COLOR MONITOR SERVICE MANUAL
Contents
1. 2 SYNC PULSE YES CHECK R611 AND R612 SYNC NO APPEARED YES 1 CHECK U201 PIN16 17 NO gt CHECK PC PC IS GOING INTO DPM MODE TROUBLE IN U201 Waveforms 1 H SYNC Tek SIE 10 0MS s 1798 Acqs Aa Nous CHT FS 2091 s Apr 2006 09 08 11 2 v SYNC E Tek SEE 25 0ks s 57 Acqs t 60V Md 00his CRT 7 3 28 V s apr 2006 09 11 14 gt CHECK H V SYNC LINE Copyright 2 2007 LG Electronics Inc All right reserved Only for training and service purposes 17 LGE Internal Use Only WIRING DIAGRAM 30P 41P EAD57188301 EAD42157801 6P PE 6631900030K Copyright 652007 LG Electronics Inc All right reserved 18 Only for training and service purposes LGE Internal Use Only EXPLODED VIEW Note Safety mark EXPLODED VIEW PARTS LIST Ref No Part No Description 300 A ABJ62781801 Cabinet Assembly W1941 W1941 19 W1941S cabinet assy high gloss black 310 A MEY40926601 Knob MOLD ABS HF 350 MAIN 5 key WX42 BLACK 320 A MBG41956001 Button Power MOLD ABS WX42 translucent ABS power button lens 400 ACQ62782001 Cover Assembly Rear W1942 WX42 19 W1942 LPL BACK COVER ASM DUAL 410 MDQ39062306 PRESS EGI 0 8 W1542 EGI W1542s Rear Frame2. POINT AS OPENING EACH POWER LINE 2 IS IC1 PIN3 1 8V NO CHECK IC1 1 8V 3 IC1 PIN1 3 3V 3 3V LINE ves NO CHECK U201 PIN2 gt CHECK CRYSTAL X501 PULSE rs CHECK U201 Waveforms 1 P605 5 6 2 IC1 3 3 IC1 1 4 U201 2 Tek Run 10 0kS s Sample Tek Run 10 0kS s Sample Tek Run 10 0kS s Sample Tek SUJE 4 006575 36 Acqs E T 1 E F ye E 1 E T 1 eim IET bts Er exe TA rN FN 7 3 ok ad Y V t t n Mi N m NE ear NEN Si CER SRK Bm CR wes client apr aid Toy rooms GER CRT s Apr 2006 ur 00V OO citet OR 5 Apr 2006 id ku hq og Copyright 6 2007 LG Electronics Inc All right reserved pyright amp 9 44 LGE Internal Use Only Only for training and service purposes 2 NO RASTER OSD IS NOT DISPLAYED LIPS NO RASTER OSD IS NOT DISPLAYED CHECK P605 VOLTAGE PIN5 6 5V YES P605 PIN9 5V YES CHECK P605 PIN10 CHECK PULSE AS CONTACTING PROBE TO THE LAMP WIRE OF THE YES REPLACE LCD MODULE Waveforms NO NO CHECK POWER BOARD LIPS NO CHECK U201 INVERTER ON OFF PORT NO 1 CONFIRM BRIGHTNESS OSD CONTRL STATUS 2 CHECK MICOM DIM ADJ PORT gt POWER BOARD LIPS 1 P605 5 6 Tek Run 10 0kS s Sample E
3. ei se 57 56 YEM B 3 BVA PL 4 veP B TSUMIPFR U201 4 TSUM1PFR CLKOUTM B 4 UP01 gt CLKOUTP B 1 Y3M B LAMPADU 1 2 T C502 0 047UF 0503 0 047UF C504 LL 0 047uF C505 Wo cau 0506 1000pF T C507 FO 047uF C508 RED A 4 O 047UF BLU A 4 Wa E X O O N O O D gt YOM A EI 34 NoEL ao GRN A 4 YOP A o GPIO_F15 EHNO 20 SPro_r2a em2 27 GPIO_P27 EWL za Y4M A DOCA S0A RS232 1X 19 onca_sua rs222 rx 1s 12C MoA GPIG P11 25 12c woA GP10 P40 os YA4P A Y2M A Yap a 19 WIDE 19 22 WIDE 22 UF eso Y3M A O TM TMIO O Z O O O OVR HSYNC L 20D Y3P A READY 1C503 C518 FO dur MBACOBWMNBT P OS VSYNC 4 21 4 8VD 1 2 GPIO H22 PWMO GPIO R24 PWM28 GPIO_H45 PWM4 3 3VA PL 1 2 1C502 W25X20AVSNIG T2C_ MDA GPIO_P11 I2C MCL GPIO P10 DDCA_SCL AS232_RX R514 10K Svsli 210 D CA SDA RS232 TX TSUMIPFR 111 2 3 3VA PL alc alc 2 O SDAAI 1 D SCLAI 1 MOOON 4 THE IN SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECT
4. hazardous condition will not exist if the jumper wire opens 2 Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern 3 Connect insulated 20 gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side Carefully crimp and solder the connections CAUTION Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges LGE Internal Use Only TIMING CHART VIDEO A lt gt E lt gt DY B lt SYNC C Sync Dot Total Video Sync Front Blanking MODE H V Polarit Clock Frequency Period Active Duration Porch Time Resolution Sany Ss E Time A D C B 1 H Pixels pun 31 468 900 720 18 108 54 in V Lines 70 08 449 400 12 2 35 2 H Pixels dps 31 469 800 640 16 96 48 640 X 480 V Lines 59 94 525 480 10 2 33 3 H Pixels nae 37 5 840 640 16 64 120 m V Lines i 500 48075 1 3 16 4 H Pixel 37 879 1056 800 40 128 88 ige s 40 0 800 x 600 V Lines 60 317 628 600 1 4 23 5 H Pixels 46 875 1056 800 16 80 160 49 5 800 x 600 V Lines 75 0 625 600 1 3 21 6 i 49 72 1152 2 32 4 224 H Pixels Em 5 5 83 B 832
5. 1 Sync Signal Type Separate Sync SOG 3 2 Video Input Signal 1 Type R G B Analog 2 Voltage Level 0 0 71 V a Color 0 0 0 Vp p b Color 7 0 0 467 Vp p C Color 15 0 0 714 Vp p 3 Input Impedance 75 Q 3 3 Operating Frequency Horizontal 30 61kHz Vertical 56 75Hz Copyright 2 2007 LG Electronics Inc All right reserved Only for training and service purposes 4 MAX RESOLUTION Analog 1360 x 768 60Hz 5 POWER SUPPLY 5 1 Power Adaptor Built in Power Input AC 100 240V 50 60Hz 0 8A 5 2 Power Consumption MODE HN SYNC VIDEO POWER CONSUMPTION LED COLOR less than 24 W max POWER ON NORMAL ON ON ACTIVE BLUE less than 21 W typ STAND BY OFF ON OFF less than 1 W AMBER SUSPEND ON OFF OFF less than 1 W AMBER DPMS OFF OFF OFF OFF less than 1 W AMBER POWER S W OFF less than 1 W OFF 6 ENVIRONMENT 6 1 Operating Temperature 10 C 35 C 50 F 95 F 6 2 Relative Humidity 10 80 Non condensing 6 3 MTBF 50 000 HRS with 90 Confidence level Lamp Life 40 000 Hours Min 7 DIMENSIONS with TILT SWIVEL Width 448 4 mm 17 65 Depth 198 4 mm 7 81 Height 357 9 mm 14 09 8 WEIGHT with TILT SWIVEL Net Weight Gross Weight 2 9 kg 6 44 Ibs 3 6 kg 8 lbs LGE Internal Use Only PRECAUTION WARNING FOR THE SAFETY RELATED COMPONENT There are some special components used in LCD monitor that are im
6. AUO 420 MDQ53366301 PRESS SBHG 0 6mm W1941S SBHG W19418 lamp shield 430 MCK42615801 Cover MOLD PC ABS W1642 ABS Hinge body 440 MCK42615601 Cover MOLD PC ABS W1642 PC ABS HINGE COVER 910 MCK42001101 Cover MOLD ABS W1642 ABS 920 AAN52738301 Base Assembly ASSY W1642 AFO4HA W1642 BASE ASSY ND LOCAL 200 EAJ52964001 LCD Module TFT LM190WH1 TLA1 ZBD WXGA 19 0INCH 1366X768 300CD COLOR 72 16 9 1000 1 R Time ms VIA 170 160 T CON SIW POL LGC Fab P6 AG Thick 13mm Weight 1550g Lamp W 330 EBR41617001 PCB Assembly CONTROL T T LM73A BAIKAL 3 19 INCH RD 450 EAY38422103 Power Supply Assembly FREE 2 LAMP DMB IC MODEL LCD Lianchang AIP 0186 WIDE 15 19 EBR36269405 PCB Assembly Power POWER T T LM 73B BAIKAL IIII 15 LCD 460 A EBR55661701 PCB Assembly MAIN T T Mstar 64pin Analog W1941S T chassis 20 2 2l 2 2 23 3VD 1 YOP B 4 DIMADJ 2 LED AMI1 LED_GAI1 TE INVON 4 2 1 8VDU4 2 0513 3 3vD 1 2 10uF 18V He C517 0519 c520 O 1UF a k O 1ur 3 3VA PU 1 Er C514 C515 D 1uF O 1ur 15v 18V Svs 4 2 ST DET 4 2 O_P16 PWM1 0_PO2 SAR2 0_PO1 SAR1 0_POO SARO 0_P27 PWM3 Q_PO7 GP GP GP GP GP GP 37 56 T g X501 14 318MHz d Y1M B 0 FOL SAR2 0 PoO SARL 0 P 17 8480 9 Peo Pwut 0 P12 0 r07 0 006 v4P B GP Gp 3 LZ 61 sa so cri ss
7. B EN ICLKOUTP B 4 JCLKOUTM B 1 3Y2P B 4 JY2M B Gs Y1P B 1 jY1M B 4 666666 ovem 66 66 1YOP B 1 READY TOUCH KEY 8634 Bess 856 9 622 6 a603 KST3906 MTF E YOM B En LED GA 1 9 R623 TACT KEY 100 R624 TACT KEY KEV4 4 2 I T KEYO 4 2 c G604 KST3806 MTF B53 ese READY TOUCH KEY Bess READY TOUCH KEY E LED AM 1 al 21 Mstar 64pin Scaler PCB DATE POWER amp WAFER 2008 06 21 SERE MODEL me E aa l LisBectrorics BLOCK isHEET 7 AUG 2008 P NO MFL32179281 Printed in China
8. WE iv M10 0ms Glitch Chi 5 Apr 2006 2 P605 10 lek kun S0 0KS s Sample L Cl 08 49 27 tier nnns EJ 20V Che Shane MS dVins Chi X SEO 26 May 2006 Chi 560mv 08 05 02 3 LAMP CURRENT Tek SITE 10 0MS s 878 Acqs L F la 34 2 V a 17 0 V C1 Freg 48 135kH2 Ich wo M 0 0ps Chi 12V sApr2006 09 12 50 Copyright e 2007 LG Electronics Inc All right reserved Only for training and service purposes 15 LGE Internal Use Only 3 NO RASTER OSD IS NOT DISPLAYED MAIN NO RASTER OSD IS NOT DISPLAYED CHECK U201 NO PIN26 3 3V PIN30 1 8V YES U501 NO CHECK IC1 1 8V gt 3 3V PIN 108 109 14 3MHZ YES CHECK U501 PIN27 H SYNC AND NO 1 CHECK PIN 1 2 SOLDERING CONDITION 2 CHECK X501 3 TROUBLE IN U201 PIN28 V SYNC IS PULSE APPEARED AT SIGNAL PINS YES TROUBLE IN CABLE OR LCD MODULE Waveforms 4 U201 2 Tek BEE 4 000875 36 Acqs E la 3 46 v ja 3 80 v cirreq 14 3369MHz 1 00 V M25 0ms CHT 7 2 00 V s Apr 2006 09 00 08 CHECK CONNECTION LINE FROM D SUB TO U201 Copyright 652007 LG Electronics Inc All right reserved 16 Only for training and service purposes LGE Internal Use Only 4 TROUBLE IN DPM TROUBLE IN DPM
9. right reserved Only for training and service purposes WARNING BE CAREFUL ELECTRIC SHOCK If you want to replace with the new backlight CCFL or inverter circuit must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms Handle with care wires or connectors of the inverter circuit If the wires are pressed cause short and may burn or take fire Leakage Current Hot Check Circuit AC Volt meter Good Earth Ground such as WATER PIPE CONDUIT etc To Instrument s exposed METALLIC PARTS W 1 5 Kohm 10W LGE Internal Use Only SERVICING PRECAUTIONS CAUTION Before servicing receivers covered by this service manual and its supplements and addenda read and follow the SAFETY PRECAUTIONS on page 3 of this publication NOTE f unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication always follow the safety precautions Remember Safety First General Servicing Precautions 1 Always unplug the receiver AC power cord from the AC power source before a Removing or reinstalling any component circuit board module or any other receiver assembly b Disconnecting or reconnecting any receiver electrical plug or other electrical connection c Connecting a test substitute in parallel with an electrolytic capacitor in the receiver CAUTION A wrong part substitution or incorrec
10. unless all solid state device heat sinks are correctly installed 8 Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead Always remove the test receiver ground lead last Copyright 62007 LG Electronics Inc All right reserved Only for training and service purposes 9 Use with this receiver only the test fixtures specified in this service manual CAUTION Do not connect the test fixture ground strap to any heat sink in this receiver Electrostatically Sensitive ES Devices Some semiconductor solid state devices can be damaged easily by static electricity Such components commonly are called Electrostatically Sensitive ES Devices Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any electrostatic charge on your body by touching a known earth ground Alternatively obtain and wear a commercially available discharging wrist strap device which should be removed to prevent potential shock reasons prior to applying power to the unit under test 2 After removing an electrical assembly equipped with ES devices place the assembly on a conductive surf
11. voltage 6 Signal collection This part function is to collect the any change from the DC output and feed back to the primary through photo transistor Copyright 2 2007 LG Electronics Inc All right reserved Only for training and service purposes gt LGE Internal Use Only ADJUSTMENT Windows EDID V1 0 User Manual 2 EDID Read amp Write 1 Run WinEDID exe Operating System MS Windows 98 2000 XP 2 WinEDID V 1 0 CS Port Setup Windows 98 gt Doesn t need setup Windows 2000 XP gt Need to Port Setup This program is available for LCD Monitor only 1 Port Setup a Copy UserPort sys file to c WINNT system32 drivers folder b Run Userport exe 2 Edit Week of Manufacture Year of Manufacture Serial Number a Input User Info Data b Click Update button c Click Write button c Remove all default number d Add 300 3FF e Click Start button f Click Exit button Copyright 2007 LG Electronics Inc All right reserved 12 LGE Internal Use Ont Only for training and service purposes y SERVICE OSD 1 Turn off the power switch at the right side of the display 2 Wait for about 5 seconds and press MENU POWER switch for 1 second interval 3 The SVC OSD menu contains additional menus that the User OSD menu as describe
12. weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or lift off the board The following guidelines and procedures should be followed whenever this condition is encountered At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board Use this technique only on IC connections 1 Carefully remove the damaged copper pattern with a sharp knife Remove only as much copper as absolutely necessary 2 carefully scratch away the solder resist and acrylic coating if used from the end of the remaining copper pattern 3 Bend a small U in one end of a small gauge jumper wire and carefully crimp it around the IC pin Solder the IC connection 4 Route the jumper wire along the path of the out away copper pattern and let it overlap the previously scraped end of the good copper pattern Solder the overlapped area and clip off any excess jumper wire Copyright 62007 LG Electronics Inc All right reserved Only for training and service purposes At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins This technique involves the installation of a jumper wire on the component side of the circuit board 1 Remove the defective copper pattern with a sharp knife Remove at least 1 4 inch of copper to ensure that a
13. 5o euv 8 5 4 I Bojeuy LGE Internal Use Only Copyright 2 2007 LG Electronics Inc All right reserved Only for training and service purposes DESCRIPTION OF BLOCK DIAGRAM 1 Video Controller Part This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock The pixel clock for each mode is generated by the PLL The range of the pixel clock is from 25MHz to 86MHz in W1941S case This part consists of the Scaler ADC convertor TMDS receiver and LVDS transmitter The Scaler gets the video signal converted analog to digital interpolates input to 1360 X768 resolution signal and outputs 8 bit R G B signal to transmitter 2 Power Part This part consists of the one 3 3V and one 1 8V regulators to convert power which is provided 5V in Power board 18V is provided for inverter 5V is provided for LCD panel and micom in W1941S case Also 5V is converted 3 3V and 1 8V by regulator Converted power is provided for IC in the main board The inverter converts from DC18V to AC 700Vrms and operates back light lamps of module in W1941S case 3 MICOM Part This part is include video controller part And this part consists of flash IC which stores control data Reset IC and the Micom The Micom distinguishes polarity and frequency of the H V sync are supplied from signal cable The controlled data of each modes is stored in Flash
14. RICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET Mstar 64pin Scaler PCB DATE 2008 06 21 ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE AN SYMBOL MARK OF THE SCHEMETIC LGElectronics SCALER P601 KCN DS 3 00 svs 1 2 Svs 1 2 62 oj lt C612 cds C614 o 1uF oJaurf o ur PED A 1 1 D SDAA 1 gt GRN A 1 6066 6 VSYNC 1 1 D SCLA 1 IC1 APEBB3S C503 SEpF 124223076 3 3VA PL 4 3 3VD 1 2 C604 Tur 10V 2188F READY THE IN SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE N SYMBOL MARK OF THE SCHEMETIC 1 BVD 4 KTA4241 2 C610 68pF SvS 1 2 1 SECRET LGElectronics ST DET 1 P603 SMW200 05 P605 SMH200 1 1 svs 1 2 INVON 1 DIMADJ P604 Fw40038 30 LAMPADU 1 66 JY2P A 4 JY2M A EN JY1P A 1 JY1M A 4 I YOP A 4 1 YOM A 1 1 Y3P 8 1 Y3M
15. Website http biz LGservice com G E mail http www L GEservice com techsup html COLOR MONI TOR CHASSIS NO LM84K MODEL FLATRON W1941S W1941S PFT A QF Same model for Service CAUTION BEFORE SERVICING THE UNIT READ THE SAFETY PRECAUTIONS IN THIS MANUAL CONTENTS SPECIFICATIONS e 2 ADJUSTMENT u eme 12 PRECAUTIONS eee 3 TROUBLESHOOTING GUIDE 14 TIMING CHART uuu u ite ec ete detiene tuts 7 WIRING DIAGRAM eee 18 DISASSEMBLY eee 8 EXPLODED VIEW 19 BLOCK DIAGRAM esee 9 REPLACEMENT PARTS LIST 21 DESCRIPTION OF BLOCK DIAGRAM 11 SCHEMATIC DIAGRAM 25 SPECIFICATIONS 1 LCD CHARACTERISTICS Type TFT Color LCD Module Active Display Area 18 5 inch diagonal Pixel Pitch 0 10 RGB H x 0 30 V mm Size 430 4 H x 254 6 V x 13 0 D Color Depth 16 7M colors Electrical Interface LVDS Surface Treatment Operating Mode Backlight Unit Anti Glare Hard Coating 3H Transmissive mode Normally White 2 CCFL N OPTICAL CHARACTERISTICS 2 1 Viewing Angle by Contrast Ratio gt 10 Left 88 Typ Top 85 Typ Right 88 Typ Bottom 85 Typ 2 2 Luminance 180 Typ Typ 30 250 min 300 Typ 6500K 150 min 9300K 2 3 Contrast Ratio 6000 min DFC 8000 1 Typ SIGNAL Refer to the Timing Chart 3
16. ace such as aluminum foil to prevent electrostatic charge buildup or exposure of the assembly 3 Use only a grounded tip soldering iron to solder or unsolder ES devices 4 Use only an anti static type solder removal device Some solder removal devices not classified as anti static can generate electrical charges sufficient to damage ES devices 5 Do not use freon propelled chemicals These can generate electrical charges sufficient to damage ES devices 6 Do not remove a replacement ES device from its protective package until immediately before you are ready to install it Most replacement ES devices are packaged with leads electrically shorted together by conductive foam aluminum foil or comparable conductive material 7 Immediately before removing the protective material from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed CAUTION Be sure no power is applied to the chassis or circuit and observe all other safety precautions 8 Minimize bodily motions when handling unpackaged replacement ES devices Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device LGE Internal Use Only General Soldering Guidelines 1 Use a grounded tip low wattage soldering iron and appropriate tip size and s
17. ct then solder each connection Power Output Transistor Device Removal Replacement 1 Heat and remove all solder from around the transistor leads 2 Remove the heat sink mounting screw if so equipped 3 Carefully remove the transistor from the heat sink of the circuit board 4 Insert new transistor in the circuit board 5 Solder each transistor lead and clip off excess lead 6 Replace heat sink Diode Removal Replacement 1 Remove defective diode by clipping its leads as close as possible to diode body 2 Bend the two remaining leads perpendicular y to the circuit board 3 Observing diode polarity wrap each lead of the new diode around the corresponding lead on the circuit board 4 Securely crimp each connection and solder it 5 Inspect on the circuit board copper side the solder joints of the two original leads If they are not shiny reheat them and if necessary apply additional solder Fuse and Conventional Resistor Removal Replacement 1 Clip each fuse or resistor lead at top of the circuit board hollow stake 2 Securely crimp the leads of replacement component around notch at stake top 3 Solder the connections CAUTION Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures LGE Internal Use Only Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will
18. d below a CLEAR ETI To initialize using time c Auto Color W B balance and Automatically sets the gain and offset value press key for over 3 sec AGING Select Aging mode on off Module To select applied module NVRAM INIT EEPROM initialize 24C16 press key for over 3 sec R G B 9300K Allows you to set the R G B 9300K value manually f R G B 6500K Allows you to set the R G B 6500K value manually g R G B Offset Allows you to set the R G B Offset value manually Analog Only h R G B Gain Allows you to set the R G B Gain value manually Analog Only d b d e ama WH Video Signal Generator OR 000 000000 0 9 00000000 0 8 0 mE PARALLEL PORT OFF o ON 5V Power inlet required Control Line Power Select Switch lt la le ON 110V 220V eee Power LED O e e e ord z E V Sync On Off Switch Switch must be ON Figure 1 Cable Connection Copyright 2007 LG Electronics Inc All right reserved 13 Only for training and service purposes CGE Internal Use Only TROUBLESHOOTING GUIDE 1 NO POWER NO POWER POWER INDICATOR OFF CHECK POWER BOARD 1 CHECK P605 VOLTAGE NO AND FIND OUT A SHORT PINS PING 5V
19. hape that will maintain tip temperature within the range or 500 F to 600 F 2 Use an appropriate gauge of RMA resin core solder composed of 60 parts tin 40 parts lead 3 Keep the soldering iron tip clean and well tinned 4 Thoroughly clean the surfaces to be soldered Use a mall wire bristle 0 5 inch or 1 25cm brush with a metal handle Do not use freon propelled spray on cleaners 5 Use the following unsoldering technique a Allow the soldering iron tip to reach normal temperature 500 F to 600 F b Heat the component lead until the solder melts c Quickly draw the melted solder with an anti static suction type solder removal device or with solder braid CAUTION Work quickly to avoid overheating the circuitboard printed foil 6 Use the following soldering technique a Allow the soldering iron tip to reach a normal temperature 500 F to 600 F b First hold the soldering iron tip and solder the strand against the component lead until the solder melts c Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil and hold it there only until the solder flows onto and around both the component lead and the foil CAUTION Work quickly to avoid overheating the circuit board printed foil d Closely inspect the solder area and remove any excess or splashed solder with a small wire bristle brush IC Remove Replacement Some chassis circuit boards have slotted h
20. memory Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 10 LGE Internal Use Only LIPS Board Block Diagram 50 60Hz EMI INPUT RECTIFIER ENERGY Site OUTPUT RECTIFIER COMPONENTS AND FILTER TRANSFER AND FILTER LINE 100 240V PWM PHOTO SIGNAL CONTROL COUPLER Collection CIRCUIT ISOLATION ION PRIMARY SECONDARY Operation description_Power EMI components This part contains of EMI components to comply with global marketing EMI standards like FCC VCCI CISPR the circuit included a line filter across line capacitor and of course the primary protection fuse 2 Input rectifier and filter This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor 3 Energy Transfer This part function is for transfer the primary energy to secondary through a power transformer 4 Output rectifier and filter This part function is to make a pulse width modulation control and to provide the driver signal to power switch to adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized and also the over power protection is also monitor by this part 5 Photo Coupler isolation This part function is to feed back the DC output changing status through a photo transistor to primary controller to achieve the stabilized DC output
21. oles oblong through which the IC leads are inserted and then bent flat against the circuit foil When holes are the slotted type the following technique should be used to remove and replace the IC When working with boards using the familiar round hole use the standard technique as outlined in paragraphs 5 and 6 above Removal 1 Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts 2 Draw away the melted solder with an anti static suction type solder removal device or with solder braid before removing the IC Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully bend each IC lead against the circuit foil pad and solder it 3 Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coating to the areas Small Signal Discrete Transistor Removal Replacement 1 Remove the defective transistor by clipping its leads as close as possible to the component body 2 Bend into a U shape the end of each of three leads remaining on the circuit board 3 Bend into a U shape the replacement transistor leads 4 Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the U with long nose pliers to insure metal to metal conta
22. portant for safety These parts are marked Non the schematic diagram and the replacement parts list It is essential that these critical parts should be replaced with the manufacturer s specified parts to prevent electric shock fire or other hazard Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT Must mount the module using mounting holes arranged in four corners Do not press on the panel edge of the frame strongly or electric shock as this will result in damage to the Screen Do not scratch or press on the panel with any sharp objects such as pencil or pen as this may result in damage to the panel Protect the module from the ESD as it may damage the electronic circuit C MOS Make certain that treatment person s body are grounded through wrist band Do not leave the module in high temperature and in areas of high humidity for a long time The module not be exposed to the direct sunlight Avoid contact with water as it may a short circuit within the module If the surface of panel become dirty please wipe it off with a softmaterial Cleaning with a dirty or rough cloth may damage the panel CAUTION Please use only a plastic screwdriver to protect yourself from shock hazard during service operation Copyright 62007 LG Electronics Inc All
23. t polarity installation of electrolytic capacitors may result in an explosion hazard d Discharging the picture tube anode 2 Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device DVM FETVOM etc equipped with a suitable high voltage probe Do not test high voltage by drawing an arc 3 Discharge the picture tube anode only by a first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected and then b touch the other end of the insulated clip lead to the picture tube anode button using an insulating handle to avoid personal contact with high voltage 4 Do not spray chemicals on or near this receiver or any of its assemblies 5 Unless specified otherwise in this service manual clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner cotton tipped stick or comparable non abrasive applicator 1096 by volume Acetone and 9096 by volume isopropyl alcohol 9096 9996 strength CAUTION This is a flammable mixture Unless specified otherwise in this service manual lubrication of contacts in not required 6 Do not defeat any plug socket B voltage interlocks with which receivers covered by this service manual might be equipped 7 Do not apply AC power to this instrument and or any of its electrical assemblies
24. x 624 V Lines 74 55 667 624 1 3 39 7 i 48 363 1344 1024 24 136 160 H Pixels 65 0 1024 x 768 V Lines 60 806 768 3 6 29 8 H Pixels 60 123 1312 1024 16 96 176 78 75 1024 x 768 V Lines 3 75 029 800 768 1 3 28 9 H Pixels 47 776 1664 1280 64 128 192 79 5 1280 x 768 V Lines 59 90 798 768 3 y 20 10 MEROS 85 5 47 712 1792 1360 64 112 256 1360 x 768 V Lines 60 015 795 768 3 6 18 Copyright 2 2007 LG Electronics Inc All right reserved 7 LGE Internal Use Only Only for training and service purposes DISASSEMBLY 1 Pull the cabinet upwards Pull the cabinet upwards Then push the button push to separate Then separate all latches on each side the hinge body and stand body 3 4 Remove the control button from cabinet Then disassemble the connector 5 6 Separate the lamp shield from rear shield Turn around the base lock to open the Please pull off the latch first lock between base cover and stand body 7 Then separate stand body and base cover Copyright 2007 LG Electronics Inc All right reserved ses Only for training and service purposes GE tar S Only BLOCK DIAGRAM AMI sINPOW ZUWS S8 ZH09089 X0981 AS T NE E NS AC E z i WON useri HWSTE TT Jes A5 eoejieu y 40 8 19U95 19019 euibu3 998J19 U DIPJIOUT jaueg 4 k 5015522014 Aejdsiq SCAT AS T sdwe7z 19 1 AU 19114 ouAsy 52u sA
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