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3. M6 SHE DRAWING NUMBER A SANTA CLARA CA 95052 8119 54 1 Odoooooo ooooopooooooooo 6d000000000000p000000000 00000000600000p000000000 999999999999999 999999999 o 000000600000b0000000000 00000000040000090000000p0000000000 96909909090000006900000p0000000090 o i 000000000 P 000600006 o o o o o o o o o o Qi o o o o o o o o o o 2200 MISSION COLLEGE BLVD P O BOX 58119 13 7 5 195 u Ooo o BOTTOM VIEW o9 o O 000 e 3 608000000 00000000000000006 0000000000 0000600000000000000000000000 DEPARTMENT 000000000000000090000000000000000 000000000000000090000000000000000 00000000000000006000000000000000 1 5 MAX ALLOWABLE COMPONENT HEIGHT 7 o5 SIDE VIEN SEE DETAL F 12 5 DETAIL F SCALE 25 1 TOP VIEW IT 1S DISCLOSED IN CONFIDENCE AND ITS CONTENTS be ex p 2x 11 75 120 2 KIMAANA TRIS DIMPLE MAY BE PRESENT ON SOME DESIGNS DEPTH WILL BE 0 01 TO 0 1 2mm DIAMETER s s CORNER ZONE IDENTIFICATION MARKS THERE MAY BE 0 MAY NOT BE DISCLOSED REPRODUCED DISPLAYED OR MODIFIED WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION R THIS DRAWING CONTAINS INTEL
4. Tcase C a o A a 40 35 TDP TGASE_MAX Thermal Profile Y 0 298 X 43 2 1U Alternative Heatsink Y 0 331 X 40 Quad Core Intel Xeon Processor 5400 Series TMDG 55 56 1U Alternative Heatsink Thermal Mechanical Design Quad Core Intel Xeon Processor 5400 Series TMDG Mechanical Drawings Note Table B 1 Mechanical Drawings The mechanical drawings included in this appendix refer to the thermal mechanical enabling components for the Quad Core Intel Xeon Processor 5400 Series Intel reserves the right to make changes and modifications to the design as necessary Mechanical Drawing List Drawing Description Figure Number Quad Core Intel Xeon Processor 5400 Series TMDG 2U CEK Heatsink Sheet 1 of 4 Figure B 1 2U CEK Heatsink Sheet 2 of 4 Figure B 2 2U CEK Heatsink Sheet 3 of 4 Figure B 3 2U CEK Heatsink Sheet 4 of 4 Figure B 4 CEK Spring Sheet 1 of 3 Figure B 5 CEK Spring Sheet 2 of 3 Figure B 6 CEK Spring Sheet 3 of 3 Figure B 7 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Figure B 8 Sheet 1 of 6 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Figure B 9 Sheet 2 of 6 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Figure
5. 69 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Sheet 6 of i 70 1U CEK Heatsink Sheet 1 Of 4 ai alan alin KOKO sa a ax kaka ERR A KAKA ala a a SEA YA 71 1U CEK Heatsink Sheet 2 of AJ EN halanan ka kak teen ou aa daa na SEA PARRA d ch 72 1U CEK Heatsink Sheet Ui esa heres SEENEN nana aa ana NEE SE EA a a a laet e 73 TU CEK Heatsink Sheet 4 of 4 oec nae reete eu da ee eres ae xa cu edu daa vie ar a 74 Active CEK Thermal Solution Volumetric Sheet 1 of 3 75 Active CEK Thermal Solution Volumetric Sheet 2 of 31 76 Active CEK Thermal Solution Volumetric Sheet 3 of 31 77 1U Alternative Heatsink 1 of ss sik Asi sik sika h de nae sena ete da EE ana EN SEENEN ck eu 78 tU Alternative Heatsink 2 Of 4 zaa owi sese Aaa 79 1U Alternative Heatsink 3 Of 4 sie iiie ta banan ya b nan a BORE a ven EN Waa a Ra RENE GAYA 80 1U Alternative Heatsink 4 Of 4 ue geen ierra eene nya dani Ia 81 Load Cell Installation in Machined Heatsink Base Pocket Bottom View 84 Load Cell Installation in Machined Heatsink Base Pocket Side View 85 Preload Test Configuration enar deter tite ade Hee nasi AR ER RA IR ive W k GO Aa Ra Rial 85 Quad Core Intel Xeon Processor 5400 Series TMDG 5 inteD NWPNNNNDN GE GA n AU B 2L BAL TI TI T N Reference DOCUMENTS omine IA u EEOAE SEENEN a RENE 9 Terms and Description Wi 10
6. A 1U Alternative Heatsink Thermal Mechanical Design 53 AT Component EEN 53 A 2 Thermal Solution Performance Characterics wwwwasamwanannwananzwnwanzaninzanwawa 54 A 3 Thermal Profile Adberence nenne mene mener nnn nn 54 B Mechanical Drawings riores NEE O Kara z Rae ha rage a haaa dee Een Ka ee 57 c Heatsink Clip Load Methodologie 83 GL OVEIVIEW A C aje ka 83 E Test Preparation cc cies i malane l b ba a n Ee SER en nad b k Iu daren EXC ELA RET b ka n beech eines 83 C 2 1 Heatsink Preparation uses oreet eheu EEN dE inde Sal AE Ps Ere Raa AEN AA 83 C 2 2 Typical Test Equipment srice Nee O O o reda sx e ada ad eda W n EE d 86 C 2 3 Test Procedure Examples ine aen nean Aa 86 C 2 4 Time Zero Room Temperature Preload Measurement teeta eeeeaeeaes 86 C 2 5 Preload Degradation under Bake Conditions 87 Quad Core Intel Xeon Processor 5400 Series TMDG 3 D Safety Requirements aa SEBES RENE tana kk kad al aki kik kanik kak a ekl kalak Eed dE SE 89 E Quality and Reliability Requirements L Lak kk kk kk kk kk kaka ka 91 E 1 Intel Verification Criteria for the Reference Designs sele ee kk 91 E 1 1 Reference Heatsink Thermal Verification wwwaamww kk kk kk kk kk KK KAR 91 E 1 2 Environmental Reliability Testing eeea aaa aaa aa ee erect eens mme 91 E 1 3 Material and Recycling Regul
7. Size Through Fins Mean Ya Deviation a Drop mm in kg lbs m3 hr CFM C W CC W ear 1U 27 00 0 24 0 53 25 5 15 0 305 0 0087 85 0 34 1 06 Thermal Profile Adherence The 1U alternative thermal solution is designed to meet the Thermal Profile for the Quad Core Intel Xeon Processor E5400 Series in volumetrically constrained form factors From Table A 1 the three sigma mean 3sigma performance of the thermal solution is computed to be 0 331 C W and the processor local ambient temperature TLA for this thermal solution is 40 C Hence the Thermal Profile equation for this thermal solution is calculated as Equation A 1 y 0 331 x 40 54 where y Processor Tc sE value C Quad Core Intel Xeon Processor 5400 Series TMDG m 1U Alternative Heatsink Thermal Mechanical Design n te D X Processor power value W Figure A 3 below shows the comparison of this reference thermal solution s Thermal Profile to the Quad Core Intel Xeon Processor E5400 Series Thermal Profile specification The 1U alternative solution meets the Thermal Profile with 0 5 C margin at the upper end TDP By designing to Thermal Profile it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions Figure A 3 1U Alternative Heatsink Thermal Adherence to Quad Core Intel Xeon Processor L5400 Series Thermal Profile 65 60 55
8. The fan speed control device only needs to read the Torrset msr and compare this to the DTS value from the PECI interface The equation for calculating Tcontrot iS Equation 2 2 TcoNTROL ToFFSET Where Torrser A DTS based value programmed into each processor during manufacturing that can be obtained by reading the IA32 TEMPERATURE TARGET MSR This is a static and a unique value Refer to the RS Wolfdale Processor Family BIOS Writer s Guide BWG for further details Quad Core Intel Xeon Processor 5400 Series TMDG 25 m n tel Thermal Mechanical Reference Design Figure 2 9 depicts the interaction between the Thermal Profile and TcoNTRoL Figure 2 9 TcontroL and Thermal Profile Interaction 2 2 7 2 2 7 1 26 T as MAX T oNTROL Tease TDP Power If the DTS temperature is less than TconrRoL then the case temperature is permitted to exceed the Thermal Profile but the DTS temperature must remain at or below TcontroL The thermal solution for the processor must be able to keep the processor s Tcase at or below the Thermal Profile when operating between the TcoNrRoL and TcasE Max at TDP under heavy workload conditions Refer to Section 2 4 1 for the implementation of the TcoNrRou value in support of fan speed control FSC design to achieve better acoustic performance Thermal Profile Concepts for the Quad Core Intel Xeon Processor 5400 Series Dual Thermal Profile Concept for the Quad
9. ez s o o m lt Quad Core Intel Xeon Processor 5400 Series TMDG 67 m n tel Mechanical Drawings Figure B 11 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Sheet 4 of 6 a o e lt v DI Z o N ls gt LL o 3 B a tc lt o m oc w e Li Hd I 2 d o s of 2 E d ES z E S Lon 3 B g 2 3 gt 25 35 z ES 2 z E 22 I ES E wo EE 5 N A 2e ES a s EE IE RE 23 ES Se o g o as 35 CS ES 5 L 5 E ES Ze 58 m ss E EE 98 uz s 52 Sz 27 oo Ec 5 2 EES a o a lt 68 Quad Core Intel Xeon Processor 5400 Series TMDG Mechanical Drawings n tel Figure B 12 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Sheet 5 of 6 AE lt 2 2 a DRAWING SHEET 5 OF T5 T TET 9g Wa CME 1 300 ws E Coin 3 EET 1 433 pel e 2x 1 62 5 I co 3 3 101 18 14 6 99 1275 3 50 88 9 96 52 13 800 VOLUMETRIC HEIGHT KEEPINS Quad Core Intel Xeon Process
10. k l CH Oo T eaa a Quad Core Intel Xeon Processor 5400 Series TMDG 73 m n tel Mechanical Drawings Figure B 17 1U CEK Heatsink Sheet 4 of 4 oe ca lt s N lt E DI a E lu eo a CH o ia S gt S j j l e e LINK i NI NZ ig co ta amp T m r 74 Quad Core Intel Xeon Processor 5400 Series TMDG Mechanical Drawings n tel Figure B 18 Active CEK Thermal Solution Volumetric Sheet 1 of 3 Z e in iesza enn Ir lt Sx gt in ba EN d E a x E a z g i 8 E 2 s I xa S E E i gt SEA ul E ex cu amp a E B a Z a E SE 2 S E E Baa kudi Ber s Dag E e EE 2 A ES 5 a 8g u S8 5 p z z SS Clai g EES s c a ne El E EJ 3 a S EJ f 7 mt a M a S2 ca Quad Core Intel Xeon Processor 5400 Series TMDG Mechanical Drawings y BEER X 2 a awo Jazis ASSdWSTIHI NYA ASSY 0 A38 38 DW OI W dn TINA A2N3 0341
11. or above the TDP for a thermally relevant timeframe One example of a worst case thermal condition is when a processor local ambient temperature is at or above 42 8 C for Quad Core Intel Xeon Processor X5400 Series Thermal Profile A Thermal Profile B supports volumetrically constrained platforms i e 1U blades etc and is based on Intel s 1U air cooling solution Because of the reduced capability represented by such thermal solutions designing to Thermal Profile B results in an increased probability of TCC activation and an associated measurable performance loss Measurable performance loss is defined to be any degradation in the processor s performance greater than 1 5 The 1 5 number is chosen as the baseline since the run to run variation in a given performance benchmark is typically between 1 and 2 Although designing to Thermal Profile B results in increased TcAsg temperatures compared to Thermal Profile A at a given power level both of these Thermal Profiles ensure that Intel s long term processor reliability requirements are satisfied In other words designing to Thermal Profile B does not impose any additional risk to Intel s long term reliability requirements Thermal solutions that exceed Thermal Profile B specification are considered incompliant and will adversely affect the long term reliability of the processor Quad Core Intel Xeon Processor 5400 Series TMDG 27 m n tel Thermal Mechanical Reference Design
12. 2 2 4 Multiple Core Special Considerations e ea eect tees eee eats kya 21 2 2 5 Thermal Profile wwa sna as eae ce sews exui veg ENEE ENEE Da ka a k Van 24 2 2 06 TCONTROL DERMIEON ana ENNEN R nn anan dir tete PE gru eite atra te A eg i 25 2 2 7 Thermal Profile Concepts for the Quad Core Intel Xeon Processor 5400 Sel S u ess ay aa senate epe xerit KEEN ES ENER SEENEN VEER FEN RR ICA S 26 2 2 8 Performance Targets u s sad iiec eite awa 28 2 3 Fan Fall stelle eu geg helna neda ninan SA Ste cliente tien ee daka kek an EE da ina 32 2 4 Characterizing Cooling Solution Performance Reoulrements kk kk 33 2 4 1 Fan Speed AA eii area sene tees r d Gaia d v a aa S ada ME 33 2 4 2 Processor Thermal Characterization Parameter Relationshipes 34 2 4 3 Chassis Thermal Design Considerations aaa aa anawa naa ananasa niania 36 2 5 Thermal Mechanical Reference Design Considerations saaaaaa aaa aaa aa aaa aaa wanawa 37 2 5 1 Heatsink SOlUKIO S Aa 37 2 5 2 Thermal Interface Material 38 2523 SUMMARY ED 38 2 5 4 Assembly Overview of the Intel Reference Thermal Mechanical Design 39 2 5 5 Thermal Solution Performance Characteristics cesses 41 2 5 6 Thermal Profile Adherence uuua rara aaa aaa aa nennen enne nenne rne nnn 42 2 5 7 Combpornents ae EE 45 2 5 8 Boxed Active Thermal Solution for the Quad Core Intel Xeon Processor 5400 Series Thermal Profile 49
13. 250 20 to gt 40 225 40 to gt 80 205 80 to 100 175 100 to 145 120 125 2120 Change in velocity is based upon a 0 5 coefficient of restitution Shipping and Random Vibration Total per n a n a Handling e System Level system e Unpackaged 10 minutes e 5 Hz to 500 Hz Beba e 2 20 g RMS random s e 5 Hz 001 g Hz to 20 Hz 0 01 g Hz slope up e 20 Hz to 500 Hz 0 01 g2 Hz flat e Random control limit tolerance is 3 dB Note In the case of a discrepancy information in the most recent LGA771 Socket Mechanical Design Guidelines supersedes that in the Table E 1 above Recommended Test Sequence Each test sequence should start with components i e baseboard heatsink assembly etc that have not been previously submitted to any reliability testing The test sequence should always start with a visual inspection after assembly and BIOS Processor memory test The stress test should be then followed by a visual inspection and then BIOS Processor memory test Post Test Pass Criteria The post test pass criteria are 1 No significant physical damage to the heatsink and retention hardware 2 Heatsink remains seated and its bottom remains mated flatly against the IHS surface No visible gap between the heatsink base and processor IHS No visible tilt of the heatsink with respect to the retention hardware Quad Core Intel Xeon Processor 5400 Series TMDG m Quality and Reliability Requir
14. 3000 D 1 25001 4X 66 35 43 11 6929 A si ING SHEET 2 OF 4 CALE 1 1 DQ NOT SCALE 1 37801 35 gt A E El P E z 2 SL m s SE B E 8 2 al amp gt s SS a co EL ea E Quad Core Intel Xeon Processor 5400 Series TMDG 77 Mechanical Drawings e Quad Core Intel Xeon Processor 5400 Series TMDG Mechanical Drawings Figure B 22 1U Alternative Heatsink 2 of 4 HEAT SINK GEOMETRY DETAILS GR N oS SSS x S s2 S i i ZE GE annn NN EE SSS SSS fore TIRAYIN TIRSIN Quad Core Intel Xeon Processor 5400 Series TMDG 79 Figure B 23 1U Alternative Heatsink 3 of 4 80 intel Mechanical Drawings aa x wn hi 5 lt EL lee u LL a gt m rei Lu u uU lt EJ E z N E a
15. 3434 404 NAOHS SNOISN3MIQ 100433 13 S0008 e a a o re SNOISNJWIO 12VX3 EE NO 1N380200 31V 39V1104 d3lv 38 OL 9NIMVHO SIHL U S310N 7035012610 38 LON AVA SNIVINOO 9NINVUO SIHL v G 9 L 8 65 Quad Core Intel Xeon Processor 5400 Series TMDG Mechanical Drawings ions for ht Restricti ig d He inition an z v m S 9 L 8 30 181569 q o Lnau AMENIITA 03NO11V SINJNOdNOJ QHYOBUJKLON ON LNOd33M YUJONI 4 OUVOB ONIUdS 32 NOILJIHIS38 1H913H INJNOdNOJ GHYOBA3HLOW XVW WWII Er o U G3KOTIY 1N3W32V1d INJNOdNOJ GYVOGYIHLOW ON O V 6 64 Une 62 09 12972 9 0 99 29 1264 2 62 9 100927 3 v0 99 148621 6L 5L NO112181S38 LH9I3H IN3NOdNOJ XVN WN O L GL2 0 VJUV A18435SVS 10 JNISIV3H H H H H 99 9 Cez on 1989 3 c ez un 6 LSL 1 3 3 9 g 1000 H NOI12181838 1H913H INJNOdNOJ XYW WW O L wSL2 O VJUV MNISIV3H O NOILOIWIS38 1H513H LN3NOdNOJ XYN NN O E BLI 0 M 00p 27 0N3931 9609 1006 2 GK 1180 21 lr 9825 t v6711 5 t en g 9 ATNO S3SOdUNd IALLYYLSATII 804 AWYGNNOB F 133208 S310H HINOYHL 9NILNNOW NOLINTOS TYWH3HL LZ un MAKINI S 0 0 9r sz Baseboard Keepout Footprint Def Enabling Components Sheet 2 of 6
16. B 10 Sheet 3 of 6 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Figure B 11 Sheet 4 of 6 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Figure B 12 Sheet 5 of 6 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Figure B 13 Sheet 6 of 6 1U CEK Heatsink Sheet 1 of 4 Figure B 14 1U CEK Heatsink Sheet 2 of 4 Figure B 15 1U CEK Heatsink Sheet 3 of 4 Figure B 16 1U CEK Heatsink Sheet 4 of 4 Figure B 17 Active CEK Thermal Solution Volumetric Sheet 1 of 3 Figure B 18 Active CEK Thermal Solution Volumetric Sheet 2 of 3 Figure B 19 Active CEK Thermal Solution Volumetric Sheet 3 of 3 Figure B 20 1U Alternative Heatsink 1 of 4 Figure B 21 1U Alternative Heatsink 2 of 4 Figure B 22 1U Alternative Heatsink 3 of 4 Figure B 23 1U Alternative Heatsink 4 of 4 Figure B 24 57 m n tel Mechanical Drawings Figure B 1 2U CEK Heatsink Sheet 1 of 4 c m lt 3 z a gt s ER 5 ot A 3 zS 3 aa Er B r 5 x E 2 Ww 2 5 amp x 3 E E i eo s m m 58 Quad Core Intel Xeon Processor 5400 Series TMDG Mechanical Drawings Figure B 2 2U CEK He
17. Core Intel Xeon Processor X5400 Series The Quad Core Intel Xeon Processor X5400 Series is designed to go into various form factors including the volumetrically constrained 1U and custom blade form factors Due to certain limitations of such form factors i e airflow thermal solution height it is very challenging to meet the thermal requirements of the processor To mitigate these form factor constraints Intel has developed a dual Thermal Profile specification shown in Figure 2 10 Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n te L Figure 2 10 Dual Thermal Profile Diagram Tcase max B RU Tease max A gt f Thermal Profile B Thermal Profile A Power TDP The Thermal Profile A is based on Intel s 2U air cooling solution Designing to Thermal Profile A ensures that no measurable performance loss due to Thermal Control Circuit TCC activation is observed in the processor It is expected that TCC would only be activated for very brief periods of time when running a worst case real world application in a worst case thermal condition These brief instances of TCC activation are not expected to impact the performance of the processor A worst case real world application is defined as a commercially available useful application which dissipates a power equal to
18. The area of the surface on which the heat transfer takes place Without any enhancements this is the surface of the processor package IHS One method used to improve thermal performance is by attaching a heatsink to the IHS A heatsink can increase the effective heat transfer surface area by conducting heat out of the IHS and into the surrounding air through fins attached to the heatsink base e The conduction path from the heat source to the heatsink fins Providing a direct conduction path from the heat source to the heatsink fins and selecting materials with higher thermal conductivity typically improves heatsink performance The length thickness and conductivity of the conduction path from the heat source to the fins directly impact the thermal performance of the heatsink In particular the quality of the contact between the package IHS and the heatsink base has a higher impact on the overall thermal solution performance as processor cooling requirements become strict Thermal interface material TIM is used to fill in the gap between the IHS and the bottom surface of the heatsink and thereby improves the overall performance of the thermal stackup IHS TIM Heatsink With extremely poor heatsink interface flatness or roughness TIM may not adequately fill the gap The TIM thermal performance depends on its thermal conductivity as well as the pressure load applied to it Refer to Section 2 5 2 for further information on the TIM between the IHS
19. W rI E lt bal MERE je g 4 E KE wo E e m T Z E S m a 3 so ca Quad Core Intel Xeon Processor 5400 Series TMDG Mechanical Drawings Figure B 24 1U Alternative Heatsink 4 of 4 COMPONENT DETAILS 8 38 INTERNAL THREAD IAL THREAD BO JEPARTMENT Quad Core Intel Xeon Processor 5400 Series TMDG 81 82 Mechanical Drawings Quad Core Intel Xeon Processor 5400 Series TMDG Heatsink Clip Load Methodology n te L C C 1 Note c 2 C 2 1 Note Heatsink Clip Load Methodology Overview This section describes a procedure for measuring the load applied by the heatsink clip fastener assembly on a processor package This procedure is recommended to verify the preload is within the design target range for a design and in different situations For example e Heatsink preload for the LGA771 socket e Quantify preload degradation under bake conditions This document reflects the current metrology used by Intel Intel is continuously exploring new ways to improve metrology Updates will be provided later as this document is revised as appropriate Test Preparation Heatsink Preparation Three load cells are assembled into the base of the heatsink under test in the area interfacing with the processor Integrated Heat Spreader IHS using l
20. Xeon Processor X5400 Series except the Quad Core Intel Xeon Processor X5482 sku 2 Refer to the Quad Core Intel Xeon Processor 5400 Series Datasheet for the Thermal Profile specifications In case of conflict the data information in the datasheet supersedes any data in this figure Quad Core Intel Xeon Processor 5400 Series TMDG 29 m n tel Thermal Mechanical Reference Design Figure 2 12 Thermal Profile for Quad Core Intel amp Xeon Processor E5400 Series Tcase C Thermal Profile Y 0 298 x 432 Power W Note The thermal specifications shown in this graph are for reference only Refer to the Quad Core Intel Xeon Processor 5400 Series Datasheet for the Thermal Profile specifications In case of conflict the data information in the datasheet supersedes any data in this figure 30 Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n tel Figure 2 13 Thermal Profile for Quad Core Intel Xeon Processor X5482 Series Table 2 4 Thermal Profile 2U Tcase C Thermal Profile Y 2 0 187 x 35 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Power W Table 2 4 and Table 2 5 describe the thermal performance target for the Quad Core Intel Xeon Processor 5400 Series cooling solution enabled by Intel Intel Reference Heatsink Performance Targets for the Quad Core Intel Xeon Processor
21. detail in Appendix B The overall volumetric keep in zone encapsulates the processor socket and the entire thermal mechanical enabling solution 2 5 4 2 Assembly Drawing Figure 2 16 Exploded View of CEK Thermal Solution Components Quad Core Intel Xeon Processor 5400 Series TMDG 39 m n tel Thermal Mechanical Reference Design Note Note 2 5 4 3 40 The CEK reference thermal solution is designed to extend air cooling capability through the use of larger heatsinks with minimal airflow blockage and bypass CEK retention solution can allow the use of much heavier heatsink masses compared to the legacy limits by using a load path directly attached to the chassis pan The CEK spring on the secondary side of the baseboard provides the necessary compressive load for the thermal interface material The baseboard is intended to be isolated such that the dynamic loads from the heatsink are transferred to the chassis pan via the stiff screws and standoffs This reduces the risk of package pullout and solder joint failures Using the CEK reference thermal solution Intel recommends that the maximum outside diameter dimension of the chassis pan standoffs regardless of shape that interfaces with the CEK spring on the secondary side of the baseboard and captive screws on the primary side of the baseboard to attach the heatsink to the chassis pan should be no larger than 7 112 mm 0 28 in For example circular standoffs
22. is a static and a unique value Refer to the RS Wolfdale Processor Family BIOS Writers Guide BWG for further details TDP Thermal Design Power Thermal solution should be designed to dissipate this target power level TDP is not the maximum power that the processor can dissipate Thermal Monitor A feature on the processor that can keep the processor s die temperature within factory specifications under normal operating conditions Thermal Profile Line that defines case temperature specification of a processor at a given power level TIM Thermal Interface Material The thermally conductive compound between the heatsink and the processor case This material fills the air gaps and voids and enhances the transfer of the heat from the processor case to the heatsink TLA The measured ambient temperature locally surrounding the processor The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink The system ambient air temperature external to a system chassis This temperature is usually measured at the chassis air inlets A unit of measure used to define server rack spacing height 1U is equal to 1 75 in 2U equals 3 50 in etc 8 Quad Core Intel Xeon Processor 5400 Series TMDG 11 12 Introduction Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n tel 2 Thermal Mecha
23. should be no larger than 7 112 mm 0 28 in point to point The baseboard mounting holes for the CEK solution are at the same location as the hole locations used for previous Intel Xeon processor thermal solution However CEK assembly requires 10 16 mm 0 400 in large diameter holes to compensate for the CEK spring embosses The CEK solution is designed and optimized for a baseboard thickness range of 1 57 2 31 mm 0 062 0 093 in While the same CEK spring can be used for this board thickness range the heatsink standoff height is different for a 1 57 mm 0 062 in thick board than it is for a 2 31 mm 0 093 in thick board In the heatsink assembly the standoff protrusion from the base of the heatsink needs to be 0 6 mm 0 024 in longer for a 2 31 mm 0 093 in thick board compared to a 1 57 mm 0 062 in thick board If this solution is intended to be used on baseboards that fall outside of this range then some aspects of the design including but not limited to the CEK spring design and the standoff heights may need to change Therefore system designers need to evaluate the thermal performance and mechanical behavior of the CEK design on baseboards with different thicknesses Refer to Appendix B for drawings of the heatsinks and CEK spring The screws and standoffs are standard components that are made captive to the heatsink for ease of handling and assembly Contact your Intel field sales representative for an electronic versi
24. specifications Quad Core Intel Xeon Processor 5400 Series TMDG 41 m n tel Thermal Mechanical Reference Design Figure 2 18 1U CEK Heatsink Thermal Performance 045 0 70 040 u a 030 Test 2 96e 04CFM 1 76e 02CFM o 3 025 AP inch water 0 15 a CFM Through Fins 2 5 6 Thermal Profile Adherence The 2U CEK Intel reference thermal solution is designed to meet the Thermal Profile A for the Quad Core Intel Xeon Processor 5400 Series From Table 2 4 the three sigma mean 3sigma performance of the thermal solution is computed to be 0 187 C W and the processor local ambient temperature Tra for this thermal solution is 40 C Hence the Thermal Profile equation for this thermal solution is calculated as Equation 2 8 y 0 187 X 40 where y Processor Tc sE value C X Processor power value W Figure 2 19 below shows the comparison of this reference thermal solution s Thermal Profile to the Quad Core Intel Xeon Processor 5400 Series Thermal Profile A specification The 2U CEK solution meets the Thermal Profile A with a 0 6 C margin at the upper end TDP By designing to Thermal Profile A it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions 42 Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n te L Figure 2 19 2U CEK Thermal Adherence to
25. the principle of thermal characterization parameter described above e Define a target case temperature Tcase max and corresponding TDP given in the processor datasheet e Define a target local ambient temperature at the processor T A The following provides an illustration of how one might determine the appropriate performance targets The example power and temperature numbers used here are not related to any Intel processor thermal specifications and are for illustrative purposes only Quad Core Intel Xeon Processor 5400 Series TMDG 35 m n tel Thermal Mechanical Reference Design Assume the datasheet TDP is 85 Wand the case temperature specification is 68 oC Assume as well that the system airflow has been designed such that the local processor ambient temperature is 45 C Then the following could be calculated using equation 2 3 from above Equation 2 5 PCA TCASE Tia TDP 68 45 85 0 27 C W To determine the reguired heatsink performance a heatsink solution provider would need to determine Ycs performance for the selected TIM and mechanical load configuration If the heatsink solution was designed to work with a TIM material performing at Pcg lt 0 05 C W solving for equation 2 4 from above the performance of the heatsink would be Equation 2 6 sA PCA Ycs 0 27 0 05 0 22 9C W If the local processor ambient temperature is assumed to be 40 C the same calculation can be carried ou
26. to avoid damage The boxed processor contains the components necessary to solve both issues The boxed processor will include the following items e Quad Core Intel Xeon Processor 5400 Series e Unattached heatsink solution 4 screws 4 springs and 4 heatsink standoffs all captive to the heatsink Thermal Interface Material pre applied on heatsink Installation Manual Intel Inside logo Quad Core Intel Xeon Processor 5400 Series TMDG 51 m n tel Thermal Mechanical Reference Design The other items listed in Figure 2 16 that are required to complete this solution will be shipped with either the chassis or boards They are as follows e CEK Spring supplied by baseboard vendors e Heatsink standoffs supplied by chassis vendors 8 52 Quad Core Intel Xeon Processor 5400 Series TMDG 1U Alternative Heatsink Thermal Mechanical Design n te A A 1 Figure A 1 1U Alternative Heatsink Thermal Mechanical Design Intel has also developed an 1U alternative reference heatsink design for the volumetrically constrained form factor and targeted for the rack optimized and ultra dense SKUs This alternative heatsink design meets the thermal profile specifications of the Quad Core Intel Xeon Processor E5400 Series and offers the advantages of weight reduction and cost savings in using this alternative 1U heatsink This section describes the alternative heatsink thermal performance and adherence to Qu
27. wire PWM DTS Heatsink Solution Description Min a LS is Pas AB Unit Notes 12V 12 Volt Fan Power 10 8 12 12 13 2 V Supply IC Fan Current Draw N A 1 25 1 5 1 5 A SENSE SENSE Frequency 2 2 2 2 Pulses per fan revolution 1 Note System board should pull this pin up to Vcc with a resistor Figure 2 27 Fan Cable Connection Active CEK 50 PIN 3 PIN4 PIN 2 LE Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n te L Table 2 10 Fan Cable Connector Pin Out Active CEK 2 5 8 2 2 5 8 3 Pin Number Signal Color 1 Ground Constant Black 2 Power 12V Yellow 3 Signal 2 pulses per revolution Green 4 Control 21KHz 28KHz Blue Systems Considerations Associated with the Active CEK This heatsink was designed to help pedestal chassis users to meet the processor thermal requirements without the use of chassis ducting It may be necessary to implement some form of chassis air guide or air duct to meet the T 4 temperature of 40 C depending on the pedestal chassis layout Also while the active heatsink solution is designed to mechanically fit into a 2U chassis it may require additional space at the top of the heatsink to allow sufficient airflow into the heatsink fan Therefore additional design criteria may need to be considered if this heatsink is used in a 2U rack mount chassis or in a chassis that h
28. 00 Series Datasheet Shear load that can be applied to the package IHS Tensile load that can be applied to the package IHS Torque that can be applied to the package IHS Now Quad Core Intel Xeon Processor 5400 Series TMDG 13 m n tel Thermal Mechanical Reference Design Quad Core Intel amp XeonE Processor 5400 Series Package The Quad Core Intel Xeon Processor 5400 Series is packaged using the flip chip land grid array FC LGA package technology Please refer to the Quad Core Inte Xeon Processor 5400 Series Datasheet for detailed mechanical specifications The Quad Core Intel Xeon Processor 5400 Series mechanical drawing shown in Figure 2 1 Figure 2 2 and Figure 2 3 provide the mechanical information for the Quad Core Intel Xeon Processor 5400 Series The drawing is superseded with the drawing in the processor datasheet should there be any conflicts Integrated package socket stackup height information is provided in the LGA771 Socket Mechanical Design Guide Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n te Figure 2 1 Quad Core Intel Xeon Processor 5400 Series Mechanical Drawing 1 of 3
29. 00000000000000 EE 2 el gd m xv mj lt i lt lt r 44 R E tu e a ak w 3 HE 7 w EE ES ER SE es aS Ejda E al sa d T ER Ci ko E 28 EE ss o oz aS ey z5 zs Er S8 ze a ERE L zg 5 zz TS cs M zs ss S i HN n 55 1 H SES o ty gt b ga ss a ze Es 33 S2 ga oo nd oo Ec E u T Note Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution are available in the processor Thermal Mechanical Design Guidelines Quad Core Intel Xeon Processor 5400 Series TMDG 15 m te Thermal Mechanical Reference Design Figure 2 2 Quad Core Intel Xeon Processor 5400 Series Mechanical Drawing 2 of 3 se o n w a o co lt k Eo EJ Ed e 2 zs RES SI KSE oz A le s s 2 LL SE d i z 3 5 amp di Ze C o EI A Z kl B i Li ze He o 55 gt ss ES 0000000000000000 000000000000000 1 OR 000000000000000 000000000000009 7 na ges 299000
30. 0000000004000000000000000 ES Z 0000000060000009000000000000000 Q 60000000000000000 0000000000000000 AB sa 000009000000000050000000000000000 ces OO00000000000000000000000000000000 q um 900000000000000090000000000000000 3 993998999 22 72222 000000000 EM 8883888888 j 885858508 8 900000000 9000000000 Z 900000000 OO0000000 z zu 900000000 7 900000000 bd oo 900000000 000000000 gt 2 000000 000090000 z zS 006000000 666000066 3 900000000 QQQ000000 E ow 900000000 000000000 a ZE 000000000 000000000 E 900000000 Q00000000 SE 000000000 er 7 900000009 o 900000000 990000000 o as OO00000000000000060000000000000000 o OO00000000000000000000000000000000 ee O00000000000000090000000000000000 000000000000000090000000000000000 z cu 000000000000000000000000000000000 TE 000000000000000090000000000000000 00000000000000000000000000000000 a5 O000000000000000 000000000000000 CS ZE Ss m E E s eile e v e o 2 EH SL ZIZ sS A z8 z s zz E ZS a se H 8E L BE BE za g 2 2 5 ES 2 lt So SE ug 24 ES Sa za co BS CS o u w o ca 16 Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n te Figure 2 3 Quad Core Intel Xeon Processor 5400 Series Mechanical Drawing 3 of 3 3 x 3 Da wr 3 oF 3 Daa D66788 DO NOT SCALE DRAWING
31. 15N35 LIL 1NSHLMS c3 I XX 3 A ZI th1 Wd 2 XX 9 amp 21 201 F WdH KWA WU XXX DEED 18YL10A ONI LYHJdO 20 d318vN3 Wha IIAYIYYA ATHYJNIT AdAL NYA as SNCIIV2IJIO34S NVJ zm D16646 GROI THE NO Fr 31400 L ba 31V2 Y TIYLJA 68121 NIW SEH NE 00090 Xm za TABLICI NIN er 36127 NIN um 000511 7 Ha d zara 130 335 H 0 o X m DESEN NOI 14140830 EW WOLLYYOdUOD TALNI 40 INISNOO N3LLINM YOIMd JHI LNOHIIM 02141104 YO 031414910 Q3JNQOWJ2H 038019810 38 LON AWA AUOLSIH NOISIAJU SIN31N02 SLI ANY 32N3dl iNO2 NI 0385012510 SI LI NOIIVHWHOJNI 1vYI1N3013NO2 NOILY3Od3O 31NI SNIYINOZ 9NIAYSO SIHL Quad Core Intel Xeon Processor 5400 Series TMDG T U intel Figure B 19 Active CEK Thermal Solution Volumetric Sheet 2 of 3 76 Mechanical Drawings Figure B 20 Active CEK Thermal Solution Volumetric Sheet 3 of 3 TWO NO 216645 6R0I SW 2 REV xk lt MAX 1 01891 SIDE GAP FIN TO HS BASE EDGE 2X 0 48 p SEE DETAIL B 5 1
32. 2 2 6 Figure 2 8 Note above the case to ambient resistance represents the slope of the line and the processor local ambient temperature represents the y axis intercept Hence the TCASE max Value of a specific solution can be calculated at TDP Once this point is determined the line can be extended to Power P OW representing the Thermal Profile of the specific solution If that line stays at or below the Thermal Profile specification then that particular solution is deemed as a compliant solution TCONTROL Definition TcoNTROL Can be described as a trigger point for fan speed control implementation The processor TcoNrRoL Value provided by the Digital Thermal Sensor is relative and no longer absolute The TcoNrRoL value is now defined as a relative value to the TCC activation set point i e PECI Count 0 as indicated by PROCHOT Figure 2 8 depicts the interaction between the TconTtroL value and Digital Thermal Sensor value TcoNTRoL Value and Digital Thermal Sensor Value Interaction Digital Thermal Sensor Temperature Tcontrol 5 DU ET Temperature Time The value for TconTrRaL is calibrated in manufacturing and configured for each processor individually For the Quad Core Intel Xeon Processor 5400 Series the TcoNTROL value is obtained by reading the processor model specific register IA32_TEMPERATURE_TARGET MSR There is no TcoNTROL Base Value to sum as previously required on legacy processors
33. 2 2 7 2 2 2 8 28 Refer to the Quad Core IntelB Xeon Processor 5400 Series Datasheet or Section 2 2 8 for the Thermal Profile A and Thermal Profile B specifications Section 2 5 of this document also provides details on the 2U and 1U Intel reference thermal solutions that are designed to meet the Quad Core Intel Xeon Processor X5400 Series Thermal Profile A and Thermal Profile B respectively Thermal Profile Concept for the Quad Core Intel Xeon Processor E5400 X5482 Series The Quad Core Intel Xeon Processor E5400 Series is designed to go into various form factors including the volumetrically constrained 1U and custom blade form factors The Quad Core Intel Xeon Processor X5482 is designed to go into volumetrically unconstrained workstation platforms only Intel has developed single thermal profile for E5400 X5482 Series Designing to the Thermal Profile ensures that no measurable performance loss due to Thermal Control Circuit TCC activation is observed in the processor It is expected that TCC would only be activated for very brief periods of time when running a worst case real world application in a worst case thermal condition These brief instances of TCC activation are not expected to impact the performance of the processor A worst case real world application is defined as a commercially available useful application which dissipates a power equal to or above the TDP for a thermally relevant timeframe One examp
34. 2 82212252 232 and Aluminum Copper Fin Asia Vital Components Steve Huang APAC Copper Base AVC 86 755 3366 8888 x66888 CNDA AP5281 86 138 252 45215 steve avc com cn and Huabin Chen China Only Aluminum 886 755 3366 8888 x66871 huabin avc com cn Copper Fin Auras Ian Shih Copper Base CNDA 5779699 liverpool auras com tw 886 2 89901653 x314 and Aluminum Copper Fin CCI Chaun Choung Monica Chih Copper Base Technology Co Ltd monica_chih ccic com tw CNDA 8747572 886 2 29952666x292 and Harry Lin ackinc aol com Don 714 739 5797 Aluminum CoolJag Chia Cherne Alice Yang Industry Co Ltd 886 4 7323090 alice cooljag com Kenny Kwang 510 824 0888 kenny cooljagusa com Copper Fin CoolerMaster Helena Wen Copper Base CNDA 7425225 helena_wen collermaster com tw 886 2 3234 0050x235 Copper Fin Molex Aljo Amorelli Copper Base CNDA 11277 Aljo Amorelli molex com 630 718 5919 and Jeremy Shen 886 2 26202300 459 Aluminum 886 926132586 Copper Fin Taisol Electronics Jane Yui Copper Base CNDA 3434254 jane yui taisol com tw 886 2 2656 2658 x113 and Aluminum Copper Fin Thermaltake Vera Lee Copper Base CNDA 7429482 veraQthermaltake com 886 2 2662 6501 255 and Aluminum 98 Quad Core Intel Xeon Processor 5400 Series TMDG Enabled Suppliers Information Quad Core Intel Xeon Processor 5400 Series TMDG 99 n tel Enabled Suppliers Information 100 Quad Core Intel Xeon Pro
35. 5400 Series They provide a thermal management approach to support the continued increases in processor frequency and performance Please see the Quad Core Intel Xeon Processor 5400 Series Datasheet for guidance on these thermal management features Digital Thermal Sensor The Quad Core Intel Xeon Processor 5400 Series include on die temperature sensor feature called Digital Thermal Sensor DTS The DTS uses the same sensor utilized for TCC activation Each individual processor is calibrated so that TCC activation occurs at a DTS value of 0 The temperature reported by the DTS is the relative offset in PECI counts below the onset of the TCC activation and hence is negative Changes in PECI counts are roughly linear in relation to temperature changes in degrees Celsius For example a change in PECI count by 1 represents a change in temperature of approximately 19C However this linearity cannot be guaranteed as the offset below TCC activation exceeds 20 30 PECI counts Also note that the DTS will not report any values above the TCC activation temperature it will simply return O in this case The DTS facilitates the use of multiple thermal sensors within the processor without the burden of increasing the number of thermal sensor signal pins on the processor package Operation of multiple DTS will be discussed in more detail in Section 2 2 4 Also the DTS utilizes thermal sensors that are optimally located when compared with thermal diodes
36. 55 3366 8888 x66871 huabin avc com cn Copper Fin Auras Ian Shih Copper Base CNDA 5779699 liverpool auras com tw 886 937 183 194 and Aluminum Copper Fin CCI Chaun Choung Monica Chih Copper Base Technology Co Ltd monica_chih ccic com tw CNDA 8747572 8862 29952666 EXT 292 and Harry Lin 714 739 5797 Al min m ackinc aol com Aluminum CoolJag Chia Cherne Alice Yang Industry Co Ltd 886 4 7323090 alice cooljag com Kenny Kwang 510 824 0888 kenny cooljagusa com Copper Fin CoolerMaster Helena Wen Copper Base CNDA 7425225 helena_wen collermaster com tw 886 2 3234 0050x235 Copper Fin Taisol Electronics Jane Yui Copper Base CNDA 3434254 jane yui taisol com tw 886 2 2656 2658 x113 and Aluminum Copper Fin Thermaltake Vera Lee Copper Base CNDA 7429482 vera thermaltake com 886 2 2662 6501 255 Quad Core Intel Xeon Processor 5400 Series TMDG 97 intel Enabled Suppliers Information Table F 2 Additional Suppliers for the Quad Core Intel XeonE Processor 5400 Series Intel Reference Solution Sheet 2 of 2 Development i Assembly Component Description Suppliers Supplier Contact Info 1U Heatsink Alternative CEK Copper Fin Aavid David Huang Heatsink Copper Base Thermalloy huang aavid com CNDA 2525071 6035223517228 Frank Hsue frank hsu aavid com tw 886 2 26989888 x306 Copper Fin ADDA Jungpin Chen Copper Base CNDA AP1249 jungpin adda com tw 886
37. 8 x66871 huabin avc com cn rev04 CEK Spring for LGA771 socket Intel p n D13646 Stainless Steel 301 Kapton Tape on Reinforced Spring Fingers ITW Fastex CNDA 78538 Roger Knell rknell itwfastex com 773 307 9035 Henry Lu henry mail itwasia com tw 886 7 881 9206x10 Quad Core Intel Xeon Processor 5400 Series TMDG 95 intel Enabled Suppliers Information Table F 1 Suppliers for the Ouad Core IntelE XeonE Processor 5400 Series Intel Reference Solution Sheet 2 of 2 Re D I t Assembly Component Description Suppliers Supplier Contact Info CEK771 01 1U CEK Heatsink Copper Fin Copper Fujikura Fujikura America for 1U Intel p n C90546 rev02 Base CNDA 1242012 stacked fin Ash Ooe a ooeQfujikura com 408 748 6991 Fujikura Taiwan Branch Yao Hsien Huang yeohsien fujikuratw com tw 886 2 8788 4959 Thermal Interface Material See CEK771 01 2U CEK Spring for CEK771 See CEK771 01 2U CEK771 02 1U CEK Low Cost Aluminum Asia Vital Steve Huang APAC for 1U Heatsink for Mid Extrusion Components AVC 86 755 3366 8888 x66888 and Low Power CNDA AP5281 86 138 252 45215 SKUs steve avc com cn Intel p n D71537 Huabin Chen China Only Rev 02 886 755 3366 8888 x66871 huabin avc com cn Thermal Interface See CEK771 01 2U Material CEK Spring for See CEK771 01 2U CEK771 Note CEK771 02 1U is the 1U alternative referenc
38. CORPORATION CONFIDENTIAL INFORMATION Note The optional dimple packing marking highlighted by Detail F from the above drawing may only be found on initial processors Quad Core Intel Xeon Processor 5400 Series TMDG m n tel Thermal Mechanical Reference Design 2 1 3 Note 18 The package includes an integrated heat spreader IHS The IHS transfers the non uniform heat from the die to the top of the IHS out of which the heat flux is more uniform and spreads over a larger surface area not the entire IHS area This allows more efficient heat transfer out of the package to an attached cooling device The IHS is designed to be the interface for contacting a heatsink Details can be found in the Quad Core Intel Xeon Processor 5400 Series Datasheet The processor connects to the baseboard through a 771 land surface mount socket A description of the socket can be found in the LGA771 Socket Mechanical Design Guide The processor package and socket have mechanical load limits that are specified in the Quad Core Intel Xeon Processor 5400 Series Datasheet and the LGA771 Socket Mechanical Design Guide These load limits should not be exceeded during heatsink installation removal mechanical stress testing or standard shipping conditions For example when a compressive static load is necessary to ensure thermal performance of the Thermal Interface Material TIM between the heatsink base and the IHS
39. Guidelines apply only to SKUs which have Thermal Monitor2 enabled Quad Core Intel Xeon Processor 5400 Series TMDG Thermal Mechanical Reference Design n tel 2 4 Characterizing Cooling Solution Performance Reguirements 2 4 1 Fan Speed Control Fan speed control FSC technigues to reduce system level acoustic noise are a common practice in server designs The fan speed is one of the parameters that determine the amount of airflow provided to the thermal solution Additionally airflow is proportional to a thermal solution s performance which conseguently determines the Tcase of the processor at a given power level Since the TcAsg of a processor is an important parameter in the long term reliability of a processor the FSC implemented in a system directly correlates to the processor s ability to meet the Thermal Profile and hence the long term reliability requirements For this purpose the parameter called TcoNTROL as explained in Section 2 2 6 is to be used in FSC designs to ensure that the long term reliability of the processor is met while keeping the system level acoustic noise down Figure 2 14 depicts the relationship between TcoNrRoL and FSC methodology Figure 2 14 TcoNTrRoL and Fan Speed Control Tu MAX Doi ur pe aaa a TcontroL Fan Speed Control Region Fans at max speed which may depend on local ambient temp Tcase within specifications TDP Power Once the Tcontro Value is de
40. Processor Mechanical Parameters Table 13 Input and Output Conditions for the Quad Core Intel Xeon Processor 5400 Series Thermal Management Features nemen niens 22 Processor Core Geometric Center DIMENSIONS ee ee kk kk ee aa aaa aaa aaa koke ee mne 23 Intel Reference Heatsink Performance Targets for the Quad Core Intel Xeon Processor X5400 SeLieS cccesecssccecsessevseswsessecscesseverseeedeeseevssswsreaverenseeeens 31 Intel Reference Heatsink Performance Targets for the Quad Core Intel Xeon Processor E5400 Series ka ner NENNEN KEE naa da aaa rna aua aa aa ra a aaa na 32 Fan Speed Control TCONTROL and DTS Relationship sse 34 CEK Heatsink Thermal Mechanical CharacteriSt CS aa aaa aa aaa aaa kk kK 47 Recommended Thermal Grease Dispense Weight e ea aa ee eee teens kk kk kk kk kk kk ka 47 Fan Specifications Boxed 4 wire PWM DTS Heatsink Solution 50 Fan Cable Connector Pin Out Active CEK awa aaa anawa nasa awake ee kaka akata are ens 51 1U Alternative Heatsink Thermal Mechanical Characteristics wwwsamwanaaa 54 Mechanical Drawing LiSE owe aa i A O A ea male A AA EE A RENE ERE ME CREER kaw AG RENE 57 Typical Test EU PM iIi 86 Use Conditions Environment 92 Suppliers for the Quad Core Intel Xeon Processor 5400 Series Intel lee Tt Le NEE 95 Additional Suppliers for the Quad Core Intel Xeon Processor 5400 Series Intel Reference Solution EEN 97 Quad Core Int
41. Quad Core Intel Xeon Processor X5400 Series Thermal Profile A Thermal Profile A Y 0 168 X 42 8 2UCEK Reference Solution Y 20 187 X 40 0 5 10 15 20 25 30 35 40 4 50 5b 60 6 70 75 80 om 10 110 10 Power W TDP The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B for the Quad Core Intel Xeon Processor X5400 Series From Table 2 7 the three sigma mean 3sigma performance of the thermal solution is computed to be 0 246 C W and the processor local ambient temperature Tra for this thermal solution is 40 C Hence the Thermal Profile equation for this thermal solution is calculated as Equation 2 9 y 0 246 X 40 where y x Processor Tcase value C Processor power value W Figure 2 20 below shows the comparison of this reference thermal solution s Thermal Profile to the Quad Core Intel Xeon Processor X5400 Series Thermal Profile specification The 1U CEK solution meets the Thermal Profile B with 0 5 C margin at the upper end TDP However as explained in Section 2 2 7 designing to Thermal Profile B results in increased TCC activation and measurable performance loss for the processor Quad Core Intel Xeon Processor 5400 Series TMDG 43 inteD Figure 2 20 1U CEK Thermal Adherence to Quad Core Intel amp XeonE Processor X5400 Thermal Mechanical Reference Design Series Thermal Profile B 60 Thermal Profile B 6 Y 0 221 X 435 y5 1U CEK Reference Sol
42. Quad Core Intel Xeon Processor 5400 Series Thermal Mechanical Design Guidelines November 2007 Reference Number 318611 Revision 001 IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT Intel products are not intended for use in medical life saving or life sustaining applications Intel may make changes to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The Quad Core Intel Xeon 5400 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available upon request Contact your local Intel sales office or y
43. Wolfdale DP Processor Enabled CEK and Available electronically Package Mechanical Models in IGES and ProE format Table 1 1 1 4 Table 1 2 10 intel Introduction Reference Documents Sheet 2 of 2 Document Comment Clovertown Harpertown Wolfdale DP Processor Enabled Components Available electronically CEK Thermal Models in Flotherm and Icepak Clovertown Harpertown Wolfdale DP Processor Package Thermal Models in Flotherm and Icepak Available electronically RS Wolfdale Processor Family BIOS Writers Guide BWG See Note following table Thin Electronics Bay Specification A Server System Infrastructure SSI www ssiforum com Specification for Rack Optimized Servers Note Contact your Intel field sales representative for the latest revision and order number of this document Definition of Terms Terms and Descriptions Sheet 1 of 2 Term Description Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct For this example it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface DTS Digital Thermal Sensor replaces the Tdiode in previous products and uses the same sensor as the PROCHOT sensor to indicate the on die temperature The temperature value represents the number of degrees below the TCC activation temperature MSR The processor provides a variety
44. X5400 Series Parameter Maximum Unit Notes Altitude Sea level m Heatsink designed at 0 meters TLA 40 sC TDP 120 W 2U CEK Thermal Profile A TCASE_MAX_A 63 C Airflow 27 CFM Airflow through the heatsink fins 45 9 m hr Pressure Drop 0 182 Inches of H2O 45 3 Pa YCA 0 187 C W Mean 30 1U CEK Thermal Profile B TCASE_MAX_B 70 C Airflow 15 CFM Airflow through the heatsink fins 25 5 m hr Pressure Drop 0 331 Inches of H20 82 4 Pa VCA 0 246 C W Mean 30 Quad Core Intel Xeon Processor 5400 Series TMDG 31 inteD Table 2 5 Note 2 3 Note 32 Thermal Mechanical Reference Design Intel Reference Heatsink Performance Targets for the Quad Core Intel Xeon Processor E5400 Series Parameter Maximum Unit Notes Altitude Sea Level m Heatsink designed at 0 meters TLA 40 C TDP 80 W 1U CEK TCASE_MAX 67 C Airfl 15 CFM Airflow through the heatsink fins ua 25 5 m hr Pressure Dro 0 331 Inches of H20 P 82 4 Pa WCA 0 246 C W Mean 30 1U Alternative Heatsink TCASE_MAX 67 C Airfl 15 CFM Airflow through the heatsink fins IrTIOw 25 5 m3 hr Pressure Dro 0 331 Inches of H20 H 82 4 Pa WCA 0 331 C W Mean 30 Intel does not enable reference heatsink for the Quad Core Intel Xeon Processor X5482 with 150W TDP The Intel 2U CEK is capable of meeting the thermal specifica
45. a 1U CEK Reference Solution Y 0 246 X 40 Tcase C AB oa 40 35 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 Intel has also developed an 1U alternative reference heatsink design This alternative heatsink design meets the thermal profile specifications of the Quad Core Intel Xeon Processor E5400 Series and offers the advantages of weight reduction and cost savings Refer to Appendix B for detail information Components Overview Heatsink with Captive Screws and Standoffs The CEK reference heatsink uses snapped fin technology for its design It consists of a copper base and copper fins with Shin Etsu G751 thermal grease as the TIM The mounting screws and standoffs are also made captive to the heatsink base for ease of handling and assembly as shown in Figure 2 22 and Figure 2 23 for the 2U and 1U heatsinks respectively Quad Core Intel Xeon Processor 5400 Series TMDG 45 m n tel Thermal Mechanical Reference Design Figure 2 22 Isometric View of the 2U CEK Heatsink li IBN Mi I Ill ANS Wwe 2 DE Z Note Refer to Appendix B for more detailed mechanical drawings of the heatsink Figure 2 23 Isometric View of the 1U CEK Heatsink 46 Note Refer to Appendix B for more detailed mechanical drawings of the heatsink The function of the standoffs is to provide a bridge between the chassis and the heatsink f
46. a thermal management system PROCHOT THERMTRIP and FORCEPR The PROCHOT and THERMTRIP outputs will be shared by all cores on a processor The first core to reach TCC activation will assert PROCHOT A single FORCEPR input will be shared by every core Table 2 2 provides an overview of input and output conditions for the Quad Core Intel Xeon Processor 5400 Series thermal management features Input and Output Conditions for the Quad Core Intel Xeon Processor 5400 Series Thermal Management Features Item Processor Input Processor Output TM1 TM2 DTScore x gt TCC Activation Temperature All Cores TCC Activation PROCHOT DTScore x gt TCC Activation Temperature PROCHOT Asserted THERMTRIP DTScore x gt THERMTRIP Assertion THERMTRIP Asserted Temperature all cores shut down FORCEPR FORCEPR Asserted All Cores TCC Activation Note 1 Series X 1 2 3 4 represents any one of the corel core2 core3 and core4 in the Quad Core Intel Xeon Processor 5400 2 For more information on PROCHOT THERMTRIP and FORCEPR see the Quad Core Intel Xeon Processor 5400 Series Datasheet 2 2 4 4 22 Heatpipe Orientation for Multiple Core Processors Thermal management of multiple core processors can be achieved without the use of heatpipe heatsinks as demonstrated by the Intel Reference Thermal Solution discussed in Section 2 5 To assist customers interested in desi
47. ad Core Intel Xeon Processor E5400 Series thermal profile specifications Component Overview The alternative 1U reference heatsink is an extruded aluminum heatsink and shares the same volumetric footprint as the 1U CEK heatsink It reuses Intel 1U CEK Captive standoff screws Thermal Interface Material TIM and Spring Figure A 1 shows the isometric view of the 1U alternative heatsink Isometric View of the 1U Alternative Heatsink Note Refer to Appendix B for more detailed mechanical drawings of the heatsink Quad Core Intel Xeon Processor 5400 Series TMDG 53 A 2 Figure A 2 Table A 1 A 3 Thermal Solution Performance Characterics 1U Alternative Heatsink Thermal Mechanical Design Figure A 2 shows the performance of the 1U alternative heatsink This figure shows the thermal performance and the pressure drop through fins of the heatsink versus the airflow provided The best fit eguations for these curves are also provided to make it easier for users to determine the desired value without any error associated with reading the graph 1U Alternative Heatsink Thermal Performance 0 50 045 Led d EE 040 A ji 0 35 S ER s o 0 30 d DE ARA 5 025 5 N TT 020 CEH Mean Test HQ 0 1172 0 7295 CF M li s EM Sp CFM Ming Fins 1U Alternative Heatsink Thermal Mechanical Characteristics A a Pressure Height Weight Target Airflow Standard
48. also be taken into account to make sure that all load cells protrude equally from the heatsink base It may be useful to screen the load cells prior to installation to minimize variation Quad Core Intel Xeon Processor 5400 Series TMDG 83 m n tel Heatsink Clip Load Methodology Figure C 1 84 Alternate Heatsink Sample Preparation As just mentioned making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results An alternate method to make sure that the test setup will measure loads representative of the non modified design is e Machine the pocket in the heatsink base to a depth such that the tips of the load cells are just flush with the heatsink base e Then machine back the heatsink base by around 0 25 mm 0 01 so that the load cell tips protrude beyond the base Proceeding this way the original stack height of the heatsink assembly should be preserved This should not affect the stiffness of the heatsink significantly Load Cell Installation in Machined Heatsink Base Pocket Bottom View Heatsink Base Pocket Diameter 29 mm 41 157 Package IHS Outline Top Surface Quad Core Intel Xeon Processor 5400 Series TMDG Heatsink Clip Load Methodology n te L Figure C 2 Load Cell Installation in Machined Heatsink Base Pocket Side View Wax to maintain load cell in Height of position during heatsink pocke
49. and the heatsink base e The heat transfer conditions on the surface on which heat transfer takes place Convective heat transfer occurs between the airflow and the surface exposed to the flow It is characterized by the local ambient temperature of the air Tj A and the local air velocity over the surface The higher the air velocity over the surface the resulting cooling is more efficient The nature of the airflow can also enhance heat transfer via convection Turbulent flow can provide improvement over laminar flow In the case of a heatsink the surface exposed to the flow includes the fin faces and the heatsink base An active heatsink typically incorporates a fan that helps manage the airflow through the heatsink Passive heatsink solutions require in depth knowledge of the airflow in the chassis Typically passive heatsinks see slower air speed Therefore these heatsinks are typically larger and heavier than active heatsinks due to the increase in fin surface required to meet a required performance As the heatsink fin density the number of fins in a given cross section increases the resistance to the airflow increases it is more likely that the air will travel around the heatsink instead of through it unless air bypass is carefully managed Using air ducting techniques to manage bypass area is an effective method for maximizing airflow through the heatsink fins Quad Core Intel Xeon Processor 5400 Series TMDG 37 m n
50. aracteristics Figure 2 17 and Figure 2 18 show the performance of the 2U and 1U passive heatsinks respectively These figures show the thermal performance and the pressure drop through fins of the heatsink versus the airflow provided The best fit equations for these curves are also provided to make it easier for users to determine the desired value without any error associated with reading the graph Figure 2 17 2U CEK Heatsink Thermal Performance 0 60 Test 328e 05CFM 5 78e 03CFM 0 40 o w o AP inch water Mean Test Y 0 1301 1 2736 CFM 7 0 20 G 0 0033 CW CRM Through Fins If other custom heatsinks are intended for use with the Quad Core Intel Xeon Processor 5400 Series they must support the following interface control requirements to be compatible with the reference mechanical components e Requirement 1 Heatsink assembly must stay within the volumetric keep in e Requirement 2 Maximum mass and center of gravity Current maximum heatsink mass is 1000 grams 2 2 Ibs and the maximum center of gravity 3 81 cm 1 5 in above the bottom of the heatsink base e Requirement 3 Maximum and minimum compressive load Any custom thermal solution design must meet the loading specification as documented within this document and should refer to the Quad Core Intel Xeon Processor 5400 Series Datasheet and LGA771 Socket Mechanical Design Guide for specific details on package socket loading
51. as drive bay obstructions above the inlet to the fan heatsink Thermal Profile A should be used to help determine the thermal performance of the platform The primary recommended control method for this solution is using pulse width modulation control This control method requires the motherboard provide the correct PWM duty cycle to the active fan heatsink solution to properly follow the thermal profile If no PWM signal is detected the active heatsink solution will default back to a thermistor controlled mode and the fan will automatically adjust fan RPM to meet the thermal profile It is critical to supply a constant 12 V to the fan header so that the active CEK heatsink solution can operate properly If a system board has a jumper setting to select either a constant 12 V power to the fan header or a variable voltage it is strongly recommended that the jumper be set by default to the constant 12 V setting It is recommended that the ambient air temperature outside of the chassis be kept at or below 35 C The air passing directly over the processor heatsink should not be preheated by other system components Meeting the processor s temperature specification is the responsibility of the system integrator Boxed Processor Contents A direct chassis attach method must be used to avoid problems related to shock and vibration due to the weight of the heatsink required to cool the processor The board must not bend beyond specification in order
52. ation on tradeoffs made with TIM selection Designs should consider possible decrease in applied pressure over time due to potential structural relaxation in enabled components e Ensuring system electrical thermal and structural integrity under shock and vibration events The mechanical requirements of the attach mechanism depend on the weight of the heatsink and the level of shock and vibration that the system must support The overall structural design of the baseboard and system must be considered when designing the heatsink attach mechanism Their design should provide a means for protecting LGA771 socket solder joints as well as preventing package pullout from the socket The load applied by the attachment mechanism must comply with the package and socket specifications along with the dynamic load added by the mechanical shock and vibration requirements as identified in Section 2 1 1 Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n te L 2 2 2 2 1 Figure 2 4 A potential mechanical solution for heavy heatsinks is the direct attachment of the heatsink to the chassis pan In this case the strength of the chassis pan can be utilized rather than solely relying on the baseboard strength In addition to the general guidelines given above contact with the baseboard surfaces should be minimized during installation in order to avoid any damage to the baseboard The Intel reference des
53. atsink Sheet 2 of 4 HEAT SINK GEOMETRY DETAILS SECTION A A Quad Core Intel Xeon Processor 5400 Series TMDG 59 m n tel Mechanical Drawings Figure B 3 2U CEK Heatsink Sheet 3 of 4 a o ca lt d E lt E LLI a gt m ral 3 LLI 2 wo U m lt EE x E z 3 a a LL Ss ra 5 ji 1 j N E M lt 45 LZ A m E Y EEG m co ES o a 60 Quad Core Intel Xeon Processor 5400 Series TMDG Mechanical Drawings Figure B 4 2U CEK Heatsink Sheet 4 of 4 a m lt m Lu a z LE LL e D g CH s o 32 EXTERNAL THREAD sS STEEL Quad Core Intel Xeon Processor 5400 Series TMDG 61 inteD Figure B 5 CEK Spring Sheet 1 of 3 62 Mechanical Drawings intel Quad Core Intel Xeon Processor 5400 Series TMDG Mechanical Drawings Figure B 6 CEK Spring Sheet 2 of 3 intel Quad Core Intel Xeon Processor 5400 Series TMDG 63 m n tel Mechanical Drawings Figure B 7 CEK Spring Sheet 3 of 3 intel 64 Quad Core Intel Xeon Processor 5400 Series TMDG intel Mechanical Drawing
54. available with legacy processors This is achieved as a result of a Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n te L smaller foot print and decreased sensitivity to noise These DTS benefits will result in more accurate fan speed control and TCC activation The DTS application in fan speed control will be discussed in more detail in Section 2 4 1 2 2 3 Platform Environmental Control Interface PECI The PECI interface is designed specifically to convey system management information from the processor initially only thermal data from the Digital Thermal Sensor Itisa proprietary single wire bus between the processor and the chipset or other health monitoring device The PECI specification provides a specific command set to discover enumerate devices and read the temperature For an overview of the PECI interface please refer to PECI Feature Set Overview For more detailed information on PECI please refer to Platform Environment Control Interface PECI Specification and Quad Core Intel Xeon Processor 5400 Series Datasheet 2 2 4 Multiple Core Special Considerations 2 2 4 1 Multiple Digital Thermal Sensor Operation Each Quad Core Intel Xeon Processor 5400 Series can have multiple Digital Thermal Sensors located on the die Each die within the processor currently maps to a PECI domain The Quad Core Intel Xeon Processor 5400 Series contains two cores per die domain an
55. c keep in it has a larger footprint due to the elimination of retention mechanism and clips used in the older enabled thermal mechanical components This allows the heatsink to grow its base and fin dimensions further improving the thermal performance A drawback of this enlarged size and use of copper for both the base and fins is the increased weight of the heatsink The retention scheme employed by CEK is designed to support heavy heatsinks approximately up to 1000 grams in cases of shock vibration and installation as explained in Appendix E Some of the thermal and mechanical characteristics of the CEK heatsinks are shown in Table 2 7 a Target Size Height Weight Airflow Mean Yoa ioi sii Pressure Drop Through Fins on Ze 3 mm in kg lbs Iddi CC W CC W Pa in H20 2U 50 80 2 00 1 0 2 2 45 9 27 0 177 0 0033 45 3 0 182 1U 27 00 1 06 0 53 1 2 25 5 15 0 240 0 0023 82 4 0 331 Thermal Interface Material TIM A TIM must be applied between the package and the heatsink to ensure thermal conduction The CEK reference design uses Shin Etsu G751 thermal grease The recommended grease dispense weight to ensure full coverage of the processor IHS is given below For an alternate TIM full coverage of the entire processor IHS is recommended Recommended Thermal Grease Dispense Weight Processor Minimum Maximum Units Notes TIM Dispense weight 400 mg Shin Etsu G751 Di
56. cessor 5400 Series TMDG
57. d two domains die per socket BIOS will be responsible for detecting the proper processor type and providing the number of domains to the thermal management system An external PECI device that is part of the thermal management system polls the processor domains for temperature information and currently receives the highest of the DTS output temperatures within each domain Figure 2 5 provides an illustration of the DTS domains for the Quad Core Intel Xeon Processor 5400 Series Figure 2 5 DTS Domain for Quad Core Intel Xeon Processor 5400 Series Quad Core Intel Xeon Processor 5400 Series TMDG 21 m n tel Thermal Mechanical Reference Design 2 2 4 2 2 2 4 3 Table 2 2 Thermal Monitor for Multiple Core Products The thermal management for multiple core products has only one TcoNTno value per processor The TcoNTROL for processor 0 and TcontroL for processor 1 are independent from each other If the DTS temperature from any domain within the processor is greater than or equal to TconrRoL the processor case temperature must remain at or below the temperature as specified by the thermal profile See Section 2 2 6 for information on TcoNTRoL The PECI signal is available through CPU pin G5 on each LGA771 socket for the Quad Core Intel Xeon Processor 5400 Series Through this pin the two domains provide the current hottest value received from all the temperature sensors to an external PECI device such as
58. e heatsink design for Quad Core Intel Xeon Processor E5400 Series in volumetrically constrained form factors F 1 2 Additional Suppliers The Intel enabled solutions for Quad Core Intel Xeon Processor 5400 Series are preliminary The Intel enabled solutions have not been verified to meet the criteria outlined in Appendix E Customers can purchase the Intel enabled thermal solution components from the suppliers listed in Table F land Table F 2 For additional details please refer to the Quad Core Intel Xeon Processor 5400 Series thermal mechanical enabling components drawings in Appendix B 96 Quad Core Intel Xeon Processor 5400 Series TMDG Enabled Suppliers Information intel Table F 2 Additional Suppliers for the Quad Core Intel Xeon Processor 5400 Series Intel Reference Solution Sheet 1 of 2 RE Development R Assembly Component Description Suppliers Supplier Contact Info 2U Heatsink Alternative CEK Copper Fin Aavid David Huang Heatsink Copper Base Thermalloy huangQaavid com CNDA 2525071 603922352724 Frank Hsue frank hsu aavid com tw 886 2 26989888 x306 Copper Fin ADDA Jungpin Chen Copper Base Corporation jungpin adda com tw CNDA AP1249 886 2 82212252x232 and Aluminum Copper Fin Asia Vital Components Steve Huang APAC Copper Base AVC 86 755 3366 8888 x66888 CNDA AP5281 86 138 252 45215 steve avc com cn and Huabin Chen China Only Aluminum 886 7
59. educing power consumption This is accomplished through a combination of Thermal Monitor and Advanced Thermal Monitor TM2 Thermal Monitor modulates the duty cycle of the internal processor clocks resulting in a lower effective frequency When active the TCC turns the processor clocks off and then back on with a predetermined duty cycle Thermal Monitor 2 activation adjusts both the Quad Core Intel Xeon Processor 5400 Series TMDG 19 m n tel Thermal Mechanical Reference Design 2 2 2 20 processor operating frequency via the bus multiplier and input voltage via the VID signals Please refer to the Quad Core Intel Xeon Processor 5400 Series Datasheet for further details on TM and TM2 PROCHOT is designed to assert at or a few degrees higher than maximum Tcase as specified by the thermal profile when dissipating TDP power and can not be interpreted as an indication of processor case temperature This temperature delta accounts for processor package lifetime and manufacturing variations and attempts to ensure the Thermal Control Circuit is not activated below maximum Tcase when dissipating TDP power There is no defined or fixed correlation between the PROCHOT assertion temperature and the case temperature However with the introduction of the Digital Thermal Sensor DTS on the Quad Core Intel Xeon Processor 5400 Series the DTS reports a relative offset below the PROCHOT assertion see Section 2 2 2 for more detai
60. el Xeon Processor 5400 Series TMDG Revision History intel Reference Number Revision Number Description Date 318611 001 Initial release of the document November 2007 Quad Core Intel Xeon Processor 5400 Series TMDG 8 Quad Core Intel Xeon Processor 5400 Series TMDG Introduction 1 1 1 1 2 1 3 Table 1 1 Quad Core Intel Xeon Processor 5400 Series TMDG Introduction Objective The purpose of this guide is to describe the reference thermal solution and design parameters required for the Quad Core Intel Xeon Processor 5400 Series It is also the intent of this document to comprehend and demonstrate the processor cooling solution features and requirements Furthermore this document provides an understanding of the processor thermal characteristics and discusses guidelines for meeting the thermal requirements imposed over the entire life of the processor The thermal mechanical solutions described in this document are intended to aid component and system designers in the development and evaluation of processor compatible thermal mechanical solutions Scope The thermal mechanical solutions described in this document pertain to a solution s intended for use with the Quad Core Intel Xeon Processor 5400 Series in 1U 2U 2U and workstation form factors systems This document contains the mechanical and thermal requirements of the processor cooling so
61. ements n te L E 1 2 4 E 1 3 Note No signs of physical damage on baseboard surface due to impact of heatsink No visible physical damage to the processor package Successful BIOS Processor memory test of post test samples Thermal compliance testing to demonstrate that the case temperature specification can be met org RA Recommended BIOS Processor Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses with the thermal mechanical enabling components assembled The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered Testing setup should include the following components properly assembled and or connected e Appropriate system baseboard e Processor and memory e All enabling components including socket and thermal solution parts The pass criterion is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors Intel PC Diags is an example of software that can be utilized for this test Material and Recycling Requirements Material shall be resistant to fungal growth Examples of non resistant materials include cellulose materials animal and vegetable based adhesives grease oils and many hydrocarbons Synthetic materials such as PVC formulations certain polyurethane compositions e g polye
62. file represents the processor s TDP and the associated maximum case temperature Tcase max and the lower end point represents the local ambient temperature at P OW The slope of the Thermal Profile line represents the case to ambient resistance of the thermal solution with the y intercept being the local processor ambient temperature The slope of the Thermal Profile is constant which indicates that all frequencies of a processor defined by the Thermal Profile will require the same heatsink case to ambient resistance In order to satisfy the Thermal Profile specification a thermal solution must be at or below the Thermal Profile line for the given processor when its DTS temperature is greater than TcoNrRoL refer to Section 2 2 6 The Thermal Profile allows the customers to make a trade off between the thermal solution case to ambient resistance and the processor local ambient temperature that best suits their platform implementation refer to Section 2 4 3 There can be multiple combinations of thermal solution case to ambient resistance and processor local ambient temperature that can meet a given Thermal Profile If the case to ambient resistance and the local ambient temperature are known for a specific thermal solution the Thermal Profile of that solution can easily be plotted against the Thermal Profile specification As explained Quad Core Intel Xeon Processor 5400 Series TMDG Thermal Mechanical Reference Design n te L
63. ge Power Heat source should always be specified for measurements Yes Case to sink thermal characterization parameter A measure of thermal interface material performance using total package power Defined as Tcasg Ts Total Package Power Ysa Sink to ambient thermal characterization parameter A measure of heatsink thermal performance using total package power Defined as Ts T A Total Package Power TCASE The case temperature of the processor measured at the geometric center of the topside of the IHS TCASE_MAX The maximum case temperature as specified in a component specification TCC Thermal Control Circuit Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and or operating freguency and input voltage adjustment when the die temperature is very near its operating limits Quad Core Intel Xeon Processor 5400 Series TMDG Introduction intel Table 1 2 Terms and Descriptions Sheet 2 of 2 TCONTROL A processor unique value for use in fan speed control mechanisms TcontroL is a temperature specification based on a temperature reading from the processor s Digital Thermal Sensor TconrRoL Can be described as a trigger point for fan speed control implementation TCONTROL TOFFSET TOFFSET An offset value from the TCC activation temperature value programmed into each processor during manufacturing and can be obtained by reading the IA_32_TEMPERATURE_TARGET MSR This
64. gning heatpipe heatsinks processor core locations have been provided In some cases this may influence the designer s selection of heatpipe orientation For this purpose the core geometric center locations as illustrated in Figure 2 6 are provided in Table 2 3 Dimensions originate from the vertical edge of the IHS nearest to the pin 1 fiducial as shown in Figure 2 6 Quad Core Intel Xeon Processor 5400 Series TMDG Thermal Mechanical Reference Design Figure 2 6 Processor Core Geometric Center Locations Table 2 3 Processor Core Geometric Center Dimensions Feature X Dimension Y Dimension Core 1 18 15 mm 6 15 mm Core 2 18 15 mm 10 35 mm Core 3 18 15 mm 18 85 mm Core 4 18 15 mm 23 05 mm Quad Core Intel Xeon Processor 5400 Series TMDG 23 m n tel Thermal Mechanical Reference Design 2 2 5 Thermal Profile The thermal profile is a line that defines the relationship between a processor s case temperature and its power consumption as shown in Figure 2 7 The equation of the thermal profile is defined as Equation 2 1 y ax b Where y Processor case temperature Tcase C x Processor power consumption W a Case to ambient thermal resistance YCA C W b Processor local ambient temperature TLA 9C Figure 2 7 Thermal Profile Diagram 24 Maze MAK DE Thermal Profile Tease TDP Power The high end point of the Thermal Pro
65. hase the Intel reference thermal solution components from the suppliers listed in Table F 1 For additional details please refer to the Quad Core Intel Xeon Processor 5400 Series thermal mechanical enabling components drawings in Appendix B Table F 1 Suppliers for the Quad Core Intel Xeon Processor 5400 Series Intel Reference Solution Sheet 1 of 2 Development e Assembly Component Description Suppliers Supplier Contact Info CEK771 01 2U CEK Heatsink Copper Fin Copper Fujikura Fujikura America for 2U 2U Heatsink p n Intel Boxed Heatsink p n D36871 Intel Reference C61708 rev03 Base includes PCM45F TIM cover CNDA 1242012 stacked fin Ash Ooe a ooeQfujikura com 408 748 6991 Fujikura Taiwan Branch Yao Hsien Huang yeohsienGfujikuratw com tw 886 2 8788 4959 CEK Heatsink Copper Fin Copper Base Furukawa CNDA 65755 Crimped fin Tim Yu YuQFurukawaAmerica com 408 345 1520 Intel Boxed Johnson Tseng Heatsink p n includes PCM45F JohnsonQtfe com tw D36871 TIM cover 02 2563 8148x15 Thermal Interface Grease Shin Etsu G751 Randy Isaacson rev04 LGA771 socket Intel p n D13646 Kapton Tape on Reinforced Spring Fingers CNDA AP5281 Material CNDA 75610 risaacsonQmicrosi com 480 893 8898x113 CEK Spring for Stainless Steel 301 AVC Steve Huang APAC 86 755 3366 8888 x66888 86 138 252 45215 steve avc com cn Huabin Chen China Only 886 755 3366 888
66. ign for Quad Core Intel Xeon Processor 5400 Series is using such a heatsink attachment scheme Refer to Section 2 5 for further information regarding the Intel reference mechanical solution Processor Thermal Parameters and Features Thermal Control Circuit and TDP The operating thermal limits of the processor are defined by the Thermal Profile The intent of the Thermal Profile specification is to support acoustic noise reduction through fan speed control and ensure the long term reliability of the processor This specification requires that the temperature at the center of the processor IHS known as TcAsg remains within a certain temperature specification For illustration Figure 2 4 shows the measurement location for the Quad Core Intel Xeon Processor 5400 Series package Compliance with the Tease specification is required to achieve optimal operation and long term reliability See the Inte Xeon Dual and Multi Processor Family Thermal Test Vehicle User s Guide for Case Temperature definition and measurement methods Processor Case Temperature Measurement Location Measure Tcase at this point geometric center of the package 375 mm To ease the burden on thermal solutions the Thermal Monitor feature and associated logic have been integrated into the silicon of the processor One feature of the Thermal Monitor is the Thermal Control Circuit TCC When active the TCC lowers the processor temperature by r
67. it should not exceed the corresponding specification given in the LGA771 Socket Mechanical Design Guide The heatsink mass can also add additional dynamic compressive load to the package during a mechanical shock event Amplification factors due to the impact force during shock must be taken into account in dynamic load calculations The total combination of dynamic and static compressive load should not then exceed the processor socket compressive dynamic load specified in the LGA771 Socket Mechanical Design Guide during a vertical shock It is not recommended to use any portion of the processor substrate as a mechanical reference or load bearing surface in either static or dynamic compressive load conditions Quad Core Intel Xeon Processor 5400 Series Considerations An attachment mechanism must be designed to support the heatsink since there are no features on the LGA771 socket to directly attach a heatsink In addition to holding the heatsink in place on top of the IHS this mechanism plays a significant role in the robustness of the system in which it is implemented in particular e Ensuring thermal performance of the TIM applied between the IHS and the heatsink TIMs especially ones based on phase change materials are very sensitive to applied pressure the higher the pressure the better the initial performance TIMs such as thermal greases are not as sensitive to applied pressure Refer to Section 2 5 2 and Section 2 5 7 2 for inform
68. le of a worst case thermal condition is when a processor local ambient temperature is at or above 43 2 C for Quad Core Intel Xeon Processor E5400 Series Thermal Profile Thermal solutions that exceed the Thermal Profile specification are considered incompliant and will adversely affect the long term reliability of the processor Refer to the Quad Core Intel Xeon Processor 5400 Series Datasheet or Section 2 2 8 for the Quad Core Intel Xeon Processor 5400 Series Thermal Profile specifications Section 2 5 and Appendix A of this document provide details on 1U Intel reference thermal solutions that are designed to meet the Quad Core Intel Xeon Processor E5400 Series Thermal Profile Performance Targets The Thermal Profile specifications for this processor are published in the Quad Core Intel amp Xeon Processor 5400 Series Datasheet These Thermal Profile specifications are shown as a reference in the subsequent discussions Quad Core Intel Xeon Processor 5400 Series TMDG Thermal Mechanical Reference Design intel Figure 2 11 Thermal Profile for the Quad Core Intel amp KeonG Processor X5400 Series TCASE MAX is a thermal solution design point In actuality units will not significantly exceed TCASE MAX A due to TCC activation Thermal Profile B Y20221 x 43 5 Thermal Profile A Y 0 168 x 42 8 Notes 1 The The thermal specifications shown in this graph are for Quad Core Intel
69. ls on the Digital Thermal Sensor Thermal solutions must be designed to the processor specifications i e Thermal Profile and can not be adjusted based on experimental measurements of TcAsg PROCHOT or Digital Thermal Sensor on random processor samples By taking advantage of the Thermal Monitor features system designers may reduce thermal solution cost by designing to the Thermal Design Power TDP instead of maximum power TDP should be used for processor thermal solution design targets TDP is not the maximum power that the processor can dissipate TDP is based on measurements of processor power consumption while running various high power applications This data set is used to determine those applications that are interesting from a power perspective These applications are then evaluated in a controlled thermal environment to determine their sensitivity to activation of the thermal control circuit This data set is then used to derive the TDP targets published in the processors datasheet The Thermal Monitor can protect the processors in rare workload excursions above TDP Therefore thermal solutions should be designed to dissipate this target power level The thermal management logic and thermal monitor features are discussed in extensive detail in the Quad Core Intel 9 XeonQ Processor 5400 Series Datasheet In addition on die thermal management features called THERMTRIP and FORCEPR are available on the Quad Core Intel Xeon Processor
70. lution In case of conflict the data in the Quad Core Intel Xeon Processor 5400 Series Datasheet supersedes any data in this document Additional information is provided as a reference in the appendices References Material and concepts available in the following documents may be beneficial when reading this document Reference Documents Sheet 1 of 2 Document Comment European Blue Angel Recycling Standards http www blauer engel de Intel Xeon Dual and Multi Processor Family Thermal Test Vehicle See Note at bottom table User s Guide LGA771 Socket Mechanical Design Guide See Note following table LGA771 SMT Socket Design Guidelines See Note following table LGA771 Daisy Chain Test Vehicle User Guide See Note following table Stoakley Platform Design Guide PDG See Note following table Dual Core Intel Xeon9 Processor Based Servers Platform Design See Note following table Guide PDG Dual Core Intel Xeon Processor Based Workstation Platform Design See Note following table Guide PDG Clovertown Harpertown amp Wolfdale DP Processors Compatibility Design See Note following table Guide for Bensley Bensley VS and Glidewell Platforms PECI Feature Set Overview See Note following table Platform Environment Control Interface PECI Specification See Note following table Quad Core Intel amp Xeon amp Processor 5400 Series Datasheet See Note following table Clovertown Harpertown
71. nce Regardless of which scheme is employed system designers must ensure that the Thermal Profile specification is met when the processor Digital Thermal Sensor temperature exceeds the TcoNroL value for a given processor Processor Thermal Characterization Parameter Relationships The idea of a thermal characterization parameter Y psi is a convenient way to characterize the performance needed for the thermal solution and to compare thermal solutions in identical conditions heating source local ambient conditions A thermal characterization parameter is convenient in that it is calculated using total package power whereas actual thermal resistance 0 theta is calculated using actual power dissipated between two points Measuring actual power dissipated into the heatsink is difficult since some of the power is dissipated via heat transfer into the socket and board Be aware however of the limitations of lumped parameters such as Y when it comes to a real design Heat transfer is a three dimensional phenomenon that can rarely be accurately and easily modeled by lump values The case to local ambient thermal characterization parameter value ca is used as a measure of the thermal performance of the overall thermal solution that is attached to the processor package It is defined by the following equation and measured in units of C W Equation 2 3 cA TCASE TLA TDP 34 Where ECA Case to local ambient thermal characte
72. nical Reference Design This chapter describes the thermal mechanical reference design for Quad Core Intel Xeon Processor 5400 Series Both Quad Core Intel Xeon Processor X5400 Series and Quad Core Intel Xeon Processor E5400 Series are targeted for the full range of form factors 2U 2U and 1U The Quad Core Intel Xeon Processor X5482 sku is an ultra performance version of the Quad Core Intel Xeon Processor 5400 Series with 150W TDP and is use only in workstation platforms 2 1 Mechanical Requirements The mechanical performance of the processor cooling solution must satisfy the requirements described in this section 2 1 1 Processor Mechanical Parameters Table 2 1 Processor Mechanical Parameters Table Parameter Minimum Maximum Unit Notes Volumetric Requirements and Keepouts 1 Static Compressive Load 3 Static Board Deflection 3 Dynamic Compressive Load 3 Transient Bend 3 Shear Load 70 Ibf 2 4 5 311 N Tensile Load 25 Ibf 2 4 6 111 N Torsion Load 35 in Ibf 2 4 7 3 95 N m Notes 1 Refer to drawings in Appendix B 2 Inthe case of a discrepancy the most recent Quad Core Intel Xeon Processor 5400 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in Table 2 1 above 3 These socket limits are defined in the LGA771 Socket Mechanical Design Guide 4 These package handling limits are defined in the Quad Core Intel Xeon Processor 54
73. nks will be verified within specific boundary conditions using a TTV and the methodology described in the Inte Xeon Dual and Multi Processor Family Thermal Test Vehicle User s Guide The test results for a number of samples are reported in terms of a worst case mean 36 value for thermal characterization parameter using real processors based on the ITV correction offset Environmental Reliability Testing Structural Reliability Testing The Intel reference heatsinks will be tested in an assembled condition along with the LGA771 Socket Details of the Environmental Reguirements and associated stress tests can be found in the LGAZZI Socket Mechanical Design Guide The use condition environment definitions provided in Appendix E 1are based on speculative use condition assumptions and are provided as examples only Quad Core Intel Xeon Processor 5400 Series TMDG 91 intel Table E 1 E 1 2 2 E 1 2 3 92 Use Conditions Environment Ouality and Reliability Reguirements S is Example 10 Use Environment Speculative Stress Example Use Example 7 Yr Yr Stress Condition Condition Stress Equiv Equi quiv Shipping and Mechanical Shock Total of 12 n a n a Handling e System level drops per system Unpackaged e Trapezoidal 2 drops pet axis e 25g e direction e velocity change is based on packaged weight Product Non Weight Ibs palletized Product Velocity Change in sec lt 20 Ibs
74. nts and other heat generating components determine the chassis thermal performance and the resulting ambient temperature around the processor The size and type passive or active of the thermal solution and the amount of system airflow can be traded off against each other to meet specific system design constraints Additional constraints are board layout spacing component placement and structural considerations that limit the thermal solution size In addition to passive heatsinks fan heatsinks and system fans other solutions exist for cooling integrated circuit devices For example ducted blowers heat pipes and liquid cooling are all capable of dissipating additional heat Due to their varying attributes each of these solutions may be appropriate for a particular system implementation Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n te L To develop a reliable cost effective thermal solution thermal characterization and simulation should be carried out at the entire system level accounting for the thermal requirements of each component In addition acoustic noise constraints may limit the size number placement and types of fans that can be used in a particular design 2 5 Thermal Mechanical Reference Design Considerations 2 5 1 Heatsink Solutions 2 5 1 1 Heatsink Design Considerations To remove the heat from the processor three basic parameters should be considered e
75. oad cells equivalent to those listed in Section C 2 2 To install the load cells machine a pocket in the heatsink base as shown in Figure C 1 and Figure C 2 The load cells should be distributed evenly as close as possible to the pocket walls Apply wax around the circumference of each load cell and the surface of the pocket around each cell to maintain the load cells in place during the heatsink installation on the processor and motherboard The depth of the pocket depends on the height of the load cell used for the test It is necessary that the load cells protrude out of the heatsink base However this protrusion should be kept minimal as it will create an additional load offset since the heatsink base is artificially raised The measurement load offset depends on the whole assembly stiffness i e motherboard clip fastener etc For example the Quad Core Intel Xeon Processor 5400 Series CEK Reference Heatsink Design clip and fasteners assembly have a stiffness of around 160 N mm 915 Ib in If the resulting protrusion is 0 038 mm 0 0015 then a extra load of 6 08 N 1 37 Ib will be created and will need to be subtracted from the measured load Figure C 3 shows an example using the Quad Core Intel Xeon Processor 5400 Series CEK Reference Heatsink designed for the Quad Core Intel Xeon Processor 5400 Series in the 771 land LGA package When optimizing the heatsink pocket depth the variation of the load cell height should
76. of model specific registers that are used to control and report on processor performance Virtually all MSRs handle system related functions and are not accessible to an application program FMB Flexible Motherboard Guideline an estimate of the maximum value of a processor specification over certain time periods System designers should meet the FMB values to ensure their systems are compatible with future processor releases FSC Fan Speed Control IHS Integrated Heat Spreader a component of the processor package used to enhance the thermal performance of the package Component thermal solutions interface with the processor at the IHS surface LGA771 Socket The Quad Core Intel Xeon Processor 5400 Series interfaces to the baseboard through this surface mount 771 Land socket See the LGA771 Socket Mechanical Design Guide for details regarding this socket PMAX The maximum power dissipated by a semiconductor component PECI A proprietary one wire bus interface that provides a communication channel between Intel processor and chipset components to external thermal monitoring devices for use in fan speed control PECI communicates readings from the processors Digital Thermal Sensor PECI replaces the thermal diode available in previous processors PCA Case to ambient thermal characterization parameter psi A measure of thermal solution performance using total package power Defined as Tcase Tal Total Packa
77. on of mechanical and thermal models of the CEK Pro Engineer IGES and Icepak Flotherm formats Pro Engineer Icepak and Flotherm models are available on Intel Business Link IBL Intel reserves the right to make changes and modifications to the design as necessary The thermal mechanical reference design for the Quad Core Intel Xeon Processor 5400 Series was verified according to the Intel validation criteria given in Appendix E 1 Any thermal mechanical design using some of the reference components in combination with any other thermal mechanical solution needs to be fully validated according to the customer criteria Also if customer thermal mechanical validation criteria differ from the Intel criteria the reference solution should be validated against the customer criteria Structural Considerations of CEK As Intel explores methods of keeping thermal solutions within the air cooling space the mass of the thermal solutions is increasing Due to the flexible nature and associated large deformation of baseboard only attachments Intel reference solutions such as Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n te L 2 5 5 CEK are now commonly using direct chassis attach DCA as the mechanical retention design The mass of the new thermal solutions is large enough to require consideration for structural support and stiffening on the chassis Thermal Solution Performance Ch
78. ontrol with a 6101 PCI card GPIB added to the scanner allowing it to be connected to a PC running LabVIEW or Vishay s StrainSmart software 4 IMPORTANT In addition to just a zeroing of the force reading at no applied load it is important to calibrate the load cells against known loads Load cells tend to drift Contact your load cell vendor for calibration tools and procedure information 5 When measuring loads under thermal stress bake for example load cell thermal capability must be checked and the test setup must integrate any hardware used along with the load cell For example the Model 13 load cells are temperature compensated up to 71 C as long as the compensation package spliced into the load cell s wiring is also placed in the temperature chamber The load cells can handle up to 121 C operating but their uncertainty increases according to 0 02 rdg F Test Procedure Examples The following sections give two examples of load measurement However this is not meant to be used in mechanical shock and vibration testing Any mechanical device used along with the heatsink attach mechanism will need to be included in the test setup i e back plate attach to chassis etc Prior to any test make sure that the load cell has been calibrated against known loads following load cell vendor s instructions Time Zero Room Temperature Preload Measurement 1 Pre assemble mechanical components on the board as needed prior
79. or 5400 Series TMDG m n tel Mechanical Drawings Figure B 13 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Sheet 6 of 6 mE x E a e ru peces 08 28 03 12 08 03 08 11 03 DATE REVISION TABLE 08 MODI 06 REVE ZONE REV DESCRIPTION Icz 04 FIXED NOTE ON 70 Quad Core Intel Xeon Processor 5400 Series TMDG Mechanical Drawings Figure B 14 1U CEK Heatsink Sheet 1 of 4 3 M OR FQUIV G LEE SPRING C 012E CEK HEAT SINK LGA771 01 Quad Core Intel Xeon Processor 5400 Series TMDG 71 intel Figure B 15 1U CEK Heatsink Sheet 2 of 4 Mechanical Drawings zz 1 A Ley HZ li NJ HEAT SINK GEOMETRY DETAILS BOTH SIDES 1 300 72 Quad Core Intel Xeon Processor 5400 Series TMDG Mechanical Drawings Figure B 16 1U CEK Heatsink Sheet 3 of 4 n m N E lt E DI a gt ta E lu U U lt E x z u lt HI I a gt
80. or attaching and load carrying When assembled the heatsink is rigid against the top of the standoff and the standoff is rigid to a chassis standoff with the CEK spring firmly sandwiched between the two In dynamic loading situations the standoff carries much of the heatsink load especially in lateral conditions when compared to the amount of load transmitted to the processor package As such it is comprised of steel The distance from the bottom of the heatsink to the bottom of the standoff is 8 79 mm 0 346 in for a board thickness of 1 57 mm 0 062 in The standoff will need to be modified for use in applications with a different board thickness as defined in Section 2 5 4 2 The function of the screw is to provide a rigid attach method to sandwich the entire CEK assembly together activating the CEK spring under the baseboard and thus providing the TIM preload A screw is an inexpensive low profile solution that does not negatively impact the thermal performance of the heatsink due to air blockage Any fastener i e head configuration can be used as long as it is of steel construction the head does not interfere with the heatsink fins and is of the correct length of 20 64 mm 0 8125 in Quad Core Intel Xeon Processor 5400 Series TMDG Thermal Mechanical Reference Design Table 2 7 2 5 7 2 Table 2 8 CEK Heatsink Thermal Mechanical Characteristics intel Although the CEK heatsink fits into the legacy volumetri
81. our distributor to obtain the latest specifications and before placing your product order Copies of documents which have an order number and are referenced in this document or other Intel literature may be obtained by calling1 800 548 4725 or by visiting Intel s website at http www intel com Intel Intel Inside Xeon Intel Core and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries Other brands and names may be claimed as the property of others Copyright O 2007 Intel Corporation All rights reserved 2 Quad Core Intel Xeon Processor 5400 Series TMDG Contents 1 Introdu tio ni mE 9 1 1 ele 9 dE 9 Ri EE 9 1 4 Definition of EE 10 2 Thermal Mechanical Reference Design 13 2 1 Mechanical Reg irements ae wie a vives sene R WSE kanik na eran REGE aaa 13 2 1 1 Processor Mechanical Parameters wwsanemwanannwananuwananunwananzwananuminanaa 13 2 1 2 Quad Core Intel Xeon Processor 5400 Series Package 14 2 1 3 Quad Core Intel Xeon Processor 5400 Series Considerations 18 2 2 Processor Thermal Parameters and Features 19 2 2 1 Thermal Control Circuit and TD 19 2 2 2 Digital Thermal Gensor xak ku ay sus senes KAREN kal kla ak nal aa ENNER NENNEN RENE NNN 20 2 2 3 Platform Environmental Control Interface PECI cceseeeeeeeee tees tees eeeees 21
82. pout requirements shown in Appendix B must be met to use this CEK spring design 48 Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n te D 2 5 8 Figure 2 26 Boxed Active Thermal Solution for the Quad Core Intel amp Xeon Processor 5400 Series Thermal Profile Intel will provide a 2U passive and a 1U passive active heatsink solution for boxed Quad Core Intel Xeon Processor 5400 Series This active heatsink solution is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present and side directional airflow is not an issue This active heatsink solution consists of a 4 wire PWM fan and a 1U passive heatsink compatible with 1U form factors both mechanically and thermally These solutions are intended for system integrators who build systems from components available through distribution channels The retention solution used for these products is called the CEK The CEK base is compatible with all the heatsink solutions Figure 2 26 provides a representation of the active CEK solution This design is based on a 4 pin PWM PECI DTS controlled active fan heatsink solution PWM Pulse Width Modulation also synonymous with Pulse Duration Modulation PDM is a modulation in which the duration of pulse is varied in accordance with some characteristic of the modulating signal This solution is being offered to help provide better control over pedestal chassis acous
83. pply a compressive load of up to 133 N 30 Ibf on the TIM to improve the thermal performance Quad Core Intel Xeon Processor 5400 Series TMDG 47 m n tel Thermal Mechanical Reference Design 2 5 7 3 CEK Spring The CEK spring which is attached on the secondary side of the baseboard is made from 0 80 mm 0 0315 in thick 301 stainless steel half hard Any future versions of the spring will be made from a similar material The CEK spring has four embosses which when assembled rest on the top of the chassis standoffs The CEK spring is located between the chassis standoffs and the heatsink standoffs The purpose of the CEK spring is to provide compressive preload at the TIM interface when the baseboard is pushed down upon it This spring does not function as a clip of any kind The two tabs on the spring are used to provide the necessary compressive preload for the TIM when the whole solution is assembled The tabs make contact on the secondary side of the baseboard In order to avoid damage to the contact locations on the baseboard the tabs are insulated with a 0 127 mm 0 005 in thick Kapton tape or equivalent Figure 2 24 shows an isometric view of the CEK spring design Figure 2 24 CEK Spring Isometric View Figure 2 25 Isometric View of CEK Spring Attachment to the Base Board Secondary Primary Please refer to Appendix B for more detailed mechanical drawings of the CEK spring Also the baseboard kee
84. rements ell el ee ee ker ee ee ee kk mene 93 F Enabled Suppliers Information 95 FI Supplier Information usuwa wa coepto uie na ke dak danin se dbase ae da era BAG AER ENNEN dk a 95 F 1 1 Intel Enabled SUppliers mai eo reet sare XR AR RR ERR Rat ker NEEN AS 95 F 1 2 Additional Suppliers seess SEAN SR NENNEN AKTE NEEN SEENEN ER NEE daa NEE SNE Wes Nee 96 Figures 2 1 Quad Core Intel Xeon Processor 5400 Series Mechanical Drawing 1 of 3 15 2 2 Quad Core Intel Xeon Processor 5400 Series Mechanical Drawing 2 of 3 16 2 3 Quad Core Intel Xeon Processor 5400 Series Mechanical Drawing 3 of 3 17 2 4 Processor Case Temperature Measurement Location 19 2 5 DTS Domain for Quad Core Intel Xeon Processor 5400 Series 21 2 6 Processor Core Geometric Center Locations 23 2 7 Thermal Profile Diagram ese ebe ESA EES ka sana anka diy kak naa ak a dad ERE nance wanted Pda CG 24 2 8 TCONTROL Value and Digital Thermal Sensor Value Interactlon 25 2 9 TCONTROL and Thermal Profile Interacton nmm 26 2 10 Dual Thermal Profile Diagram ia Kan k n 27 2 11 Thermal Profile for the Quad Core Intel Xeon Processor X5400 Series 29 2 12 Thermal Profile for Quad Core Intel Xeon Processor E5400 Series 30 2 13 Thermal Profile for Quad Core Intel Xeon Processor X5482 Series 31 2 14 TCONTROL and Fan Speed Cont
85. rization parameter C W Tcase Processor case temperature C TLA Local ambient temperature in chassis at processor C TDP TDP dissipation W assumes all power dissipates through the integrated heat spreader IHS Quad Core Intel Xeon Processor 5400 Series TMDG Thermal Mechanical Reference Design n te L The case to local ambient thermal characterization parameter of the processor ca is comprised of Ycs the TIM thermal characterization parameter and of Ysa the sink to local ambient thermal characterization parameter Equation 2 4 cA Yes Ysa Where Yes Thermal characterization parameter of the TIM C W Ysa Thermal characterization parameter from heatsink to local ambient C W Pcs is strongly dependent on the thermal conductivity and thickness of the TIM between the heatsink and IHS Ysa is a measure of the thermal characterization parameter from the bottom of the heatsink to the local ambient air Ys is dependent on the heatsink material thermal conductivity and geometry It is also strongly dependent on the air velocity through the fins of the heatsink Figure 2 15 illustrates the combination of the different thermal characterization parameters Figure 2 15 Processor Thermal Characterization Parameter Relationships mu m ho 5 ra PROCESSOR 2 4 2 1 Example The cooling performance Pca is then defined using
86. rol 33 2 15 Processor Thermal Characterization Parameter Relationships wwwmwwaamwanwwaaza 35 2 16 Exploded View of CEK Thermal Solution Componente kk kk kk kk kk kk ka 39 2 17 2U CEK Heatsink Thermal Performance 41 2 18 1U CEK Heatsink Thermal Performance khk khk h k llk kk kk kk kk kk nennen kK kak kk kk kk kk kk kak kk 42 2 19 2U CEK Thermal Adherence to Quad Core Intel Xeon Processor X5400 Series Thermal Profile A ecce ce adan ANEN owe k ba ka W Raw k akan naka a wl W L n Ki 43 2 20 1U CEK Thermal Adherence to Quad Core Intel Xeon Processor X5400 Series Thermal Profile Bist di yy cento edet dE y De px k EIU EE M SR TERR EE d Ki 44 2 21 1U CEK Thermal Adherence to Quad Core Intel Xeon Processor E5400 Series Thermal Profile staje yina rinie barn EA 45 2 22 Isometric View of the 2U CEK Heatsink wanauza nnn 46 2 23 Isometric View of the 1U CEK Heatsink aaa aa aaa aaa aaa meme nene nnns 46 2 24 CEK Spring Isometric VIEW sayi x cs dak kski A W bide ection A ds a w R NEEN NEESS 48 2 25 Isometric View of CEK Spring Attachment to the Base Board s 4s4111121 48 2 26 Boxed Active CEK Heatsink Solutions with PWM DTS Control Representation Only ete i OOOO y wa ik has kurk n een aid 49 2 27 Fan Cable Connection Active CEK sakal aaa aaa aaa aaa nana kd kek kaka a a kaka a kar a saa a va bana 50 A 1 Isometric View of the 1U Alternative Hea
87. s for lons ht Restricti ig d He ion an Baseboard Keepout Footprint Def Enabling Components Sheet 1 of 6 Figure B 8 S 9 L 8 NOISEHA f 133008 Man LNOdi3X ONITYNA JAJ AMINO 1005 1 IKS 39N343334 04 NMOHS SISOdaNd JALIVALSNIJI 804 AWYONNOB f 134308 NO112131S3U 1H913H S12 0 QUVOB LS31 FEMI EJ mi jo Jar wot Z LHS 338 YNISLYJH SWIG H04 Z LHS 338 ANITINO ATBWISSYSIO MNISLVJH MOTY Y ei d 99 66 3915 AuvWiud 002 92 18 034011V SLN3NOdNOO QBYOGH3HION ON LNOd33X UJONIJ QNVOS ONIUdS 32 NOI12181938 LHDI3H LN3NOdNOO XYW NN 0 L SLE O V3uV ATBWJSSYSIQ JNISLV3H 14 MYA 430105 NOILSIYISIY 1H913H LNJNOdNOJ QNVOGH3HLON XYW WWII Cep Q3MO11V INJNJIVId LN3NOdWOJ QWYOGUHJHLOW ON NO112181838 1H913H LNJNOdNOJ XVN WW 0 L GLZ O V3HY WNISLYJH SWIG 404 2 LHS 338 LHS 338 ANITINO YNISIYJH SSVSIA EEIKLIEER TVG 430108 134208 YO NOILYHOdHOD IJLNI JO 1N3SNOO NLLIU SLNJINOJ SLI ONY JANJA JNOJ NI 03801 4 ONIMYUO NId33X f 134908 FHL Ol 4 33 NO NMOHS 38 771M 1N0d33 NOLIVINOJU 43334 3SVild S310H ONILNNOW M39 JHL ONY I TIVI 03114408 HLIM NOI1V138802 NI ISN Yd 201 INOHLIM 0314100 YO OJAVIdSTO 03200 SI LI NOILVNSOJNI 1V11N301 JNOO NOI 1YBOdUO2 NOI10I81S38 LH9I3H IN3NOdWOO XVW NM O E 8118
88. spense weight is an approximate target TIM loading provided 18 30 Ibf Generated by the CEK by CEK 80 133 N It is recommended that you use thermally conductive grease Thermally conductive grease reguires special handling and dispense guidelines The following guidelines apply to Shin Etsu G751 thermal grease For guidance with your specific application please contact the vendor Vendor information is provided in Appendix F The use of a semi automatic dispensing system is recommended for high volume assembly to ensure an accurate amount of grease is dispensed on top of the IHS prior to assembly of the heatsink A typical dispense system consists of an air pressure and timing controller a hand held output dispenser and an actuation foot switch Thermal grease in cartridge form is reguired for dispense system compatibility A precision scale with an accuracy of 5 mg is recommended to measure the correct dispense weight and set the corresponding air pressure and duration The IHS surface should be free of foreign materials prior to grease dispense Additional recommendations include recalibrating the dispense controller settings after any two hour pause in grease dispense The grease should be dispensed just prior to heatsink assembly to prevent any degradation in material performance Finally the thermal grease should be verified to be within its recommended shelf life before use The CEK reference solution is designed to a
89. ssor and the corresponding maximum Tcase temperature These parameters are usually combined in a single lump cooling performance parameter ca case to air thermal characterization parameter More information on the definition and the use of Wea is given in Section 2 5 and Section 2 4 2 e Heatsink interface to IHS surface characteristics including flatness and roughness e The performance of the TIM used between the heatsink and the IHS e Surface area of the heatsink e Heatsink material and technology Development of airflow entering and within the heatsink area e Physical volumetric constraints placed by the system e Integrated package socket stackup height information is provided in the LGA771 Socket Mechanical Design Guide Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n te L 2 5 4 Assembly Overview of the Intel Reference Thermal Mechanical Design The reference design heatsinks that meet the Quad Core Intel Xeon Processor 5400 Series thermal performance targets are called the Common Enabling Kit CEK heatsinks and are available in 1U 2U 8 2U form factors Each CEK consists of the following components e Heatsink with captive standoff and screws e Thermal Interface Material TIM e CEK Spring 2 5 4 1 Geometric Envelope The baseboard keepout zones on the primary and secondary sides and height restrictions under the enabling component region are shown in
90. ster and some polyethers plastics which contain organic fillers of laminating materials paints and varnishes also are susceptible to fungal growth If materials are not fungal growth resistant then MIL STD 810E Method 508 4 must be performed to determine material performance Material used shall not have deformation or degradation in a temperature life test Any plastic component exceeding 25 grams should be recyclable per the European Blue Angel recycling standards The following definitions apply to the use of the terms lead free Pb free and ROHS compliant Lead free and Pb free Lead has not been intentionally added but lead may still exist as an impurity below 1000 ppm RoHS compliant Lead and other materials banned in RoHS Directive are either 1 below all applicable substance thresholds as proposed by the EU or 2 an approved pending exemption applies RoHS implementation details are not fully defined and may change Quad Core Intel Xeon Processor 5400 Series TMDG 93 94 Ouality and Reliability Reguirements Quad Core Intel Xeon Processor 5400 Series TMDG Enabled Suppliers Information F Enabled Suppliers Information F 1 Supplier Information F 1 1 Intel Enabled Suppliers The Intel reference enabling solution for Quad Core Intel Xeon Processor 5400 Series is preliminary The Intel reference solutions have not been verified to meet the criteria outlined in Appendix E Customers can purc
91. t height installation of selected load cell YMM HEE RAMA Figure C 3 Preload Test Configuration Preload Fixture copper core with milled out pocket Load Cells 3x Quad Core Intel Xeon Processor 5400 Series TMDG 85 Table C 1 C 2 3 C 2 4 86 e n tel Heatsink Clip Load Methodology Typical Test Equipment For the heatsink clip load measurement use equivalent test equipment to the one listed Table C 1 Typical Test Equipment Item Description Part Number Model Load cell Honeywell Sensotec Model 13 subminiature load cells AL322BL Notes 1 5 compression only Select a load range depending on load level being tested www sensotec com Data Logger Vishay Measurements Group Model 6100 scanner with a Model 6100 or scanner 6010A strain card one card required per channel Notes 2 3 4 Notes 1 Select load range depending on expected load level It is usually better whenever possible to operate in the high end of the load cell capability Check with your load cell vendor for further information 2 Since the load cells are calibrated in terms of mV V a data logger or scanner is required to supply 5 volts DC excitation and read the mV response An automated model will take the sensitivity calibration of the load cells and convert the mV output into pounds 3 With the test equipment listed above it is possible to automate data recording and c
92. t to determine the new case to ambient thermal resistance Equation 2 7 PcA TcasE TLA TDP 68 40 85 0 33 C W 2 4 3 2 4 3 1 36 It is evident from the above calculations that a reduction in the local processor ambient temperature has a significant positive effect on the case to ambient thermal resistance reguirement Chassis Thermal Design Considerations Chassis Thermal Design Capabilities and Improvements One of the critical parameters in thermal design is the local ambient temperature assumption of the processor Keeping the external chassis temperature fixed internal chassis temperature rise is the only component that can affect the processor local ambient temperature Every degree gained at the local ambient temperature directly translates into a degree relief in the processor case temperature Given the thermal targets for the processor it is extremely important to optimize the chassis design to minimize the air temperature rise upstream to the processor Trise hence minimizing the processor local ambient temperature The heat generated by components within the chassis must be removed to provide an adequate operating environment for both the processor and other system components Moving air through the chassis brings in air from the external ambient environment and transports the heat generated by the processor and other system components out of the system The number size and relative position of fans ve
93. taink aaa aa aaa aaa aaa aaa aaa aaaa kan KK 53 A 2 1U Alternative Heatsink Thermal Performance cesses 54 A 3 1U Alternative Heatsink Thermal Adherence to Quad Core Intel Xeon Processor L5400 Series Thermal Profile 55 B 1 2U CEK Heatsink Sheet 1 ofA AA 58 B 2 2U CEK Heatsink Sheet 2 of 4 us es ae nkawa ai wana wanna ada A nan hath akanai aa Nai ENEA 59 B 3 2U CEK Heatsink Sheet 3 of 4 oaz aa ESA a kh kad ha aka duds E Da eu a PAR RA aa 60 B 4 2U CEK Heatsink Sheet 4 of A NENNEN Kaa nin ainan AEK ad a a anak a ekle k s 61 4 Quad Core Intel Xeon Processor 5400 Series TMDG B 5 B 6 B 8 B 14 B 15 B 16 B 17 B 18 B 19 B 20 B 21 B 22 B 23 B 24 C 1 C 2 C 3 GEK Spring Sheet l OF 3 IA aa u b n a a Kea Gaus DEWE aa Gi ku k na 62 CEK Spring Sheet 2 0f aaa 63 GEK Spring Sheet 3 003 ia Aa 64 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Sheet 1 of 6 i s se see kak kalkk ka da makawa wakawaua kale ada ak eee 65 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Sheet 2 of 66 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Sheet 3 of i 67 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Sheet 4 of i 68 Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components Sheet 5 of i
94. tel Thermal Mechanical Reference Design 2 5 2 2 5 3 38 Thermal Interface Material TIM application between the processor IHS and the heatsink base is generally reguired to improve thermal conduction from the IHS to the heatsink Many thermal interface materials can be pre applied to the heatsink base prior to shipment from the heatsink supplier and allow direct heatsink attach without the need for a separate TIM dispense or attach process in the final assembly factory All thermal interface materials should be sized and positioned on the heatsink base in a way that ensures the entire processor IHS area is covered It is important to compensate for heatsink to processor attach positional alignment when selecting the proper TIM size When pre applied material is used it is recommended to have a protective application tape over it This tape must be removed prior to heatsink installation The TIM performance is susceptible to degradation i e grease breakdown during the useful life of the processor due to the temperature cycling phenomena For this reason the measured Tease value of a given processor can decrease over time depending on the type of TIM material Refer to Section 2 5 7 2 for information on the TIM used in the Intel reference heatsink solution Summary In summary considerations in heatsink design include e The local ambient temperature T 4 at the heatsink airflow CFM the power being dissipated by the proce
95. termined as explained earlier the DTS temperature reading from the processor can be compared to this TcoNrRoL value A fan speed control scheme can be implemented as described in Table 2 6 without compromising the long term reliability of the processor Quad Core Intel Xeon Processor 5400 Series TMDG 33 m n tel Thermal Mechanical Reference Design Table 2 6 2 4 2 Fan Speed Control TcoNrRoL and DTS Relationship Condition FSC Scheme DTS lt TCONTROL FSC can adjust fan speed to maintain DTS lt TcoNrRoL low acoustic region DTS gt TcoNTROL FSC should adjust fan speed to keep Tcase at or below the Thermal Profile specification increased acoustic region There are many different ways of implementing fan speed control including FSC based on processor ambient temperature FSC based on processor Digital Thermal Sensor DTS temperature or a combination of the two If FSC is based only on the processor ambient temperature low acoustic targets can be achieved under low ambient temperature conditions However the acoustics cannot be optimized based on the behavior of the processor temperature If FSC is based only on the Digital Thermal Sensor sustained temperatures above Tcontro drives fans to maximum RPM If FSC is based both on ambient and Digital Thermal Sensor ambient temperature can be used to scale the fan RPM controlled by the Digital Thermal Sensor This would result in an optimal acoustic performa
96. tics This is achieved though accurate measurement of processor temperature through the processor s Digital Thermal Sensor DTS temperature Fan RPM is modulated through the use of an ASIC Application Specific Integrated Circuit located on the serverboard that sends out a PWM control signal to the 4 pin of the connector labeled as Control This heatsink solution also requires a constant 12 V supplied to pin 2 and does not support variable voltage control or 3 pin PWM control If no PWM signal is detected on the 4th pin this heatsink solution will revert back to thermistor control mode supporting both the 4 wire PWM and standard 3 wire ambient air control methods The active heatsink solution will not exceed a mass of approximately 1050 grams Note that this is per processor so a dual processor system will have up to approximately 2100 grams total mass in the heatsinks This large mass will require a minimum chassis stiffness to be met in order to withstand force during shock and vibration Boxed Active CEK Heatsink Solutions with PWM DTS Control Representation Only Quad Core Intel Xeon Processor 5400 Series TMDG 49 m n tel Thermal Mechanical Reference Design 2 5 8 1 Table 2 9 Clearance is required around the heatsink to ensure unimpeded airflow for proper cooling The physical baseboard keepout requirements for the active solution are the same as the passive CEK solution shown in Appendix B Refer to Fig
97. tion when local ambient temperature T A is maintained at or below 35 C Fan Fail Guidelines Under fan failure or other anomalous thermal excursions Tcase may exceed Thermal Profile Thermal Profile B for Quad Core Intel Xeon Processor X5400 Series for a duration totaling less than 360 hours per year without affecting long term reliability life of the processor For more typical thermal excursions Thermal Monitor is expected to control the processor power level as long as conditions do not allow the Tcase to exceed the temperature at which Thermal Control Circuit TCC activation initially occurred Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below this Tcase level by TCC activation then data integrity is not assured At some higher threshold THERMTRIP will enable a shut down in an attempt to prevent permanent damage to the processor Thermal Test Vehicles TTVs may be used to check anomalous thermal excursion compliance by ensuring that the processor Tcase value as measured on the TTV does not exceed Tcase max Tcase max B for Quad Core Intel Xeon Processor X5400 Series at the anomalous power level for the environmental condition of interest This anomalous power level is equal to 80 of the TDP limit for Quad Core Intel Xeon Processor X5400 Series with 120W TDP and 90 of the TDP limit for Quad Core Intel Xeon Processor E5400 Series with 80W TDP Fan Failure
98. to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target chassis For example If the attach mechanism includes fixtures on the back side of the board those must be included as the goal of the test is to measure the load provided by the actual heatsink mechanism 2 Install the test vehicle in the socket 3 Assemble the heatsink reworked with the load cells to motherboard as shown for the Quad Core Intel Xeon Processor 5400 Series CEK reference heatsink example in Figure C 3 and actuate attach mechanism 4 Collect continuous load cell data at 1 Hz for the duration of the test A minimum time to allow the load cell to settle is generally specified by the load cell vendors Quad Core Intel Xeon Processor 5400 Series TMDG Heatsink Clip Load Methodology n te L often on the order of 3 minutes The time zero reading should be taken at the end of this settling time Record the preload measurement total from all three load cells at the target time and average the values over 10 seconds around this target time as well i e in the interval for example over target time 5 seconds target time 5 seconds C 2 5 Preload Degradation under Bake Conditions This section describes an example of testing for potential clip load degradation under bake conditions 1 2 Repeat time zero room temperature preload measurement 3 4 Record continuous load cell data as follo
99. ure B 18 through Figure B 20 for additional details on the active CEK thermal solution volumetrics Fan Power Supply The active heatsink includes a fan which requires a 12 V power supply Platforms must provide a matched fan power header to support the boxed processor Table 2 9 contains specifications for the input and output signals at the heatsink fan connector The fan outputs a SENSE signal an open collector output which pulses at a rate of two pulses per fan revolution A baseboard pull up resistor provides VCC to match the baseboard mounted fan speed monitor requirements if applicable Use of the SENSE signal is optional If the SENSE signal is not used pin 3 of the connector should be tied to GND It is recommended that a 4 pin fan header be used on the baseboard in addition to a control ASIC that can send a PWM signal to the active fan heatsink solution on the 4th pin at a nominal 25 KHz frequency If a 3 pin CPU fan header is used instead the active fan heatsink solution will revert back to an automatic ambient air temperature control mode The fan power header on the baseboard must be positioned to allow the fan heatsink power cable to reach it The fan power header identification and location must be documented in the supplier s platform documentation or on the baseboard itself The baseboard fan power header should be positioned within 177 8 mm 7 in from the center of the processor socket Fan Specifications Boxed 4
100. ution 5 Y 20 246 X 40 S 0 5 10 15 2 253 8 40 46 0 55 60 6 70 75 80 90 100 110 120 Power W TDP The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile specification for the Quad Core Intel Xeon Processor E5400 Series From Table 2 7 the three sigma mean 3sigma performance of the thermal solution is computed to be 0 246 C W and the processor local ambient temperature T A for this thermal solution is 40 C Hence the Thermal Profile equation for this thermal solution is calculated as Equation 2 10 y 0 246 X 40 44 where y Processor Tcagg value C X Processor power value W Figure 2 21 below shows the comparison of this reference thermal solution s Thermal Profile to the Quad Core Intel Xeon Processor E5400 Series Thermal Profile specification The 1U CEK solution meets the Thermal Profile with 7 39C margin at the upper end TDP By designing to Quad Core Intel Xeon Processor E5400 Series Thermal Profile it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions Quad Core Intel Xeon Processor 5400 Series TMDG m Thermal Mechanical Reference Design n te L Figure 2 21 1U CEK Thermal Adherence to Quad Core Intel Xeon Processor E5400 Note 2 5 7 2 5 7 1 Series Thermal Profile TDP T 65 CASE MAX 60 Thermal Profile Y 0 298 X 43 2 55
101. ws U1 Preheat thermal chamber to target temperature 45 9C or 85 9C for example Place unit into preheated thermal chamber for specified time Sample rate 0 1 Hz for first 3 hrs Sample rate 0 01 Hz for the remainder of the bake test Remove assembly from thermal chamber and set into room temperature conditions 6 Record continuous load cell data for next 30 minutes at sample rate of 1 Hz 8 Quad Core Intel Xeon Processor 5400 Series TMDG 87 88 Heatsink Clip Load Methodology Quad Core Intel Xeon Processor 5400 Series TMDG m Safety Requirements n tel D Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards 1 UL Recognition approved for flammability at the system level All mechanical and thermal enabling components must be a minimum UL94V 2 approved 2 CSA Certification All mechanical and thermal enabling components must have CSA certification 3 Heatsink fins must meet the test requirements of UL1439 for sharp edges 8 Quad Core Intel Xeon Processor 5400 Series TMDG 89 90 Safety Reguirements Quad Core Intel Xeon Processor 5400 Series TMDG Quality and Reliability Requirements n te D E 1 E 1 1 E 1 2 E 1 2 1 Ouality and Reliability Reguirements Intel Verification Criteria for the Reference Designs Reference Heatsink Thermal Verification The Intel reference heatsi
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