CERAMIC CHIP 2203 000725 C600 C CERAMIC CHIP 2203 000812 C339 C406 C423 C512 C CERAMIC CHIP 6 2 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authoriza2. 2703 003125 C154 C CERAMIC CHIP 2703 003260 L300 L301 INDUCTOR SMD 2703 003293 L410 INDUCTOR SMD 2703 003297 L105 INDUCTOR SMD 2703 003698 L132 INDUCTOR SMD 2801 00455 1 OSC300 CRYSTAL UNIT 2801 004589 OSC102 CRYSTAL UNIT 2809 001327 OSC100 CRYSTAL UNIT 2809 001348 OSC101 CRYSTAL UNIT 2901 001525 F500 F501 F503 F504 FILTER EMI SMD 2901 001525 F505 FILTER EMI SMD 2901 001540 F506 F507 FILTER EMI SMD 2904 001929 F104 FILTER EMI SMD 2909 001324 F103 FILTER EMI SMD 2910 000070 F102 FILTER EMI SMD 2910 000093 F101 FILTER EMI SMD 2911 000137 F100 FILTER EMI SMD 3301 001438 L140 L400 INDUCTOR SMD 3301 001534 L127 L128 INDUCTOR SMD 3301 001659 L601 INDUCTOR SMD 3301 001789 L600 INDUCTOR SMD 3301 001885 L403 L405 L407 L409 INDUCTOR SMD 3301 001885 L413 L414 INDUCTOR SMD 3404 001303 TAC600 TAC601 TAC602 SWITCH TACT 3404 001303 TAC603 SWITCH TACT 3705 001503 RFS100 CONNECTOR COAXIAL 3708 002222 SLC500 CONNECTOR FPC FFC PIC 3709 001540 SIM300 CONNECTOR CARD EDGE 3709 001575 CD300 CONNECTOR CARD EDGE 3711 006015 HDC500 CONNECTOR HEADER 6 5 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Main Electrical Parts List SEC CODE Design LOC Description 3711 006615 HDC501 CONNECTOR HEADER 3711 006923 HDC400 CONNECTOR HEADER 3711 007004 BTC600 CONNECT
3. 6 MAIN Electrical Parts List SEC CODE Design LOC Description 0403 001688 D602 Diode 0404 001172 D200 D500 Diode 0406 001208 D400 Diode 0406 001231 ZD401 ZD402 ZD406 DIODE ZENER 0406 001231 ZD600 ZD601 ZD605 DIODE ZENER 0406 001231 ZD606 DIODE ZENER 0406 001286 D501 Diode 0406 001293 ZD405 DIODE ZENER 0505 001325 Q400 TR POWER 1001 001370 U715 IC 1001 001585 U602 IC 1001 001607 U104 IC 1003 002277 U600 IC 1108 000314 UME200 MEMORY 1201 002781 PAM102 IC 1201 003027 U101 IC 1203 006043 U500 IC 1203 006158 U300 IC 1203 006159 U100 IC 1204 003112 U714 IC 1205 003761 U102 IC 1205 003866 U106 IC 1205 003868 U105 IC 1205 003938 UCP200 IC 1209 001945 U401 IC 1404 001221 V200 THERMISTOR 2007 000141 R226 R227 R402 R403 R CHIP 2007 000141 R603 R604 R CHIP 2007 000144 R205 R207 R305 R306 R CHIP 2007 000148 R309 R CHIP 2007 000153 C1022 C1023 C CERAMIC CHIP 2007 000156 R609 R CHIP 2007 000162 R129 R133 R134 R135 R CHIP 2007 000162 R229 R411 R CHIP 2007 000170 R308 R410 R CHIP 2007 000173 C516 C CERAMIC CHIP 2007 000242 R400 R509 R511 R CHIP 2007 000758 R101 R CHIP 2007 001288 R300 R301 R CHIP 6 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Main Electrical Parts List
4. 006872 C174 C177 C179 C180 C CERAMIC CHIP 2203 006872 C187 C188 C189 C320 C CERAMIC CHIP 2203 006872 C321 C332 C333 C CERAMIC CHIP 2203 006890 C116 C CERAMIC CHIP 2203 006978 C500 C CERAMIC CHIP 2203 007210 C145 C176 C178 C CERAMIC CHIP 2203 007271 C508 C CERAMIC CHIP 2203 007279 C114 C158 C301 C302 C CERAMIC CHIP 2203 007279 C310 C311 C501 C CERAMIC CHIP 2203 007317 C171 C CERAMIC CHIP 2203 007369 C122 C CERAMIC CHIP 2404 001377 TA400 C TA CHIP 2404 001430 TA600 C TA CHIP 2409 001172 BAT300 BATTERY 2703 001409 L129 L131 INDUCTOR SMD 2703 001728 L109 INDUCTOR SMD 2703 001734 L136 INDUCTOR SMD 2703 001747 C1018 L112 C CERAMIC CHIP 2703 002203 C126 C CERAMIC CHIP 2703 002267 L102 INDUCTOR SMD 2703 002365 C102 C CERAMIC CHIP 2703 002551 L502 INDUCTOR SMD 6 4 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Main Electrical Parts List SEC CODE Design LOC Description 2703 002793 L111 INDUCTOR SMD 2703 002794 C146 C CERAMIC CHIP 2703 002798 C147 C CERAMIC CHIP 2703 002901 L116 LLV0603 F15NJ 2703 002907 C132 C133 C CERAMIC CHIP 2703 002918 L120 L125 INDUCTOR SMD 2703 002958 L104 INDUCTOR SMD 2703 002999 C125 0129 C134 C135 C CERAMIC CHIP 2703 003003 L124 INDUCTOR SMD
5. AMIC CHIP 2203 006399 C1002 C1003 C106 C CERAMIC CHIP 2203 006399 C111 C123 C306 C316 C CERAMIC CHIP 2203 006399 C319 C322 C323 C324 C CERAMIC CHIP 2203 006399 C325 C326 C327 C328 C CERAMIC CHIP 2203 006399 C329 C330 C335 C336 C CERAMIC CHIP 2203 006399 C340 C509 C510 C511 C CERAMIC CHIP 6 3 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Main Electrical Parts List SEC CODE Design LOC Description 2203 006399 C513 C514 C515 C606 C CERAMIC CHIP 2203 006423 C104 C149 C153 C161 C CERAMIC CHIP 2203 006423 C162 C165 C172 C202 C CERAMIC CHIP 2203 006423 C228 C232 C236 C247 C CERAMIC CHIP 2203 006423 C254 C255 C338 C CERAMIC CHIP 2203 006562 C218 C221 C226 C230 C CERAMIC CHIP 2203 006562 C231 C240 C242 C243 C CERAMIC CHIP 2203 006562 C246 C251 C331 C334 C CERAMIC CHIP 2203 006562 C401 C402 C411 C412 C CERAMIC CHIP 2203 006562 C504 C603 C604 C CERAMIC CHIP 2203 006674 L118 INDUCTOR SMD 2203 006824 C163 C166 C191 C192 C CERAMIC CHIP 2203 006824 C303 C304 C502 C CERAMIC CHIP 2203 006839 C222 C CERAMIC CHIP 2203 00684 1 C605 C CERAMIC CHIP 2203 006846 C150 C CERAMIC CHIP 2203 006872 C1005 C1007 C160 C CERAMIC CHIP 2203
6. OR HEADER 3722 00287 1 IFC600 JACK PHONE GH71 08731A ANT100 ANT101 ANT102 NPR CONTACT ANT GH71 08731A ANT135 SPK400 SPK401 NPR CONTACT ANT rf LPS181210T 2 L500 INDUCTOR SMD Please consult the GSPN website Samsung Portal for the most recent version of the product s part list 6 6 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization
7. tion Main Electrical Parts List SEC CODE Design LOC Description 2203 000812 C520 C CERAMIC CHIP 2203 001072 C144 C416 C417 C CERAMIC CHIP 2203 001153 C1009 C136 C CERAMIC CHIP 2203 002487 C602 C CERAMIC CHIP 2203 002709 C1012 0119 C128 C201 C CERAMIC CHIP 2203 002709 C219 C223 C225 C241 C CERAMIC CHIP 2203 002709 C318 C409 C420 C505 C CERAMIC CHIP 2203 002709 C607 C CERAMIC CHIP 2203 005056 C140 C CERAMIC CHIP 2203 005288 C1024 0112 C CERAMIC CHIP 2203 005395 C124 C CERAMIC CHIP 2203 005446 L134 INDUCTOR SMD 2203 005450 C1004 C1011 C195 C CERAMIC CHIP 2203 005552 C194 L139 C CERAMIC CHIP 2203 005682 C103 C400 C506 C CERAMIC CHIP 2203 005729 C1008 C151 C CERAMIC CHIP 2203 005732 C1006 C CERAMIC CHIP 2203 005736 C237 L123 U716 C CERAMIC CHIP 2203 005789 L107 INDUCTOR SMD 2203 005792 C138 C142 C CERAMIC CHIP 2203 005806 C107 C CERAMIC CHIP 2203 006048 C227 C244 C245 C252 C CERAMIC CHIP 2203 006048 C315 C317 C507 C609 C CERAMIC CHIP 2203 006048 C610 C CERAMIC CHIP 2203 006123 C1010 C CERAMIC CHIP 2203 00614 1 C601 C CERAMIC CHIP 2203 006194 C109 C120 C121 C148 C CERAMIC CHIP 2203 006257 C419 C519 C CERAMIC CHIP 2203 006260 C1013 C308 C309 C CERAMIC CHIP 2203 006305 C186 C197 C CERAMIC CHIP 2203 006318 L119 INDUCTOR SMD 2203 006324 C175 C CERAMIC CHIP 2203 006348 C300 C CER
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