Kingston Technology HyperX 8GB DDR3-2800
Contents
1. 9 8 7 6 Programmable Additive Latency 0 CL 2 or CL 1 clock 8 bit pre fetch Burst Length 8 Interleave without any limit sequential with starting address 000 only 4 with tCCD 4 which does not allow seamless read or write either on the fly using A12 or MRS Bi directional Differential Data Strobe Internal self calibration Internal self calibration through ZQ pin RZQ 240 ohm 1 On Die Termination using ODT pin Average Refresh Period 7 8us at lower than TCASE 85 C 3 9us at 85 C lt TCASE lt 95 C Asynchronous Reset PCB Height 2 118 53 80mm w heatsink single sided component Continued gt gt Document No 4807276 001 B00 04 22 15 Page 1 continued MODULE WITH HEAT SPREADER 133 35 mm 8 12 mm C Co Gg CLr ir r Zir FE FF H G E ELPA PM PM MA a 71 FF Fe FE E PRED TOR E o0 A Ww D C Kingston O O MODULE DIMENSIONS 133 35 30 00 Units millimeters 18 80 15 80 11 00 8 00 0 00 0 00 54 70 FOR MORE INFORMATION GO TO WWW KINGSTON COM All Kingston products are tested to meet our published specifications Some motherboards or system configurations may not2. operate at the published HyperX memory speeds and timing settings Kingston does not recommend that any user attempt to run their computers faster than the published speed Overclocking or modifying your system timing may result in damage to computer components kingston com Document No 4807276 001 B00 Page 2
3. Memory Module Specifications Kingston HX328C12T2K2 8 8GB 4GB 512M x 64 Bit x 2 pcs DDR3 2800 CL12 240 Pin DIMM Kit Kingston DESCRIPTION Kingston s HX328C12T2K2 8 is a kit of two 512M x 64 bit 4GB DDR3 2800 CL12 SDRAM Synchronous DRAM 1Rx8 memory modules based on eight 512M x 8 bit FBGA compo nents per module Each module kit supports Intel XMPo Extreme Memory Profiles Total kit capacity is 8GB Each module kit has been tested to run at DDR3 2800 at a low latency timing of 12 15 15 at 1 65V The SPDs are programmed to JEDEC standard latency DDR3 1600 timing of 11 11 11 at 1 5V Each 240 pin DIMM uses gold contac fingers The JEDEC standard electrical and mechanical specifications are as follows XMP TIMING PARAMETERS e JEDEC DDR3 1600 CL11 11 11 1 5V e XMP Profile 1 D3 2800 CL12 15 15 1 65V e XMP Profile 2 D3 2666 CL11 15 15 1 65V kingston com SPECIFICATIONS CL IDD 11 cycles Row Cycle Time tRCmin 48 125ns min Refresh to Active Refresh 260ns min Command Time tRFCmin Row Active Time tRASmin 35ns min Maximum Operating Power 2 160 W per module UL Rating 94V 0 Operating Temperature 0 C to 85 C Storage Temperature 55 C to 100 C Power will vary depending on the SDRAM used FEATURES JEDEC standard 1 5V 1 425V 1 575V Power Supply VDDQ 1 5V 1 425V 1 575V 800MHz fCK for 1600Mb sec pin 8 independent internal bank Programmable CAS Latency 11 10
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