AI 225 User Manual.book - United Electronic Industries
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1. You can select either the CL or CV clock as a timebase Because of the parallel architecture of Al 225 layer either clock triggers all converters Aggregate rate Per channel rate Number of channels Copyright 2007 United Electronic Industries Inc Tel 781 821 2890 www ueidaq com Vers 3 2 Date 04 05 2007 File Al225Chapter3 fm DNA AI 225 Layer Chapter 3 13 Programming with the Low Level API Acquisition rate cannot be selected on per channel basis To select a different resulting rate for a different channel program the proper decimators in the FIR unit 3 2 ChannelList The Al 225 layer has a very simple channel list structure as shown in the table Settings below Bit Name Purpose 31 DO LNCL NEXT Tells firmware there is a next entry in the channel list 20 DO LNCL TSRO Request timestamp as a next data point 7 0 Channel number 3 3 Layer Layer specific functions are described in the DaqLibHL h file e js DaAdv225Read and This function works using underlying DqgReadAIChannel but converts the data using internal knowledge of the input range and calibrates every channel It Parameters Uses DOCMD _IOCTL with DOIOCTL CVTCHNL under the hood When this function is called for the first time the firmware stops any ongoing operation on the device specified and reprograms it according to the channel list supplied This function uses the preprogrammed CL up2. sssssssssssseseeeene nennen nennen nnns 5 Copyright 2007 Date 04 05 2007 Vers Draft United Electronic Industries Inc File AI 225 User ManualLOF fm Chapter 1 DNA AI 225 Layer Chapter 1 Introduction Introduction This document outlines the feature set and use of the Al 225 layer This layer is an analog input module for the PowerDNA I O Cube 1 1 Organization This PowerDNA Al 225 User Manual is organized as follows of this Manual Copyright 2006 United Electronic Industries Inc Introduction This chapter provides an overview of PowerDNA Analog Input Series board features the various models available and what you need to get started The Al 225 layer This chapter provides an overview of the device architecture connectivity and logic of the Al 225 layer Programming with the High Level API This chapter provides an overview of the how to create a ses sion configure the session for analog input and interpret results on the Al 225 series layer Programming with the Low Level API This chapter describes low level API commands for configuring and using the Al 225 series layer Appendix A Accessories This appendix provides a list of accessories available for Al 225 layer s Appendix B Calibration This appendix outlines layer calibration for the Al 225 series layer Index This is an alphabetical listing of the topics covered in this man ual Conventions To help you get the most out of t
3. cfvolt cvolt ONEVOLTINNV for all channels gain i cfvolt pcval i You need to perform data calibration only when you configure and use the Al 225 layer directly without DQE running OMM Copyright 2006 Tel 781 821 2890 www ueidaq com Vers 3 2 United Electronic Industries Inc Date 04 05 2007 File Al225Chapter1 fm ST DNA AI 225 Layer Chapter 2 10 Programming the High Level API Chapter 2 Programming the High Level API This section describes how to program the PowerDNA AI 225 using the UeiDaq s framework API Since the UeiDaq Framework is object oriented its objects can be manipulated in the same manner from different development environments such as Visual C Visual Basic or LabVIEW Although the following section focuses on the C API the concept is the same no matter what programming language you use Please refer to the UeiDaq Framework User Manual for more information on using other programming languages 2 4 Creating a The Session object controls all operations on your PowerDNA device The first Session task therefore is to create a session object as follows CUeiSession session 2 2 Configuring Framework uses resource strings to select which device subsystem and chan the nels to use within a session The resource string syntax is similar to a web URL Channels device class gt lt IP address gt
4. DO NOT USE PRODUCTS SOLD BY UNITED ELECTRONIC INDUSTRIES INC AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS Products sold by United Electronic Industries Inc are not authorized for use as critical components in life support devices or systems A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness Any attempt to purchase any United Electronic Industries Inc product for that purpose is null and void and United Electronic Industries Inc accepts no liability whatsoever in contract tort or otherwise whether or not resulting from our or our employees negligence or failure to detect an improper purchase Table of Contents Chapter 1 Introduction uuuleeleeeseeseeeeleee nnn 1 1 1 Organization of this manual 00 en 1 1 2 Tie Al 225 Eayer a hey ea aaa t eBeUudbexb exi EROS ROS ENG 3 1 3 Device architecture 2 0 elles m hr 4 1 4 Layer Connectors and Wiring 1 0 2 0 0 cee ee 5 1 4 1 Wiring Diagrams for the Al 225 0 0 eee 6 1 5 Layer Capabilities occ reete dtes Recte orien ie dade grat uten ee 7 1 5 1 Thermocouple Measurement 00 0000 eee eee 7 1 6 Data Representation llis es 8 1 6 1 Software Calibration of this Layer 0 0 0 0 0c ee 9 Chapter 2 Programming the High Level API 0 00
5. 3 2 United Electronic Industries Inc Date 04 05 2007 File Al225Chapter2 fm DNA AI 225 Layer Chapter 2 11 Programming the High Level API Celsius from channels 0 and 1 using K thermocouples Use the built in CJC sensor session CreateTCChannel pdna 192 168 100 2 Dev0 Ai0 1 100 0 100 0 UeiThermocoupleTypeK UeiTemperatureScaleCelsius UeiCJCTypeBuiltIn 0 0 UeiAIChannelInputModeDifferential Ne 2 3 Configuring You can configure the Al 225 to run in simple mode point by point or buffered the Timing mode ACB mode In simple mode the delay between samples is determined by software on the host computer In buffered mode the delay between samples is determined by the Al 225 on board clock The following sample shows how to configure the simple mode Please refer to the UeiDaq Framework User Manual to learn how to use the other timing modes session ConfigureTimingForSimpleIO 2 4 Reading Reading data from the Al 225 is done using a reader object There is a reader Data object to read raw data coming straight from the A D converter There is also a reader object to read data already scaled to volts or temperatures The following sample code shows how to create a scaled reader object and read samples Create a reader and link it to the session s stream CueiAnalogScaledReader reader session GetDataStream read one scan the buffer
6. STEP STEP STEP Copyright 2006 United Electronic Industries Inc DNA AI 225 Layer Appendices The following cables and STP boards are available for the Al 201 layer DNA CBL 62 2 5ft 62 way round shielded cable DNA STP AI U Universal PowerDNA Analog Input Terminal Panel DNA STP 62 62 channel screw terminal panel DNA 5B CONN 24 channel signal conditioning mating panel Note that once you perform layer calibration yourself factory calibration war ranty is void Calibration should be performed with microvolt resolution precision voltage source with low 1 Ohm or less output impedance Calibration assumes use of the single ended mode where all channels have the same signal and return lev els Please tie AGND to the common return of all channels with a 10k resistor to keep it closer to the common mode level To perform layer calibration you should have a precision voltage source attached to all twenty five channels and run a serial terminal program attached to the IOM serial port Use the simod 1 command to calibrate the layer Calibration Procedure using serial port terminal Apply OV on all channels Type simod 1 From the device table select the proper device to be calibrated The firmware will ask you to apply OV and press Enter when this is done The firmware then acquires multiple scans for averaging within ten seconds The firmware will ask you to apply 1V and press Enter when this
7. LSB of the result beyond 24 bit level Can NA be used in averaging 1 DIO2 Level of DIO1 line output 0 1 DIO1 Level of DIO1 line input 0 DIOO Level of DIOO line input Tel 781 821 2890 www ueidaq com Vers 3 2 Date 04 05 2007 File Al225Chapter1 fm DNA AI 225 Layer Chapter 1 9 Introduction 1 6 1 Software Unlike most PowerDNA layers the Al 225 relies on software calibration on the Calibration of host side this Layer The idea of layer calibration is to read average and store readings from all channels at zero volts and then at the fixed level 1V is the default level By subtracting actual readings at zero volts from the ideal value 0x800000 straight binary the software calculates calibration offsets The firmware then subtracts the offset adjusting value from the average value read at 1V The result represents an offset compensated reading at 1V By divid ing actual calibration voltage by offset compensated reading the software cal culates the actual channel gain When DQE opens the IOM it automatically downloads calibration coefficients from each Al 225 in the PowerDNA cube by issuing DOCMD RDFIFO commands with FIFO GET CAL FIFO channel In return the firmware sends a CALSET 225 structure which contains the gain calibration level and the averaged readings at zero volts and that level Then the software stores offset adjusting values directly and calculates actual gain for every channel as follows
8. Product Disclaimer 1i Connectors and Wiring 5 R l Conventions 1 Reading Data 11 Creating a Session 10 S D Sampling Rate 3 Data Representation 8 Software Calibration 9 E Support ii ESD Protection 3 T F Thermocouple Measurement 7 Features 3 W Wiring Diagrams 6 Copyright 2007 i Tel 781 821 2890 www ueidaq com Vers 1 0 UnlediElecironie Indusiries Inc Date 04 05 2007 File Al 225 User ManuallX fm
9. be normal voltages Clipping is a sign of tripping the pro tection circuitry of the layer which is designed to protect layer components from damage by high voltage This can happen under a variety of conditions such as a different potential for the Al 225 s ground vs the chassis of the instrument this can be fixed by connecting the chassis to the AGND line on the STP AI U Given the variables Let Veg OV this is AGND Let Vcc 5V or anywhere between 4 75V to 5 25V depending on the P S U Breaking the following rules activates the protection circuitry 1 Voc 0 25V gt Vin gt Veg 0 25V Vec 0 25V gt Vin gt Veg 0 25V 2 Vin Vin lt 1 25V Copyright 2006 Tel 781 821 2890 www ueidaq com Vers 3 2 United Electronic Industries Inc Date 04 05 2007 File AI225Appx fm Index A G A D Converters 3 Gains 7 A D Resolution 3 H Accessories 18 High Level API 10 Anti Alias Filtering 7 Architecture 4 Input Configurations 6 B Internet Support ii Block Diagram 4 L C Layer Commands and Parameters 13 Calibration 9 Low Level API 12 How to 18 M calibration Mailing Address ii How to 19 Mode Calibration Procedure 18 ACB 14 Capabilities 7 DMap 16 Channel List Settings 13 Oo Channel List Structure 13 Cleaning up the Session 11 Configuration Bits 12 Configuration Settings 12 Configuring Channels 10 Configuring Timing 11 Organization 1 Overvoltage Protection 3 P Pinout 5
10. bit A D converters The layer can return 24 bit two s complement data in 32 bit words combined with levels on general purpose digital I O lines By default if acquisition is not running the output buffer is filled with relative addresses On reset every entry in the output buffer is filled with its relative posi tion number If you start receiving consecutive data from the layer such as 0 1 2 it means that either the layer is not initialized properly or it is damaged The following definition converts raw data from the converter into a 24 bit straight binary value define LT2440 GETVAL V V 25 amp 0Oxffffff 0x800000 Volts V Copyright 2006 United Electronic Industries Inc To convert data into floating point use the following formula V is a result from the DO LT2440 GETVAL macro 2 5V 2 24 1 25V Raw 32 bit data received from converter is represented as Reset Bit Name Description State 31 EOC Zero if conversion is completed 0 30 DMY _ Always low 0 29 SIG Sign bit of the conversion If Viy is gt 0 this bit is NA HIGH If Viy is lt 0 this bit is LOW 28 MSB Most significant bit of the result If both Bit 29 NA and Bit 28 are HIGH the differential input voltage is above FS If both Bit 29 and Bit 28 are LOW the differential input voltage is below FS 27 5 LSB Less significant bits of the result NA 5 3 SubLSB Sub
11. for each of the 25 channels A differential input signal goes first to an auto zero buffer amplifier with 125Hz 3dB bandwidth and then to an A D converter The A D converter accepts signals within a 0 25 to 5V range and measures up to a 1 25V difference between AIN and Aln This mode is called referenced bipolar differential because both Aln and Aln are referenced to system ground The Al 225 uses sigma delta A Ds that sample analog signals at 1 8MHz with a high over sampling ratio and pass this data into decimating FIR filters The over sampling ratio varies from 64 to 32768 for various sampling rates This inter working of A D converters allows the Al 225 to deliver true 24 bit resolution at a 5Hz data output rate down to 19 bit resolution at a 1 kHz rate see ees Copyright 2006 Tel 781 821 2890 www ueidaq com Vers 3 2 United Electronic Industries Inc Date 04 05 2007 File Al225Chapter1 fm w re t DNA AI 225 Layer Chapter 1 Introduction 1 4 Layer The DNA AI 225 layer supports referenced differential inputs only Both signal Connectors and return line of the differential signal pair must have a potential within the and Wiring range 0 25V to 5V relative to isolated ground AGND level Figure 1 2 illus trates the pinout of the Al 225 DB 62 female 62 pin connector DIOO AGND 9V 20mA AIN1 AINO Ret
12. jumpers DNA STP 96 or DNA STP AI U JDx JGx Nx Single ended Ground Referenced Gee not valid for CDvin E Not Used standard Al 225 TORE ai p Copyright 2006 United Electronic Industries Inc Table 1 2 Analog Input Configurations RTD Bridge Wiring 5V 20k DNA STP 96 or DNA STP AI U Tel 781 821 2890 Date 04 05 2007 www ueidaq com Vers 3 2 File Al225Chapter1 fm 6 1 5 1 5 1 Layer Capabilities DNA AI 225 Layer Chapter 1 Introduction The Al 225 layer is capable of acquiring analog input voltages in 1 25V range with gains of 1 at up to 24 bits of dynamic resolution 222nV RMS resolution The layer is capable of generating its own CL channel list clock and trigger and deriving them from either local external lines from its connector or from the SYNCx bus Table 1 3 Gains Resolution Card Gain Range Noise LSB noise limited Al 225 1 V1 25 1 5 222nV Thermocouple Measurement Copyright 2006 United Electronic Industries Inc The aAnalog RC anti aliasing filtering is tuned to provide roll off at 1 5kHz half of the maximum sampling frequency as shown in Table 1 4 below Table 1 4 Anti Aliasing Filter Parameters Oversampl Noise ENOBs Frequency ing Ratio ADC System ADC Syst
13. lt lt 14 For RDFIFO devices stream the FIFO data automatically For WRFIFO do NOT send reply to WRFIFO unless needed define DQ LN PTRIGE 1L 10 enable layer irqs DGE1 1L 9 stop trigger edge MSB DGEO 1L lt lt 8 stop trigger edge define DQ LN PTRIGE 00 software 01 rising 02 falling define DQ LN STRIGE define DQ LN STRIGE define DQ LN CVCKSRC1 define DQ LN CVCKSRCO define DQ LN CLCKSRCI define DQ LN CLCKSRCO define DO LN ACTIVE DGE1 1L 7 start trigger edge MSB DGEO 1L 6 start trigger edge 00 software 01 rising 02 falling 1L 5 CV clock source MSB 1L 4 CV clock source 01 SW 10 HW 11 EXT 1L 3 CL clock source MSB 1L 2 CL clock source 01 SW 10 HW 11 EXT E 1L 1 STS LED status D 1L 0 enable operations ENABLE DQ LN ENABLE define DO LN D LN CVCKSRCO DQ LN STREAMING D LN IROEN DQ LN ACTIVE For streaming operations with hardware clocking select the following flags DQ LN ENABLE enables all operations with the layer DQ LN CVCKSRCO selects the internal channel list clock CL source as a time base The Al 225 supports CV clock DQO LN ACTIVE is needed to switch on the STS LED on the CPU layer
14. lt Device Id Subsystem Channel list For PowerDNA the device class is pdna For example the following resource string selects analog input channels 0 2 3 4 on device 1 at IP address 192 168 100 2 pdna 192 168 100 2 Dev1 A10 2 3 4 The session object s method CreateAlChannel is used to configure the chan nel list gain and signal referencing mode The gain and input mode parameters are ignored when using an Al 225 because it doesn t have programmable gain and is differential only Configure session to acquire from channels 0 and 1 session CreateAIChannel pdna 192 168 100 2 Dev0 Ai0 1 0 15 0 15 UeiAIChannellInputModeDifferential The Al 225 offers very good accuracy thanks to its 24 bit A D converters and its dedicated channel for measuring the Cold Junction Compensation temperature sensor Therefore it is well suited for measuring temperature with thermocou ples The session object s method CreateTCChannel is used to configure the chan nels thermocouple type CJC sensor and temperature scale You can use thermocouples of type E J K R S T Bor N You can measure the CJC temperature either by using a sensor integrated in the terminal block or by specifying a constant You can measure temperature in degrees Celsius Fahrenheit Kelvin or Rank ine Configure the session to acquire temperatures in degrees Copyright 2007 Tel 781 821 2890 WWw ueidaq com Vers
15. seen 11 2 1 Creating a session eer iaee ek ce ie ee ee nee E ee 11 2 2 Configuring the channels 0 0 0 0 c cee ee 11 2 3 Configuring the Timing lise RR n 12 24 Reading Data cos utere ane up Decks hr ote a eap ah eA a 12 2 5 Cleaning up the Session liiis 12 Chapter 3 Programming with the Low Level API 0c e eee eee eee eee 13 3 1 Configuration settings ra 2 69 Wed ie Gel EE ESSE EUEPTIS SAN EA 13 3 2 Channel List Settings llle hte 14 3 3 Layer specific Commands and Parameters llli lees 14 3 4 Using the Layer in ACB Mode sisiisssseeee ee eh 15 3 5 Using Layer in DMap Mode 0 00 eee ee RR Rh 17 Appendices A Accessories uo Rupee erae pee eiReee eae Re es AN 19 DNA GBE 62 ee CV Sea a Ce e Lolo dU Ln 9 Peto ete A 19 DNA SSIPeAISU Ls cn ad d rebote rb beoe bia Op ad aus doe beds 19 DNAC STIP 2625 44 4 deas oue AT ead o e M v ACA s 19 DNA 5B CONN sssssse rrr 19 B Layer Calibration oce eR RRRI EGG a ne ES eens eae Rh 19 Calibration Procedure lisse RR Rr 19 C Protection Circuits vella eerie Retard ek m Rem BART R cm RR ee elec ees 20 Copyright 2007 Date 04 05 2007 Vers 3 2 United Electronic Industries Inc File Al 225 User ManualTOC fm Table of Figures Chapter 1 Introduction uuleeleeeeeeeeeeeee Ree 1 1 1 Block Diagram of the DNA AI 225 Layer sssssssseeeee enm 4 1 2 Pinout Diagram of the Al 225 Layer
16. STEP 2 Create and initialize host and IOM sides DqDmapCreate pDqe hd0 amp pBcb UPDATE PERIOD amp dmapin amp dmapout STEP 3 Add channels into DMap Copyright 2007 Tel 781 821 2890 www ueidaq com Vers 3 2 United Electronic Industries Inc Date 04 05 2007 File Al225Chapter3 fm 16 DNA AI 225 Layer Chapter3 17 Programming with the Low Level API for i 0 i lt CHANNELS i DqDmapSetEntry pBcb DEVN DQ SSOIN i DQ ACB DATA RAW 1 amp ioffset i printf offsetsd Ox xWMn i uint32 ioffset i DqDmapInitOps pBcb DqeSetEvent pBcb DQ eDataAvailable DQ ePacketLost DQ eBufferError DQ ePacketOOB STEP 4 Start operation DgeEnable TRUE amp pBcb 1 FALSE STEP 5 Process data while keep looping DqeWaitForEvent amp pBcb 1 FALSE timeout amp eventsin if eventsin amp DQ eDataAvailable printf ndata for i 0 i lt CHANNELS i printf S08x uint32 ioffset i STEP 6 Stop operation DqeEnable FALSE amp pBcb 1 FALSE STEP 7 Clean up DqDmapDestroy pBcb DqsStopDQEngine pDqe DqCloseIOM hd0 ifndef WIN32 DqCleanUpDAQLib endif EEO NC DENN NE O Copyright 2007 Tel 781 821 2890 www ueidaq com Vers 3 2 Pnited leeironic adustties ne Date 04 05 2007 File Al225Chapter3 fm A Accessories B Layer Calibration STEP 1 STEP 2 STEP 3
17. United VAN Electronic V Industries The High Performance Alternative PowerDNA DNA AI 225 User Manual Simultaneous Sampling 24 bit 25 channel Analog Input layer for the PowerDNA Cube June 2006 Edition Version 3 2 PN Man DNA AI 225 0606 Copyright 1998 2007 United Electronic Industries Inc All rights reserved No part of this publication may be reproduced stored in a retrieval system or transmitted in any form by any means electronic mechanical by photocopying recording or otherwise without prior written permission Information furnished in this manual is believed to be accurate and reliable However no responsibility is assumed for its use or for any infringements of patents or other rights of third parties that may result from its use All product names listed are trademarks or trade names of their respective companies See UEI s website for complete terms and conditions of sale http www ueidaq com company terms aspx Contacting United Electronic Industries Mailing Address 611 Neponset Street Canton MA 02021 U S A For a list of our distributors and partners in the US and around the world please see http www ueidaq com partners Support Telephone 781 821 2890 Fax 781 821 2891 Also see the FAQs and online Live Help feature on our web site Internet Support Support support ueidaq com Web Site www ueidag com FTP Site ftp ftp ueidaq com Product Disclaimer WARNING
18. artDQEngine 1000 1 amp pDqe NULL Open communication with IOM hd0 DqOpenlOM IOM IPADDRO DO UDP DAO PORT TIMEOUT DELAY amp RdCfg Receive IOM crucial identification data DqCmdEcho hd0 DQRdCfg Set up channel list for n 0 n lt CHANN CL n n ELS n STEP 2 Create and initialize host and IOM sides Now we are going to test device DqAcbCreate pDqe hdo D EVN DQ SSOIN amp bcb Let s assume that we are dealing with AI 201 device dquser initialize acb structure Now call the function ret DgAcbInitOps bcb Tel 781 821 2890 www ueidaq com Vers 3 2 Date 04 05 2007 File Al225Chapter3 fm Copyright 2007 United Electronic Industries Inc DNA AI 225 Layer Chapter 3 15 Programming with the Low Level API amp Config 0 TrigSize NULL pDQSETTRIG TrigMode amp fCLClk 0 loat f CVClk amp CLSize CL 0 uint32 ScanBlock amp acb printf Actual clock rate f n fCVClk Now set up events DqeSetEvent bcb DQ eFrameDone DO ePacketLost DQ eBufferError DQ ePacketOOB STEP 3 Start operation Start operations DqeEnable TRUE amp bcb 1 FALSI Fl STEP 4 Process data We will not use event notification at first just retrieve scans while keep_looping DqeWaitForEvent amp bcb 1 FALSE EVENT TIMEOUT amp events if
19. date frequency 13 75Hz You can reprogram the update frequency by calling DqCmdSetC1k after the first call to DgAdv225Read Therefore you cannot perform this function call when the layer is involved in any streaming or data mapping operations If you specify a short timeout delay this function can time out when called for the first time because it is executed as a pending command and layer programming takes up to 10ms Once this function is called the layer continuously acquires data and every call to the function returns the latest acquired data If you want to cancel ongoing sampling call the same function with OxFFFFFFFF as a channel number O Copyright 2007 Tel 781 821 2890 www ueidaq com Vers 3 2 United Electronic Industries Inc Date 04 05 2007 File Al225Chapter3 fm DNA AI 225 Layer Chapter3 14 Programming with the Low Level API 3 4 Using the The following is a pseudo code example that highlights the functions needed in Layerin ACB sequence to use ACB on the 225 layer A complete example with error checking Mode can be found in the directory SampleACB205 include PDNA h unit configuration word define CFG225 uint32 Config CFG225 DO IN ENABLED V LN ACTIVE IN GETRAW N IRQEN IN CLCKSRCO N STREAMING DQ AI225 MODEFIFO STEP 1 Start DQE engine ifndef WIN32 DqInitDAQLib fendif Start engine DqSt
20. em 1000 128 3 5uV 5yV 20 18 800 256 2uV 3uV 21 3 21 400 512 1 40 V 2uV 21 8 21 200 1024 1uV 1 5yuV 22 4 22 100 2048 750nV 1uV 22 9 22 50 4096 510nV 900nV 23 4 23 25 8192 375nV 700nV 24 24 10 16384 250nV 600nV 24 4 24 The Al 225 is capable of performing thermocouple measurements within 0 02 C at 10Hz per channel The higher the speed of measurement the more noise can be expected The following table shows test results for noise for the Al 225 when used in con junction with the STP AI U terminal 10Hz channel acquisition speed Thermocouple Temperature 100 Points Type Range P p Noise C RMS Noise C B 0 50 0 16 C 0 24 0 07 E Full 0 06 0 02 J Range 0 07 0 02 K of 0 10 0 03 N Thermocouples 0 12 0 03 R 0 32 0 1 S 0 37 0 1 Tel 781 821 2890 www ueidaq com Vers 3 2 Date 04 05 2007 File Al225Chapter1 fm 1 6 Data Represen tation DNA AI 225 Layer Chapter 1 Introduction Additional factors e Open TC detection circuitry on the DNA STP AI U adds 15uV 2uV constant offset on all channels May be compensated using the CJC temperature sensor calibration Channel channel difference may be adjusted using the offset calibration simod 3 command e CJC sensor is calibrated to better than 0 2 C accuracy at room temper ature e Stays within 0 4 C accuracy from 20 to 75 C temperature The Al 225 layer is equipped with 25 24
21. events amp DQ eFrameDone minrq acb framesize avail minrg while TRUE DqAcbGetScansCopy bcb data acb framesize acb framesize amp size amp avail samples size CHANNELS for i 0 i lt size CHANNELS itt fprintf fo Sf t float data i if i CHANNELS CHANNELS 1 fprintf fo n printf eFD d scans received d samples min d avail d n size samples minrq avail if avail minrq break Copyright 2007 Tel 781 821 2890 www ueidaq com Vers 3 2 United Electronic Industies ne Date 04 05 2007 File Al225Chapter3 fm DNA AI 225 Layer Chapter 3 Programming with the Low Level API STEP 5 Stop operation DqeEnable FALSE amp bcb 1 FALSE STEP 6 Clean up DgAcbDestroy bcb DqStopDQEngine pDqe DqCloseIOM hd0 ifndef WIN32 DqC leanUpDAQLib endif 3 5 Using Layer in DMap Mode include PDNA h STEP 1 Start DQE engine ifndef WIN32 DqInitDAQLib fendif Start engine DqStartDQEngine 1000 10 amp pDqe NULL open communication with IOM hd0 DqOpenIOM IOM IPADDRO DO UDP DAO PORT TIMEOUT DELAY amp DQRdCfg Receive IOM crucial identification data DqCmdEcho hd0 DQRdCfg for i 0 i lt DQ MAXDEVN i if DORdCfg devmod i printf Model x Option x n DQRdCfg gt devmod i DQRdCfg option i else break
22. his manual and our products we use the follow ing conventions Tips are designed to highlight quick ways to get the job done or to reveal good ideas you might not discover on your own NOTE Notes alert you to important information Tel 781 821 2890 www ueidaq com Vers 3 2 Date 04 05 2007 File Al225Chapter1 fm DNA AI 225 Layer Chapter 1 2 Introduction CAUTION Caution advises you of precautions to take to avoid injury Gi data loss and damage to your boards or a system crash Text formatted in bold typeface generally represents text that should be entered verbatim For instance it can represent a command as in the following exam ple You can instruct users how to run setup using a command such as setup exe aS Copyright 2006 Tel 781 821 2890 www ueidaq com Vers 3 2 United Electronic Industries Inc Date 04 05 2007 File Al225Chapter1 fm DNA AI 225 Layer Chapter 1 Introduction 1 2 Al 225 Layer The Al 225 layer has the following features Features 25 A D simultaneously sampling converters with differential inputs e 24 bit resolution 1 25V input range e Bipolar range 1 25V Aln and Aln within 0 25V 5 0V Unipolar range 0 25V 1 25V Aln connected to AGND directly or via up to 10KOhm resistor Input underrange overrange over the 1 25V range is detected by the software and reported e 5 S s to 1000 S s per channel sampling rates e gt 120dB rejection of AC componen
23. is done Apply 1V and press Enter The firmware then acquires multiple scans for averaging within ten seconds The firmware calculates the offset adjustment and gain and displays them For a normally working layer the gain should be within 151 156 nV bit Values out side this range suggest either high noise levels problems with the voltages applied or a hardware problem with the layer Press Esc and reply y if you want to save the calibration values into E PROM To verify calibration reset the PowerDNA cube NOTE The Al 225 layer is extremely sensitive 1bit 152nV and can react to your movements near voltage source cabling and input connectors We recommend locating the voltage source and PowerDNA cube being Tel 781 821 2890 www ueidaq com Vers 3 2 Date 04 05 2007 File AI225Appx fm DNA AI 225 Layer calibrated as far away from the operator and sources of EM noise as possible We also recommend calibrating the offset by applying O volts from the signal source rather than by shorting inputs You can verify calibration after resetting the PowerDNA cube by using the same simod 1 routine but do not save the results at the end simod 2 shows raw acquired data without filtering as well as RMS and delta readings For Al 225 layers we recommend annual factory recalibration at UEI C Protection At times the signal being measured appears to clip when attempting to mea Circuits sure what appear to
24. must be big enough to contain one value per channel double data 2 reader ReadSingleScan data 2 5 Cleaning up The session object cleans itself up when it goes out of scope or when it is the Session destroyed However to reuse the object with a different set of channels or parameters you can also clean up the session manually session CleanUp O Copyright 2007 Tel 781 821 2890 www ueidaq com Vers 3 2 United Electronic Industries Inc Date 04 05 2007 File Al225Chapter2 fm Chapter 3 DNA AI 225 Layer Chapter3 12 Programming with the Low Level API Programming with the Low Level API This section describes how to program the PowerDNA cube using the low level API The low level API offers direct access to PowerDNA DAQBios protocol and also allows you to directly access device registers We recommend that you use the UeiDaq Framework see Chapter 2 because it is easier to use You should only need to use the low level API if you are using an operating sys tem other than Windows 3 1 Configuration Configuration setting are passed in DgCmdSetCfg and Settings DqAcbInitOps functions Note that not all configuration bits apply to Al 225 layer The following bits make sense define DQ FIFO MODEFIFO 2L lt lt 16 continuous acquisition with FIFO define DQ LN MAPPE define DQ LN STREA define DQ LN IROEN D 1L 15 For WRRD DMAP devices ING 1L
25. t of 50 60Hz for sampling rates below 10Hz e gt 120dB Power Supply rejection ratio Typical 120dB of common mode rejection e 120Hz 3dB analog front end bandwidth e 15V overvoltage and 2kV ESD protection at every input One channel may be used for Cold Junction Compensation CJC Entire analog front end isolated from digital circuitry Direct Inputs for thermocouples May be used with RTDs may be used with external excitation source voltage excitation is available on the STP AI U Strain gauge bridge completion resistors required Input Impedance 100 Mohm Input bias current 15nA e Non linearity 3ppm 0 000396 e System noise 0 5u V RMS at 5Hz acquisition rate e Effective number of bits 23 5 5Hz down to 19 1kHz e Input ground to system ground isolation 350V ms Power consumption 3 9W max e SYNC interface option allows external triggering E Copyright 2006 Tel 781 821 2890 www ueidaq com Vers 3 2 United Electronic Industries Inc Date 04 05 2007 File Al225Chapter1 fm DNA AI 225 Layer Chapter 1 Introduction 4 1 3 Device Figure 1 1 is a block diagram of the architecture of the Al 225 layer Architecture Aln24 Control Logic Control Logic 32 bit 66 MHz bus Analog Input Connector Optical Isolation External Clocks and Triggers Figure 1 1 Block Diagram of the DNA AI 225 Layer As shown in Figure 1 1 the Al 225 layer has an independent converter
26. urn AINO AIN2 Return AIN2 AINT Return AIN4 AIN3 Return AIN3 AIN5 Return AIN5 AIN4 Return AIN7 AIN6 Return AIN6 AIN8 Return AIN8 AIN7 Return AIN10 AIN9 Return AIN9 AIN11 Return AIN11 AIN10 Return AIN13 AIN12 Return AIN12 AIN14 Return AIN14 AIN13 Return AIN16 AIN15 Return AIN15 AIN17 Return AIN17 AIN16 Return AIN19 AIN18 Return AIN18 AIN20 Return AIN20 AIN19 Return AIN22 AIN21 Return AIN21 AIN23 Return AIN23 AIN22 Return AGND AIN24 Return AIN24 DIO2 AGND 9V 20mA RESERVED RESERVED DIO1 RESERVED RESERVED 21 1 42 62 43 Figure 1 2 Pinout Diagram of the Al 225 Layer Copyright 2006 Tel 781 821 2890 www ueidaq com vers 3 2 United Electronic Industries Inc Date 04 05 2007 File Al225Chapter1 fm 1 4 1 Wiring Diagrams for the Al 225 Table 1 1 Analog Input Configurations Differential Inputs DI Only DNA AI 225 Layer Chapter 1 Introduction Table 1 1 shows examples of typical connection diagrams used with various types of input signals Input Configuration Differential Signal SourceType Grounded Signal Source Floating Signal Source Examples Thermocouples Signal Conditioning with isolated outputs Battery devices DNA STP 96 or DNA STP AI U Examples Plug in instruments with non isolated inputs F C Vin bi i Two resistors 1Okohm R 100 kohm provide return paths to ground for bias currents See DNA STP AI U
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