Dataram 16GB DDR3-1066
Contents
1. iaj l 2m l anag Back view Side view os ie oe 4 WA a APY ae IIIi TEE TEE Er s fl iaid i j essa as ra H 4 i EEN EE fS Pei l an i toom j ft ee eda TTT E i _ k OSC ofl Coens oll GRSX6275M2L 15 Dec 10 Copyright 2010 Dataram Corporation U S A Headquarters 1 609 799 0071 Offices in Europe and Asia www dataram com The information contained in this document has been carefully checked and is believed to be reliable and accurate However Dataram assumes no responsibility for errors2. lp eevee GRSX6275M2L a Optimizing Value and Performance ee ine DDR3 1333 PC3L 10600 Registered ECC 1 35V 240 pin DIMMs Products in Family GRSX6275M2L 4GB 1 x 4GB 1Rx4 DIMM GRSX6275M2L 8GB 1 x 8GB 2Rx4 DIMM GRSX6275M2L 16GB 1 x 16GB 4Rx4 DIMM ee ee ee ee ee Features Description 240 pin JEDEC compliant DIMMs Each GRSX6275M2L upgrade consists of a single 133 35 mm wide by 30 mm high 1 181 x 5 25 DDR3 1333 Registered ECC DIMM that conforms to Data Transfer Rate 10 6 Gigabytes sec JEDEC s DDR3 PC3L 10600 standard One 2K bit Operating Voltage 1 35 V 0 075 EEPROM is used for Serial Presence Detect and a Fully ROHS Compliant combination register PLL with Address and Command Thermal Sensor Parity is also used A thermal sensor accurately monitors the DIMM module and can prevent exceeding the maximum operating temperature of 95C Note The 16GB upgrade is a DDR3 1066 PCL 8500 DIMM Dataram Product Oracle Sun Product Supported in these Oracle Sun systems GRSX6275M2L 4GB X4715A Sun Blade X6275 M2 Server Module GRSX6275M2L 8GB X4716A GRSX6275M2L 16GB Not Offered by Oracle Front view Notes i Tolerances on all dimensions except where otherwise indicated are 13 005 FB 1 28 i t All dimensions are expressed i pi ti in millimeters inches ere ner E werner NONE EEN Oy j ret ia res S4Th a Fas iT g TEN Diets jog E
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