AT-R1825 Manual
Contents
1. ATTEN INSTRUMENTS SM T Precision Lead free Reflow Oven Model AT R1825 _ User manual SHENZHEN ATTEN ELECTRONICS CO LTD Contents Modu O surni die cee oro secs ar cate ote wnt oats warn cid otra Main technique parameter ccccccce eee eee eee tettssssssssseseeseeeee J Structure 1INtrOductiOn cc cece cece cece ce cecncececcecucecessessecsssscsssceseseeed Function Key introduction ccc cotannad saetsecsessveiwseenevecsedaresddarescduudess 6 The function of temperature CUPVE sic ce oooieiawecwagmnsinsseeiecwdesectdecsetaesede 6 Common alloy solder temperature curve adjustment parameters 9 Common alloy solder physical constant and characteristics 6 10 Running OPE FAI Os asec nates anenneres decades aceasta cece heace dean EEE EERE 11 Back soldering Operation 0 0 cece cece ence eee e eee e eee ee tenn tees 19 PaaS UAT IN astute Ee EEE EEE ene EE E ceseeTn eee emaati eb Maat ENEE 20 PAULSON ac seanig cana uentes aan cena E E E EE 22 Parameters of the fixed CUIVES sssssssensrisiresrscrreoirinodroanisase tiiran kvuroia 22 Introduction The IR LEAD LESS REFLOW OVEN is equipment that used for electron production and maintain of SMT technique The product adopts the far infrared heating components and excellent sense temperature materials Through the precise control of the microcomputer make the temperature control curve match to the request of the SMT producti2. press the key RUN to enter the working state press the key SET to enter the parameters setting press the key ON OFF to exit the operation system 4 Setting parameters On the standby menu press the key SET to enter the parameter setting state The mode column displayed the current mode SOLDER The segment column displayed the current selective segment press the key or to select segment you want to setting Press the key RUN returns back the standby menu and press the key SET to enter the temperature setting state As shown in figure 5 Note Except the displayed the mode of the graphics display and the text display are the same oe ee X Setting parameters of the segment PREH Press the key SET once to enter the setting state of preheat segment asshownin Fig 7 Fig 8 Press the key SET again enter the temperature setting state as shownin Fig 9 Fig 10 press the key or gt change the temperature between 70 150 C Press the key SET to saving or press the key RUN to discard modification After temperature setting press the key SET once to enter the time parameter setting state as shown in Fig 11 Fig 12 Press the key or gt setting the time between 0 5Min press the key SET to saving After saving the parameter press the key RUN enter the s
3. Temperature settings Fig 22 Curve Temperature settings SOLDER TEMP TIME SLDR 250 C 00 30 el EXIT OK oe SOLDER GBD E PAOA S 00 30 300 200 1B Ay Tk A F X e Fig 23 Text Time Settings i2 T TRE F A b e G G e Fig 24 Curve Time Settings sibs X Setting parameter of segment KEEP Under the interface in Fig25 Fig26 Fig27 Fig28 press the key select temperature keeping segment and then press the key SET to enter the temperature setting state Press the key or change the setting value and then press the key SET to save it or press the key RUN to discard the modification You can t change the setting temperature lower 50 C than the last process SOLDER KEEP BIWAR 300 SOLDER TEMP K E E PRE E 0 rs 200 O 1B AT TRE F X b e G G e Fig 26 Curve Insulation set Ee SE 2 Fig 25 Text Insulation set SOLDER TEMP KEEP 235 6 SOLDERS Sy 300 200 EXIT OK X S Fig 27 Text Temperature settings Fig 28 Curve Temperature settings 1B AT TRE F X b e G G e X Setting parameter of segment COOL Under the interface in Fig29 Fig30 Fig31 Fig32 press the key gt to select cooling segment and press the key SET to enter the temperature setting state Press the key or change the setting value from 70 C to the setting last process
4. Work salver placed PCB board and other drying goods Salver pull pull the salver to placed things Power jack fuse and power switch supply power for main body and suddenness protect Display display the setting parameter and working state Operate button operate the machine and setting parameter Function key introduction DHS SMD 2 A oN Precision Lead free Reflow Oven AT R1825 s S Ast Minute a o RUN Button SET Button Bn B Fig 2Operation Panel press the key to turn on or turn off the machine If the working state hasn t quit or the temperature hasn t declined to safety the system can t force quit ee gt gt using to change the setting parameter SET running setting parameter and save the setting RUN running the machine exit running state or exit setting state The function of temperature curve In the SMT production process adjust the temperature curve according to different alloy formula or tin solder paste which make the better quality of product Usually the reflow soldering has five temperature segments The temperature and the time can be set to satisfy the request of different PCB board In order to better explain the requirements of the various temperatures and the role we will describe every temperature segment in the follow 1 The purpose and role of the warm up Heating the PCB board from room temperature to 120 150 C which make the moistu
5. 20 C 01 30 HEAT 220 01 30 eer EXIT SET Z 2 F A Fig 13 Text Heat settings Fig 14 Curve Heat settings SOLDERS YNE T 220 C RRR 300 SOLDER TEMP TIME Sy 22 0 C 01 30 ae EXILE OR ee 200 24T TRA F X i2 AT E F A a Fig 15 Text Temperature settings Fig 16 Curve Temperature settings SOLDER TEMP TIME HEAT 1 220 C S 0 1 30 HEAT 2200C 01 30 EXIT OK bg 5 Fig 17 Text Time Settings Fig 18 Curve Time Settings X Setting parameter of segment SLDR 15 Under the interface in Fig 9 Fig20 Fig21 Fig22 Fig23 Fig24 press the key select soldering segment and then press the key SET to enter the temperature setting state Press the key or setting the temperature between heating segment 300 C Press the key SET save the setting and enter the time setting state When the temperature setting between 250 300 setting the time between 0 30s when the temperature lower than 250 C setting the time O 1 Min After that press the key SET to save the setting or press the key RUN to discard modification SOLDEREN AD S 00 30 300 SOLDER TEMP TIME 20 00 30 E oe EXIT SET T7 fm os 4 a be Fig 19 Text Welding set Fig 20 Curve Welding set SOLDER TEMP TIME o PZI 250 C 00 30 O O EXIT OK yi 1B 4T KE H A 1B f E F A few e G G e Fig 21 Text
6. 30 150 190 220 270 280 temperature PU ME MEN Iongi gds 130 150 190 220 270 280 temperature Common alloy solder physical constant and characteristics Melting Solder Alloy genig Mechanical properties ey non a 63 87 Tae ot ooo ce po 99 fa asin J Ae eae eee 62 Bo 2 1179 64 39 65 m3 T prspsy P 00 si s0 bs 3 965 BS 221 45 55 3 134 97525 304 30 52 po Bs 95 BL 245 40 38 33 19 a3 43 W 1163 55 57 4 B0 a2 6s f 138 77 20 30 19 3 5 0 as o e nmu 83 6 07 is 6 po 157f 17 58 5 i30 20 Bo 280 28 m8 p5 ee ee a Br f Bt ff Bf 22k 45 2 s 5 11 a T 10 Running operation There are two working mode to select in this equipment which are Solder and REPAIR The mode Solder is designed to solder the circuit board components the whole process are PREH warm up HEAT heating SLDR solder KEEP heat preservation and COOL wait for the machine to cool down the mode Repair is designed to dismantle circuit board components there is only one temperature setting segment Before you enter the working mode make sure the parameters whether right or not You must set the parameter of the machine when you first time use it or the tin pulp formula has been changed You also can change the language Chine
7. and then press the key SET to save it or press the key RUN to discard the modification fT SOLDER TEMP COOL 150C eal EXIT SET 7 1B AT Eei F X b e G G e Fig 29 Text Cooling settings SOLDER TEMP COOL 150 C el EXD OK a 1B 4T TK A F X e Fig 31 Text Temperature settings SOLDERS COOL WHR 300 200 1B AT TRE F A b e G G e Fig 30 Curve Cooling settings SOLDER 0 300 200 i2 T TRE F A b e G e e Fig 32 Curve Temperature settings X Setting parameter of repair mode Under the interface of standby as shown in Fig 33 Fig 34 Fig 35 Fig 36 Fig 37 Fig 38 press the key to select the repair mode press the key SET to enter the temperature setting state as shown in Press the key or gt to change the temperature press the key SET to save On the repair mode the temperature range is divided into three parts when the temperature setting between 70 150 C no need to setting time when the temperature setting between 150 200 C setting the time between O 20Min When the machine operation set time will shut down automatically REPAIR E 0507 AYE D 200C 60 00 a ESE E Y i2 AT TK EB fim foc REPAIR Te 2 00 S002 7010 300 1B AT HIA fom foc A fa 18 Fig 33Text Maintenance Fig 34Curve Maintenanc
8. e REPAIR TEMP TIME 200 C 60 00 i eee EXIL OK Se A REPAIR T 200 C RRDA 300 200 fom foc a C fem d fon A A a Fig 35Text Temperature settings Fig 36Curve Temperature settings REPAIR 300 REPAIR TEMP TIME 200C 60 00 EEE EXD OK aa 1B AT TRE 1B AT F X fam foc a C fem l foc A C fa Fig 37Text Time Settings IEPA Ss 60 00 Fig 38Curve Time Settings NOTE On the setting the mode if the machine have nothing operate it will return back to the standby state on the standby state the machine have nothing operate over 30Min will shut down automatically Back Soldering operation After setting the equipment have safety conduction to operation Put the circuit board in the middle of the tray closed chassis press the key RUN enter the working state as shown in Fig 39 Fig 40 The working lamp of machine will be light and the screen will be display working the temperature display current temperature the time display setting time When the temperature reaches the set point the time start to countdown after the completion of the countdown the machine will enter the next section When the machine is working the working lamp will be shut down or flashing Under the graphics display mode the curve will become broken line as the time goes by lt 10 as shown in When the machine is running you want to exit please press the key RUN Y
9. e fan start to work You can also press the key SET or RUN to quit and return standby menu SOLDER TEMP TIME PREH a 01 30 a Detecting Element SOLDER Detecting Element 1B AT aa fm foc fan Fig43Text Detecting Element me tL A one 3 Failure of heating element When there is something wrong of the heating element the machine will alarm and then the fan start to work the screen displayed Heating Element asshownin Fig45 Fig46 You can press the key SET or RUN to quit and return standby menu SOLDER TEMP TIME PREH 28C 01 30 Heating Element SOLDER Heating Element 1B AT fm foc A fe Fig46Curve Heating Element 1B AT aa fm foc fan Fig45Text Heating Element When the machine alarm it will enter the safe mode automatically If the fan did not work or the heating element working continues you had better turn off the power immediately and check the fault Ija Attentions 1 Please use the special power supply outlet that is over 15A solely never used the same outlet with other electrical appliance Must ensure the grounding well 2 The Infrared Reflow Oven should be set horizontally there should be over 20cm between its periphery and walls 3 Don t use the machine on wet or high temperature environment 4 Don t use the water to clear the machine body directly 5 Don t use the iron wire or other
10. elt or heat resistant grove take out the PCB board 6 Note General temperature curve set from the low temperature after satisfy the soldering requirements as much as possible to reduce the soldering temperature Also can through extend back soldering time to reduce the temperature this will be conducive to the protection of low temperature components especially some connectors and plug Some components can not satisfy temperature requirement can be used to after soldering to solve Common alloy solder temperature curve adjustment parameters Warm up Heating Soldering Keep Cool polder Type C 1min CB0s C Low temperature lSn43 Pb43 B1 100 120 130 150 200 210 170 150 eaded 14 Lead free low lSn42 Bis8 100 120 120 130 180 200 temperature Lead free low Jen48 Ins2 100 120 120 130 180 200 temperature Lead mid sn63 Pb37 130 150 170 180 230 240 temperature Lead mi fsn60 Poo 130 150 170 180 230 240 temperature E oe 130 150 170 180 230 240 temperature g2 Teenie a Sn96 5 Ag3 5 130 150 180 190 240 250 temperature Mead tree pn87 Ag3 Cu 136 150 180 190 240 250 240 150 mid temperature 3 In7 PACH MOZNO 130 150 180 190 240 250 mid temperature OC Pel ggas 486190 2502260 2401 150 mid temperature l Cn1 5 Lead free gn99 3 Cu0 7 130 150 180 190 270 280 mid temperature ae ED Paracel 130 150 0020 240 950 temperature 23 Lead free high Jen97 Cu3 1
11. lp information you can installed the temperature of the soldering higher than tin pulp melting point temperature of 30 50 C We divided the solder into three low temperature solder 150 180 C mid temperature solder 190 220 C high temperature solder 230 260 C Now commonly used lead free solder materials for high temperature solder low temperature solder is generally precious metals lead free solder and the special requirements of low temperature lead solder General electronic products use rarely it often use in specific requirements for electronic equipment At present many lead free solder are also no substitute for lead solder as the mid temperature leaded solder has excellent electrical properties mechanical properties impact resistance properties of hot and cold the antioxidant properties therefore in a common electronic products also large scale use In this segment you can set the time according to the requirement in the following After high temperature melting solder shown as liquid all the components of SMT floating on the surface of the liquid solder In the surface tension effects of the flux and liquid floating components will be move to the center of the solder pad have the role of reform automatically Also in the i humid of the solder flux the solder tin and surface metal of components formed alloy layer infiltrated into components structural organization which form the ideal soldering structural Setti
12. ng the time about 10 30s a large area and the larger components shade of PCB should be set much longer time The small area or less parts PCB set shorter time generally In order to ensure quality of back solder in this stage should shorten the time as much as possible to protecting components 4 The purpose and role of the heat preservation Let high temperature liquid solder solidified into solid state soldering points Solidification quality has a direct impact the crystal structure of the solder and mechanical properties If the solidification to fast will lead the solder formation of crystalline rough solder joint is not bright mechanical properties decrease Under high temperature and mechanical impact soldering points easily crack lose mechanical and electrical connections role lower product durability We always use to stop heating methods and heat preservation for some time In the temperature slow decline process the solder can solidification and crystal good Generally set the temperature point lower than the solder point 10 20 C around Use of natural cooling when the temperature dropped to the temperature point it will enter cooling paragraph 5 The purpose and role of the cooling paragraph This cooling segment is simple usually cooled to the temperature will not scalding the people To speed up the process of operation may also stop the process when the temperature fell to below 150 C To avoid burns to use tools hand b
13. on technique completely The temperature control curve of the equipment can be adjusted accurately so it can satisfy the request of many kinds of soldering paste which are different material parameters It can shut down and alarm the faults automatically Also it has many functions such as soldering maintenance and drying The structural performance and operation has been upgraded and improved Using Chinese English bilingual operating system and efficient and convenient power switch Main technique parameter 1 Working voltage AC220V AC110V order 2 Working frequency 50 60Hz 3 Maximum output power 600W 4 Heating methods infrared radiation and hot air mix heating 5 Operating system Chinese English operating system 6 Working mode automatic soldering mode maintenance mode adjustable 7 Temperature curve paragraph warm up heating soldering heat preservation and cooling segment 8 Range of temperature and time on warm up 70 150 C 0 5Min 9 Range of temperature and time on heating warm up temperature to 220 C 0 5Min 10 Range of temperature and time on soldering heating temperature to 300 C 0 30s ll Range of temperature and time on heating preservation soldering temperature 0 50 C 12 Effective soldering area 220x280mm 13 Size 428x350x220mm Shape the structure of View after Power jack fuse and Structure introduction power switch Fig 1 Mechanical structure
14. ou also can press the key RUN to stop exhaust and return to standby mode SOLDER TEMP TIME PREH 150C 01 30 Ed EXIT Working SOE IR PREM FT IS0C S0100 1B AT HIA fm oc A C fom d fo A G fa Fig 39Text Operation Fig 40Curve Operation When the machine running to cooling segment fan starts and full exhaust When the temperature cooling to setting value the buzzer will be alarm status bar shows that the complete you can press the key RUN to rerun Faults alarm 1 Dangerous temperature There is a highest safe setting temperature on each process while the machine working After you switch on the machine it will detect the current temperature If the temperature exceeds the safe temperature 10 C the display will show Dangerous Temperature and blink The buzzer alarm and then the fan start to work The alarm will be stop and the machine running normally when the temperature decline to safety As shown in Fig 41 Fig 42 SOLDER TEMP TIME PREH 162 C 01 30 a Dangerous Temperature SOLDER Dangerous Temperature 300 BAT TR BAT TK a F X fam foc fom l oe 4 Fig41Text Dangerous Temperature Fig42Curve Dangerous Temperature 2 Failure of detecting element When there is something wrong of the temperature detecting element the 20 screen displayed Detecting Element as shownin Fig 43 Fig 44 the machine alarm and th
15. re fully volatile and eliminate the internal stress and some residue gas of the PCB board It is a gentle transition of next temperature paragraph also setting the time 1 5Min in this segment You also can set the time by the size 26 of the board and the number of the components 2 The purpose and role of the heating Activated the liquid flux of tin pulp under the role of the liquid flux remove the oxide of surface components inside the tin pulp preparation for soldering In this section the temperature of the lead alloy solder and precious metal alloy solder should be set 150 C 180 C eg Sn42 Bi58 Indium tin alloy low temperature Lead Solder Sn43 Pb43 Bil4 low temperature lead solder and so on Set the Mid temperature lead solder alloy temperature between 180 220 C Set the high temperature lead free solder alloy temperature between 220 250 C If you have solder and tin pulp information the temperature of the heating can be installed in less than tin pulp melting point temperature of 10 C is the best around 3 The purpose and role of the soldering The purpose is to complete the SMT soldering As this stage is the highest temperature in the whole soldering process the components is easy to damage This process the solder physical and chemical changes of the largest are also to the improvement of soldering process The solder dissolves very easily in the high temperature oxidation in air If you have solder and tin pu
16. se or English which you want 1 power on Turn on the main power switch back of the instrument on the left top of the display have red light lighted then press the key ON OFF on the panel to enter the standby state as shown in figure Fig 3 Fig 4 SOLDERS AVI TIME PREH OLC 01 00 rs RUNSET vv 1B AT F X fom foc G G A 4 Fig 3 Fig4 SOLDERG YN ERON BOL 2 System setting Turn on the main power switch and then press the key RUN first while pressing the key ON OFF to enter the system setting mode As shown in figure 5 the display shows the language and the display mode You can press slis ji PX OVO Englishy OOTO gt IR F Englishv GrahpMode TextModev gt GrahpMode TextModev fom foc A C fom fam fos A C fa Fig6 Curve selection Fig5 system setting the key or to select it press the key SET to make sure your change and press the key RUN to save the setting As shown in figure 6 there are six curves can be selected the curve of selection 0 is use define you can change the temperature and the time And the parameters of others curves are unchangeable You can find the parameters of each curve in the table on page 36 3 Select working mode Under the standby screen the display will be show the work state SOLDER or REPAIR press the key to select the work mode As shown in figure3
17. tandby state Under the graphics display mode the curves will auto redraw after return to the standby state SOLDER TEMP TIME PREH OC 01 00 aS EXITSET v 1B AT rei F A b 6 G C p Fig7 Text Pre heat settings SOLDER TEMP TIME PREH 150C 01 00 E EX OK eee 1B AT aa fim foc A fa Fig9 Text Temperature settings SOLDER PREH EHRON EY 300 200 1B AT TKD F X b E G G e Fig8 Curve Pre heat settings SOLDERW 2 435 Mae 1 150 C RRR 300 200 i2 T Eei F X b e G G e Fig10 Curve Temperature settings ie SOLDER TEMP TIME PREH T 150C SEM 300 PREH 150 C 01 00 res ee EXIT OK vy 1B 47 Fig 11 Text Time Settings Fig 12 Curve Time Settings X Setting parameter of segment HEAT As shown in Fig 13 Fig 14 press the key select the heating segment the screen display HEAT press the key SET enter the si temperature setting state As shown in Fig 15 Fig 16 press the key or setting the temperature between preheat segment 220 C Press the key SET save the temperature setting and enter the time setting state As shown in Fig 17 Fig 18 press the key or setting the time between 0 5Min press the key SET to saving and return back mode select or press the key RUN enter the operation standby state as shown in SOLDER TEMP TIME T 2
18. tools insert or plug up the air intake and the air outlet 6 Don t make the dangerous goods that is combustible explosive near the machine Don t dry the goods which have combustible gas 7 Don t hit the body avoid damaging the heat pipe If detects the heat pipe had been break should turn off the power supply and repaired it 8 Don t stretch your hand into the cabinet when the machine has not fall to the safe temperature 9 Don t use the machine on tablecloth to prevent plug up the air intake 10 If the heat pipe damaged must replace it with the same manufacturer production Parameters of the fixed curves NO Tempt Time Tempt Time Tempt Time Tempt Tempt IC s IC s IC s IC IC 1 120 60 160 58 200 30 190 150 2 130 60 180 58 220 30 j 200 150 3 180 6o 210 58 250 30 230 150 4 140 60 220 58 280 30 260 150 5 150 60 220 58 300 30 270 150 NOTE SEG segment PREH preheat HEAT heating SLDR soldering Tempt temperature oe 23
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