Philips TDA8002C User's Manual
Contents
1. 1 5 mm 1 60 13 0 25 Note 1 Plastic or metal protrusions of 0 25 mm maximum per side are not included OUTLINE REFERENCES EUROPEAN VERSION JEDEC EIAJ PROJECTION SOT401 1 ET ISSUE DATE 1999 Oct 12 25 Philips Semiconductors IC card interface SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology A more in depth account of soldering ICs can be found in our Data Handbook IC26 Integrated Circuit Packages document order number 9398 652 90011 There is no soldering method that is ideal for all surface mount IC packages Wave soldering is not always suitable for surface mount ICs or for printed circuit boards with high population densities In these situations reflow soldering is often used Reflow soldering Reflow soldering requires solder paste a suspension of fine solder particles flux and binding agent to be applied to the printed circuit board by screen printing stencilling or pressure syringe dispensing before package placement Several methods exist for reflowing for example infrared convection heating in a conveyor type oven Throughput times preheating soldering and cooling vary between 100 and 200 seconds depending on heating method Typical reflow peak temperatures range from 215 to 250 C The top surface temperature of the packages should preferable be kept below 232. 0 56 W TDA8002CG Tamb 25 to 85 C 0 46 W Tamb ambient temperature 25 85 C 1999 Oct 12 Philips Semiconductors Product specification IC card interface TDA8002C BLOCK DIAGRAM VDDD VDDA 100 nF 470 nF FE si SUPPLY STEP UP CONVERTER AGND INTERNAL REFERENCE 7 ALARM INTERNAL OSCILLATOR 2 5 MHz 15 VUP 470 nF 77 cs ER OFF 4 Vcc Voc PVcc L T gt GENERATOR 100 100 RSTIN EU nF CMDVCC MODE BUFFER Fan CV TV SEQUENCER CLKDIV1 ADE CLKDIV2 BUFFER CLK CLKSEL clock STROBE CIRCUITRY PRES CLKOUT THERMAL XTAL1 PROTECTION XTAL2 VO AUX1UC 4 TRANSCEIVER ui TDA8002CG s vO Ailse TRANSCEIVER AUXE 4 OUC VO VO ma TRANSCEIVER Fig 1 Block diagram FCE246 1999 Oct 12 Philips Semiconductors Product specification IC card interface TDA8002C PINNING SYMBOL DESCRIPTION XTAL1 crystal connection or input for external clock 3 crystal connection 3 O data I O line to and from microcontroller O O auxiliary line 1 to and from microcontroller for synchronous applications O auxiliary line 2 to and from microcontroller for synchronous applications O 2 5 5 3 I chip select control input for enabling pins OUC AUX1UC AUX2UC CLKSEL CLKDIV1 CLKDIV2 STROBE CV TV CMDVCC RSTIN OFF and MODE note 1 0 1 2 ALARM 4 0 1 2 open d
3. Typical dwell time is 4 seconds at 250 C A mildly activated flux will eliminate the need for removal of corrosive residues in most applications Manual soldering Fix the component by first soldering two diagonally opposite end leads Use a low voltage 24 V or less soldering iron applied to the flat part of the lead Contact time must be limited to 10 seconds at up to 300 C When using a dedicated tool all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C Philips Semiconductors Product specification IC card interface TDA8002C Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE REFLOW BGA SQFP not suitable suitable HLQFP HSQFP HSOP HTOFP HTSSOP SMS not suitable suitable PLCCG SO SOJ suitable suitable LQFP QFP TQFP not recommended 3 4 suitable SSOP TSSOP VSO not recommended suitable Notes 1 All surface mount SMD packages are moisture sensitive Depending upon the moisture content the maximum temperature with respect to time and body size of the package there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them the so called popcorn effect For details refer to the Drypack information in the Data Handbook IC26 Integrated Circuit Packages Section Packing Methods 2 These packages are not suitable for wave soldering as a
4. Semiconductors Product specification IC card interface TDA8002C Ea t CLKDIV1 act CLKDIV2 l CMDVCC to ee VUP t gt CLK A RSTIN l RST FCE274 Fig 11 Activation sequence using CMDVCC CLKDIV1 and CLKDIV2 signals to enable CLK CMDVCC _ Mec J AUX1UC AUX1 RSTIN eee ee RST STROBE l CLK l FCE251 Fig 12 Activation sequence for synchronous application 1999 Oct 12 13 Philips Semiconductors IC card interface DEACTIVATION SEQUENCE When a session is completed the microcontroller sets the CMDVCC line to HIGH state or MODE line to LOW state The circuit then executes an automatic deactivation sequence by counting the sequencer down and thus end in the Idle mode Figures 13 and 14 illustrate the deactivation sequence as follows PN Ss Product specification TDA8002C RST goes LOW tu tio CLK is stopped t12 t11 YeT I O AUX1 and AUX2 fall to zero t13 t41 T Vcc falls to zero t44 t41 1 T a special circuit ensures that I O remains below Vcc during the falling slope of Vcc VUP falls t15 1 5T CMDVCC to t14 t3 5 C EN RST t41 tde OSC_INT 64 t5 VUP l Vec mana e o o TN RSTIN FCE479 Fig 13 Deactivation sequence 1999 Oct 12 14 Philips Semicondu
5. and synchronous cards It can be placed between the card and the microcontroller It performs all supply protection and control functions It is directly compatible with ISO 7816 GSM11 11 and EMV specifications TYPE NUMBER TDA8002CT A C1 TDA8002CT A TDA8002CT B C1 TDA8002CT B TDA8002CT C C1 TDA8002CT C PACKAGE MARKING NAME DESCRIPTION VERSION plastic small outline package 28 leads body width 7 5 mm SOT136 1 TDA8002CG C1 TDA8002C LQFP32 1999 Oct 12 plastic low profile quad flat package 32 leads body 5 x 5 x 1 4 mm SOT401 1 Philips Semiconductors IC card interface QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS Product specification TDA8002C Supplies Vpp supply voltage lbb lp supply current low power IDD idie supply current Ipp activey Supply current Card supply Idle mode fcLxour 10 MHz active mode Vcc o 5 V fcLKOUT 10 MHz fcLk LOW loc 100 uA fcLk 5 MHz loc 10mA fcLk 5 MHz loc 55mA active mode Vcc o 3 V feLkour 10 MHz foLk LOW loc 100 uA fcLk 5 MHz loc 10mA foLk 5 MHz loc 55mA Vcc o output voltage card clock frequency active mode for Vcc 5 V Icc lt 55 mA DC load Icc 40 nAs AC load active mode for Vcc 3 V Icc lt 55 mA DC load Icc 40 nAs AC load deactivation sequence duration Prot continuous total power dissipation TDA8002CT x Tamb 25 to 85 C
6. of 100 KQ connected to Vpp is integrated MODE MODE OFF OFF RSTIN RSTIN CMDVCC CMDVCC Vcc Vcc RST RST CLK CLK TDA8002CT A TDA8002CT B AUX1 AUX1 PRES PRES AUX2 PRES VO VO VUP VUP S1 S1 VDDA VDDA FCE247 FCE248 Fig 2 Pin configuration TDA8002CT A Fig 3 Pin configuration TDA8002CT B 1999 Oct 12 6 Philips Semiconductors Product specification IC card interface TDA8002C FCE249 Fig 4 Pin configuration TDA8002CT C He SE aie mj 30 XTAL1 29 DGND2 28 VDDD 27 MODE 26 OFF 25 RSTIN AUX1UC CMDVCC AUX2UC Voc cs RST ALARM CLK TDA8002CG CLKSEL AUX1 CLKDIV1 CVITV CLKDIV2 PRES STROBE AUX2 FCE250 CLKOUT 9 DGND1 10 AGND 11 s2 12 VDDA 13 s1 14 VUP 15 vo 16 Fig 5 Pin configuration TDA8002CG 1999 Oct 12 7 Philips Semiconductors IC card interface FUNCTIONAL DESCRIPTION Power supply The supply pins for the chip are Vppa Vpop AGND DGND1 and DGND2 Vppa and Vppp i e Vpp should be in the range of 3 0 to 6 5 V All card contacts remain inactive during power up or power down On power up the logic is reset by an internal signal The sequencer is not activated until Vpp reaches Vin2 Vhys2 see Fig 6 When Vpp falls below V4 an automatic deactivation sequence of the contacts is performed Chip selection The chip select pin CS allows the use of several TDA8002Cs in parallel When GS is HIGH the pi
7. of crystal or resonator When the oscillator is stopped in mode 1 XTAL1 is set to HIGH The transition time and duty cycle definitions are shown in Fig 15 6 CLKOUT transition time and duty cycle do not need to be tested PRES and CMDVCC are active LOW RSTIN PRES and CS are active HIGH 4 t t CV ROO t t 1 2 MGE741 Fig 15 Definition of transition times 1999 Oct 12 21 cl PO 6661 co TDA8002C should be placed as close as possible to the card reader 4 2 3 4 5 3 3 Vor5V J1 1 C1 100 nF 10 uF ground Oc4 oO C3 O c2 O c1 0O cs Ocel L C7 Ocal CARD READ VDD tL C2 csO c70 ce 0 e560 cg c2 Q C3l L cag c6 5 470 nF L cals c5 4 din nF I 470 nF Contact normally open C3 close to pin Vcc of TDA8002C C4 close to C1 contact of card reader C5 close to VUP pin of TDA8002C C6 as close as possible to pins S1 and S2 SD FSI s cr Re Ga AD aN Oat co ND 22 TDA8002CT C CLK line may be shielded with respect to other lines Decoupling capacitors C7 and C8 may be placed as close as possible to pin Vppa A good ground plane is recommended Fig 16 Application diagram FCE195 P2 1 Vpp NOILVINYOSNI NOILVOTIddv 29e SJU
8. solder joint between the printed circuit board and heatsink at bottom version can not be achieved and as solder may stick to the heatsink on top version 3 If wave soldering is considered then the package must be placed at a 45 angle to the solder wave direction The package footprint must incorporate solder thieves downstream and at the side corners 4 Wave soldering is only suitable for LQFP TQFP and QFP packages with a pitch e equal to or larger than 0 8 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 65 mm 5 Wave soldering is only suitable for SSOP and TSSOP packages with a pitch e equal to or larger than 0 65 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 5 mm DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development Preliminary specification This data sheet contains preliminary data supplementary data may be published later Product specification This data sheet contains final product specifications Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System IEC 134 Stress above one or more of the limiting values may cause permanent damage to the device These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the
9. 0 C Wave soldering Conventional single wave soldering is not recommended for surface mount devices SMDs or printed circuit boards with a high component density as solder bridging and non wetting can present major problems To overcome these problems the double wave soldering method was specifically developed If wave soldering is used the following conditions must be observed for optimal results e Use a double wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave 1999 Oct 12 26 Product specification TDA8002C e For packages with leads on two sides and a pitch e larger than or equal to 1 27 mm the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed circuit board smaller than 1 27 mm the footprint longitudinal axis must be parallel to the transport direction of the printed circuit board The footprint must incorporate solder thieves at the downstream end For packages with leads on four sides the footprint must be placed at a 45 angle to the transport direction of the printed circuit board The footprint must incorporate solder thieves downstream and at the side corners During placement and before soldering the package must be fixed with a droplet of adhesive The adhesive can be applied by screen printing pin transfer or syringe dispensing The package can be soldered after the adhesive is cured
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13. I pIe DO Oc008vVOL SI0J9NpUO9ILES SdijiUd uoneoyIoeds 19npo1d cl PO 6661 Eez VDD 3 3Vor5V Ct L c2 VDD 100 nF TF 10 pF P1 0 voue D a eae i P1 1 z __ pie II P1 3 P1 4 P1 5 P1 6 I P1 7 Oca cso 100 nF ocs c7o Oce ceo cat Oci cO 100n AUX1UC CMDVCC 7a FE ON DODO FW ND Voc AUX2UC les cio a RST goce cag me CLK 0 Re hein AUX1 mo CLKSEL P31 44 C8l cai TDA8002CG 3 532 D CLKDIV1 CLKDIV2 STROBE P3 3 P3 4 P3 5 P3 6 CARD READ k ai A 16 15 14 13 12 11 10 9 i o uo F A 3 P37 A XTAL2 ae XTAL1 49 Vss L caf 20 100 nF T 470 nF C7 C8 77 gt 100 nF ji a 10 uF FCE196 VDD TDA8002C should be placed as close as possible to the card reader 1 Contact normally open 2 C3 close to pin Vcc of TDA8002C 3 C4 close to C1 contact of card reader CLK line may be shielded with respect to other lines 4 CS close to VUP pinot 1TDAB0020 Decoupling capacitors C7 C8 and C9 may be placed as close as possible to pin Vppa and Vppp 5 C6 as close as possible to pins S1 and S2 A good ground plane is recommended Fig 17 Application diagram for more details see Application note AN98054 SI0J9NpUO9ILES sdijlud 29e SJUI Ped Ol O
14. INTEGRATED CIRCUITS DATA SHEET TDA8002C IC card interface Product specification 1999 Oct 12 Supersedes data of 1999 Feb 24 File under Integrated Circuits ICO2 Philips PHILIPS Semiconductors DH I LI E Philips Semiconductors Product specification IC card interface TDA8002C FEATURES Single supply voltage interface 3 3 or 5 V environment Low power sleep mode Three specific protected half duplex bidirectional buffered I O lines Voc regulation 5 V 5 or 3 V 5 Icc lt 55 mA for Vpp 3 0 to 6 5 V with controlled rise and fall times Thermal and short circuit protections with current limitations Automatic ISO 7816 activation and deactivation sequences Enhanced ESD protections on card side gt 6 kV Clock generation for the card up to 12 MHz with synchronous frequency changes Clock generation up to 20 MHz external clock Synchronous and asynchronous cards memory and smart cards ISO 7816 GSM11 11 compatibility and EMV Europay MasterCard and Visa compliant Step up converter for Vcc generation Supply supervisor for spikes elimination and emergency deactivation Chip select input for easy use of several TDA8002Cs in parallel ORDERING INFORMATION APPLICATIONS IC card readers for e GSM applications e Banking e Electronic payment e Identification e Pay TV e Road tolling GENERAL DESCRIPTION The TDA8002C is a complete low power analog interface for asynchronous
15. O Vpp WHEN CS IS HIGH AND 100 KQ WHEN CS Is LOW HIGH level output voltage lon 20 HA on data lines LOW level output voltage on louc 1 mA data lines HIGH level input voltage on data lines LOW level input voltage on data lines ALARM and OFF when connected open drain outputs lOH OFF HIGH level output current Vonorr 5 V on pin OFF 1999 Oct 12 18 Philips Semiconductors Product specification IC card interface TDA8002C SYMBOL PARAMETER CONDITIONS VOL OFF LOW level output voltage on loL oFF 2 MA pin OFF loLtaarm LOW level output current on Vor aLarm 0 V pin ALARM VoH ALaRM HIGH level output voltage IOH ALARM 2 MA on pin ALARM tw ALARM pulse width Clock output CLKOUT powered from Vpp frequency on CLKOUT low power LOW level output voltage lou 1 mA 16 HIGH level CHIEN voltage Sn 1 mA Vpp 0 5 e sane S OS Internal oscillator fint frequency of internal active mode 2 oscillator sleep mode Card reset output RST Votinact output voltage inactive modes ta RST delay between RSTIN and RST enabled RST LOW level output voltage lou 200 HA HIGH level ouput voltage lon 200 uA Card clock output CLK Votinact output voltage inactive modes o LOW level output voltage lou 200 uA HIGH level output voltage lon 50 uA a rise and fall times CL 30 pF note 3 slew rate rise a
16. RES AUX1 CLK RST and Vcc on all other pins storage temperature continuous total power dissipation TDA8002CT x Tamb 25 to 85 C TDA8002CG Tamb 25 to 85 C ambient temperature Tj junction temperature 150 C Note 1 Stress beyond these levels may cause permanent damage to the device This is a stress rating only and functional operation of the device under this condition is not implied HANDLING Every pin withstands the ESD test according to MIL STD 883C class 3 for card contacts class 2 for the remaining Method 3015 HBM 1500 100 pF 3 positive pulses and 3 negative pulses on each pin with respect to ground THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth a thermal resistance from junction to ambient in free air SOT136 1 70 K W SOT401 1 91 K W 1999 Oct 12 16 Philips Semiconductors Product specification IC card interface TDA8002C CHARACTERISTICS Voo 3 3 V Tamb 25 C fxta 10 MHz unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Vpp supply voltage 3 IDD Ip supply current low power mode lDD idle supply current Idle mode fe_kout 10 MHz lDD active supply current active mode Vcc o 5 V foLKOUT 10 MHz foLk LOW loc 100 uA fcLk 5 MHz loc 10mA foLk 5 MHz loc 55 mA active mode Veco 3 V foLKOUT 10 MHz fcLx LOW loc 100 uA fcLx 5 MHz loc 10mA foLk 5 MHz lo
17. Vafxtai fxtal Vofrtal STOP low STROBE Lowe X t x t x t STOP low Vofint Notes 1 X don t care 2 In low power mode 3 fin 32 kHz in low power mode VO circuitry The three I O transceivers are identical The state is HIGH for all I O pins i e I O VOUC AUX1 AUX1UC AUX2 and AUX2UC Pin I O is referenced to Vcc and pin I OUC to Vpn thus ensuring proper operation in the event that Vcc Vo The first side on which a falling edge is detected becomes a master input An anti latch circuitry first disables the detection of the falling edge on the other side which becomes slave output see Fig 8 After a delay time ta between 50 and 400 ns the logic 0 present on the master side is transferred on the slave side When the input is back to HIGH level a current booster is turned on during the delay ta on the output side and then both sides are back to their idle state ready to detect the next logic 0 on any side In the event of a conflict both lines may remain LOW until the software enables the lines to be HIGH The anti latch circuitry ensures that the lines do not remain LOW if both sides return HIGH regardless of the prior conditions The maximum frequency on the lines is approximately 200 kHz When CS is HIGH I OUC AUX1UC and AUX2UC are internally pulled up to Vpp with 20 kQ resistors When CS is LOW I OUC AUX1UC and AUX2UC are permanently HIGH with integrated 100 KQ pull up resisto
18. ard and the microcontroller via the I O lines LOW POWER MODE ACTIVATION l DEACTIVATION ACTIVE MODE MGE735 Fig 9 State diagram 1999 Oct 12 Philips Semiconductors IC card interface ACTIVATION SEQUENCE From Idle mode the circuit enters the activation mode when the microcontroller sets the CMDVCC line LOW or sets the MODE line HIGH when the CMDVCC line is already LOW The internal circuitry is then activated the internal clock is activated and an activation sequence is executed When RST is enabled it becomes the inverse of RSTIN Figures 10 to 12 illustrate the activation sequence as follows 1 Step up converter is started t4 to Product specification TDA8002C 2 Vccrises from 0 to 3 or 5 V te t4 1 T according to the state on pin CV TV I O AUX1 and AUX2 are enabled and CLK is enabled tg t4 4T I O AUX1 and AUX2 were forced LOW until this time 4 CLK is set by setting RSTIN to HIGH t4 5 RST is enabled ts t4 7T after ts RSTIN has no further action on CLK but is only controlling RST a The value of Vcc 5 or 3 V must be selected by the level on pin CV TV before the activation sequence OSC_INT 64 l l CMDVCC VUP VO LOW CLK a TT RSTIN l RST FCE273 Fig 10 Activation sequence using RSTIN and CMDVCC 1999 Oct 12 12 Philips
19. c 55 mA Vine threshold voltage on Vpp for falling voltage supervisor Vhys2 hysteresis on Vine Card supply Vcc o output voltage Idle mode active mode Voc 5 V loc lt 55 mA DC load Icc 40 nAs AC load Voc 3 V loc lt 55 mA DC load Icc 24 nAs AC load Icc o output current Veco from 0 to 5 or 3 V Vcc short circuited to ground SR slew rate rising or falling slope Crystal connections XTAL1 and XTAL2 external capacitors note 1 resonance frequency note 2 1999 Oct 12 17 Product specification Philips Semiconductors ificati IC card interface SYMBOL PARAMETER CONDITIONS TDA8002C Data lines GENERAL delay between falling edge of I O AUX1 AUX2 I OUC AUX1UC and AUX2UC rise and fall times maximum frequency on data lines aie 0 5 us 200 kHz DATA LINES I O AUX1 AND AUX2 WITH 10 KQ PULL UP RESISTOR CONNECTED TO 2 Yoc output voltage Idle and low power modes 0 3 HIGH level output voltage lon 20 HA on data lines LOW level output voltage on data lines 0 TN HIGH level input voltage on data lines LOW level input voltage on data lines voltage on data lines outside a session internal pull up resistance between data lines and Voc current from data lines when active pull up is active LOW level input current on data lines DATA LINES I OUC AUX1UC AND AUX2UC WITH 20 KQ PULL UP RESISTOR CONNECTED T
20. c008vVOL uoneoyIoeds 19npo1d Philips Semiconductors Product specification IC card interface TDA8002C PACKAGE OUTLINES S028 plastic small outline package 28 leads body width 7 5 mm SOT136 1 Z 28 pin 1 index THE si 5 scale DIMENSIONS inch dimensions are derived from the original mm dimensions A max UNIT A1 A2 A3 bp c DM EM e HE 18 1 7 6 17 7 7 4 0 71 0 30 0 69 0 29 2 65 inches 0 10 Note 1 Plastic or metal protrusions of 0 15 mm maximum per side are not included OUTLINE REFERENCES EUROPEAN VERSION IEC JEDEC EIAJ PROJECTION SOT136 1 075E06 MS 013AE ET 97 05 22 ISSUE DATE 1999 Oct 12 24 Philips Semiconductors Product specification IC card interface TDA8002C LQFP3z2 plastic low profile quad flat package 32 leads body 5 x 5 x 1 4mm SOT401 1 detail X DIMENSIONS mm are the original dimensions A max UNIT Ai A2 Ag bp c
21. ctors IC card interface Fault detection The following fault conditions are monitored by the circuit e Short circuit or high current on Voc e Removing card during transaction e Vpp dropping e Overheating Product specification TDA8002C When one or more of these faults are detected the circuit pulls the interrupt line OFF to its active LOW state and a deactivation sequence is initiated In the event that the card is present the interrupt line OFF is set to HIGH state when the microcontroller has reset the CMDVCC line HIGH after completion of the deactivation sequence In the event that the card is not present OFF remains LOW OSC_INT 64 OFF tio PRES Voc 5 t2 EN C RST t41 tde om or ea dei deoir E S aa sis t14 el I t3 CE FCE480 Fig 14 Emergency deactivation sequence 1999 Oct 12 Philips Semiconductors Product specification IC card interface TDA8002C LIMITING VALUES In accordance with the Absolute Maximum Rating System IEC 134 note 1 SYMBOL PARAMETER CONDITIONS MIN MAX UNIT Vppp digital supply voltage i 76 5 V analog supply voltage card supply voltage pins XTAL1 XTAL2 ALARM CS MODE RSTIN CLKSEL AUX2UC AUX1UC CLKDIV1 CLKDIV2 CLKOUT STROBE CMDVCC CV TV and OFF input voltage on card contact pins I O AUX2 PRES PRES AUX1 CLK RST and Vcc electrostatic handling voltage on pins I O AUX2 PRES P
22. nd fall Strobe input STROBE Vin HIGH level input voltage 0 7Vpp Vpp V 1999 Oct 12 19 Philips Semiconductors IC card interface SYMBOL PARAMETER CONDITIONS Product specification TDA8002C Logic INPUTS CV TV AND CS INTEGRATED 10 KQ PULL UP RESISTOR CONNECTED TO Vpp note 5 LOW level input voltage HIGH level input voltage 0 7Vpp Voo Logic inputs PRES and PRES note 5 Vit LOW level input voltage 0 0 3Vpp V Vin HIGH level input voltage 0 7Vpp Voo V g uA lIL PRES LOW level input current on pin PRES liH PRES HIGH level input current on pin PRES Protections shut down local temperature shut down current at Vcc activation sequence guaranteed by design duration see Fig 12 deactivation sequence guaranteed by design duration see Fig 14 start of the window for see Figs 10 and 11 sending CLK to the card end of the window for sending CLK to the card see Fig 11 tis time from input to select time from input to deselect SL t toz time from deselect to high pull up resistor at pin impedance OFF 10 kQ 1 device 2 devices in parallel maximum rise time on pin CS maximum fall time on pin CS 1999 Oct 12 20 Philips Semiconductors Product specification IC card interface TDA8002C Notes 1 It may be necessary to connect capacitors from XTAL1 and XTAL2 to ground depending on the choice
23. ns RSTN CMDVCC MODE CV TV CLKDIV1 CLKDIV2 CLKSEL and STROBE control the chip pins VOUC AUX1UC and AUX2UC are the copy of I O AUX1 and AUX2 when enabled with integrated 20 kQ pull up resistors connected to Vpp and OFF is enabled When CS goes LOW the levels on pins RSTIN CMDVCC MODE CV TV CLKDIV1 CLKDIV2 and STROBE are internally latched l OUC AUX1UC and AUX2UC go to high impedance with respect to I O AUX1 and AUX2 with integrated 100 k pull up resistors connected to Vpp and OFF is high impedance Supply voltage supervisor Vpp This block surveys the Vpp supply A defined retriggerable pulse of 10 ms minimum tw is delivered on the ALARM output during power up or power down of Vpp see Fig 6 This signal is also used for eliminating the spikes on card contacts during power up or power down When Vopn reaches Vino Vhys2 an internal delay tw is started The ALARM output is active until this delay has expired When Vos falls below Vin2 ALARM is activated and a deactivation sequence of the contacts is performed 1999 Oct 12 Product specification TDA8002C Clock circuitry The TDA8002C supports both synchronous and asynchronous cards There are three methods to clock the circuitry e Apply a clock signal to pin STROBE e Use of an internal RC oscillator e Use of a quartz oscillator which should be connected between pins XTAL1 and XTAL2 or an external clock applied on XTAL1 When CLKSEL is HIGH
24. ocument does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher for any consequence of its use Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights Printed in The Netherlands 545004 25 03 pp28 Philips Semiconductors Date of release 1999 Oct 12 Document order number 9397 750 06149 Let make things better S PHILIPS
25. rain PMOS reset output for microcontroller active HIGH control input signal for CLK LOW XTAL oscillator HIGH STROBE input 1 CLKDIV1 8 6 I control input with CLKDIV2 for choosing CLK freguency control input with CLKDIV1 for choosing CLK freguency STROBE 10 8 external clock input for synchronous applications CLKOUT 11 clock output see Table 1 DGND1 12 1 supply digital ground 1 S 14 1 I O capacitance connection for voltage doubler 16 17 18 CLKSEL 5 2 S1 IO capacitance connection for voltage doubler VUP I O output of voltage doubler O AUX2 auxiliary I O line to and from card data I O line to and from card PRES card input presence contact active LOW active HIGH card input presence contact card voltage selection input line high 5 V low 3 V note 1 I O auxiliary I O line to and from card clock to card output C31 see Table 1 card reset output C21 supply for card C11 CMDVCC start activation sequence input from microcontroller active LOW RSTIN card reset input from microcontroller OFF 27 27 27 26 O open drain NMOS interrupt output to microcontroller active LOW 1999 Oct 12 5 Philips Semiconductors Product specification IC card interface TDA8002C SYMBOL TYPE TYPE TYPE TYPE DESCRIPTION CT A CT B MODE operating mode selection input HIGH normal LOW sleep Note 1 A pull up resistor
26. rs connected to Vpp tg conflict idle MGD703 Fig 8 Master and slave signals 1999 Oct 12 Philips Semiconductors IC card interface Logic circuitry After power up the circuit has six possible states of operation Figure 9 shows the state diagram IDLE MODE After reset the circuit enters the idle mode A minimum number of functions in the circuit are active while waiting for the microcontroller to start a session e All card contacts are inactive e I OUC AUX1UC and AUX2UC are high impedance e Oscillator XTAL runs delivering CLKOUT e Voltage supervisor is active LOW POWER MODE When pin MODE goes LOW the circuit enters the low power sleep mode As long as pin MODE is LOW no activation is possible Product specification TDA8002C If pin MODE goes LOW in the active mode a normal deactivation sequence is performed before entering the low power mode When pin MODE goes HIGH the circuit enters the normal operating mode after a delay of at least 6 ms 96 cycles of CLKOUT During this time the CLKOUT remains at 16 kHz e All card contacts are inactive e Oscillator XTAL does not operate e The Vpp supervisor ALARM output card presence detection and OFF output remain functional e Internal oscillator is slowed to 32 kHz providing 16 kHz on CLKOUT ACTIVE MODE When the activation sequence is completed the TDA8002C will be in the active mode Data is exchanged between the c
27. specification is not implied Exposure to limiting values for extended periods may affect device reliability Application information Where application information is given it is advisory and does not form part of the specification LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances devices or systems where malfunction of these products can reasonably be expected to result in personal injury Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale 1999 Oct 12 27 Philips Semiconductors Argentina see South America Australia 3 Figtree Drive HOMEBUSH NSW 2140 Tel 61 2 9704 8141 Fax 61 2 9704 8139 Austria Computerstr 6 A 1101 WIEN P O Box 213 Tel 43 1 60 101 1248 Fax 43 1 60 101 1210 Belarus Hotel Minsk Business Center Bld 3 r 1211 Volodarski Str 6 220050 MINSK Tel 375 172 20 0733 Fax 375 172 20 0773 Belgium see The Netherlands Brazil see South America Bulgaria Philips Bulgaria Ltd Energoproject 15th floor 51 James Bourchier Blvd 1407 SOFIA Tel 359 2 68 9211 Fax 359 2 68 9102 Canada PHILIPS SEMICONDUCTORS COMPONENTS Tel 1 800 234 7381 Fax 1 800 943 0087 China Hong Kong 501 Hong Kong Industrial Technology Centre 72 Tat Chee Avenue Kowloon Tong HONG KONG Tel 852 2319
28. the clock should be applied to the STROBE pin When CLKSEL is LOW the internal oscillators is used When an internal clock is used the clock output is available on pin CLKOUT The RC oscillator is selected by making CLKDIV1 HIGH and CLKDIV2 LOW The clock output to the card is available on pin CLK The frequency of the card clock can be the input frequency divided by 2 or 4 STOP low or 1 25 MHz depending on the states of CLKDIV1 or CLKDIV2 see Table 1 When STROBE is used for entering the clock to a synchronous card STROBE should remain stable during activation sequence otherwise the first pulse may be omitted Do not change CLKSEL during activation When in low power sleep mode the internal oscillator frequency which is available on pin CLKOUT is lowered to approximately 16 kHz for power economy purposes Philips Semiconductors Product specification IC card interface TDA8002C Vih2 Vhys2 VDD Vih2 e tw 7 lt tw ALARM AINA Ww l FCE272 Fig 6 ALARM as a function of Vpp tw pulse width minimum of 10 ms OFF I OUC AUX1UC AUX2UC FCE245 el tig ts Tp er tpm Fig 7 Chip select 1999 Oct 12 9 Philips Semiconductors IC card interface Product specification TDA8002C Table 1 Clock circuitry definition FREQUENCY OF FREQUENCY OF CLKSEL CLKDIV1 CLKDIV2 CLKOUT LOW HIGH LOW Vofint Vofint LOW LOW LOW
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