Stec UFM 16GB
Contents
1. Parameter Symbol Value Unit Power Supply Voltage Relative to Ground Vous 0 3 to 5 5 V Voltage on D and D Relative to Ground VDATA 0 3 to 3 6 V Ambient Operating Temperature Commercial Tat 0 to 70 C Ambient Operating Temperature Industrial Tas 40 to 85 C Storage Temperature Tstg 40 to 85 C 5 2 DC Characteristics Measurements at Recommended Operating Conditions unless otherwise specified Table 16 DC Characteristics for Full Speed Operation T 25 C Vdd 5V Vss 0V Parameter Symbol Test conditions Min Typ Max Unit Supply Voltage Veus 4 75 5 5 25 V Input LOW Voltage Vit 0 8 V Input HIGH Voltage Vin 2 0 V Output LOW Voltage VoL RL SE o 0 3 V Output HIGH Voltage Vou Ri SE ie 2 8 3 6 V Output Signal Crossover S Voltage Vors 12 2 0 v Table 17 DC Characteristics for High Speed Operation Ta 25 C Vdd 5V Vss 0V Parameter Symbol Test conditions Min Typ Max Unit Supply Voltage Vous 4 75 5 5 25 V High Speed Idle Level VHSOI 10 10 mV High Speed Data Signaling High VHSOH 360 440 mV High Speed Data Signaling Low VHSOL 10 10 mV Chirp J Level differential Voltage VORRE Ge t y Chirp K Level differential Voltage VCHIRPK ae i ae mY amp sTEC The SSD Company 61000 07022 108 September 2012 SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 5 3 AC Characteristics Measurements at Recommended Operating Conditions unless otherwise specifi2. Embedded USB Flash Module Table 3 Standard 2x5 Pin Assignment Pin Number Signal Name Pin Type Number Signal Name Pin Type 1 VBUS Power 6 NC VO 2 NC 7 GND Ground 3 D UO 8 NC 4 NC 9 Key Blocked Pin 5 D UO 10 Reserved 2 2 2 Hirose 9 Pin Connector Table 4 Hirose 9 Pin Assignment nan Signal Name Pin Type rales Signal Name Pin Type 1 NC 6 GND Ground 2 NC 7 D UO 3 Reserved 8 D VO 4 NC 9 GND Ground 5 VBUS Power 2 3 Signal Description Signal Name Filtrete EH Bumper Description EI ETE KE OH Hirose 9 pin VBUS Power 1 5 Bus voltage supply from source D VO 3 8 Data line D VO 5 7 Data line GND Ground 2 6 9 Ground NC Open 2 4 6 8 1 2 4 No Connect Key Open 9 Alignment pin Reserved 10 3 Host should leave Not Connected 2 4 Performance The Industrial Grade embedded USB flash module is USB 2 0 high speed 480Mb sec and USB 1 1 full speed 12Mb sec compliant Measured performance for high speed can be found in Table 6 Table 6 Read Write Performance Parameter Value Sustained Read up to 30 MB sec Sustained Write up to 20 MB sec 61000 07022 108 September 2012 6 srec The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 2 5 Power Consumption The power consumption currents listed in Table 7 ar
3. USB Solid State Flash Disk Capacity 1GB 16GB USB 2 0 Compliant Form Factors Horizontal Mount Standard 2x5 or Hirose 9 Pin Connector 2x Planar TSOP Flash or 2x Stacked TSOP Flash High Reliability Advanced Wear Leveling BCH ECC Engine corrects up to 16 bits errors per 1 Kbyte Automatic Bad Block Management Single Level Cell SLC NAND Flash Memory Unique Serial Number Commercial and Industrial Operating Temperatures Available RoHS 6 Compliant www stec inc com Lf STEC Embedded USB Flash Module ar STEC 1GB to 16GB Capacities a f E Ke The SSD Company SLUFMxxxU2TU D y STEC Embedded USB Flash Module provides non volatile solid state storage in a compact design making it perfectly suited for embedded applications The standard USB 2 0 interface provides designers with a true plug n play storage device allowing for short design cycles and fast time to market The embedded USB flash module is manufactured with STEC s state of the art USB 2 0 flash memory controller providing high data reliability and endurance Flash management software embedded in the controller emulates a hard disk enabling read write operations that are identical to a standard sector based hard disk Sophisticated wear leveling algorithms ensures greater flash endurance while automatic bad block management and a built in ECC Engine ensure the highest data reliability Based on a BCH error correct algorithm the ECC eng
4. XXX lot code 61000 07022 108 September 2012 15 srec The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module STEC USB FLASH MODULE LABEL SPECIFICATION Pe 1 Label Outline and Dimensions 2 Designated Post printable Areas Post print information s 1 OPTIONAL for Customer Part No Human Readable Font Helvetica Neve z 23mm 9055 G Bme IM WS 2 OPTIONAL for Customer Part No Barcode Code 128 S 3 STEC Item No Human Readable Font Helvetica Neve 57 Condensed 4 Comor Rodius x4 E 4 STEC Part No Font Helvetica Neve 57 Condensed bpt 0 76mm 0 03in 5 Manufacturing Date Code S 6 Manufacturer s Logo n ot esents d ele 7 Capacity Font Helvetica Neve 57 Condensed 6pt Compliance Logos pre print Text iid reo Barcode Fil ea E Printable Information Area FI Non Printable Informeton Aveo 3 Pre printed content and sample 4 Post printed content and sample Actual Size Actual Size Enlarged for Viewing Cenc 1 CE RC Tie 9 4000 01887 r000xx CEU256VCAS2MOOU 100210 P01 001 1GB 6 Label Material Information MATERIALS 2 mil white uncoated mylar 1 mil transparent adhesive UV inks Glossy Fini UL CSA Approved COLOR PALATTE O One Color Process BLACK LABEL ORIENTATION Bottom of label comes off roll first NOTES H Label is to be place on bottom of drive STEC USB FLASH MODULE LABEL SPECIFICATION REVISION B PRODUCT MANAGER SCOTT PHILLIPS REVISION DATE DECEMB
5. eee ee ceeeseeeseeeceeeseeeeeeeseeeeeecaeseceseeeeeesseneeeeeseeeeeesseneaeess 10 4 4 Electrostatic Discharge EG 11 4 5 Mean Time Between Failure MTBF A 11 4 6 Standards Compltance nese nestetsttestntsttntttnttnnntnnttnnttnnnttnntnn nenn neenneennsen nenn enn 11 BI Electrical SpecificatiONS scssssecaiicascciscasdaccedcudicasianacestanicausdanseadeeaniedicaansuaicuaubeaennauieatsuance 12 5 1 Absolute Maximum Ratings ecsscecscsasens ori 12 52 DG Characteristics 2 200 ccniekiniiiee a e Ea ea Rene 12 EC NEE TEE 13 6 0 SGSI Command eee ee Pee eee 13 70 Evaluating USB Flash Module ccsic2 se ctcces cca cts a eaae eacee 14 CEA E ee 15 9 0 Programmed Vendor and Product Names cccccccccssseseeeceeeeeeeeeseeeseeeeeeeeeeeeeseeesenenees 17 10 0 STEC s Contact TOWN ON siscssciisiciscscnwissevcicsinescicistevsiciidcsenesicestiereesteusiidieecieiesss 18 10 1 Worldwide Headquarters cccecccccceccecceeeeeeeceeeesneeseesaneeseesaneeseesaeeeeeeaeeesesseneeseeseneeeensenees 18 102 Worldwide Locations geess gesteet geneet Eege 18 110 Revision FUISt ONY wicascaiciscssticececnesaennceracacceanceancnnscacnianasnancncscarteanaccatencaceesinansanncacaceccsecasanas 19 61000 07022 108 September 2012 2 e serge The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 1 0 Introduction This datasheet includes the following sections Product Specifications covers the most referenced specificati
6. Embedded USB Flash Module Table of Contents LO Cc E 3 20 Product EIERE 4 2 1 Mechanical DIMENSIONS ssecte vic tced viceetevssaeeneeiaaevdateadceessdedebesanteeed uaceedes taecdeeanceeeesuaaeenddiaeedeae 4 2 1 1 Standard 2x5 Connector Form Fachor nne 4 2 1 2 Hirose 9 Pin Connector Form Factor 5 22 Pn ASSIQNIMO Mb eseu hectic eerie cent envied scan leaders ade ends detente tenance 6 2 2 1 Standard 2x5 Connector eccccceceeeeeeeceeeeceeeeeeaeeeeaaeseeeeeseaeeesaaeseeaeeseeeeeseaeeetaeeeeeeeee 6 2 2 2 Hirose 9 Pin Connector 00 ceeececeteeeeeeeeeeeee anaana ea eaa aiad 6 CC We ERR E le e EE 6 24 te Tu ne 6 25 Power CONSUMPTION WE 7 3 0 Theory of Operati scien cases cans irad nisrani ai ana ia deccunsedawetnee donsiatecanetenadacsceseee 7 3 1 Block Diag ralis EE 7 3 1 1 Controller Embedded Components 7 3 1 2 Controller External Components 8 g2 Flash Mamageme EE 8 3 2 Bad Block Management essasi sninn nasai AN Ka ieee acetate 8 3 2 2 Wear Leveling enoras A eevee 8 3 2 3 Error Correcto Mineon ai EEN Se 9 33 e and BE lee TEE 9 3 3 1 Using USB Flash Module with XP Embedded 9 3 4 Unique Serial Number 10 4 0 Environmental Specificati nS sicssccce secs ccc cove scce secs cdcccecscece sere ncctietiictewsiiccecsiceiencceeis 10 4 1 Recommended Operating Conditions esse eese eeseeesieesiresirsstrssrnssrnnstnssinssrnnstnssrnnsrnnsrnn snene 10 KREIEN 10 A3 Shock Vibration ANd Humidity
7. Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Commercial Operating Temperature Ta 0 25 70 C Industrial Operating Temperature Tas 40 85 C Bus Voltage 5V Veus sv 4 75 5 0 5 25 V 4 2 Reliability Table 11 Reliability Parameter Value Uncorrectable Bit Error Rate UBER lt 1 uncorrectable error per 10 bits read Endurance 1GB 4GB 8GB 16GB Up to seven 7 full drive capacity writes per day for three 3 years Up to five 5 full drive capacity writes per day for three 3 years Fresh From Life End 10 years at 40 C 1 year at life end at 40 C Note Endurance varies with usage above numbers assumes a mix of 50 sequential and 50 unaligned random 4KB writes All parts covered under 3 year warranty Data Retention listed as specified by NAND flash manufacturer Data Retention 61000 07022 108 September 2012 10 e serge The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 4 3 Shock Vibration and Humidity Table 12 Shock Vibration amp Humidity Parameter Value Shock 1500G Peak 0 5m pulse duration 5 pulses 6 axes per JESD22 B110 Vibration 20G Peak 20 2000 Hz 4 cycles per direction X Y and Z per JESD22 B103 Humidit 85 C 85 RH Vmax for 500 hrs y per JESD22 A101 4 4 Electrostatic Discharge ESD The embedded USB flash module has been tested and approved for immu
8. connector Table 2 Mechanical Dimensions Hirose 9 pin Connector Parameter Value Length 38 00 0 15 mm 1 496 0 006 in Width 23 00 0 15 mm 0 906 0 006 in Height 5 97 mm 0 235 in max Units mm inches Side View Side View Bottom View a 5 97 0 235 i Max REF 23 00 0 15 i rn ie 0 906 0 006 SE Pin 6 i i oo LQFP 64 i o Pin 9 USB Controller i Pin 1 d 3 3 Note 4 02 0 130 0 008 1 60 Y 0 063 gt 3 254 0 15 La MAX 0 128 1 379 0 80 0 07 gt 31 804 0 15 0 031 0 003 i i i 1 252 0 006 a S 38 00 0 15 i 1 496 0 006 Si Notes 1 a Hole for M2 5 x 4 mm panhead machine screw b 2 9 mm drill diameter c 5 56 mm plated annular ring top and bottom of PCB d Main board will use threaded standoff e Connect annular ring to ground f Topside Keepout of 6 3 mm 0 248 in circular area Standoff Keep Out of 15 24 x 7 37 mm 0 60 x 0 29 in Component area on bottom side region extends 3 66 mm 0 145 in below PCB Hirose DF9 9S 1V 61 Recepticle Units are in mm inches ok Oh Figure 3 Mechanical Dimensions Hirose 9 pin Connector 61000 07022 108 September 2012 5 e serge The SSD Company SLUFMxxxU2TU I y Data Sheet 2 2 Pin Assignment 2 2 1 Standard 2x5 Connector Pin STEC
9. ER 2010 SPEC DESIGNER TODD PICQUELLE SPECIFICATION 62100 00050 001 LABEL PART 745 10 00256 001 THIS INFORMATION IS CONFIDENTIAL AND PROPRIETARY TO STEC AND SHALL NOT BE REPRODUCED OR OTHERWISE DISCLOSED TO ANYONE OTHER THAN STEC EMPLOYEES WITHOUT WRITTEN PERMISSION FROM STEC STEC USB FLASH MODULE LABEL SPECIFICATION 5 Placement of Label Actual Size Entargea tor Viewing Figure 6 Label Specification 61000 07022 108 September 2012 srec The SSD Company 16 SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 9 0 Programmed Vendor and Product Names The embedded USB flash module can be manufactured with standard or customer specific Vendor and Product Names Table 24 lists the standard names for USB Flash Module The names can be displayed by the OS for example Windows XP displays the names in the notifications area in the right corner of the screen the first time the module is installed Windows Device Manager and the properties of the USB Flash Module also can display the names Table 24 STEC Standard USB Vendor and Product Names Parameter Value Vendor Name STEC Product Name STEC USB 2 0 61000 07022 108 September 2012 17 e serge The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 10 0 STEC s Contact Information 10 1 Worldwide Headquarters 3001 Daimler Str
10. e adapters can be ordered with the following ordering information SLUFDM 2x5 ADPT A for modules with Standard 2x5 connector SLUFDM ADPT C for modules with Hirose 9 pin connector preliminary inquire for availability 61000 07022 108 September 2012 14 e serge The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 8 0 Product Marking A manufacturing label is applied to the finished product The label s post printed information is described in the tables below and label is shown in Figure 6 Table 21 Label Post Printed Fields Customer P N STEC Item No Human era BOM Assembly STEC P N ELE S Mfg s Logo Capacity Readable No As listed in As Listed in Optional Optional See Table 22 Ordering See Table 23 EsTEC Ordering Information Information Table 22 BOM Assembly Number Information BOM Assembly Number Description Format ppp00 0xxxx yyzT C I U STEC designation for OEM Flash products ppp00 ppp is 940 for standard or customer prefix for custom 0XxXXX PCB number yy Product Revision Capacity Designator Randomly assigned per PCB number based on designator availability T Model Revision C Commercial and Industrial Operating Temperature U RoHS Compliant Table 23 Kanban ID Information kKanban ID yymmdd XXX xxx Description yymmdd Date code of manufacturing SMT Line at which the part XXX was manufactured
11. e for reference only Power consumption may change according to flash memory used Table 7 Power Consumption Power State Symbol Power Consumption for Power Consumption for 1GB 8GB Capacities Typical 16GB Capacity Typical Normal INORMAL 70 6 70 8 mA Suspend ISUSPEND 0 8 0 9 mA Sleep IsLEEP 0 8 0 9 mA Read IREAD 108 3 114 5 mA Write WRITE 160 9 167 3 mA 3 0 Theory of Operation 3 1 Block Diagram The embedded USB flash module uses STEC s proprietary USB flash memory controller and is combined with SLC NAND flash for optimal device reliability The controller s firmware supports the latest NAND flash technology from multiple vendors and is optimized for the highest performance and reliability The controller consists of the functional blocks shown in Figure 4 and described below Micro Flash Storage Controller Management Unit Algorithm Dual Channel USB oe Multi Layer Bus Flash Flash Bank 0 nterface Host Controller Interface Flash Bank 1 Controller 4 Voltage SRAM ROM Buffer Ecc Regulator S i Figure 4 Controller block diagram 3 1 1 Controller Embedded Components Microcontroller the hardware backbone for the USB flash memory controller algorithm USB 2 0 Interface Controller with high speed 480 Mbps device function This block interfaces with the host system via the USB interface Dual Channel Flash Inter
12. ed Table 18 AC Characteristics Full Speed Parameter Symbol Min Typ Max Unit Rise Time Ter 4 20 ns Fall Time TFF 4 20 ns Differential Rise and Fall o Time Matching TrReM 90 111 11 d Driver Output Resistance Zorv 28 44 Q Table 19 AC Characteristics High Speed Parameter Symbol Min Typ Max Unit Rise Time 10 90 Tusr 500 ps Fall Time 10 90 Tuer 500 ps Driver Output Resistance ZHSDRV 40 5 49 5 Q 6 0 SCSI Command List Table 20 SCSI Command List Command List OpCode RBC SPC 2 SPC 3 INQUIRY 12h y y y MODESENSE 6 1Ah V V y MODESENSE 10 5Ah y y PREVENT ALLOW MEDIUM REMOVAL 1Eh y y y READ 10 28h y READ CAPACITY 25h y REQUEST SENSE 03h y y START STOP UNIT 1Bh y TEST UNIT READY 00h V V y WRITE 10 2Ah V VERIFY 10 2Fh y S SYNC CACHE 35h y 61000 07022 108 September 2012 13 amp sTEC The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 7 0 Evaluating USB Flash Module Adapters are available for customers that do not have the hardware layout ready for the embedded USB flash module The adapter shown in Figure 5 uses a Standard 2x5 connector and enables inserting the embedded USB flash module into a standard USB port on a desktop or laptop PC Inquire for adapters that use the Hirose9 pin connector Figure 5 USB Flash Module Adapter Th
13. eet 640 W California Ave Ste 200 Santa Ana California 92705 USA Sunnyvale California 94086 USA General Support 949 476 1180 Telephone 949 476 1180 Fax 949 476 1209 Fax 408 737 2554 10 2 Worldwide Locations STEC Technology Sdn Bhd STEC Inc China Plot 107 Bayan Lepas Industrial Park RM1805 18F Bund Centre Phase 4 222 Yan An Rd East 11900 Penang Malaysia HangPu District Shanghai 200002 Telephone 60 48 887 888 P R China Telephone 86 21 6132 3892 Ext 629 STEC Inc Taiwan STEC Inc Europe RM1101 11F No 495 Via del Caravaggio 3 Guang Fu S Rd 20100 Milano Taipei Taiwan Italy Telephone 88 63 573 3233 Telephone 39 02 479 56 213 702 IRIZ 7 Floor Shinyurigaoka City Building 4 407 S N 134 2 1 1 and 134 1 1 1 Manpukuji Aso ku Kawasaki shi CTS No 2344 Kanagawa ken 215 0004 Japan Baner Pashan Link Road Telephone 81 44 959 2883 Pune 411 008 Telephone 91 20 4678 0681 61000 07022 108 September 2012 18 e serge The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 11 0 Revision History Revision Date Description 101 02 15 2011 Preliminary release 102 02 23 2011 T designator added to BOM Assembly Number Extended changed to Industrial Temperature 103 04 08 2011 UBER Endurance and ECC Engine corrected paper error only 104 06 07 2011 Logo updated 1 High replaced by Planar when describing flash placement Prel
14. face Controller that serves as the interface to the NAND flash components It supports all the major NAND flash memory manufacturers Flash Storage Management Algorithm Block is responsible for the flash management including wear leveling bad block management and Error Detection and Correction ECC block is responsible for on the fly error correction Sector Buffer for optimized performance SRAM for running controller firmware fast and efficient ROM for storing controllers boot code 61000 07022 108 September 2012 7 e serge The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 3 1 2 Controller External Components In addition to the functional blocks shown in Figure 4 the embedded USB flash module has the following external components SLC NAND Flash for the most reliable data storage Crystal Oscillator 12Mhz as the main clock source 3 2 Flash Management Since the embedded USB flash module provides a standard USB interface to the host no software integration is required providing the shortest time to market for design engineers The firmware of the embedded USB 2 0 controller contains STEC s advanced flash memory management algorithms to ensure the most optimum device performance reliability and endurance It was designed to maximize the benefits of flash memory while at the same time overcoming inherent NAND flash limitations Implemented in firmware are the below fea
15. ide View 2x Stacked TSOP Flash 2x Planar TSOP Flash Bottom View n A See Notes 1 and 2 4 0D 0 1 H in 1 0 126 D 0 004 pack S PENEUS he Pin 3 D Pin 4 NCH r Ce y 2 54 e in 5 D 0 100 DH S je amp t Q gt V 1 1 Pin 6 NCL ji t Typ t I Pin 8 NC y RES i Pin 7 GND 23 00 0 15 Void Area Pin 10 pap fi l 0 906 0 006 8 00 0 315 D L J Pin 9 Key 2344015 5 72 0 225 Typ 0 092 0 006 1 60 KA 0 063 4 4 53 0 15 L H MAX l 27 50 0 15 0 178 0 006 7 37 0 15 i 1 083 0 006 1 004015 0290 0 006 L 38 00 0 15 J 0 039 0 006 1 00 0 15 737 015 1 496 0 006 0 039 0 006 0 290 0 006 ke Notes 11 16 0 439 Max REF 10 27 0 404 Max REF 1 The 2x5 socket is used for the USB signals 2 The sockets are Samtec compatible 0 25 sq SMT socket SSM series and mates with TSW MTSW TST TSS ZST ZSS DW EW ZW and TSM series connectors 3 STEC IC Tower Patent No for TSOP stacking is RE 36 916 4 Pin 10 is reserved Host should leave Pin 10 not connected 5 Units are in mm inches Figure 2 Mechanical Dimensions Standard 2x5 Connector 61000 07022 108 September 2012 4 e serge The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 2 1 2 Hirose 9 Pin Connector Form Factor Table 2 and Figure 3 show the mechanical dimensions of the USB Flash Module with Hirose 9 pin
16. ignature It will then compare the original written signature with the newly created signature and sets an error flag if the two signatures are not the same Correction of the data is done on the fly when the error flag is set and the data presented to the host will be the same as the original written data This powerful Error Correction scheme results in an Uncorrectable Bit Error Rate UBER of less than 1 in 10 bits read 3 3 OS and Boot Support The embedded USB flash module can be used as the OS boot and main storage device for most Microsoft Operating Systems as well as most embedded Operating Systems as listed in Table 8 When used as the OS boot and main storage device the embedded USB flash module is recognized as the fixed hard drive in the system Table 8 Supported Operating Systems Boot and Main Operating System Secondary Storage Storage Version Windows Vista 7 y Conditional Windows XP Pro y y Windows XP Embedded y y Service Pack 2007 Windows CE y y 4 2 and 5 0 Windows for POS WEPOS y VxWorks y y 6 1 and up Linux y V Kernel 2 4 and up Note When using the embedded USB flash module as the OS boot device it should be verified that the system BIOS supports booting from a USB device Please contact your BIOS vendor to verify this 3 3 1 Using USB Flash Module with XP Embedded When using embedded USB flash module with Windows XP Embedded it is recommended that the Enhanced Write Fil
17. iminary notice removed 105 07 07 2011 Product Marking section updated 106 05 31 2012 Endurance removed 107 09 10 2012 Endurance added Data retention updated Format updated Trademarks clarified Contact Information updated ECC engine statement corrected Reserved pin identified OS Boot support for Vista and 7 is conditional 108 09 21 2012 16GB Industrial Temperature added Ordering Information and note on first page G 61000 07022 108 September 2012 19 The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module DISCLAIMER OF LIABILITY STEC Inc reserves the right to make changes to specifications and product descriptions such as but not limited to numbers parameters and other technical information contained herein without notice Please contact the STEC Inc sales office to obtain the latest specifications STEC Inc grants no warranty with respect to this datasheet neither explicit or implied and is not liable for direct or indirect damages Some states do not grant the exclusion of incidental damages and as such this statement may not be valid in such states The provisions of the datasheet do not convey to the purchaser of the device any license under any patent rights or other intellectual property rights of STEC Inc or others EXPORT ADMINISTRATION REGULATIONS The information provided may be subject to United States Export Controls Such information should not be downloaded or exported i
18. ine can correct up to 16 bit errors per 1 Kbyte The embedded USB flash module is available with a Standard 2x5 connector 2 54mm pitch or a Hirose 9 pin connector The embedded USB flash module with its high performance high reliability and low cost per megabyte is the product of choice in embedded applications such as Gaming POS Workstations Networking Equipment and Industrial PCs STEC offers value added services to OEM customers such as customized form factors and test solutions custom firmware controlled Bill of Materials customer specific labeling and serialization mbedded USB Flash M Part Number Flash Placement Capacity SLUFM1GU2TU I y 2x Planar TSOP Flash 1 GB SLUFM2GU2TU I y 2x Planar TSOP Flash 2 GB SLUFM4GU2TU I y 2x Planar TSOP Flash 4 GB SLUFM8GU2TU I y 2x Planar TSOP Flash 8 GB SLUFM16GU2TU I A 2x Stacked TSOP Flash 16 GB Legend SL STEC standard finished product UFM Embedded USB flash module form factor 1G 2G 4G 8G 16G 1GB 2GB 4GB 8GB 16GB capacity U2T STEC s USB flash memory controller 2 Generation U RoHS 6 compliant Part numbers without I Commercial temperature range 0 C to 70 C Industrial temperature range 40 C to 85 C y A for Standard 2x5 y C for Hirose 9 pin connector connector Note The 16GB embedded USB flash module is available with standard connector only SLUFMxxxU2TU I y Data Sheet STEC
19. into or to a national or resident of Cuba Iraq Libya North Korea Iran Syria or any other country to which the United States has embargoed goods or given to ii anyone on the United States Treasury Department s list of Specially Designated Nationals or the U S Commerce Department s Table of Deny Orders By using the information you represent and warrant that you are not located in under the control of or a national or resident of any such country or on any such list TRADEMARKS STEC the STEC logo and The SSD Company are either registered trademarks or trademarks of STEC Inc in the United States and certain other countries All other trademarks or brand names referred to herein are the property of their respective owners COPYRIGHT NOTICE Copyright 2012 by STEC Inc All rights reserved Information contained in this document including but not limited to any instructions descriptions and product specifications is considered proprietary and confidential to STEC Inc and shall not be modified used copied reproduced or disclosed in whole or in part in any form or by any means electronic or mechanical for any purpose without the written consent of STEC Inc 61000 07022 108 September 2012 20 e serge The SSD Company
20. nity from ESD under the conditions described in Table 13 below Table 13 ESD Rating for USB Flash Module ESD Type VEUTEE AA Air 2 4 8 Contact 2 4 4 5 Mean Time Between Failure MTBF STEC estimates the Mean Time Between Failure MTBF using a prediction methodology based on reliability data for the individual components in the embedded USB flash module Table 14 below summarizes the prediction results for the embedded USB flash module based on the following two methodologies Telcordia Special Report SR 332 Reliability Prediction Procedure for Electronic Equipment MIL HNBK 217 The analysis was performed using Relex Software Table 14 USB Flash Module MTBF Product Condition MTBF hours Telcordia SR 332 GB 25 C SLUFM4GU2TU A MIL HNBK 217 gt 8 000 000 Telcordia SR 332 GB 25 C SLUFM8GU2TU A MIL HNBK 217 gt 7 000 000 4 6 Standards Compliance The embedded USB flash module complies with the following standards CE EN 55022 55024 FCC Class B for Information Technology UL 60950 RoHS 6 USB 2 0 Mass Storage Class 61000 07022 108 September 2012 11 e serge The SSD Company SLUFMxxxU2TU I y Data Sheet 5 0 Electrical Specifications 5 1 Absolute Maximum Ratings Operation not guaranteed at extreme corner cases Table 15 Absolute Maximum Ratings STEC Embedded USB Flash Module
21. ong product life is required For example operating systems that use a file system will update the File Allocation Table FAT every time a write is done to the device Without any wear leveling in place the area on the flash where the FAT table is located would wear out faster than other areas reducing the lifetime of the entire flash device To overcome this limitation the flash management algorithm needs to make sure that each block in the device ages i e is worn out at the same rate The built in wear leveling scheme makes sure that with every write to the flash the youngest block is used This ensures that the full flash media is used uniformly so that one area of the flash will not reach the endurance limits prematurely before other areas 61000 07022 108 September 2012 8 e serge The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 3 2 3 Error Correction The USB 2 0 Interface Controller implements an advanced Error Correction scheme based on the BCH error correct algorithm The ECC engine can correct up to 16 bits per 1 KByte To ensure the fastest performance correction is done on the fly in hardware only Each time the host application writes a sector of 512 bytes to the embedded USB flash module a unique ECC signature is created by the ECC engine and written together with the data to the flash When the data is read back by the host the ECC engine creates again the unique ECC s
22. ons such as mechanical dimensions ball assignment signal description and performance Theory of Operation explains the embedded USB flash module block diagram and flash management features Environmental Specifications characterizes the recommended operating conditions reliability parameters and shock vibration and humidity parameters Electrical Specifications describes the absolute maximum ratings and AC DC characteristics Evaluating USB Flash Module describes how designers can evaluate the embedded USB flash module if there is no Standard 2x5 or Hirose 9 pin connector yet available on the hardware design Product Marking describes the marking on the embedded USB flash module Figure 1 USB Flash Module e serge 61000 07022 108 September 2012 3 The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 2 0 Product Specifications 2 1 Mechanical Dimensions 2 1 1 Standard 2x5 Connector Form Factor Table 1 and Figure 2 show the mechanical dimensions of the embedded USB flash module with Standard 2x5 connector Table 1 Mechanical Dimensions Standard 2x5 Connector Parameter Value Length 38 00 0 15 mm 1 496 0 006 in Width 23 00 0 15 mm 0 906 0 006 in Height 2x Planar TSOP Flash 10 27 mm 0 404 in max 2x Stacked TSOP Flash 11 16 mm 0 439 in max Units mm inches Side View 2x Stacked TSOP Flash Side View S
23. ter EWF feature is implemented The EWF intercepts calls at the sector level and thereby eliminates many file system updates writes to the flash Windows XP Embedded Service Pack 2 Feature Pack 2007 introduced an additional write protect feature called File Based Write Filter FBWF The new FBWF function write protects embedded devices at the file level in contrast to the EWF which has been protecting devices at the sector level FBWF and EWF combined with the built in wear leveling algorithm ensure that the maximum life span of the flash device is achieved 61000 07022 108 September 2012 9 e serge The SSD Company SLUFMxxxU2TU I y Data Sheet STEC Embedded USB Flash Module 3 4 Unique Serial Number During manufacturing stage a unique serial number is written to the embedded USB flash module that includes a date code related to the time of manufacturing The serial number uses the following format AA B C DD EE FFFF GGGG Table 9 below describes the parameters of the serial number Table 9 Unique Serial Number format Symbol Parameter AA STEC Reserved 86h B Year hex C Month hex DD Day hex EE Production PC Number hex FFFF Last 2 Bytes of MAC Address GGGG Serial Number Incremental hex The Serial Number can be obtained through Windows Device Manager or Linux Isusb utility 4 0 Environmental Specifications 4 1 Recommended Operating Conditions Table 10
24. tures Flash file system management Bad block management Wear leveling Performance optimization 3 2 1 Bad Block Management Inherent to NAND flash technology are areas blocks on the media that cannot be used for storage because of their high error rate These so called bad blocks are already identified by the flash vendor during manufacturing but can also be accumulated over time during device operation The USB 2 0 controller contains a table that lists all the bad blocks on the device Bad Block Table and automatically maps out these blocks upon system initialization During device operation it ensures that newly accumulated bad blocks are also mapped out and added to the Bad Block Table Bad block management is 100 transparent to the host application which will not be aware of the location or existence of bad blocks on the media 3 2 2 Wear Leveling The SLC NAND flash devices that are being used in the USB flash module are rated for 100 000 Write Erase cycles per block for 43nm flash and 60 000 Write Erase cycles per block for 32nm flash This means that after the rated erase cycles the erase block has a higher probability for errors than the error rate that is typical to the flash While standard flash write erase cycles may be good for consumer data storage such as digital cameras MP3 players etc it is not sufficient for industrial and embedded applications where data is constantly written to the device and l
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