SDM-HS75 +SDM-HS75P
Contents
1. ferm rae abba 13 HUMING CHART rt 9 EXPLODED VIEW PARTS LIST spits 14 OPERATING INSTRUCTIONS 10 SPECIFICATIONS 1 LCD CHARACTERISTICS 4 Max Resolution Analog 1280 x 1024 75Hz Type TFT Color LCD Module Digital 1280 x 1024 60Hz Active Display Area 17 inch 358 5 H x 296 5 V Size 358 5 W x 296 5 H x 17 0 D 5 POWER SUPPLY Pixel Pitch 0 264 per one friad x 0 264 Color Depth 16 2M Colors 5 1 Power AC 100 240V 50 60Hz 1 0A Electrical Interface LVDS Surface Treatment Glare 5 2 Power Consumption 2 1 Viewing Angle by Contrast Ratio 10 STAND BY Top 65 min 75 Typ Bottom 55 min 65 Typ DPMS OFF 2 2 Luminance 350 Typ POWER S W OFF less than 1 W OFF 2 3 Contrast Ratio 450 Typ 6 ENVIRONMENT 3 SIGNAL Refer to the Timing Chart 6 1 Operating Temperature 5 C 35 C 41 F 95 F Ambient 3 1 Sync Signal 6 2 Relative Humidity 1096 8096 Non condensing Type Separate Sync 3 2 Video Input Signal 7 DIMENSIONS with TILT SWIVEL 1 Type G B Analog 2 Voltage Level 0 0 70 V 5 Width 388 mm 3 Input Impedance 75 Depth 104 mm Height 397 mm 3 3 Operating Frequency Horizontal Analog 28 80kHz 8 WEIGHT with TILT SWIVEL Horizontal Digital 28 64kHz Vertical Analog 48 75Hz Net Weight 4 9 kg Vertical Digital 60 2 Gross Weight 7 3 kg SDM HS75 HS75P E Signal Connector Pin Assignment2. e DVI D Connector Signal DVI D Pin Signal DVI D Hot Plug Detect B co 10 11 12 13 14 15 T M D S Data2 T M D S Data2 T M D S Data2 4 Shield T M D S Data4 T M D S Data4 DDC Clock DDC Data Analog Vertical Sync T M D S Data1 T M D S Data1 T M D S Data1 3 Shield T M D S Data3 T M D S Data3 15V Power Ground return for 5V H Sync and V Sync 16 17 18 19 20 21 22 23 24 T M T M T M T M T M T M T M T M T M D S Transition Minimized Differential Signaling D S DataO D S 0 D S Data0 5 Shield D S Data5 D S 5 D S Clock Shield D S Clock D S Clock SDM HS75 HS75P E PRECAUTION WARNING FOR THE SAFETY RELATED COMPONENT N WARNING There are some special components used in LCD BE CAREFUL ELECTRIC SHOCK monitor that are important for safety These parts are marked on the schematic diagram and the replacement parts list is essential that these critical parts should be replaced with the manufacturer s specified parts to prevent electric shock fire or other hazard e f you want to replace with the new backlight CCFL or inverter circuit must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms e Handle with care wires or conn
3. Electrostatically Sensitive ES Devices Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any electrostatic charge on your body by touching a known earth ground Alternatively obtain and wear a commercially available discharging wrist strap device which should be removed to prevent potential shock reasons prior to applying power to the unit under test 2 After removing an electrical assembly equipped with ES devices place the assembly on a conductive surface such as aluminum foil to prevent electrostatic charge buildup or exposure of the assembly 3 Use only a grounded tip soldering iron to solder or unsolder ES devices 4 Use only an anti static type solder removal device Some solder removal devices not classified as anti static can generate electrical charges sufficient to damage ES devices 5 Do not use freon propelled chemicals These can generate electrical charges sufficient to damage ES devices 6 Do not remove a replacement ES device from its protective package until immediately before you are ready to install it Most replacement ES devices are packaged with leads electrically shorted together by conductive
4. SDM HS75 HS75P E SERVICING PRECAUTIONS CAUTION Before servicing receivers covered by this service manual and its supplements and addenda read and follow the SAFETY PRECAUTIONS on page 3 of this publication NOTE f unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication always follow the safety precautions Remember Safety First General Servicing Precautions 1 Always unplug the receiver AC power cord from the AC power source before a Removing or reinstalling any component circuit board module or any other receiver assembly b Disconnecting or reconnecting any receiver electrical plug or other electrical connection c Connecting a test substitute in parallel with an electrolytic capacitor in the receiver CAUTION A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard d Discharging the picture tube anode 2 Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device DVM FETVOM etc equipped with a suitable high voltage probe Do not test high voltage by drawing an arc 3 Discharge the picture tube anode only by a first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected and then
5. b touch the other end of the insulated clip lead to the picture tube anode button using an insulating handle to avoid personal contact with high voltage 4 Do not spray chemicals on or near this receiver or any of its assemblies 5 Unless specified otherwise in this service manual clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner cotton tipped stick or comparable non abrasive applicator 10 by volume Acetone and 90 by volume isopropyl alcohol 9096 9996 strength CAUTION This is a flammable mixture Unless specified otherwise in this service manual lubrication of contacts in not required 6 Do not defeat any plug socket voltage interlocks with which receivers covered by this service manual might be equipped 7 Do not apply AC power to this instrument and or any of its electrical assemblies unless all solid state device heat sinks are correctly installed 8 Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead Always remove the test receiver ground lead last 9 Use with this receiver only the test fixtures specified in this service manual CAUTION Do not connect the test fixture ground strap to any heat sink in this receiver Electrostatically Sensitive ES Devices Some semiconductor solid state devices can be damaged easily by static electricity Such components commonly are called
6. bend each IC lead against the circuit foil pad and solder it 3 Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coating to the areas Small Signal Discrete Transistor Removal Replacement 1 Remove the defective transistor by clipping its leads as close as possible to the component body 2 Bend into a U shape the end of each of three leads remaining on the circuit board 3 Bend into a U shape the replacement transistor leads 4 Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the U with long nose pliers to insure metal to metal contact then solder each connection Power Output Transistor Device Removal Replacement 1 Heat and remove all solder from around the transistor leads 2 Remove the heat sink mounting screw if so equipped 3 Carefully remove the transistor from the heat sink of the circuit board 4 Insert new transistor in the circuit board 5 Solder each transistor lead and clip off excess lead 6 Replace heat sink Diode Removal Replacement 1 Remove defective diode by clipping its leads as close as possible to diode body 2 Bend the two remaining leads perpendicular y to the circuit board 3 Observing diode polarity wrap each lead of the new diode around the corresponding lead on the circuit board 4 Securely crimp each connection and solder it 5 Inspect on the circuit
7. HISTORY Model Name SDM HS75 HS75P SERVICE MANUAL Part No 9 878 333 01 When clicking an item it s detail is displayed SUPP CORR Description of SUP COR text mex mw _ _ SDM HS75 HS75P SERVICE MANUAL US Mode Canadian Model AEP Model TFT LCD COLOR COMPUTER DISPLAY SONY There are some different LCD panels are used in the model SDM HS75 HS75P Therefore the repair parts are also different Please confirm the serial number before repairing SDM HS75 No Model name Colour Destination Serial Range Panel SDM HS75 SILVER UC 1 000 001 1 150 000 SDM HS75 SILVER UC 1 150 001 1 300 000 SDM HS75 BLACK UC 1 500 001 1 600 000 TPV TPV TPV SDM HS75P Model name Colour Destination Serial Range Panel SDM HS75P SILVER U 1 000 001 1 150 000 AUO CPT SDM HS75P SILVER U 1 150 001 1 300 000 SDM HS75P BLACK U 1 500 001 1 600 000 AUO SDM HS75P BLACK U 1 600 001 1 700 000 CPT A SDM HS75P SILVER E 1 000 001 1 150 000 A SDM HS75P SILVER SDM HS75P BLACK 1 500 001 1 600 000 AUO SDM HS75P BLACK A 1 600 001 1 700 000 CPT C C C C P UO EP 1 150 001 1 300 000 CPT EP EP SDM HS75 HS75P E CONTENTS SPECIFICATIONS e cmon 3 DISASSEMBLY te id LES 11 PRECAUTION 9 EXPLODED VIEW
8. OVER REAR COVER Black ACCESSORIES amp PACKING MATERIALS POWER SUPPLY CORD SET U C Black English Sony EMCS Corporation 20050 02 1 Made Japan 9 878 333 01 Tec 2005 4 SDM HS75 HS75P E
9. S HUN ON Mi EANES 587 6 0 800 224 2 12 24 800 600 _5625 2 65 600 25 2 J 1 SoS 72188Hz 666 600 6 6 3 MUI E 2 sm zm ze 3s 4 lt N s mo 3 a 4 EARS Macie Pv _ ewe we m w 6 m mmm m w 8 fs RUE 10 sw 3 i E wr m fe a wo 4 s 2 I CEPIT mas Wer mas we 3 I Hm 0 SDM HS75 HS75P E TIMING CHART OPERATING INSTRUCTIONS FRONT REAR VIEW 1 b Power switch and indicator To turn the display on or off press the 5 power switch upward The power indicator lights up in green when the display is turned on and lights up in orange when the monitor is in power saving mode 2 MENU button This button displays or closes the main menu 3 4 buttons These buttons function as the buttons when selecting the menu items and making adjustments 4 OK button This button selects the item or executes the settings in the menu 5 C button This button is used to change the brightness of the O O C C C 9g screen INPUT uy OK x A MENU b 6 INPUT button This button swit
10. UTION Work quickly to avoid overheating the circuitboard printed foil 6 Use the following soldering technique a Allow the soldering iron tip to reach a normal temperature 5000 F to 6002 F b First hold the soldering iron tip and solder the strand against the component lead until the solder melts c Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil and hold it there only until the solder flows onto and around both the component lead and the foil CAUTION Work quickly to avoid overheating the circuit board printed foil d Closely inspect the solder area and remove any excess or splashed solder with a small wire bristle brush IC Remove Replacement Some chassis circuit boards have slotted holes oblong through which the IC leads are inserted and then bent flat against the circuit foil When holes are the slotted type the following technique should be used to remove and replace the IC When working with boards using the familiar round hole use the standard technique as outlined in paragraphs 5 and 6 above Removal 1 Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts 2 Draw away the melted solder with an anti static suction type solder removal device or with solder braid before removing the IC Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully
11. board copper side the solder joints of the two original leads If they are not shiny reheat them and if necessary apply additional solder Fuse and Conventional Resistor Removal Replacement 1 Clip each fuse or resistor lead at top of the circuit board hollow stake 2 Securely crimp the leads of replacement component around notch at stake top 3 Solder the connections CAUTION Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures SDM HS75 HS75P E Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or lift off the board The following guidelines and procedures should be followed whenever this condition is encountered At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board Use this technique only on IC connections 1 Carefully remove the damaged copper pattern with a sharp knife Remove only as much copper as absolutely necessary 2 carefully scratch away the solder resist and acrylic coating if used from the end of the remaining copper pattern 3 Bend a small U in one end of a small gauge jumper wire and carefully crimp it around the IC pin Solder th
12. ced hinge outside m 8 If Back cabinet will be departed easily please pull upside edge of Back cabinet outside SDM HS75 HS75P E EXP LODED VIE W aai 0 0 RRO TREN e MATE 8 r eo 02000 0 050 000009 le 9 0 0 Fl 20 9 aitaa 09 092 8 o 00 r MU need 2pcs ed SD M H S75 HS75P E EXPLODED VIEW PARTS LIST Plant TPV SDM HS75 ED 4 LCD PANEL CPT uU 1 805 883 11 LCD PANEL CMO 9 i178917 M MOUNTEDPWB H OOOO 2__ 2050 745 1 REAR COVER Silver EE 2 588 882 11 REAR COVER Black ACCESSORIES amp PACKING MATERIALS POWER CORD BLACK U C POWER CORD BLACK AEP QUICK SETUP GUIDE U C QUICK SETUP GUIDE AEP SDM HS75 HS75P E EXPLODED VIEW PARTS LIST Plant TPV SDM HS75P EE im 610582711 LODPANEL AUO _ 81789 18511 MOUNTEDPWB A AUO OO O _ 9 1789180 MOUNTEDPWB H AUO O 2__ 2050 745 1 REAR COVER Silver EE 2 588 882 11 REAR COVER Black ACCESSORIES amp PACKING MATERIALS POWER CORD BLACK U C POWER CORD BLACK AEP QUICK SETUP GUIDE U C QUICK SETUP GUIDE AEP 2452 SDM HS75 HS75P E EXPLODED VIEW PARTS LIST Plant SDM HS75P Ret No SONY PartNo SONYname LCD PANEL 8 17891904 MOUNTEDPWB A OO O 9 esn MOUNTEDPWB H OO O _ REARC
13. ches the video input signal between INPUT1 and INPUT2 when computers are connected to the moniter N A 7 Light sensor This sensor measures the brightness of the surrounding NAA gt area Be sure not to cover the sensor with papers etc ES SONY 8 9 8 AC IN connector 19 Connect the power cord supplied 9 DVI D input connector digital RGB This connector inputs digital RGB video signals that comply with DVI Rev 1 0 10 HD15 RGB input connector analog RGB This connector inputs analog RGB video signals 0 7 Vp p positive and SYNC signals DDC Display Data Channel is a standard of VESA zd SDM HS75 HS75P E 1 2 3 DISASSEMBLY 1 Please remove Screws which are between Hinge and Stand support like picture 2 Please pull the Stand support at the Hinge then Stand support will be departed 3 Please remove the screw cover at the Back cabinet then screw cover will be departed 4 Please lift the left bottom side edge of Back cabinet with tip jig like picture then latch will be departed 5 Please lift the bottom side of Back cabinet with fingertip like picture then latch will be departed 6 Please pull the left side of Back cabinet like picture then latch will be departed SDM HS75 HS75P E 7 7 If Back cabinet will be departed easily please pull bottom side of Back cabinet fa
14. e IC connection 4 Route the jumper wire along the path of the out away copper pattern and let it overlap the previously scraped end of the good copper pattern Solder the overlapped area and clip off any excess jumper wire At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins This technique involves the installation of a jumper wire on the component side of the circuit board 1 Remove the defective copper pattern with a sharp knife Remove at least 1 4 inch of copper to ensure that a hazardous condition will not exist if the jumper wire opens 2 Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern 3 Connect insulated 20 gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side Carefully crimp and solder the connections CAUTION Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges SDM HS75 HS75P E TIMING CHART lt lt Dot Clock MHz Horizontal Frequency kHz Vertical Frequency Hz Horizontal etc us Vertical etc ms gt gt H V Sync Dot Total Period Video Active Blanking time Sync Duration Back Porch Front Porch se i RR RR ad ee te Mi MW NUE
15. ectors of the inverter circuit If the wires are pressed cause short and may burn or take fire e Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee Leakage Current Hot Check Circuit TAKE CARE DURING HANDLING THE LCD MODULE AC Volt meter WITH BACKLIGHT UNIT e Must mount the module using mounting holes arranged in four corners Do not press on the panel edge of the frame strongly or electric shock as this will result in damage to the Screen Do not scratch or press on the panel with any sharp objects such as pencil or pen as this may result in Good Earth Ground such as WATER PIPE CONDUIT etc To Instrument s exposed METALLIC PARTS 1 5 Kohm 10W damage to the panel e Protect the module from the ESD as it may damage the electronic circuit C MOS e Make certain that treatment person s body grounded through wrist band Do not leave the module in high temperature and in areas of high humidity for a long time The module be exposed to the direct sunlight Avoid contact with water as it may a short circuit within the module e f the surface of panel become dirty please wipe it off with a softmaterial Cleaning with a dirty or rough cloth may damage the panel CAUTION Please use only a plastic screwdriver to protect yourself from shock hazard during service operation
16. foam aluminum foil or comparable conductive material 7 Immediately before removing the protective material from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed CAUTION Be sure no power is applied to the chassis or circuit and observe all other safety precautions 8 Minimize bodily motions when handling unpackaged replacement ES devices Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device SDM HS75 HS75P E General Soldering Guidelines 1 Use a grounded tip low wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500QF to 600 QF 2 Use an appropriate gauge of RMA resin core solder composed of 60 parts tin 40 parts lead 3 Keep the soldering iron tip clean and well tinned 4 Thoroughly clean the surfaces to be soldered Use a mall wire bristle 0 5 inch or 1 25cm brush with a metal handle Do not use freon propelled spray on cleaners 5 Use the following unsoldering technique a Allow the soldering iron tip to reach normal temperature 5000 F to 600 Q F b Heat the component lead until the solder melts c Quickly draw the melted solder with an anti static suction type solder removal device or with solder braid CA
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