Stamped Spring Pin - Ironwood Electronics
Contents
1. Ironwood 7 el 800 404 0204 E L E C T R O N C S www ironwoodelectronics com Socket Mechanics SBT BGA sockets provide high bandwidth in a small cost effective ZIF socket for prototype test and burn in applications SBT BGA socket is a simple mechanical socket based on stamped spring pin technology SBT BGA socket is a solder less socket that can be mounted on to a PCB using supplied hardware The PCB should have mounting and alignment holes at proper locations see page 2 of the drawing for recommended PCB layout information Typical SBT BGA socket footprint is only 5mm larger than the maximum IC size It is compatible with the alternate SG BGA elastomer socket footprint If there are pre existing holes in the PCB a SBT BGA socket can be custom designed to accommodate those holes please call Ironwood Tech Support 1 800 404 0204 Figure 1 shows a typical stamped spring pin socket A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power SBT socket uses SBT contact technology for high endurance and wide temperature applications SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn in amp Test applications The stamped pin used in the socket is a low resistance lt 0 015Q connector Figure 2 shows a Figure 1 Stamped Spring Pin Socket picture of the Imm center stamped spring pin SBT2. compress the stamped pins If the backside of the target PCB contains capacitors and resistors a custom insulation plate with cavities cut for those components can be designed This insulation plate sandwiches between the backing plate and target PCB as shown in figure 4 Figure 5 shows an example of a custom insulation plate 2 09mm Top view Top Vew a 5 080mm 0 025mm with component layout i m reference only 2 09mm x E SI 36 00mm LO N Ve 2 540mm 0 025mm kel GEES 1 59mm x4 Side View 0 79mm x2 D E 1 59mm 0 18mm Figure 5 Insulation Plate example drawing IC Insertion extraction A vacuum pen is recommended for insertion extraction of ICs Figure 6 shows a typical vacuum pen TL vacuumpen Q1 can be purchased separately Hand insertion of ICs and extraction using a small tweezers is also acceptable 127 00mm 5 000 Cl 12 70mm 0 500 ts ETT A Attachments Figure 6 Vacuum Pen with Attachments 5 Page SS BI doc Rev C 6 28 2012 VP Ironwood ELECTRONICS Tel 800 404 0204 www ironwoodelectronics com 0 4mm Center BGA Stamped Contact Specification Scale 40 1 60 00 i 0 130 028 Loe UO UI 0 DE 02 DJ i 2 304H1 13 0 30 02 a 0 19 9 93 0 33 Max MECHANICAL PROPERTIES Pitch 0 40mm min Working Travel 0 63mm Contact Force working travel 34 gf Full Length 3 31mm C
3. shifted due to the fact that the wire filaments in the elastomer are at an angle the shift is half the elastomer thickness in the positive x direction The same footprint used by elastomer socket is recommended for stamped pin socket for interchangeability Again please refer to page 2 of the drawing for recommended footprint Thickness 1 5mm minimum This will change per customer application environment and usage Finish SnPb plating or Immersion Au or Immersion Ag Other plating may be used but testing may be required Typical Solder mask clearance over pad surface is acceptable Cleanliness Isopropyl Alcohol or equivalent should be used to clean the board surface prior to attaching socket IC and PCB Reflow Requirement If the same IC is used for number of cycles crown tip on stamped pin damages the Sn63Pb37 solder balls on IC and conical tip damages HASL hot air solder level pads on PCB From our test results we recommend reflowing IC solder balls every 10 cycles and HASL PCB every 30 cycles Gold plated PCBs will not need any reflows Socket Assembly Refer to figure 4 for graphical illustrations 1 Install the socket base assembly onto the target PCB with the hardware socket base screws provided Because of asymmetrical tooling holes the socket can be assembled with only one orientation 2 Place BGA package solder ball side down into the socket NOTE BGA orientation on target PCB is critical If an IC frame optional
4. 180 C Mechanical Life 125 000 cycles ELECTRICAL PROPERTIES Contact Resistance lt 16mohms SR Current Rating 80C rise 4 amp l Self Inductance 0 93 nH Capacitance 0 097 pF Bandwidth 1dB 14 1 to 21 9 GHz GU 77 SPRING MATERIALS Stamped Contact BeCu Au Plate Spring SS Au Plate 0 54 i Roig 4 Imm amp 1 27mm Center LGA QFN Stamped Contact Specification Scale 25 1 Ro 10 m MECHANICAL PROPERTIES Pitch 1mm min 1 27 mmf max Working Travel 0 6mm Contact Force working travel 19 of Full Length 4 45mm Compressed Length 3 85mm Operating Temperature 55 C to 180 C Mechanical Life 125 000 cycles ELECTRICAL PROPERTIES Contact Resistance lt 16mohms Current Rating LOL rise 4 amp Self Inductance 0 93 nH be Capacitance 0 097 pF Bandwidth 1dB 14 1 to 21 9 GHz GOFF SPRING MATERIALS Stamped Contact BeCu Au Plate Spring SS Au Plate 8 Page SBT doc Rev C 6 28 2012 VP Ironwood 7 el 800 404 0204 E L E C T R O N C S www ironwoodelectronics com Socket Maintenance Setting up a Preventative Maintenance Program is important in maintaining both Socket and Test Probe life expectancy as well as good electrical continuity which will help minimize false rejects and low test yields Generally light cleaning is recommended for a preventative maintenance program of the test socket assembly The most effective way to d
5. Stamped Spring Pin Socket for Burn in amp Test Applications User Manual D H i e 92000606600 sossocee n G HIH 999990009 ee KE 0009900086 Ironwood 7 el 800 404 0204 E L E C T R O N C S www ironwoodelectronics com STAMPED SPRING PIN SOCKET USER MANUAL Table of Contents SERENE EE 2 Selecting a BGA Stamped pin socket esoe deenen Genee Een Geen 2 PCB Romir mi eaa Eee ege 3 rte 3 Dr CIE 3 TE CSS saeco sects IEE O AI EEN IEO O A O O IEE ETO AT 3 IC and PCB Remow Retin Cire ccsseesecccscenisssecnsccsasseceosasessscieeceniscsqsseccsassiceosasessscieecsnassanesecseassncsoasesssssans 3 POCO EE 3 BS ACW GINS and msulation Prale a oes sss coe sees cc cstocten se scdeetncctee che veyacesncstocces veces secstaccessyacesnedioccsssssceetnesteccessseacesnes 5 er CLOT OX OE AC O E 5 0 5mm 0 65mm amp 0 8mm Center BGA Stamped Contact Specification Scale 40 1 s00es 7 0 5mm 0 65mm amp 0 8mm Center LGA QFN Stamped Contact Specification Scale 40 1 7 Imm amp 1 27mm Center BGA Stamped Contact Specification Scale 25 21 ccccccssssssssssssscceoees 8 Imm amp 1 27mm Center LGA QEN Stamped Contact Specification Scale 25 1 ccsssseeceeees 8 GREEN H Diy Cleanine D e aaa ease sates oc r T EEEE E EEEE rE 9 WY Cb CIC AMIN Pr OCCU 1 af oeoo E E E SERDE EET 10 Heat E E D ssena Er E AENA AEREE E 10 IlPage SBT doc Rev C 6 28 2012 VP
6. assembly Rotate the socket 90 degrees and repeat the previous step Brush and vacuum the socket including the floating guide if equipped Re assemble the socket onto the load board when cleaning is complete If your test socket is to be put in storage it is recommended that the light cleaning procedure be performed before storage so that any harmful contaminants left on the test probes do not harden and become difficult to remove For example solder buildup will oxidize over time and will permanently damage probe tips Always store the socket assembly in a dust free fully enclosed package What to avoid when cleaning Use of compressed air gt 30psi is strongly discouraged Compressed Air will drive contaminants into the internal working parts of the socket Do not apply solder or heat to the test probes 91 Page SS BI doc Rev C 6 28 2012 VP Ironwood 7 el 800 404 0204 E L E C T R O N C S www ironwoodelectronics com Repeated mechanical cleaning of the probe tips will shorten the time period between required maintenance and more importantly it will start to remove surface plating which can result in continuity issues as well as contact failures and increased resistance Heavy cleaning should be avoided if possible and if needed should only be performed once in the lifetime of the test probes Heavy cleaning can be done by using the same tools and methods as with light cleaning with the exception of a soft brass brush being used
7. contact with Swivel Lid technology has 3 part system which includes top plunger bottom plunger and a spring The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time low cost and zero defects The spring probe has high current rating 4 0A continuous for 0 5mm pin and 8A for Imm pin The operating temperature range is 55 to 180 C A The solder balls from the IC package come in contact with the crown end of the pin The bottom end of stamped pin contacts the circuit board pad completing an electrical path for the signal The socket mechanism can be summarized as a downward force applied on the IC which compresses solder balls on the spring probe which in turn compresses on the circuit board and thereby making electrical connection Selecting a BGA Stamped pin socket Figure 2 Picture of Imm Please refer to the IC package drawing to select the corresponding BGA Renter stamped pin socket Visit the Ironwood website www ironwoodelectronics com Select the Products link Next under the Browse menu select the GHz BGA amp MLF Socket SG SS SBT link In the table select the part number from the first column which corresponds to your pin count IC body size array size and pitch The top webpage frame will show a link to the drawing a picture of the socket JPEG format and provide low volume price information The drawing is a four pag
8. e PDF file The first page shows the socket exploded view and the material details The second page provides the recommended PCB layout Note BGA pads are not symmetrical with respect to the mounting holes The third page shows the compatible BGA specification The fourth page shows more socket views and backing insulation plate dimensions Check the BGA pattern and the following four parameters 1 IC co planarity value should be less than or equal to that shown in the table 2 Maximum total height of IC should be less than or equal to that shown in the table 2 Page SBT doc Rev C 6 28 2012 VP Ironwood 7 el 800 404 0204 E L E C T R O N C S www ironwoodelectronics com 3 Maximum solder ball diameter of IC should be less than or equal to that shown in the table 4 Maximum and minimum solder ball height should fall within the range shown in the table If any of the above parameters do not match please call Ironwood Tech Support 1 800 404 0204 to help select a socket which may currently be in development PCB Requirements Please refer to page 2 of the socket drawing for all PCB recommendations For IC body sizes of 30mm or below the socket requires 4 mounting holes For IC body sizes of 31mm or above the socket requires 8 mounting holes Two alignment holes are used in all sockets The BGA pattern is not symmetrical with respect to the mounting holes The BGA pattern is same as the one used for the elastomer socket It is
9. etermine a schedule is by tracking test yields The maintenance schedule should be based on when yields begin to fall below the performance of a new test socket Some customers perform light cleanings on a per day basis or at 10 000 or 20 000 cycle intervals The schedule depends on amount of debris or contamination that the socket and test probes are subject to The following items should be included in a typical maintenance program Regular visual inspection to identify abnormal wear and contaminants on the socket or test probes Examine the composition of any debris present and determine its source Try to minimize the source of debris if possible Verify that the socket is properly mounted to the load board and that it s flush to the top surface of the load board Do not use any lubricants for test probe cleaning Dry Cleaning Procedure Required equipment needed Soft to medium bristle nylon brush Set of screwdrivers Set of Hex Allen wrenches Small electronics industrial vacuum Non powdered latex or rubber gloves or finger cots Cleaning Procedure Remove the socket from the load board and brush any debris from the solder pads of the load board while vacuuming If the socket is equipped with a manual lid remove or open it to gain access to the test probe tips Hold the test socket in the vertical position brush and vacuum at the same time to avoid any contaminants going inside the socket or working their way into the test probe
10. is supplied place it over the BGA package This IC frame may be necessary for packages in which the encapsulate around the die does not extend to the edge of the IC s substrate 3 Place compression plate on top of the BGA package 4 Install the socket top assembly on to the socket base assembly and swivel to lock into the position 31Page SS BI doc Rev C 6 28 2012 VP Ironwood 7 el 800 404 0204 E L E C T R O N C S www ironwoodelectronics com 5 Turn the compression screw clockwise until it makes contact with the compression plate and or the BGA package 6 Turn the compression screw further so that BGA balls are compressed on the spring pins to make contact When turning becomes hard full compression is achieved Internal stops will prevent over compression when turned by hand Compression Floating Screw compression Swivel lid plate Lid shoulder U UE screw Mounting screw Socket base Floating pin guide Stamped SBT pin Middle pin guide Bottom pin guide BGA device De tail Target PCB nsulation plate Backing plate Figure 4 Graphical Illustration of Socket Assembly 4 Page SBT doc Rev C 6 28 2012 VP Co Ironwood el 800 404 0204 E L E C T R O N C S www ironwoodelectronics com Backing and insulation Plate For all IC body sizes stamped pin sockets require a rigid metal backing plate to prevent deflection of the target circuit board due to a high normal force required to
11. ompressed Length 2 67mm Operating Temperature 55 C to 155 C Mechanical Life 10 000 cycles ELECTRICAL PROPERTIES Average Contact Resistance lt 70mohms Current Rating 2 2 amp Ambient No Cycling Non Inductive Load Self Inductance 0 9 nH Capacitance 0 03 pF Bandwidth 1dB 7 to 9 1 GHz MATERIALS stamped Contact Cu110 Alloy Au Plate Spring SS Au Plate 0 4mm Center LGA Stamped Contact Specification Scale 40 1 Lu Lil 0 353 Max MECHANICAL PROPERTIES Pitch 0 40mm min Working Travel 0 6mm Contact Force working travel 34 gf Full Length 3 31mm Compressed Length 2 67 mm Operating Temperature 55 C to 155 C Mechanical Life 10 000 cycles ELECTRICAL PROPERTIES Average Contact Resistance lt 7Omohms Current Rating 2 2 amp Ambient No Cycling Non Inductive Load Self Inductance 0 9 nH Capacitance 0 03 pF Bandwidth 1dB 7 to 9 1 GHz MATERIALS Stamped Contact Cu110 Alloy Au Plate Spring SS Au Plate SBT doc Rev C 6 28 2012 VP Ironwood 7 el 800 404 0204 E L E C T R O N C S www ironwoodelectronics com 0 5mm 0 65mm amp 0 8mm Center BG Stamped Contact Specification Scale 40 1 ie EI i MECHANICAL PROPERTIES Pitch 0 50mm min 0 8mm max Working Travel 0 43mm Contact Force working travel 30 9 of Full Length 3 4mm Compressed Length 2 92mm Operating Tem
12. perature 55 C to 180 C Mechanical Life 125 000 cycles ELECTRICAL PROPERTIES Contact Resistance lt 35mohms Current Rating 80C rise 4 amp Self Inductance 0 88 nH Capacitance 0 097 pF 1 61 Bandwidth 1dB 5 2 to 15 7 GHz goe MATERIALS SPRING i Stamped Contact BeCu Au Plate Spring SS Au Plate RU UP 0 5mm 0 65mm amp 0 8mm Center LLGA QFN Stamped Contact Specification Scale 40 1 Pitch 0 50mm min 0 8mmi max Working Travel 0 43mm Contact Force working travel 30 9 of Full Length 2 5mm Compressed Length 2 52mm Operating Temperature 55 C to 180 C Mechanical Life 125 000 cycles R0 06 R 0 04 MECHANICAL PROPERTIES UU ELECTRICAL PROPERTIES Contact Resistance lt 35mohms Current Rating 40C rise 4 amp Self Inductance 0 88 nH Capacitance 0 097 pF Bandwidth 1dB 5 2 to 15 7 GHz GU 20 SPRING MATERIALS Stamped Contact BeCu Au Plate Spring SS Au Plate 71Page SBT doc Rev C 6 28 2012 VP Ironwood 7 el 800 404 0204 E L E C T R O N C S www ironwoodelectronics com Imm amp 1 27mm Center BGA Stamped Contact Specification Scale 25 1 MECHANICAL PROPERTIES Pitch 1mm min 1 27 mmi max Working Travel 0 6mm Contact Force working travel 19 of Full Length 5 69mm Compressed Length 4 99mm Operating Temperature 65 C to
13. pogo guide top side Align and place the top floating guide on top of the floating springs Align and press SBT guide assembly 3 guides onto dowel pins protruding from socket base Mount 4 screws to attach SBT guide assembly to socket base Heat Sink Specifications For high power dissipation a specific heat sink lid can be designed using QFIN software Please call Ironwood Tech Support 1 800 404 0204 10 Page SBT agoe Rev C 6 28 2012 VP
14. with a very small amount of alcohol Remember that an excess of alcohol and heavy brushing can lead to damage as well as unfavorable test results Wet Cleaning Procedure Required equipment needed Soft to medium bristle nylon brush Set of screwdrivers Set of Hex Allen wrenches Small electronics industrial vacuum Non powdered latex or rubber gloves or finger cots Ultrasonic bath IPA 99 5 Baking oven Cleaning Procedure Remove the socket from the load board and brush any debris from the solder pads of the load board while vacuuming Remove 4 screws from the bottom of socket base Slowly remove middle and bottom guide together along with stamped contacts Floating guide and floating springs will come apart Save them for re assembly Separate both middle and bottom guides and dump stamped contacts into a beaker that has 99 5 IPA enough to cover the pins Place the beaker in ultrasonic cleaner and run at 22 C at frequencies approximately 40kHz Cleaning time 45 to 60 minutes After the ultrasonic bath remove the socket from the bath and dry with 30 psi maximum compressed air Bake socket for 30 minutes at 65C Reassemble procedure Flip the middle guide to side with bigger hole diameter and load SBT pins upside down with device interface tip end going in first Align and place bottom guide on the top of the middle guide and flip the guide assembly Place the Compression springs in the pockets located on the middle
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