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Hardware Integration Guide
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1. 1 Unused 2 GND 3 UART_CTS Clear to Send I P VUSB 4 UART_RXD Receive data I P VUSB 5 UART_RTS Request to Send O P VUSB 6 UART_TXD Transmit data O P VUSB 7 GND 8 SPI_CSB SPI bus chip select I P VIO 9 SPI_MISO SPI bus serial O P VIO 10 SPI_MOSI SPI bus serial I P VIO 11 SPI_CLK SPI bus clock I P VIO 12 VDD_USB USB amp UART supply voltage 13 VDD JO VO supply voltage 14 VDD_IN Main supply voltage 15 GND 16 PCM_IN PCM data I P VIO 17 PCM_SYNC PCM sync I P VIO 18 PCM_CLK PCM clock I P VIO 19 PCM_OUT PCM data O P VIO 20 RESET Module reset I P See note 2 21 GPIO4 VO for host BT_Active BT_State VIO 22 GPIO2 UART_DCD VO for host VIO 23 GND 24 Unused 25 Unused See note 3 26 Unused See note 3 27 Unused See note 3 28 GND BTM410 only See note 3 29 ANT BTM410 only Antenna connection 50 ohm matched See note 3 30 GND BTM410 only See note 3 31 Unused See note 3 32 Unused See note 3 33 Unused See note 3 34 Unused See note 3 35 Unused See note 3 36 Unused See note 3 37 Unused See note 3 38 Unused 39 Unused Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth CONN HIG BTM410 41 1 BTM410 411 Bluetooth AT Data Module Hardware Integration Guide 40 Unused 41 GND 42 GPIO1 UART_RI VO for host VIO 43 GPIO7 UART_ DTR VO for host VIO 44 GPIO8
2. g y Top and Bottom Radius r 0 025 d allow for stamping tray as long as outside maximum dimension is not exceeded 4 Dimensions _ WS e All dimensions are in inches unless otherwise shown 5 Tolerances xxx 0 010 A x xxx 0 005 c Ss LL L oS Ly of Lb cf ef LL ci Ly of Sa angles 1 degree 2 unless otherwise shown s Zeg zi Goler fb Sg zl 2 zl a zi e ri Pe A a ta ef La ef h VG Zem ere A ci wo 3 Reference Assemblies a Il al ds a Ee den Pa Ps G A G G aA rf a n e G a 5 250 S 0 143 410 0 512 k zi a s s ri ka ree zi a zi a ad pa s D a fs h e h 4 f P S Ed gt 0 709 Je ER 3 a pl Zo Pa adha ob a wk ri UI kz EE ef La La La pat La K vd oe oo n Ly of t SS 0 143 411 0 512 Sea La A ae gl H si Tea dee d Le ri egen Ben D Laird 5200 00022 ia F F 0 0 De 0 886 L 0 156 0 313 2 i CT OO ETE DT ITTI mE TEI ETE To cou O t Ce i ie her le e ee ae EE ER Siet SS 2 797 3 897 4 907 16 007 7 197 8 207 9 307 10 407 La i rd Tirai TECHNOLOGHES J gt lo 761 11 330 SENON P eess sC t C Y 0 507 Tte BTM410 11 Data Shipping Tray ja 12 000 Dwg No 5200 00022 Weg Zen drk 8 10 09 St 171 Figure 6 1 BTM410 and BTM411 Shipping Tray Details 6 3 Reflow Parameters Laird s surface mount modules are designed to be easily manufactured including reflow soldering to a PCB Ultimately it is the responsibility of
3. Ee EE 5 2 1 Detailed Specification Senne wiles coup coregd e ena ga ng Snes nab dad vs ded betes rinra niei 5 2 2 PINDORMIMOMS sessen aa ean ege aa E araa EEEN gege Ceeece 7 2 3 Operating Parameters soise isao ianen nien aAA EAA ANAA ENA AAAA Riadna AERAN 8 24 Noltage Specificato EE 8 FOE Regulatory EE EE 10 4 Declarations of Compliance s ssssssississiesiesiestiterstienietietnrtnrtartrstnntreninnet Error Bookmark not defined Mechanical DrawingS ccccccceceeceeeeceeeeceeeeceeeeceeeccaeeeceeeeceeeeeceeesceeeeeseesceeecceeeeceescnseesteeecteeeeneeeeeees 13 5 1 BIM410 Mechanical Detallsss ccsesc222cc5 eed d isan dete tee sep Ale Me eee 13 5 4 BIM411 Mechanical Derak terine nnat Entan Es Enasi erann EEan annn nanenane 16 6 Application Note for Surface Mount Modules c0cccceccceeeeeceeeceeeeeeeeeseecseeceeceseceeeeeeneeeseeeeeesteesneeens 20 lege et Te 20 6 2 SIPPING EE 20 63 Reflow Parameter Sacris ea aE a S Eege 21 Fs Ordering MOMAN EE 22 7 1 Product Part Number 22 T2 General COMMEN EE 23 8 Bluetooth SIG Qualification ooo cccececcesseseeeeceeescenseesseeecevessessnessseeeseeesensntsesteseeesennnniaeeeeeeesen 23 3 1 ellene 24 9 Related Documents and les 25 Americas 1 800 492 2320 Option 2 3 CONN HIG BTM410 411 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide 1 OVERVIEW AND KEY FEATURES The BTM410
4. rs o D a po so 3 oO E Ww S S 1 lol 3 S i P 1 d SCH 7 a bi H 9 20 Bag i gt gt 3 2 DE o OD le Z o 3 o V 3 OA g a a HB 3 oom 3 S S D 8 x ze ES 407 aed LOD A1vos LON od Americas 1 800 492 2320 Option 2 17 CONN HIG BTM410 41 1 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide Note An area of 1 5 mm around the module should be reserved as a keep out area Development Kit Schematics can be accessed here Development Kit Schematics BTM410 BTM411 5 6 BTM411 Mechanical Details Z I ki I Z I 5 I D I H L g I y I w APPLICATION NOTES 1 Ensure their is no copper in the antenna keep out area on any layers of the host p c board Also keep all mounting hardware or any metal clear of this area to prevent affecting proper antenna radiation 2 For best antenna performance the module should be placed on the edge of the host p c board and preferably in the corner with the antenna facing the corner 3 Antenna keep out area definition comes from the module s Developer Kit board which was used for module development and antenna performance evaluation 4 Ensure no exposed copper under module on host p c board to avoid shorting to test points on underside of module 5 The user may modify the PCB land patter
5. SURFACE MOUNT MODULES 6 1 Introduction Laird s surface mount modules are designed to conform to all major manufacturing guidelines This section is intended to provide additional guidance beyond the information that is presented elsewhere This section is considered a living document and will be updated as new information presents The modules are designed to meet the needs of several commercial and industrial applications The modules are designed to be easily manufactured and conform to current automated manufacturing processes 6 2 Shipping Modules are shipped in ESD Electrostatic Discharge safe trays that can be loaded into most manufacturers pick and place machines Layouts of the trays are provided in Figure 6 1 Americas 1 800 492 2320 Option 2 20 CONN HIG BTM410 411 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide Notes 1 Material must be capable of ee discharging an electro static charge e ESD and symbol must be located Detail A Detail B as shown ha fesse Pocket Comer Detail l it el 880 2 Laird Part Number must be a embossed into the carrier at this d i an location YY gt 3 F 3 Exterior edges may be modified to H
6. UART_DSR VO for host VIO 45 GND 46 D Not used for AT module variants VUSB 47 D Not used for AT module variants VUSB 48 GPIO6 VO for host RF_Active VIO 49 GPIO5 VO for host WLAN_Active VIO 50 GPIO3 VO for host BT_Priority VIO 1 Unused pins may have internal connections and must not be connected 2 Reset input is active low Input is pulled up to VDD_IN via 22k Minimum reset pulse width is 5 ms 3 Pins 8 11 SPI related are only for Laird internal production purposes 4 Pins 25 37 should be left not connected on modules with integrated antenna 2 3 Operating Parameters Table 2 3 Operating parameters VDD_USB USB compatibility not required 1 7 3 6 VDD_USB USB compatibility required 3 1 3 6 VDD_IO 1 7 3 3 VDD_IN 3 0 3 3 2 4 Voltage Specifications Table 2 4 Voltage specifications VUSB Input Voltage Levels Vih 0 7VDD_USB Vil 2 7 lt VDD_USB lt 3 0 0 4 0 8 1 7 lt VDD_USB lt 1 9 0 4 0 4 Output Voltage Levels 1 7 lt VDD_USB lt 1 9 Voh lout 4mA VDD_USB 0 4 Vol lout 4mA 0 4 Output Voltage Levels 2 7 lt VDD_USB lt 3 0 Voh lout 4mA VDD_USB 0 2 Vol lout 4mA 0 2 Note VDD_USB must be connected to power the USB and UART interfaces Table 2 5 Voltage specifications VIO Americas 1 800 492 2320 Option 2 8 CONN HIG BTM410 411 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetoot
7. an Absolute Current Ratings summary see Table 2 6 Low Power Sniff Mode Less than 2 5mA Supply Voltage Supply 3 0 V 3 3 VDC O 1 7 V 3 3 V DC independent of Supply USB amp UART 1 7 V 3 6 V DC independent of Supply Coexistence Compatibility WLAN 802 11 2 wire and 3 wire hardware coexistence schemes supported Connections Interface Surface Mount Pads External Antenna BTM410 Pad for 50 Ohm antenna Physical Dimensions 12 5 mm x 18 0 mm x 3 4 mm BTM410 12 5 mm x 22 0 mm x 3 4 mm BTM411 Weight 3 grams Environmental Operating Temperature 40 C to 85 C Storage Temperature 40 C to 85 C Approvals Bluetooth Qualified as an Bluetooth End product FCC Limited Modular Approval BTM410 Full Modular Approval BTM411 CE amp R amp TTE Meets CE and R amp TTE requirements Miscellaneous Lead free Lead free and RoHS compliant Warranty 5 Year Limited Lifetime Development Tools Development Kit Development board and software tools DVK BTM410 Dev Kit with BTM410 module DVK BTM411 Dev Kit with BTM411 module Americas 1 800 492 2320 Option 2 6 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth CONN HIG BTM410 41 1 BTM410 411 Bluetooth AT Data Module Hardware Integration Guide 2 2 Pin Definitions Table 2 2 Pin definitions
8. 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide Laird Laird Technologies is the world leader in the design and manufacture of customized performance critical products for wireless and other advanced electronics applications Laird Technologies partners with its customers to find solutions for applications in various industries such as Network Equipment Telecommunications Data Communications Automotive Electronics Computers Aerospace Military Medical Equipment Consumer Electronics Laird Technologies offers its customers unique product solutions dedication to research and development as well as a seamless network of manufacturing and customer support facilities across the globe CONN HIG BTM410 411 Copyright 2014 Laird Technologies Inc All rights reserved The information contained in this manual and the accompanying software programs are copyrighted and all rights are reserved by Laird Technologies Inc Laird Technologies Inc reserves the right to make periodic modifications of this product without obligation to notify any person or entity of such revision Copying duplicating selling or otherwise distributing any part of this product or accompanying documentation software without the prior consent of an authorized representative of Laird Technologies Inc is strictly prohibited All brands and product names i
9. 8 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide 4 EU DECLARATION OF CONFORMITY BTM410 BTM411 Manufacturer Product EU Directive Conformity Assessment Laird BTM410 BTM411 BTM420 BTM421 BTM430 BTM431 BTM441 BTM443 BIM461 RTTE 1995 5 EC Annex IV 4 1 Reference Standards used for Presumption of Conformity 3 1a Health and Safety 3 1a RF Exposure 3 1b Protection requirements with respect to electromagnetic compatibility 3 2 Means of the efficient use of the radio frequency spectrum 4 2 Declaration EN 60950 1 2005 2 Ed Am1 2009 Am2 2013 EN 60950 1 2006 A11 a1 2010 A12 2011 A2 2013 EN 62479 2010 EN 301 489 1 V1 9 2 2011 09 EN 301 489 17 V2 2 1 2012 09 Emissions EN55022 2010 AC 2011 ClassB Immunity EN61000 4 2 2009 EN61000 4 3 2006 A1 2008 A2 2010 EN 300 328 V1 8 1 2012 06 We Laird declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995 5 EC when used for its intended purpose Place of Issue Laird 11160 Thompson Ave Lenexa KS 66219 Date of Issue October 2009 Name of Authorized Person Daniel Waters Certifications Specialist Signature SE ced e ats gt A
10. Declaration ID The Qualification Process requires each company to registered as a member of the Bluetooth SIG www bluetooth org The following link provides a link to the Bluetooth Registration page https Awww bluetooth org login register For each Bluetooth Design it is necessary to purchase a Declaration ID This can be done before starting the new qualification either through invoicing or credit card payment The fees for the Declaration ID will depend on your membership status please refer to the following webpage https Awww bluetooth org en us test qualification qualification overview fees For a detailed procedure of how to obtain a new Declaration ID for your design please refer to the following SIG document https Awww bluetooth org DocMan handlers DownloadDoc ashx doc_id 2836988vld 3 17486 To start the listing go to https Awww bluetooth org tpg QLI_SDoc cfm In step 1 select the option Reference a Qualified Design and enter 16071 in the End Product table entry You can then select your pre paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page please note that unless the Declaration ID is pre paid or purchased with a credit card it will not be possible to proceed until the SIG invoice is paid Once all the relevant sections of step 1 are finished complete steps 2 3 and 4 as described in the help document Your new Design will be listed on the SIG website and you can print your Cert
11. Laird gt BTM410 411 DATA MODULE Hardware Integration Guide Version 6 3 global local Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 wireless support lairdtech com www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide REVISION HISTORY 1 0 1 March 2012 Initial Release 2 0 12 March 2012 General updates and compliant with firmware v16 1 3 0 3 0 13 April 2012 Reformatting and general edits Reformatting Addition of Table 2 6 Reference to Table 2 6 in Table 2 1 Update to Sniff Mode section everything following Figure 5 Cross a aa References Updated ATI Commands table Added links to Low Power and Absolute Current Ratings application notes 50 21 March 2013 Updated mechanical drawings updated FCC statements general formatting edits 6 0 16 January 2014 Separated document into two documents Hardware Integration Guide and User Guide 6 1 06 Feb 2014 Added the Bluetooth SIG Qualification section 62 07 August 2014 Updated shipping tray image and added module package dimension image 6 3 3 Sept 2014 Updated EU Declaration of Conformity Americas 1 800 492 2320 Option 2 2 CONN HIG BTM410 411 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide CONTENTS PREV ISIN IS COI EE 2 e LE EE 3 1 Overview and Key Features 4
12. SNAWIC TWOAC NYSLLVd GNV1 ddd L GN OO OO DU E ei j d L 02 0 up Ped JO p su pun UO sjulod 4s 0 Buoys piore 0 ajnpow sapun saddoo pesodxe ou snsuz 2 apinBanem s ueLjdos Jo duso WYOQS yim 6z uid O JH 0 euuajuy jeuia xg yOoOUUOD IL 30N 99S LNO dh eg L 65u37 ped aeueted pue Pepueueoen JIYOS LON OO Note An area of 1 5 mm around the module should be reserved as a keep out area No other components should be placed in this area Americas 1 800 492 2320 Option 2 14 CONN HIG BTM410 41 1 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide Development Kit Schematics can be accessed here Development Kit Schematics BTM410 BTM411 5 3 BTM410 Mechanical Details Sayd LWS MIIA WOLLOG D 2 D o El a 2 3 3 x 3 3 paie ED Otd ES ROLL suolsuewig e6e42eq4 NPON JTv S LON OG WARNING Test point dimensions are for reference only DO NOT make electrical connections to these test points this will void the warranty Laird does not recommend routing on the top layer underneath the module Americas 1 800 492 2320 Option 2 15 CONN HIG BTM410 41 1 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide Development K
13. and BTM411 Bluetooth modules from Laird are designed to meet the needs of developers who wish to add robust short range Bluetooth data connectivity to their products These modules are based on the market leading Cambridge Silicon Radio BC04 chipset providing exceptionally low power consumption with outstanding range They support the Bluetooth version 2 1 specification providing the important advantage of Secure Simple Pairing SSP which improves security and ease of use for end customers With physical sizes as small as 12 5 mm x 18 0 mm and best of class low power operation these modules are the ideal choice for applications where designers need both performance and minimum size For maximum flexibility in systems integration the modules are designed to support a separate power supply for I O To aid product development and integration Laird has integrated a complete Bluetooth protocol stack within the modules including support for the Bluetooth Serial Port Profile The modules are fully qualified as Bluetooth End Products allowing designers to integrate them within their own products with no further Bluetooth Qualification They can then list and promote products on the Bluetooth website free of charge A comprehensive AT command interface is included which simplifies firmware integration Combined with a low cost developer s kit choosing Laird Bluetooth modules guarantees the fastest route to market Features and Benefits Applic
14. ansmits higher baud rates cause a higher standby current For additional information on Absolute Current Rating see Application Note BTM4 1x Absolute Current Ratings located at www lairdtech com wireless Americas 1 800 492 2320 Option 2 9 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth CONN HIG BTM410 411 BTM410 411 Bluetooth AT Data Module Hardware Integration Guide 3 FCC REGULATORY STATEMENTS 3 1 BTM410 FCC and Industry Canada Statements The Final Equipment user manual must show the following statements This device complies with part 15 of the FCC Rules Operation is subject to the following two conditions 1 This device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment To comply with the FCC RF exposure compliance requirements this device and its antenna must not be co located or operating to conjunction with any other antenna or transmitter 3 1 1 Considerations for OEM Integration This module has a limited modular approval Approval with any other antenna configuration or layout other than that approved will necessitate additional radiated emission testing to be performed To inherit the modular approval the antennas for this tr
15. ansmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co located or operating in conjunction with any other antenna or transmitter This module was approved with the following antenna RF Solutions ANT 24G WHJ SMA OaBi Operation of this module with any other antenna will require additional testing to be performed Co location with other radio transmitting devices operating concurrently in the same band will require additional testing and certification Designers should note the distinction that the FCC makes regarding portable and mobile devices Mobile devices are defined as products that are not used closer than 20cm to the human body whereas portable devices can be used closer that 20cm to the body A device may be used in portable exposure conditions with no restrictions on host platforms when the averaged output power is less than the low power threshold for an uncontrolled environment lt 60 f GHz i e 25mW for a 2 4Ghz device The Maximum Power Exposure for the BTM410 has been evaluated and found to comply with the low power threshold for an uncontrolled environment Refer to FCC document KDB 447498 for more information on RF exposure procedures and equipment authorization policies for mobile and portable devices 3 1 2 FCC Labelling Requirement If the FCC ID is not visible when the module is installed inside another device then the outside of the device into which the module
16. ations Bluetooth v2 1 EDR Embedded devices Adaptive Frequency Hopping to handle interference Phone accessories from other wireless devices Security devices Secure Simple Pairing SSP support Medical and wellness devices External or internal antenna options Automotive applications Comprehensive AT interface for simple programming Bluetooth advertising Bluetooth End Product Qualified ePOS Compact size s Class 2 output 4 dBm Low power operation UART interface s PCM and SCO for external codec GPIO lines under AT control Wi Fi co existence Americas 1 800 492 2320 Option 2 4 CONN HIG BTM410 411 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide 2 SPECIFICATIONS 2 1 Detailed Specifications Table 2 1 Detailed specifications Wireless Specification Bluetooth Version 2 1 EDR Transmit Class Class 2 Frequency 2 402 2 480 GHz Channels 79 channels Frequency Hopping Adaptive Frequency Hopping Max Transmit Power 4 dBm at antenna pad BTM410 4 dBmi from integrated antenna BTM411 Min Transmit Power 27 dBm at antenna pad BTM410 27 dBmi from integrated antenna BTM411 Receive Sensitivity 84 dBm Range 30m Data Transfer Rate Up to 300 kbps Antenna Modes External Antenna 50 Ohm matched SMT
17. et Reflow Temperature 250 C Absolute Peak Temperature 260 S 7 ORDERING INFORMATION 7 1 Product Part Numbers BTM410 Bluetooth AT Data Module external antenna BIM411 Bluetooth AT Data Module with integrated antenna Americas 1 800 492 2320 Option 2 22 CONN HIG BTM410 41 1 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide DVK BTM410 Development board with BTM410 module soldered in place DVK BTM411 Development board with BTM411 module soldered in place 7 2 General Comments Please check with Laird Technologies for the latest information before commencing a design If in doubt ask Refer to the schematic BTIDMD R 001 pdf for the Development Kit on the following two pages for examples of typical pin connections A PDF of the schematic can be downloaded from www lairdtech com wireless 8 BLUETOOTH SIG QUALIFICATION The BTM410 and BTM411 modules are listed on the Bluetooth SIG website as qualified End Products BTM410 Laird H A BTM411 Technologies BO16071 https Awww bluetooth org tpg QLI_viewQDL cfm qid 16071 It is a mandatory requirement of the Bluetooth Special Interest Group SIG that every product implementing Bluetooth technology has a Declaration ID Every Bluetooth design is required to go through the qualification process even when referencing a Bluetooth Design that already has its own
18. h AT Data Module Hardware Integration Guide Input Voltage Levels Vih 0 7VDD_IO Vil 2 7 lt VDD_USB lt 3 0 0 4 0 8 1 7 lt VDD_USB lt 1 9 0 4 0 4 Output Voltage Levels 1 7 lt VDD_IO lt 1 9 Voh lout 4 mA VDD_USB 0 4 Vol lout 4 mA 0 4 Output Voltage Levels 2 7 lt VDD_IO lt 3 0 Voh lout 4 mA VDD_USB 0 2 Vol lout 4 mA 0 2 Table 2 6 Absolute Current Rating Summary Power up reset _avg_reset 20 7 mA t_reset_current_dur 3 0s Idle _avg 9600 baud 2 60 mA _avg 38400 baud 2 75 MA 5 second average no data at _avg 115200 baud 2 95mA UART _avg 460800 baud 4 37 MA Connectable and _avg_cycle 23 1 MA AT BTP ATS512 4 9600 Baud Discoverable average over 1 interval Inquiry _avg_inquiry 42 1 mA Initiate pairing _avg_pair_ini 28 8 MA Accept pairing _avg_pair_acc 42 0 mA Initiate a connection SPP _avg_connect_ini 39 8 mA Accept a connection SPP _avg_connect_ini 37 2 MA Connected as master no _avg_conn_master_idle 13 3 mA Active mode data exchange _avg_master_sniff_idle 13 6 mA Sniff interval 50 ms _avg_master_ssr_idle 9 9 mA SSR interval 300 ms Connected as slave no data l_avg_conn_slave_idle 29 0 mA Active mode exchange _avg_slave_sniff_idle 12 7 mA Sniff interval 50 ms _avg_slave_ssr_idle 9 9 mA SSR interval 300 ms All current peaks measured were less than 86 mA Even when no data tr
19. ificate and DoC Americas 1 800 492 2320 Option 2 23 CONN HIG BTM410 411 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide For further information please refer to the following training material https Awww bluetooth org en us test qualification qualification overview listing process updates 8 1 Additional Assistance Please contact your local sales representative or our support team for further assistance Laird Technologies Connectivity Products Business Unit Support Centre http ews support lairdtech com Email wireless support lairdtech com Phone Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 Web http Avww lairdtech com bluetooth Americas 1 800 492 2320 Option 2 24 CONN HIG BTM410 411 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide 9 RELATED DOCUMENTS AND FILES The following additional BTM410 411 technical documents are also available from the Laird BTM41x Series product page under the Documentation tab Product Brief User Guide Version 6 0 Firmware Release Notes Version 16 1 3 0 BTM411 Development Kit Quick Start Guide SPP Version 2 Development Kit Schematics Quick Start Guide Americas 1 800 492 2320 Option 2 25 CONN HIG BTM410 411 Europe
20. is installed must also display a label referring to the enclosed module This exterior label can use wording such as the following Contains Transmitter Module FCC ID Pl4410B or Contains FCC ID PI4410B Any similar wording that expresses the same meaning may be used Americas 1 800 492 2320 Option 2 10 CONN HIG BTM410 411 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide 3 2 BTM411 FCC and Industry Canada Statements The user manual must show the following statements This device complies with part 15 of the FCC Rules Operation is subject to the following two conditions 1 This device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment To comply with the FCC RF exposure compliance requirements this device and its antenna must not be co located or operating to conjunction with any other antenna or transmitter 3 2 1 Considerations for OEM Integration To inherit the modular approval the antennas for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co located or operating in conjunction with any other antenna or
21. it Schematics can be accessed here Development Kit Schematics BTM410 BTM411 5 4 BTM411 Mechanical Details Size Pitch Dimension A 3 0495mm Al A2 D D1 E COMPONENT SIDE TOP VIEW 22 0x12 5x3 0495mm 1mm Minimum 2 822mm 0 8mm 2 022mm 12 37mm 21 87mm Typical 0 9mm 2 1495mm 12 5mm 12 5mm 22 0mm Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth Maximum 3 277mm 1 0mm 2 277mm 12 37mm 12 63mm 13 03mm 22 13mm Stamp hoe after separate boards sojder thickness S Notes 1 A is consist of A1 and A2 2 A2 include solder and shield 3 D1 measured on stamp hole location after depanelization 16 CONN HIG BTM410 411 BTM410 411 Bluetooth AT Data Module Hardware Integration Guide Note An area of 1 5 mm around the module should be reserved as a keep out area Development Kit Schematics can be accessed here Development Kit Schematics BTM410 BTM411 5 5 BTM411 Mechanical Details SION g SE LU aa gm kel Ss SS O SS Ta D Sg 5 H we EI x Z g Z 85 8 O wo g O N gg e J gt Sa 8 2a c 4 na k m T O E w Ss gt bi J d 2 1970 22 5 gt 2 ech pin pitch S i g T gt 100x10 ZS d H 3 2 D Nm gt kel S S Gel 1 85 r gt Ir lal s sg Kai GG E ononon lt S a Fa E wei O e S a Z S a i I i Wal g o ba E w O bn 53 Q Bo Z S J N El Wi e amp N 3 Sr
22. mericas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth 12 CONN HIG BTM410 411 BTM410 411 Bluetooth AT Data Module Hardware Integration Guide 5 MECHANICAL DRAWINGS 5 1 BTM410 Mechanical Details ZPRIOFEFWLS uondLosag winwixey peordA wnwiuin uolsuewig HUE E XS ZL XO SL MIIA dOL sz 30IS LNSNOdWOD e aBpe peog 0 4U20 ped 6p pueog 0 34u20 ped youd Oo n ped jeqojp Is Das JY SSAUYIUL BOd pueog jo abpa o ped jo Bua eqo Pause 44 uo ew uorezuauo plays JH d SIDE VIEW A WOS LON Od Note An area of 1 5 mm around the module should be reserved as a keep out area Americas 1 800 492 2320 Option 2 13 CONN HIG BTM410 411 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide Development Kit Schematics can be accessed here Development Kit Schematics BTM410 BTM411 5 2 BTM410 Mechanical Details Soch D 3 a amp kel bn g o a o S 3 D T lt SS 7 c S lt 3 Q gt v O D 5 i a 5 2 E 3 3 bd 3 5 a o g a o 3 gt 2 3 x z bi 13 70 pin pitch ra 1 00 x 10 re ANIILNO JINGOW z a 0u aas mmm SNOI
23. n dimensions based on their experience and or process capability DO NOT SCALE Application Notes nate ISS NM Welch SST emwan N Hunn Et BTDAR CONN HIG BTM410 411 18 Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide Note An area of 1 5 mm around the module should be reserved as a keep out area Development Kit Schematics can be accessed here Development Kit Schematics BTM410 BTM411 5 7 BTM411 Mechanical Details o EN g amp 39 ooooonoonnong S88 bY g 2 edad Soe Bt H B SS a eNA Sq E Fc A 4 Si E 32m ka 3 gt T S a 26 3 let 46 i le 66 8 6 0 gie x NolWosroud Solo Wd al OINPOYY t10 p bed Lem reg JIY S LON OO UEWAEYD q ww Americas 1 800 492 2320 Option 2 19 CONN HIG BTM410 411 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide WARNING Test point dimensions are for reference only DO NOT make electrical connections to these test points this will void the warranty Laird does not recommend routing on the top layer underneath the module Development Kit Schematics can be accessed here Development Kit Schematics BTM410 BTM411 6 APPLICATION NOTE FOR
24. n this publication are registered trademarks or trademarks of their respective holders This material is preliminary Information furnished by Laird Technologies in this specification is believed to be accurate Devices sold by Laird Technologies are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only Laird Technologies makes no warranty express statutory and implied or by description regarding the information set forth herein Laird Technologies reserves the right to change specifications at any time and without notice Laird Technologies products are intended for use in normal commercial and industrial applications Applications requiring unusual environmental requirements such as military medical life support or life sustaining equipment are specifically not recommended without additional testing for such application Limited Warranty Disclaimer Limitation of Liability global local e Americas 1 800 492 2320 Option 2 26 CONN HIG BTM410 41 1 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth
25. pad BTM410 Integrated Antenna option 0 dBi multilayer ceramic BTM411 UART Interface Serial Interface RS 232 bi directional for commands and data 16550 compatible Baud Rate Configurable from 1 200 to 921 600 bps Non standard baud rates supported Bits 8 Parity Odd even none Stop bits 1or2 Default Serial parameters 9600 n 8 1 Levels Set by VDD_USB input Modem Control DTR DSR DCD RI RTS CTS General Purpose O 8 general purpose I O pins Interface Audio Support 1 PCM channel 64 kbps SCO Channels Support SCO and eSCO PCM Interface Configurable as master or slave 8 bit A law 8 bit law 13 bit linear PCM Clock available when in slave mode Americas 1 800 492 2320 Option 2 5 CONN HIG BTM410 411 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth BTM410 411 Bluetooth AT Data Module Hardware Integration Guide Protocols And Firmware Bluetooth Stack Version 2 1 compliant Fully integrated Profiles GAP Generic Access Profile SDP Service Discovery Profile SPP Serial Port Profile Firmware Upgrade Available over UART Connection Modes Point to point cable replacement Command Interface AT Instructions set Comprehensive control of connection and module operation S Registers for non volatile storage of parameters Current Consumption Data Transfer Typically 32 mA Note For
26. the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste Laird Technologies surface mount modules conform to J STD 020D1 standards for reflow temperatures IMPORTANT During reflow modules should not be above 260 C and not for more than 30 seconds Americas 1 800 492 2320 Option 2 21 Europe 44 1628 858 940 Hong Kong 852 2923 0610 www lairdtech com bluetooth CONN HIG BTM410 411 BTM410 411 Bluetooth AT Data Module Hardware Integration Guide Target Profile Soak Min Soak Max Liquidous Lower Target Upper Target Absolute Peak O 20 40 60 80 100120140 160 180 200 220 240 260 280 300 320 340 360 Figure 6 2 Recommended Reflow Temperature Temperatures should not exceed the minimums or maximums presented in Table 6 1 Table 6 1 Recommended Maximum and minimum temperatures Temperature Inc Dec Rate max 3 C Sec Temperature Decrease rate goal 2 3 C Sec Soak Temp Increase rate goal 5 1 C Sec Flux Soak Period Min 60 Sec Flux Soak Period Max 90 Sec Flux Soak Temp Min 150 C Flux Soak Temp max 190 SS Time Above Liquidous max 60 Sec Time Above Liquidous min 20 Sec Time In Target Reflow Range goal 30 Sec Time At Absolute Peak max 30 Sec Liquidous Temperature SAC305 217 K Lower Target Reflow Temperature 225 C Upper Targ
27. transmitter Co location with other radio transmitting devices operating concurrently in the same band will require additional testing and certification Designers should note the distinction that the FCC makes regarding portable and mobile devices Mobile devices are defined as products that are not used closer than 20cm to the human body whereas portable devices can be used closer that 20cm to the body A device may be used in portable exposure conditions with no restrictions on host platforms when the averaged output power is less than the low power threshold for an uncontrolled environment lt 60 f GHz i e 25 mW for a 2 4 GHz device The Maximum power Exposure for the BTM411 has been evaluated and found to comply with the low power threshold for an uncontrolled environment Refer to FCC document KDB 447498 for more information on RF exposure procedures and equipment authorization policies for mobile and portable devices 3 2 2 FCC Labelling Requirement If the FCC ID is not visible when the module is installed inside another device then the outside of the device into which the module is installed must also display a label referring to the enclosed module This exterior label can use wording such as the following Contains Transmitter Module FCC ID P14411B or Contains FCC ID PI4411B Any similar wording that expresses the same meaning may be used Americas 1 800 492 2320 Option 2 11 CONN HIG BTM410 41 1 Europe 44 1628 85
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