Goodram 2GB DDR2-800
Contents
1. 49 Reserved for future use 0x00 0 50 Reserved for future use 0x00 0 51 Reserved for future use 0x00 0 52 Reserved for future use 0x00 0 53 Reserved for future use 0x00 0 54 Reserved for future use 0x00 0 55 Reserved for future use 0x00 0 56 Reserved for future use 0x00 0 57 Reserved for future use 0x00 0 58 Reserved for future use 0x00 0 59 Reserved for future use 0x00 0 60 Reserved for future use 0x00 0 61 Reserved for future use 0x00 0 62 SPD Revision 0x11 17 63 Checksum for Bytes 0 62 0x7E 126 64 255 Manufacturer s specific data GOODRAM logo and GOODDRIVE logo are registered trademarks of Wilk Elektronik S A Wilk Elektronik S A All other trademarks and logos are the property of their respective owners Poland 43 174 aziska G rne ul Mikotowska 42 WILK All products and specifications are subject to change without notice tel 0 32 736 90 00 fax 0 32 736 90 01 ERENTRONICRA S cn www Wilk com pl e www goodram com Saat Rev 24 07 2008 Wilk Elektronik S A 20082. 2 21 SDRAM Module Attributes 0x00 0 22 SDRAM Device Attributes General 0x07 7 23 Minimum Clock Cycle at CL X 0 5 0x30 48 24 Maximum Data Access Time tAC from Clock at CL X 0 5 0x45 69 25 Minimum Clock Cycle at CL X 1 0x3D 61 26 Maximum Data Access Time tAC from Clock at CL X 1 0x50 80 27 Minimum Row Precharge Time tRP 0x3C 60 28 Minimum Row Active to Row Active delay tRRD Ox1E 30 29 Minimum RAS to CAS delay tRCD 0x3C 60 30 Minimum Active to Precharge Time tRAS 0x2D 45 31 Module Bank Density 0x80 128 32 Address and Command Input Setup Time Before Clock 0x17 23 33 Address and Command Input Hold Time After Clock 0x25 37 34 Data Input Setup Time Before Clock 0x05 5 35 Data Input Hold Time After Clock 0x12 18 36 Write recovery time tWR 0x3C 60 37 Internal write to read command delay tWTR Ox1E 30 38 Internal read to precharge command delay tRTP Ox1E 30 39 Memory Analysis Probe Characteristics 0x00 0 40 Extension of Byte 41 tRC and Byte 42 tRFC 0x00 0 41 SDRAM Device Minimum Active to Active Auto Refresh Time tRC 0x3C 60 42 SDRAM Device Minimum Auto Refresh to Active Auto Refresh tRFC 0x69 105 43 SDRAM Device Maximum device cycle time tCKmax 0x80 128 44 SDRAM Device Maximum skew between DQS and DQ signals tDQSQ 0x14 20 45 DDR SDRAM Device Maximum Read Data Hold Skew Factor tQHS Ox1E 30 46 Reserved for future use 0x00 0 47 SDRAM Device Attributes DDR SDRAM DIMM Height 0x00 0 48 Reserved for future use 0x00 0
3. Wwww goodram com MEMORY MODULE SPECIFICATION GR 800 D2 64 L6 2GDC GOOD GOODRAM RAM SPEED DATA TRANSFER 800MHz PC2 6400 professional memory for everyone MODULETYPE DDR2 SDRAM DIMM DDR Il MODULE MODULE DATAWIDTH 64 PART NUMBERING CAS LATENCY 6 SYSTEM MODULE DENSITY 2GB Dual Channel ITI Nid I Nid FEATURES PART NUMBER GR800D264L6 2GDC MODULE TYPE DDR2 SDRAM DIMM MODULE DENSITY 2x1GB MODULE DATA WIDTH 64 DRAM CHIP ORAGNIZATION 64Mx8 NUMBER OF DRAM CHIPS 16 NUMBER OF MODULE RANKS 2 NUMBER OF MODULE SIDES 2 REGISTERED NO ECC SUPPORT NO PIN COUNT 240 PIN SUPPLY VOLTAGE 1 8V SSTL 18 COMPATIBLE YES PROGRAMMED SPD MEMORY 128 BYTES MAX AVG PERIODIC REFRESH INTERVAL 7 8 us Z Z 800MHz 2x400MHz PC2 6400 6 BS 667MHz 2x333MHz PC2 5300 5 533MHz 2x266MHz PC2 4200 4 RAS TO CAS DELAY tRCD 15 ns ROW PRECHARGE TIME tRP 15 ns ROW ACTIVE TO ROW ACTIVE DELAY tRRD 7 505 ACTIVE TO PRECHARGE TIME tRAS 45 ns ACTIVE TO ACTIVE AUTO REFRESH TIME tRC 60ns AUTO REFRESH TO ACTIVE AUTO REFRESH tRFC 105 ns 3 DEVICE CYCLE TIME tCK MAX 8 PCB TYPE DDR2 SDRAM DIMM BOARD DIMENSIONS 133 35 x30mm 0 1mm BOARD THICKNESS 127mm 0 13mm DRAM PACKAGE INFORMATION FBGA x8bit CONTACT PADS PIN GOLD PLATED GOODRAM logo and GOODDRIVE logo are registered trademarks of Wilk Elektronik S A Wilk Elektronik S A All other trademarks and logos are the property of their respective owners Poland 43 174 taziska Go
4. rne ul Mikotowska 42 WILK All products and specifications are subject to change without notice tel 0 32 736 90 00 fax 0 32 736 90 01 ELEKTRONIK A L u www wilk com pl e www goodram com EZ il Rev 24 07 2008 Wilk Elektronik S A 2008 www goodram com MEMORY MODULE SPECIFICATION SPD CONFIGURATION GOOD BYTE DESCRIPTION HEX DEC RANI professional memory for everyone 0 Number of Serial PD Bytes written during module production 0x80 128 1 Total number of Bytes in Serial PD device 0x08 8 2 Fundamental Memory Type FPM EDO SDRAM 0x08 8 3 Number of Row Addresses on this assembly Ox0E 14 4 Number of Column Addresses on this assembly 0x0A 10 5 Number of DIMM Banks 0xA1 161 6 Data Width of this assembly 0x40 64 7 Data Width of this assembly 0x00 0 8 Voltage Interface Level of this assembly 0x05 5 9 SDRAM Cycle time at Maximum Supported CAS Latency CL CL X 0x25 37 10 SDRAM Access from Clock 0x40 64 11 DIMM configuration type Non parity Parity or ECC 0x00 0 12 Refresh Rate Type 0x82 130 13 Primary SDRAM Width 0x08 8 14 Error Checking SDRAM Width 0x00 0 15 SDRAM Device Attributes Minimum Clock Delay Back to Back RCA 0x00 0 16 SDRAM Device Attributes Burst Lengths Supported 0x0 12 17 SDRAM Device Attributes Number of Banks on SDRAM Device 0x04 18 SDRAM Device Attributes CAS Latency 0x70 112 19 SDRAM Device Attributes CS Latency 0x00 0 20 SDRAM Device Attributes Write Latency DIMM Type Information 0x02
Download Pdf Manuals
Related Search