Samsung M393B2G70BH0-YH909 memory module
Contents
1. 71 Register Control Word Functions RC4 RC5 RICE 55h 72 Register Control Word Functions RC6 RC7 Default 00h 73 Register Control Word Functions RC8 RC9 Default 00h 74 Register Control Word Function RC10 RC11 Default 00h 75 Register Control Word Function RC12 RC13 Default 00h 76 Register Control Word Function RC14 RC15 Default 00h 77 116 Reserved gt 00h 117 Module Manufacturer ID Code Least Significant Byte Samsung 80h 118 Module Manufacturer ID Code Most Significant Byte Samsung CEh 119 Module ID Module Manufacturing Location Onyang Korea Oth 120 Module ID Module Manufacturing Date 00h 121 Module ID Module Manufacturing Date z 00h 122 125 Module ID Module Serial Number gt 00h 126 Cyclical Redundancy Code DEh 9Ch FBh A8h 127 Cyclical Redundancy Code 90h 39h EEh E6h 128 Module Part Number M 4Dh 129 Module Part Number 3 33h 130 Module Part Number 9 39h 131 Module Part Number 3 33h 132 Module Part Number B 42h 133 Module Part Number 2 32h 134 Module Part Number G 47h 135 Module Part Number 7 37h 136 Module Part Number 0 30h 137 Module Part Number B die 42h 138 Module Part Number H 48h 139 Module Part Number 0 30h 140 Module Part Number 2Dh 141 Module Part Number Y 59h 142 Module Part Number F H M K 46h 48h 4Dh 4Bh 143 Module Part Number 8 9 0 38h 39h 4th 30h Samsona ELECTRONICS Page 2 3 FEB 2012 SERIAL PRESENCE DETECT Byte2. 071ns 1 25ns OFh OCh 09h OAh 13 Reserved Reserved 00h CAS Latencies Supported Least Significant Byte 6 7 8 6 7 8 6 7 8 14 67 8 g 9 10 9 10 1Ch 3Ch FCh FCh 11 13 11 CAS Latencies Supported Most Significant Byte 6 7 8 6 7 8 6 7 8 15 6 7 8 x 9 9 10 9 10 00h 00h 02h 00h 11 13 11 16 Minimum CAS Latency Time tAAmin 13 125ns 69h 17 Minimum Write Recovery Time tWRmin 15ns 78h 18 Minimum RAS to CAS Delay Time tRCDmin 13 125ns 69h 19 Minimum Row Active to Row Active Delay Time tRRDmin 7 5ns 6ns 5ns 6ns 3Ch 30h 28h 30h 20 Minimum Row Precharge Time tRPmin 13 125ns 69h 21 Upper Nibbles for tRAS and tRC 7 11h 22 Minimum Active to Precharge Time tRASmin Least Significant Byte 37 5ns 36ns 34ns 35ns 2Ch 20h 10h 18h 23 Minimum Active to Active Refresh Time tRCmin Least Significatn Byte 50 625ns 49 125ns 47 125ns 48 125ns 95h 89h 79h 81h 24 Minimum Refresh Recovery Time tRFCmin Least Significant Byte 260ns 20h 25 Minimum Refresh Recovery Time tRFCmin Most Significant Byte 260ns 08h 26 Minimum Internal Write to Read Command Delay Time tWTRmin 7 5ns 3Ch 27 Minimum Internal Read to Precharge Command Delay Time tRTPmin 7 5ns 3Ch 28 Upper Nibble for tFAW 37 5ns 30ns 27ns 30ns Oth 00h 00h 00h 29 Minimum Four Activate Window Delay Time tFAWmin Least Significant Byte 37 5ns 30ns 27ns 30ns 2Ch FOh D8h FOh 30 SDRAM Output Drivers supported DLL off Mode RZQ 6 RZQ 7 83h 31 SDRAM Thermal and Refresh Optio
3. SERIAL PRESENCE DETECT M393B2G70BHO YF809 Y H909 YMA09 Y KO009 Organization 2G x 72 Composition 1G x 4 36ea Used component part K4B4G0446B HYF8 HYH9 HYKO HYMA of rows in module 2 Row of banks in component 8 Banks Feature 30mm height amp double sided component Refresh 8K 64ms Bin Sort F8 DDR3 1066 CL 7 H9 DDR3 1333 CL 9 KO DDR3 1600 CL 11 MA DDR3 1866 CL 13 RCD Vendor and Revision Inphi UV GS02 Samsona ELECTRONICS Byte Eon Function Supported Hex Value unction Described Note YF809 YH909 YMAO09 YK009 YF809 YH909 YMA09 YK009 Number of Serial PD Bytes Written SPD Device Size CRC Coverage CRC coverage 0 116Byte SPD Byte 0 Total 256Byte SPD Byte Use 92h 176Byte 1 SPD Revision Version 1 1 11h 2 Key Byte DRAM Device Type DDR3 SDRAM OBh 3 Key Byte Module Type Registered DIMM Oth 4 SDRAM Density and Banks 4Gb 8banks 04h 5 SDRAM Addressing Row 16 Column 11 22h 6 Module Nominal Voltage VDD 1 35V and 1 5V 02h 7 Module Organization 2Rank x4 08h 8 Module Memory Bus Width ECC 64bit OBh 9 Fine Timebase Dividend and Divisor 1ps 1th 10 Medium Timebase Dividend 1 8 0 125ns Oth 11 Medium Timebase Divisor 1 8 0 125ns 08h 12 SDRAM Minimum Cycle Time tCKmin 1 875ns 1 5ns 1
4. erent f Function Supported Hex Value PR YF809 YH909 YMA09 YK009 YF809 YH909 YMA09 YK009 aoe 144 Module Part Number Blank 20h 145 Module Part Number Blank 20h 146 147 Module Revision Code 00h 148 SDRAM Manufacturer s JEDEC ID Code Samsung 80h 149 SDRAM Manufacturer s JEDEC ID Code Samsung CEh 150 175 Manufacturer s Specific Data 00h 176 255 Open for customer use 00h ams ond ELECTRONICS Page 3 3 FEB 2012
5. ns No ODTS No ASR Oth 32 Module Thermal Sensor with TS 80h 33 SDRAM Device Type Standard Monolithic DRAM Device 00h 34 Fine Offset for SDRAM Minimum Cycle Time tCKmin 1 875ns 1 5ns 1 071ns 1 25ns 00h 00h CAh 00h 35 Fine Offset for Minimum CAS Latency Time tAAmin 13 125ns 00h Page 1 3 FEB 2012 SERIAL PRESENCE DETECT Byte Suwa Function Supported Hex Value unction Described Note YF809 yH909 YMA09 YK009 YF809 YH909 YMA09 YKO09 36 Fine Offset for Minimum RAS to CAS Delay Time tRCDmin 13 125ns 00h 37 Fine Offset for Minimum Row Precharge Delay Time tRPmin 13 125ns 00h 38 Fine Offset for Minimum Active to Active Refresh Delay Time tRCmin 50 625ns 49 125ns 47 125ns 48 125ns 00h 39 59 Reserved General Section Reserved 00h 60 Module Nominal Height 30mm OFh 61 Module Maximum Thickness Planar Double sides 11h 62 Reference Raw Card Used R C E 2 0 44h 63 DIMM Module Attributes 2 Rows of DRAM 1 Register used 09h 64 Heat Spreader Solution without HS 00h 65 Register vendor ID code LSB Inphi 04h 66 Register vendor ID code MSB Inphi B3h 67 Register Revision Number Inphi UVGS02 2th 68 Register Type SSTE32882 00h 69 Register Control Word Functions RC0 RC1 Default 00h 70 Register Control Word Functions RC2 RC3 RICE 50h
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